CN115274479A - Preparation method of display device, display device and electronic equipment - Google Patents
Preparation method of display device, display device and electronic equipment Download PDFInfo
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- CN115274479A CN115274479A CN202210856706.2A CN202210856706A CN115274479A CN 115274479 A CN115274479 A CN 115274479A CN 202210856706 A CN202210856706 A CN 202210856706A CN 115274479 A CN115274479 A CN 115274479A
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- 238000002360 preparation method Methods 0.000 title abstract description 12
- 230000002159 abnormal effect Effects 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000005856 abnormality Effects 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 230000002547 anomalous effect Effects 0.000 claims description 6
- 238000010494 dissociation reaction Methods 0.000 claims description 5
- 230000005593 dissociations Effects 0.000 claims description 5
- 230000008439 repair process Effects 0.000 abstract description 12
- 230000007547 defect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 238000002503 electroluminescence detection Methods 0.000 description 4
- 238000005424 photoluminescence Methods 0.000 description 4
- 238000000241 photoluminescence detection Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention discloses a preparation method of a display device, the display device and electronic equipment, wherein the preparation method comprises the following steps: providing a substrate, wherein a plurality of light emitting diodes arranged in an array are arranged on the substrate; detecting the light emitting diodes on the substrate, and if the abnormality is detected, marking the abnormal light emitting diodes as abnormal diodes; selecting a part of light emitting diodes in the plurality of light emitting diodes, wherein the position of each light emitting diode in the part of light emitting diodes is a first position; if the plurality of selected light emitting diodes positioned at the first position comprise abnormal diodes, marking the normal light emitting diodes positioned at any side of the abnormal diodes as substitute diodes, wherein the position of the substitute diodes is a second position; and transferring the normal light-emitting diodes and the substitute diodes which are positioned at the first position to the driving backboard, and connecting the normal light-emitting diodes and the substitute diodes with a driving circuit on the driving backboard. The preparation method can avoid transferring the abnormal diode to the driving back plate, thereby reducing the time consumption of the later repair process.
Description
Technical Field
The invention relates to the technical field of light-emitting display, in particular to a preparation method of a display device, the display device and electronic equipment.
Background
In the process of manufacturing the display device, the light emitting diodes need to be transferred to the driving backplane through a bulk transfer technology and bonded with the driving circuit on the driving backplane. However, due to the body abnormality of the light emitting diode itself or the bonding connection abnormality between the light emitting diode and the driving circuit, there is a light emitting diode that cannot emit light normally in the manufactured display device. In order to improve the display effect of the display device, after the display device is manufactured, the light emitting diodes are often required to be detected, and abnormal light emitting diodes are repaired and replaced individually. The repair process is time consuming, inefficient and costly.
Disclosure of Invention
The embodiment of the invention discloses a preparation method of a display device, the display device and electronic equipment, which can reduce the time consumption of a later repair process, improve the production efficiency and reduce the repair cost.
In order to achieve the above object, the present invention discloses a method for manufacturing a display device, comprising:
providing a substrate, wherein a plurality of light emitting diodes are arranged in an array on the substrate;
detecting the light emitting diodes on the substrate, and if the abnormality is detected, marking the abnormal light emitting diodes as abnormal diodes;
selecting a part of the light-emitting diodes from the plurality of light-emitting diodes, wherein the position of each light-emitting diode is a first position;
if the abnormal diodes are included in the selected plurality of light-emitting diodes at the first positions, marking the normal light-emitting diodes at any side of the abnormal diodes as substitute diodes, wherein the position of the substitute diodes is a second position;
and transferring the normal light emitting diodes and the replacing diodes which are positioned at the first position to a driving backboard, and connecting the light emitting diodes and the replacing diodes with a driving circuit on the driving backboard.
As an alternative implementation manner, in the embodiment of the present invention, the plurality of light emitting diode arrays located at the first position are arranged, and the substitute diode located at the second position and the abnormal diode located at the first position are located in the same column or the same row.
As an alternative implementation, in the embodiment of the present invention, the second position is disposed adjacent to the first position.
