JPH0257477B2 - - Google Patents
Info
- Publication number
- JPH0257477B2 JPH0257477B2 JP61247447A JP24744786A JPH0257477B2 JP H0257477 B2 JPH0257477 B2 JP H0257477B2 JP 61247447 A JP61247447 A JP 61247447A JP 24744786 A JP24744786 A JP 24744786A JP H0257477 B2 JPH0257477 B2 JP H0257477B2
- Authority
- JP
- Japan
- Prior art keywords
- start point
- line
- scanning
- laser beam
- hole shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003754 machining Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 23
- 238000003698 laser cutting Methods 0.000 claims description 22
- 238000010586 diagram Methods 0.000 description 12
- 238000013459 approach Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はレーザ切断方法、特にレーザビームに
より板状の被加工物を切抜くレーザ切断方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser cutting method, and particularly to a laser cutting method for cutting out a plate-shaped workpiece using a laser beam.
［従来の技術］
レーザビームにより板状の被加工物を切抜く従
来のレーザ切断方法の一例を第５図および第６図
に示す。[Prior Art] An example of a conventional laser cutting method for cutting out a plate-shaped workpiece using a laser beam is shown in FIGS. 5 and 6.
このレーザ切断方法は、予め定めた穴形状の線
Ｌに沿つてレーザビームを走査して板状の被加工
物を切抜くことにより、前記被加工物から脱落部
材Ｍが切抜かれた製品を得るものである。 This laser cutting method scans a laser beam along a predetermined hole-shaped line L to cut out a plate-shaped workpiece, thereby obtaining a product in which the falling member M is cut out from the workpiece. It is something.
このレーザ切断方法では、加工開始点Ｏを前記
穴形状の線Ｌよりも廃材となるべき脱落部材Ｍ側
に設定し、該加工開始点Ｏから前記穴形状の線Ｌ
上に設定した実質上の加工開始点ａまでレーザビ
ームを直線的に走査する。このとき、前記実質上
の加工開始点ａに達するのは前記レーザビームの
加工スポツトの外径であり、したがつて、該加工
スポツトの外径が前記実質上の加工開始点ａに達
したのちの走査軌跡L1は、前記穴形状の線Ｌよ
りも前記レーザビームの加工スポツト半径ｒだけ
前記加工開始点Ｏ側に偏位したものとなり、前記
レーザビームを引き続き該走査軌跡L1上を第５
図の矢印方向に走査することにより、板状の被加
工物を切抜く。ここで、前記レーザビームが前記
実質上の加工開始点ａに再び接近すると、前記脱
落部材Ｍはその重量により、前記レーザビームが
前記実質上の加工開始点ａに達する手前の点Ｄに
おいて自重を支えきれずに落下するため、第６図
に示すように、前記穴形状の線Ｌより内側に突出
した突出部Ｃが製品に生じる。該突出部Ｃは前記
脱落部材Ｍの落下後のレーザ照射によりある程度
溶融されるが、完全には除去されずに前記製品に
残つてしまう。 In this laser cutting method, a machining start point O is set on the side of the falling member M that is to be scrapped than the line L of the hole shape, and from the machining start point O to the line L of the hole shape.
The laser beam is scanned linearly to the actual processing start point a set above. At this time, it is the outer diameter of the processing spot of the laser beam that reaches the actual processing start point a, and therefore, the outer diameter of the processing spot reaches the actual processing start point a. The next scanning locus L1 is deviated from the hole-shaped line L by the processing spot radius r of the laser beam toward the processing start point O, and the laser beam continues to move along the scanning locus L1 . 5
A plate-shaped workpiece is cut out by scanning in the direction of the arrow in the figure. Here, when the laser beam approaches the actual processing start point a again, the fallen member M loses its own weight due to its weight at a point D before the laser beam reaches the actual processing start point a. Since the product cannot be supported and falls, a protrusion C is formed on the product that protrudes inward from the hole-shaped line L, as shown in FIG. Although the protrusion C is melted to some extent by the laser irradiation after the falling member M falls, it remains on the product without being completely removed.
