JPH06196857A - Working method of half-divided through hole in printed-wiring board - Google Patents

Abstract

PURPOSE:To eliminate that a metal barrier metal is rolled up and to efficiently work the outer shape of a printed-wiring board by a method wherein a metal part on one side in a through hole is drilled and removed and the through hole is half-divided and cut. CONSTITUTION:Before a half-dividing and cutting operation along an outer-shape working line C at a printed-wiring board 1, a metal part on one side in a through hole 2 to be half-divided and cut is drilled and removed at a part (a) indicated by a dotted line from the side of a material 6 to be cut off. Then, while a router is being turned in the clockwise direction along the outer-shape working line C, it is moved from the left to the right, a routing operation is performed, the material 6 to be cut off is cut off and removed, and the through hole 2 is half-divided and cut. A metal burr 4 is produced on one side on the other side of a half-divided through hole 3 which has been obtained. Then, the printed-wiring board 1 is turned over, it is reset, a metal burr 4 produced on one side on the other side of the half-divided through hole 3 is drilled in a part (b) indicated by a dotted line and it is cut off from its base.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a half through hole in the outer shape processing of a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, in external processing of a printed wiring board, as shown in FIG. 6, a through hole 2 on the outer peripheral portion of the printed wiring board 1 is cut in half by routing. Due to the half cut of the through hole 2, metal burrs 4 and metal curls 5 are generated at both ends of the half through hole 3 as shown in FIGS. In the case shown in FIG. 7, the router cuts from left to right as shown by the arrow while rotating clockwise, so that a flat metal beam 4 is generated at the left end of the half-thru hole 3 and a needle-like beam is formed at the right end. A metal flash 4 is generated. In the case shown in FIG. 8, the router cuts from the right to the left as shown by the arrow while rotating in the clockwise direction, so metal swelling 5 is generated at the right end of the half-through hole 3, and a flat metal burr is formed at the left end. 4 occurs. In this way, metal burrs 4 and metal curl 5 generated at both ends of the half-thru hole 3
Must be removed thereafter, so that the outer shape of the printed wiring board 1 cannot be efficiently processed.

[0003]

SUMMARY OF THE INVENTION Therefore, according to the present invention, a half-divided through hole of a printed wiring board can be obtained by processing a half-divided through-hole so as to eliminate metal burrs and curling of the metal so as to improve the efficiency of external processing of the printed wiring board. It is intended to provide a processing method of.

[0004]

In order to solve the above-mentioned problems, a method of processing a through-hole for a printed wiring board according to the present invention is to remove one side metal part of the through-hole into a half of the printed wiring board by drilling, and then It is characterized in that the through hole is cut in half by routing, and then the printed wiring board is set upside down to remove the metal burr generated on the other side of the half through hole by drilling.

[0005]

As described above, according to the method for processing a through hole of a printed wiring board of the present invention, the metal portion on one side of the through hole to be divided is removed by drilling before the through hole of the printed wiring board is cut by routing. Therefore, when the through hole is cut in half by routing, metal burrs do not occur on the drilled side. Further, in the method for processing a half cut through hole of a printed wiring board of the present invention, after the half cut of the through hole, the printed wiring board is set upside down and the metal burr generated on the other side of the half cut through hole is removed from the root by drilling. As a result, you can get a half-divided through hole without metal flash or metal turning.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for processing a through hole of a printed wiring board according to the present invention will be described with reference to the drawings. The through hole 2 on the outer peripheral portion of the printed wiring board 1 shown in FIG. Prior to half-cutting along C, the metal part on one side of the through-hole 2 to be half-cut was cut off from the cut-off material 6 side by drilling a portion a indicated by a dotted circle as shown in FIG. Next, while rotating the router clockwise along the outer shape processing line C of the printed wiring board 1, the router is moved from left to right for routing and the cut-off material 6 is cut and removed as shown in FIG. A half cut was made. A metal beam 4 was formed on the other side of the half through hole 3 obtained by this half cut. Next, the printed wiring board 1 is set upside down as shown in FIG. 4, and the metal burr 4 formed on the other side of the half-divided through-hole 3 is indicated by a dotted circle b.
It was drilled and cut from the base. Thus, as shown in FIG. 5, the half-divided through-hole 3 has a shape with no metal burr and no metal swelling and a constant precision.
In addition, although the example of the through hole having no land has been described in the above embodiment, the present invention is not limited to this, and a through hole having a land may be used.

[0007]

As described above, according to the method for processing a half-through hole of a printed wiring board of the present invention, a half-through hole having a constant shape and a good shape without a metal burr or a metal curl can be obtained. In addition, it is not necessary to remove the metal burr and the metal curl after processing the half-divided through-hole, which can contribute to the efficiency of the external processing of the printed wiring board.

[Brief description of drawings]

FIG. 1 is a diagram showing steps of an embodiment of a method for processing a half-through hole of a printed wiring board according to the present invention.

FIG. 2 is a diagram showing steps of an embodiment of a method for processing a half-through hole of a printed wiring board according to the present invention.

FIG. 3 is a diagram showing steps of an embodiment of a method for processing a half-through hole of a printed wiring board according to the present invention.

FIG. 4 is a diagram showing steps of an embodiment of a method for processing a printed wiring board half-divided through hole of the present invention.

FIG. 5 is a diagram showing steps of an embodiment of a method of processing a through-hole for a printed wiring board according to the present invention.

FIG. 6 is a diagram showing a through hole on the outer peripheral portion of the printed wiring board.

FIG. 7 is a diagram showing a state in which the through hole of FIG. 6 is routed from left to right and cut in half.

8 is a diagram showing a state in which the through hole in FIG. 6 is routed from right to left and cut in half.

[Explanation of symbols] 1 printed wiring board 2 through hole 3 half through hole 4 metal beam

Claims (1)

[Claims] 1. A metal part on one side of a through hole to be halved of a printed wiring board is removed by drilling, then the through hole is halved by routing, and then the printed wiring board is set upside down to reset the halved through hole. A method for processing a half-through hole of a printed wiring board, characterized in that metal burrs generated on the other side are removed from the root by drilling.