As an alternative embodiment, in an embodiment of the present invention, the driving circuit has a plurality of main areas and a plurality of spare areas corresponding to the main areas;
the transferring the normal light emitting diodes and the substitute diodes located at the first position to the driving backplane and connected with the driving circuit on the driving backplane comprises:
transferring the normal light emitting diode located at the first position to the main region and bonding to the corresponding main region, and transferring the substitute diode to the spare region or the main region corresponding to the abnormal diode and bonding to the spare region or the main region corresponding to the abnormal diode.
As an optional implementation manner, in an embodiment of the present invention, the main area is disposed corresponding to the first position, and the spare area is disposed corresponding to the second position;
the transferring the normal light emitting diode located at the first position to the main region and bonded to the corresponding main region, and transferring the replacement diode to the spare region or the main region corresponding to the abnormal diode and bonded to the spare region or the main region corresponding to the abnormal diode, includes:
transferring the normal light emitting diode located at the first position to the main area and bonding to the main area, and transferring the replacement diode located at the second position to the spare area and bonding to the spare area to make the main area corresponding to the abnormal diode at the first position free.
As an optional implementation manner, in an embodiment of the present invention, the plurality of light emitting diodes on the substrate are arranged in an equidistant array, the replacement diode is disposed adjacent to the replaced abnormal diode, a distance between the replacement diode and the replaced abnormal diode is a1, a distance between the light emitting diode at the first position and the light emitting diode at the first position adjacent thereto is a2, and a2 is greater than or equal to 2a1; and/or the presence of a gas in the gas,
the main areas and the spare areas are arranged in an array mode, the distance between every two adjacent main areas is a3, and a1 is larger than or equal to a3 and smaller than or equal to a2.
As an alternative implementation, in an embodiment of the present invention, the driving circuit includes a plurality of pairs of positive electrodes and negative electrodes, and both the positive electrodes and the negative electrodes are long strips;
the pair of positive electrodes and the pair of negative electrodes are arranged in parallel and at intervals, and a plurality of electric connection areas are formed along the length extension directions of the positive electrodes and the negative electrodes, wherein one electric connection area is the main area, and the rest electric connection areas are the standby areas.
As an optional implementation manner, in an embodiment of the present invention, if the abnormal diode is included in the selected plurality of light emitting diodes located at the first position, the normal light emitting diodes located on either side of the abnormal diode are marked as the replacement diodes, and before the replacement diodes are located after the second position, and the normal light emitting diodes located at the first position and the replacement diodes are transferred to the driving backplane and connected to the driving circuit on the driving backplane, the method further includes:
and peeling the normal light emitting diode and the substitute diode which are positioned at the first position from the substrate in a laser dissociation mode.
The invention also discloses a display device which is prepared by the preparation method of the display device.
The invention also discloses an electronic device comprising the display device.
Compared with the prior art, the invention has the beneficial effects that:
according to the manufacturing method of the display device, the display device and the electronic equipment provided by the embodiment of the invention, the light emitting diodes are checked before the light emitting diodes are transferred to detect the light emitting diodes with the abnormal body, and the normal light emitting diodes positioned on one side of the abnormal diodes on the first position are selected as the substitute diodes to replace the abnormal diodes to be transferred to the driving backboard during transferring, so that the abnormal diodes with the abnormal body are prevented from being transferred to the driving backboard, and the effect of reducing the number of the abnormal diodes on the driving backboard can be realized. Therefore, time consumption of the later-stage repairing process can be reduced, the total production efficiency of the display device is improved, and the total production cost of the display device is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application;
FIG. 2 is a flow chart of a method for fabricating a display device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a substrate and a light emitting diode formed on the substrate according to an embodiment of the disclosure;
fig. 4 is a schematic structural diagram of a substrate and a light emitting diode (showing a first position and a second position) formed on the substrate according to an embodiment of the present disclosure;
fig. 5 is another flowchart of a method for manufacturing a display device disclosed in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a driving backplane having light emitting diodes bonded thereon according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a positive electrode and a negative electrode of a driving back plate disclosed in an embodiment of the present application;
fig. 8 is a schematic structural diagram of a display device disclosed in an embodiment of the present application.