なお、前記レーザビームの加工スポツトが１点
に集中され、加工スポツト半径ｒ＝０となつた場
合には、前記走査軌跡L1は前記穴形状の線Ｌと
一致する。 Note that when the processing spot of the laser beam is concentrated at one point and the processing spot radius r=0, the scanning locus L1 coincides with the line L of the hole shape.
［発明が解決しようとする課題］
しかしながら、上述した従来のレーザ切断方法
では、レーザビームが実質上の加工開始点ａに戻
る前に脱落部材Ｍはその自重により落下し、その
際、製品に突出部Ｃが残るので、該製品に穿孔さ
れた穴に、軸、スイツチや電子素子などの部品を
精度よく挿入する際、前記突出部Ｃが邪魔をして
挿入不能となるため、やすりやその他の手段によ
り前記突出部Ｃを切断する作業工程が必要になる
という欠点がある。[Problem to be Solved by the Invention] However, in the conventional laser cutting method described above, the falling member M falls due to its own weight before the laser beam returns to the actual processing starting point a, and at that time, the falling member M falls off due to its own weight, and at that time, the falling member M falls off due to its own weight. Since part C remains, when parts such as shafts, switches, and electronic devices are inserted accurately into the holes drilled in the product, the protruding part C interferes with the insertion, making it impossible to insert files or other parts. There is a drawback that a work step of cutting the protruding portion C by means is required.
切断の目的は、予め定めた穴形状の線に沿つて
レーザビームを走査して板状の被加工物を切抜く
際に発生する前記突出部が製品の輪郭外へ突出す
ることを防止し、切抜いただけで前記製品を使用
できるようにして、突出部を切断する作業工程を
省略することができるレーザ切断方法を提供する
ことにある。 The purpose of cutting is to prevent the protrusion that occurs when cutting out a plate-shaped workpiece by scanning a laser beam along the line of a predetermined hole shape from protruding outside the contour of the product; It is an object of the present invention to provide a laser cutting method that allows the product to be used just by cutting it out, and that can omit the step of cutting the protrusion.
［課題を解決するための手段］
本発明のレーザ切断方法は、
予め定めた穴形状の線Ｌに沿つてレーザビーム
を走査して板状の被加工物を切抜くレーザ切断方
法であつて、
加工開始点０を前記穴形状の線Ｌよりも製品と
反対側に設定し、
実質上の加工開始点A1を前記穴形状の線Ｌよ
りも前記製品側に設定し、
前記レーザビームを、
前記加工開始点０から前記実質上の加工開始点
A1まで走査したのち、
該実質上の加工開始点A1から、前記穴形状の
線Ｌより少なくとも加工スポツト半径ｒだけ前記
加工開始点０側に偏位した走査軌跡L1まで、前
記穴形状の線Ｌを横切る第１の所定軌跡L2に沿
つて走査して、
その後、前記走査軌跡L1上を走査させたのち、
該走査軌跡L1の終了近傍において、該走査軌
跡L1から前記実質上の加工開始点A1まで前記穴
形状の線Ｌを横切る第２の所定軌跡L3に沿つて
走査する。[Means for Solving the Problems] The laser cutting method of the present invention is a laser cutting method in which a plate-shaped workpiece is cut by scanning a laser beam along a line L of a predetermined hole shape, A machining start point 0 is set on the side opposite to the product from the line L of the hole shape, an actual machining start point A1 is set on the side of the product from the line L of the hole shape, and the laser beam is From the machining start point 0 to the actual machining start point
After scanning to A1 , the hole shape is scanned from the actual machining start point A1 to a scanning locus L1 that is deviated from the line L of the hole shape by at least a machining spot radius r toward the machining start point 0 side. After scanning along a first predetermined locus L2 that intersects the line L of Scanning is performed along a second predetermined locus L3 that crosses the line L of the hole shape up to the actual processing start point A1 .