Description of the main reference numerals
A display device 1; a substrate 10; a light emitting diode 11; an anomalous diode 110; a replacement diode 111; a red diode 11a; a green diode 11b; a blue light diode 11c; a first position 12; a second position 13; a drive back plate 14; a main region 140; a spare area 141; a positive electrode 142; a negative electrode 143; an electrical connection region 144; an electronic device 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present disclosure, and fig. 2 is a flowchart illustrating a step of a method for manufacturing a display device disclosed in an embodiment of the present disclosure. The embodiment of the invention discloses a preparation method of a display device 1, the display device 1 prepared by the preparation method of the display device 1 can include but is not limited to a display screen and a touch screen, and the display device 1 can be applied to but is not limited to electronic equipment 2 with a light-emitting display function, such as televisions, computers, flat panels, vrs (Virtual Reality) glasses, AR (Augmented Reality) glasses, projectors, mobile phones, teaching machines, game machines, electronic watches, vehicle-mounted display screens, and the like, so as to be used as at least one screen included in the electronic equipment 2, wherein in fig. 1, the electronic equipment 2 is taken as a mobile phone, and the display device 1 is taken as an example of the application of the touch screen of the electronic equipment 2, and the structures of the display device 1 and the electronic equipment 2 are exemplarily shown. Due to the preparation method, the time consumption of the later repair process can be reduced, the production efficiency is improved, and the repair cost is reduced, so that the production efficiency of the display device 1 and the electronic equipment 2 comprising the display device 1 is higher, and the production cost is lower.
Specifically, the preparation method comprises the following steps:
s1, providing a substrate, wherein a plurality of light emitting diodes which are arranged in an array mode are arranged on the substrate.
Referring to fig. 2 and 3 together, the substrate 10 may alternatively include, but is not limited to, sapphire, glass, or a plate of a material that can be used for disposing a semiconductor material, so as to form the light emitting diode 11 on the substrate 10.
In order to facilitate the manufacturing, automatic identification and transfer of the light emitting diodes 11, optionally, the plurality of light emitting diodes 11 formed on the substrate 10 may be arranged in an equidistant array, and a distance between two adjacent light emitting diodes 11 located in the same row or the same column is a1, where the distance a1 is a center-to-center distance between two light emitting diodes 11.
And S2, detecting the light emitting diodes on the substrate, and marking the abnormal light emitting diodes as abnormal diodes if the abnormality is detected.
Here, the anomalous diode 110 is shown in gray squares in fig. 3 for ease of viewing.
Alternatively, the manner of inspecting the light emitting diode 11 on the substrate 10 includes at least one of photoluminescence inspection, electroluminescence inspection, and appearance defect inspection, so that the light emitting diode 11 having at least one of photoluminescence performance defect, electroluminescence performance defect, and appearance defect can be inspected.
In an alternative example, the manner of detecting the light emitting diode 11 on the substrate 10 may include photoluminescence detection, and for example, may include emitting light to the light emitting diode 11, and detecting the brightness of light emitted by the light emitting layer of the light emitting diode 11 absorbing the energy of the light, so as to detect the light emitting diode 11 with the insufficient photoluminescence performance of the light emitting layer, that is, the light emitting diode 11 with the photoluminescence performance defect.
In another alternative example, the manner of detecting the light emitting diode 11 on the substrate 10 may include electroluminescence detection, and for example, the method may include temporarily connecting an electrode of the light emitting diode 11 to a detection circuit, and applying electricity to the light emitting diode 11 to detect the brightness of light emitted from the light emitting layer, so as to detect the light emitting diode 11 with the insufficient electroluminescence performance of the light emitting layer, that is, the light emitting diode 11 with the defect of electroluminescence performance.
In still another alternative example, the manner of detecting the led 11 on the substrate 10 may include appearance defect Inspection, for example, may include Automatic Optical Inspection (AOI) to capture and collect an image of the led 11 through a camera, and compare the image of the normal led 11 through image processing, so as to detect the led 11 with appearance defects.
It is understood that, when the manner of detecting the light emitting diode 11 on the substrate 10 includes multiple types of photoluminescence detection, electroluminescence detection and appearance defect detection, the specific sequence of performing photoluminescence detection, electroluminescence detection and appearance defect detection respectively, and whether to perform at least two types of photoluminescence detection, electroluminescence detection and appearance defect detection simultaneously can be selected according to the actual situation, and the embodiment is not limited specifically.
And S3, selecting a part of the light-emitting diodes from the plurality of light-emitting diodes, wherein the position of each light-emitting diode in the part of the light-emitting diodes is the first position.
As shown in fig. 4, optionally, the plurality of light emitting diodes 11 located at the first position 12 are arranged in an array, a distance between the light emitting diode 11 located at the first position 12 and the light emitting diode 11 located at the adjacent first position 12 is a2, where the distance a2 is a center-to-center distance between the two light emitting diodes 11, and the distance a2 may satisfy: a2 ≧ 2a1, in other words, at least another light-emitting diode 11 is spaced between two light-emitting diodes 11 respectively located at two adjacent first positions 12, so that the density of the light-emitting diodes 11 located at the first positions 12 is greater than the density of the light-emitting diodes 11 arranged in an array on the substrate 10, so as to make the transfer process of the subsequent light-emitting diodes 11 simpler and easier to implement, wherein, for easy observation, fig. 4 is filled with oblique lines to show the plurality of light-emitting diodes 11 located at the first positions 12.
It is understood that the light emitting diode 11 located at the first position 12 may or may not include the anomalous diode 110.
In an alternative embodiment, the light emitting diode 11 located at the first position 12 includes the abnormal diode 110, and after the step S3, the method for manufacturing the display device 1 further includes:
and S4, if the selected plurality of light emitting diodes positioned at the first position comprise abnormal diodes, marking the normal light emitting diodes positioned at any side of the abnormal diodes as substitute diodes, wherein the positions of the substitute diodes are second positions.
Here, for the convenience of viewing, fig. 4 is filled with oblique lines perpendicular to the filling oblique lines of the first position 12 to show the replacement diode 111 located at the second position 13.
By selecting the substitute diode 111 to replace the abnormal diode 110 located at the first position 12 before transferring the light emitting diode 11, it is able to avoid transferring the abnormal diode 110 having body abnormality (i.e. the structural defect of the light emitting diode 11 itself), thereby reducing the number of the bad light emitting diodes 11 after transferring the light emitting diode 11, in other words, reducing the total number of the bad light emitting diodes 11 after transferring by reducing the number of the transferred abnormal diodes 110, thereby achieving the effects of reducing the time consumption of the post-repair process, improving the production efficiency and reducing the repair cost.
Alternatively, the second position 13 may be a position within a specific area, or may be any position located outside the first position 12, and the relative position relationship between the second position 13 and the first position 12 may be fixed or may not be fixed, and the selection of the second position 13 may be determined according to actual situations, which is not specifically limited in this embodiment.
In an alternative example, the relative position relationship between the second position 13 and the first position 12 is not necessary, so that the selectable range of the second position 13 is larger, and more flexible, and the possibility that a sufficient number of normal light emitting diodes 11 exist on the second position 13 to replace the abnormal light emitting diodes 11 on the first position 12 is higher.
In another optional example, the second position 13 is a position corresponding to the first position 12, and a relative position relationship between the second position 13 and the corresponding first position 12 is fixed, so that the selection of the second position 13 is more regular, and the difficulty in selecting the second position 13 can be reduced.
The "relative positional relationship is constant" as described above, and includes the case where the relative direction is constant, the relative distance is constant, and both the relative direction and the relative distance are constant.
In an alternative example, the replacement diode 111 located at the second position 13 and the abnormal diode 110 located at the first position 12 are located at the same column or the same row, so that the relative directions of the first position 12 and the second position 13 are fixed.
In another alternative example, the second location 13 is located adjacent to the first location 12 such that the first location 12 is a relative distance from the second location 13.
In still another alternative example, the replacement diode 111 located at the second position 13 and the abnormal diode 110 located at the first position 12 are located in the same column or the same row, and the second position 13 is disposed adjacent to the first position 12, so that the relative direction and the relative distance between the first position 12 and the second position 13 are both constant.
Taking the case where the plurality of light emitting diodes 11 are arranged in the up-down direction and the left-right direction, specifically, the second position 13 may be at least one position adjacent to the first position 12 and above, below, to the left, or to the right of the first position 12, where the coordinates in fig. 4 show the up-down, left-right, and left-right directions.
Alternatively, there may be a plurality of second positions 13 corresponding to one first position 12, so that the probability that at least one normal led 11 exists among the plurality of leds 11 respectively located at the plurality of second positions 13 corresponding to one first position 12 can be increased. For example, there may be two second positions 13 corresponding to one first position 12, and the two second positions 13 are respectively located at two different sides of the one first position 12, such as the upper and lower sides, the left and right sides, the upper left side, the upper right side, the lower left side, or the lower right side of the first position 12, so as to increase the probability that at least one normal led 11 exists among the leds 11 at the multiple second positions 13 corresponding to one first position 12, and at the same time, to make the number of the second positions 13 corresponding to the same first position 12 smaller, thereby facilitating selection.
Referring to fig. 5, in another alternative embodiment, the light emitting diode 11 located at the first position 12 does not include the abnormal diode 110, and after step S3, the method for manufacturing the display device 1 further includes:
and S4a, if all the plurality of light emitting diodes positioned at the first position are normal light emitting diodes, selecting the plurality of light emitting diodes positioned at the first position.
After the selection of the light emitting diodes 11 is completed, in order to facilitate the transfer of the selected light emitting diodes 11, after step S4, the method for manufacturing the display device 1 may further include:
and S5a, stripping the selected light emitting diode from the substrate in a laser dissociation mode.
It is to be understood that when the anomalous diode 110 is included in the light emitting diode 11 located in the first position 12, the selected light emitting diode 11 includes a normal light emitting diode located in the first position 12 and a replacement diode, and when the anomalous diode 110 is not included in the light emitting diode 11 located in the first position 12, the selected light emitting diode 11 includes a normal light emitting diode located in the first position 12.
In an alternative example, the light emitting diodes 11 on the substrate 10 may be entirely peeled off by laser dissociation, so that the peeling process of the light emitting diodes 11 is simple.
In another alternative example, only the selected led 11 may be peeled off the substrate 10 by laser dissociation, so as to reduce the influence on the position of the other untransferred leds 11 on the substrate 10 during the transferring of the selected led 11.
Referring to fig. 4 to 6, when the abnormal diode 110 is detected, the method for manufacturing the display device 1 further includes:
and S5, transferring the normal light emitting diode and the substitute diode which are positioned at the first position to the driving backboard, and connecting the normal light emitting diode and the substitute diode with a driving circuit on the driving backboard.
Alternatively, the transfer of the light emitting diode 11 may be achieved by any one of, but not limited to, a precision gripping technique (Stamp Pick & Place), a Self-Assembly technique (Self-Assembly), a Selective Release technique (Selective Release), and a transfer Printing technique (Roll Printing), which are mass transfer techniques.
Optionally, in the process of transferring the selected leds 11 to the driving backplane 14, the leds 11 may be transferred to a temporary carrier (not shown), and then the leds 11 are transferred from the temporary carrier to the driving backplane 14, so as to avoid the peeling between the leds 11 and the substrate 10 and the connection between the leds 11 and the driving backplane 14, thereby reducing the difficulty of the transfer process of the leds 11.
Further, after the leds 11 are transferred to the temporary carrier board, the leds 11 may be transferred among a plurality of temporary carrier boards to adjust the positions and postures of the leds 11 during the transfer.
In the related art, there is a limit to the relative position between the shifted leds 11, and based on this, no matter whether the relative position relationship between the second position 13 and the first position 12 is fixed, the replacement diode 111 may be optionally shifted to the first position 12 where the replaced abnormal diode 110 is located during the shifting process of the leds 11.
In some embodiments, the driving circuit (not shown) has a plurality of main regions 140 and a plurality of spare regions 141 corresponding to the main regions 140, and the main regions 140 and the spare regions 141 are used for bonding connection to the light emitting diodes 11.
At this time, step S5 may include:
s50, transferring the normal light emitting diode positioned at the first position to the main area and bonding the normal light emitting diode to the corresponding main area, and transferring the substitute diode to the spare area or the main area corresponding to the abnormal diode and bonding the substitute diode to the spare area or the main area corresponding to the abnormal diode.
It can be understood that, at this time, when one of the main area 140 and the spare area 141 is bonded with the led 11, the other of the main area 140 and the spare area 141 is not bonded with the led 11, in other words, the other of the main area and the spare area is left, so that, in the subsequent repair process, when an abnormal led 11 is found, the spare area 141 or the main area 140 corresponding to the position of the led 11 can be used, and the repair can be implemented by additionally providing a normal led 11 in the left spare area 141 or the main area 140 without removing the abnormal led 11, the steps of repair are few, and the repair efficiency is higher.
In some embodiments, the main area 140 may be disposed corresponding to the first position 12, and the spare area 141 may be disposed corresponding to the second position 13, in which case, the step S50 may include:
s500, transferring the normal light emitting diode located at the first position to the main area and bonding the normal light emitting diode to the main area, and transferring the substitute diode located at the second position to the spare area and bonding the substitute diode to the spare area to make the main area corresponding to the abnormal diode at the first position free.
Accordingly, the replacement diode 111 can be transferred to the spare area 141 corresponding to the main area 140 corresponding to the first position 12 without adjusting the position of the replacement diode 111 during the transfer of the light emitting diode 11, and the transfer of the light emitting diode 11 is simplified.
As described above, the two light emitting diodes 11 respectively located at the corresponding first position 12 and the second position 13 may be adjacent to each other, in other words, the distance between the first position 12 and the second position 13 may be a1, and at this time, the distance between the spare area 141 and the corresponding main area 140 may also be a1, so that the main area 140 may be disposed corresponding to the first position 12, the spare area 141 may be disposed corresponding to the second position 13, and meanwhile, the distance between the spare area 141 and the main area 140 is closer, so that the offset distance of the substitute diode 111 disposed in the spare area 141 is smaller than that of the corresponding main area 140, and the influence on the display effect of the display device 1 due to the offset of the position of the substitute diode 111 can be reduced.
As described above, there may be a plurality of second positions 13 corresponding to one first position 12, and in this case, there may also be a plurality of spare areas 141 corresponding to one main area 140. Taking as an example that there are two second positions 13 corresponding to one first position 12, and the two second positions 13 are respectively located at the upper and lower sides of the one first position 12, two spare areas 141 may be provided corresponding to one main area 140, and the two spare areas 141 are respectively located at the upper and lower sides of the main area 140.
In order to realize that the light emitting diode 11 can be electrically connected to the driving circuit by being connected to the main region 140 or the spare region 141 by bonding, in some embodiments, electrodes in which the main region 140 and the spare region 141 are formed at the same time may be provided at the driving circuit, or a main electrode may be provided at the driving circuit to form the main region 140 and a spare electrode may be provided to form the spare region 141.
Referring to fig. 6 and 7 together, it is preferable that electrodes including the main region 140 and the spare region 141 may be provided at the driving circuit, thereby making the structure of the driving circuit simple. Illustratively, the driving circuit may include a plurality of pairs of positive electrodes 142 and negative electrodes 143, the positive electrodes 142 and the negative electrodes 143 are both elongated, the pair of positive electrodes 142 and the pair of negative electrodes 143 are arranged in parallel and at intervals, and a plurality of electrical connection regions 144 are formed along the length extension direction of the positive electrodes 142 and the negative electrodes 143, wherein one electrical connection region 144 is the main region 140, and the remaining other electrical connection regions 144 are the spare regions 141, so that the main region 140 and the spare regions 141 located in the same row or the same column and having a certain relative distance can be formed by the pair of positive electrodes 142 and the pair of negative electrodes 143.
Alternatively, the driving circuit may be provided with a plurality of main regions 140 in an array, a distance between two adjacent main regions 140 is a3, the distance a3 is a center-to-center distance between the two main regions 140, and the distance a3 may satisfy: a1 ≦ a3 ≦ a2, so that on one hand, the density of the main region 140 on the driving circuit may be less than or equal to the density of the plurality of light emitting diodes 11 formed on the substrate 10, so that the process of transferring and bonding the light emitting diodes 11 to the driving circuit is simple, and on the other hand, the density of the main region 140 on the driving circuit may be greater than or equal to the density of the plurality of light emitting diodes 11 located at the first position 12, so that the density of the light emitting diodes 11 bonded to the driving circuit is large, so that the display pixels of the display device 1 are improved.
When the density of the main region 140 on the driving circuit is greater than the density of the plurality of light emitting diodes 11 located at the first position 12, the transfer and bonding of the light emitting diodes 11 may be optionally performed a plurality of times by performing step S5a plurality of times, thereby preparing the complete display device 1.
Referring to fig. 4 and 8, in addition, considering that the leds 11 disposed on the driving backplane 14 often include three types of red leds 11a, green leds 11b, and blue leds 11c, when the leds 11 are fabricated on the substrate 10, the same type of leds 11 are often fabricated on the same substrate 10 only for the sake of simple process. At this time, alternatively, the step S5 may be performed multiple times to transfer and bond the three light emitting diodes 11 of the red light diode 11a, the green light diode 11b and the blue light diode 11c to the driving back plate 14, so as to prepare the display device 1 including the three light emitting diodes 11 of the red light diode 11a, the green light diode 11b and the blue light diode 11 c.
In the manufacturing method of the display device 1 according to the embodiment of the present invention, before the light emitting diodes 11 are transferred, the light emitting diodes 11 are checked to detect the light emitting diodes 11 with the body abnormality, and during the transfer, the normal light emitting diodes 11 located at one side of the abnormal diodes 110 on the first position 12 are selected as the substitute diodes 111 to replace the abnormal diodes 110 to be transferred to the driving back plate 14, so that the abnormal diodes 110 with the body abnormality are prevented from being transferred to the driving back plate 14, and the effect of reducing the number of the abnormal diodes 110 on the driving back plate 14 can be achieved. Therefore, the time consumption of the later repair process can be reduced, the total production efficiency of the display device 1 is improved, and the total production cost of the display device 1 is reduced.
In addition, the main area 140 and the spare area 141 are arranged in the driving circuit of the driving back plate 14, so that on one hand, a more flexible bonding connection position is provided for the substitute diode 111, and on the other hand, one of the corresponding main area 140 and the spare area 141 can be left out, so that the light emitting diodes 11 for repairing are bonded and connected in the subsequent repairing process, and therefore the abnormal light emitting diodes 11 which are bonded and connected are not required to be removed, the subsequent repairing work can be further reduced, the time consumption of the subsequent repairing process is reduced, the total production efficiency of the display device 1 is improved, and the total production cost of the display device 1 is reduced.
The above detailed descriptions of the method for manufacturing a display device, the display device, and the electronic device according to the embodiments of the present invention are provided, and specific examples are used herein to explain the principles and embodiments of the present invention, and the descriptions of the above embodiments are only used to help understand the method for manufacturing a display device, the display device, and the electronic device and the core ideas thereof according to the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A method of manufacturing a display device, the method comprising:
providing a substrate, wherein a plurality of light emitting diodes are arranged in an array on the substrate;
detecting the light emitting diodes on the substrate, and if the abnormality is detected, marking the abnormal light emitting diodes as abnormal diodes;
selecting a part of the light-emitting diodes from the plurality of light-emitting diodes, wherein the position of each light-emitting diode is a first position;
if the abnormal diode is included in the selected plurality of light emitting diodes positioned at the first position, marking the normal light emitting diodes positioned at any side of the abnormal diode as a substitute diode, wherein the position of the substitute diode is a second position;
and transferring the normal light emitting diodes and the replacing diodes which are positioned at the first position to a driving backboard, and connecting the light emitting diodes and the replacing diodes with a driving circuit on the driving backboard.
2. The method for manufacturing a display device according to claim 1, wherein the plurality of light emitting diodes at the first position are arranged in an array, and the substitute diode at the second position and the anomalous diode at the first position are located in a same column or a same row.
3. The method for manufacturing a display device according to claim 2, wherein the second position is provided adjacent to the first position.
4. The method for manufacturing a display device according to any one of claims 1 to 3, wherein the driving circuit has a plurality of main regions and a plurality of spare regions corresponding to the main regions;
the transferring the normal light emitting diodes and the substitute diodes located at the first position to the driving backplane and connected with the driving circuit on the driving backplane comprises:
transferring the normal light emitting diode located at the first position to the main region and bonding to the corresponding main region, and transferring the substitute diode to the spare region or the main region corresponding to the abnormal diode and bonding to the spare region or the main region corresponding to the abnormal diode.
5. The method for manufacturing a display device according to claim 4, wherein the main area is provided in correspondence with the first position, and the spare area is provided in correspondence with the second position;
the transferring the normal light emitting diode located at the first position to the main region and bonded to the corresponding main region, and transferring the replacement diode to the spare region or the main region corresponding to the abnormal diode and bonded to the spare region or the main region corresponding to the abnormal diode, includes:
transferring the normal light emitting diode located at the first position to the main region and bonding to the main region, and transferring the substitute diode located at the second position to the spare region and bonding to the spare region to make the main region corresponding to the abnormal diode at the first position free.
6. The method for manufacturing a display device according to claim 5, wherein the plurality of light emitting diodes on the substrate are arranged in an equidistant array, the substitute diode is arranged adjacent to the replaced abnormal diode, the distance between the substitute diode and the replaced abnormal diode is a1, the distance between the light emitting diode at the first position and the light emitting diode at the first position adjacent to the substitute diode is a2, and a2 is greater than or equal to 2a1; and/or the presence of a gas in the gas,
the main areas and the spare areas are arranged in an array mode, the distance between every two adjacent main areas is a3, and a1 is larger than or equal to a3 and smaller than or equal to a2.
7. The method according to claim 4, wherein the drive circuit includes a plurality of pairs of positive electrodes and negative electrodes, the positive electrodes and the negative electrodes each being elongated;
the pair of positive electrodes and the pair of negative electrodes are arranged in parallel and at intervals, and a plurality of electric connection areas are formed along the length extension directions of the positive electrodes and the negative electrodes, wherein one electric connection area is the main area, and the rest electric connection areas are the standby areas.
8. A method for manufacturing a display device according to any one of claims 1 to 3, wherein if the abnormal diode is included in the selected plurality of light emitting diodes located at the first position, the normal light emitting diodes located on either side of the abnormal diode are marked as the replacement diodes, and the replacement diodes are located after the second position, and before the normal light emitting diodes located at the first position and the replacement diodes are transferred to the driving backplane and connected to the driving circuit on the driving backplane, the method further comprises:
and peeling the normal light emitting diode and the substitute diode which are positioned at the first position from the substrate in a laser dissociation mode.
9. A display device produced by the production method for a display device according to any one of claims 1 to 8.
10. An electronic apparatus characterized by comprising the display device according to claim 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210856706.2A CN115274479A (en) | 2022-07-19 | 2022-07-19 | Preparation method of display device, display device and electronic equipment |
| PCT/CN2022/140011 WO2024016583A1 (en) | 2022-07-19 | 2022-12-19 | Display apparatus manufacturing method, display apparatus, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210856706.2A CN115274479A (en) | 2022-07-19 | 2022-07-19 | Preparation method of display device, display device and electronic equipment |
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| CN115274479A true CN115274479A (en) | 2022-11-01 |
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|---|---|---|---|
| CN202210856706.2A Pending CN115274479A (en) | 2022-07-19 | 2022-07-19 | Preparation method of display device, display device and electronic equipment |
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| Country | Link |
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| CN (1) | CN115274479A (en) |
| WO (1) | WO2024016583A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016583A1 (en) * | 2022-07-19 | 2024-01-25 | 上海闻泰电子科技有限公司 | Display apparatus manufacturing method, display apparatus, and electronic device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10838556B2 (en) * | 2019-04-05 | 2020-11-17 | Apple Inc. | Sensing system for detection of light incident to a light emitting layer of an electronic device display |
| CN111463230A (en) * | 2020-04-13 | 2020-07-28 | 深圳市华星光电半导体显示技术有限公司 | Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate |
| CN111653584B (en) * | 2020-06-18 | 2022-08-05 | 厦门天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN112582519B (en) * | 2020-12-02 | 2022-03-11 | 苏州芯聚半导体有限公司 | Transfer method and transfer equipment for micro light-emitting diode |
| CN115274479A (en) * | 2022-07-19 | 2022-11-01 | 闻泰通讯股份有限公司 | Preparation method of display device, display device and electronic equipment |
-
2022
- 2022-07-19 CN CN202210856706.2A patent/CN115274479A/en active Pending
- 2022-12-19 WO PCT/CN2022/140011 patent/WO2024016583A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016583A1 (en) * | 2022-07-19 | 2024-01-25 | 上海闻泰电子科技有限公司 | Display apparatus manufacturing method, display apparatus, and electronic device |
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| WO2024016583A1 (en) | 2024-01-25 |
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