［作用］
したがつて、本発明のレーザ切断方法では、走
査軌跡の終了近傍において、レーザビームを走査
軌跡から実質上の加工開始点まで穴形状の線を横
切る第２の所定軌跡に沿つて走査することによ
り、前記レーザビームが前記実質上の加工開始点
に戻る手前で脱落部材がその自重により落下する
際に、製品側に切欠きが生じるように前記レーザ
ビームを走査するので、該製品の輪郭外へ突出す
る突出部が生じることがないため、該突出部をさ
らに追加工により切断する必要がない。[Operation] Therefore, in the laser cutting method of the present invention, near the end of the scanning trajectory, the laser beam is scanned along the second predetermined trajectory that crosses the hole shape line from the scanning trajectory to the actual processing start point. By doing this, the laser beam is scanned in such a way that a notch is created on the product side when the falling member falls due to its own weight before the laser beam returns to the actual processing start point, so that the product is Since no protrusion protrudes outside the contour, there is no need to cut the protrusion by additional machining.
［実施例］
次に、本発明の実施例について図面を参照して
説明する。[Example] Next, an example of the present invention will be described with reference to the drawings.
第１図は本発明のレーザ切断方法の第１の実施
例におけるレーザビーム走査の軌跡を示す図、第
２図は第１図のレーザ切断方法により穿孔された
穴の形状を示す図である。 FIG. 1 is a diagram showing a locus of laser beam scanning in a first embodiment of the laser cutting method of the present invention, and FIG. 2 is a diagram showing the shape of a hole drilled by the laser cutting method of FIG. 1.
本実施例のレーザ切断方法では、予め定めた穴
形状の線Ｌよりも製品と反対側である脱落部材
M1側に加工開始点Ｏを設定し、また前記穴形状
の線Ｌよりも前記製品側である前記脱落部材M1
と反対側の仮想円Ｎで囲つた範囲内に、実質上の
加工開始点A1を設定する。 In the laser cutting method of this embodiment, the falling member that is on the opposite side of the product from the line L of the predetermined hole shape
A machining start point O is set on the M 1 side, and the falling member M 1 is located closer to the product than the line L of the hole shape.
A practical machining start point A1 is set within the range surrounded by the virtual circle N on the opposite side.
切断が開始点されると、レーザビームを、前記
加工開始点Ｏから前記穴形状の線Ｌ上の点Ａを介
して前記実質上の加工開始点A1まで直線的に走
査したのち、該実質上の加工開始点A1から前記
穴形状の線Ｌより少なくとも加工スポツト半径ｒ
だけ前記加工開始点Ｏ側（図示内側）に偏位した
走査軌跡L1まで、前記穴形状の線Ｌを横切る第
１の所定軌跡L2に沿つて走査する。 When the cutting start point is set, the laser beam is linearly scanned from the processing start point O to the actual processing start point A1 via point A on the line L of the hole shape, and then From the upper machining start point A1 to the line L of the hole shape, at least the machining spot radius r
Scanning is performed along a first predetermined locus L 2 that crosses the line L of the hole shape up to a scanning locus L 1 that is deviated toward the machining start point O side (inside in the drawing).
その後、前記レーザビームを前記走査軌跡L1
上を走査させることにより所定の形状に切抜く
が、前記レーザビームが前記点Ａに近い前記走査
軌跡L1の終了近傍である前記走査軌跡L1上の点
Ｂに戻つてくると、前記実質上の加工開始点A1
まで前記仮想円Ｎの中を前記穴形状の線Ｌを横切
る第２の所定軌跡L3に沿つて前記レーザビーム
を走査する。ここで、該レーザビームが前記実質
上の加工開始点A1よりも前の点B1（第２図参照）
に達すると、廃材となるべき脱落部材M1はその
自重を支えきれずに落下する。その際、製品側に
切欠きが生じ、前記実質上の加工開始点A1と前
記点B1との間には突出部C1が生じるが、該突出
部C1が前記穴形状の線Ｌより内側（すなわち、
製品の輪郭外）に入ることがないように、前記点
B1から前記実質上の加工開始点A1に至る前記第
２の所定軌跡L3が設定されている。 After that, the laser beam is moved along the scanning trajectory L 1
The laser beam is cut out into a predetermined shape by scanning the top, but when the laser beam returns to point B on the scanning trajectory L1 , which is near the end of the scanning trajectory L1 near the point A, the material Upper machining start point A 1
The laser beam is scanned along a second predetermined locus L3 that crosses the line L of the hole shape in the virtual circle N until the point where the laser beam scans. Here, the laser beam reaches a point B 1 before the actual processing start point A 1 (see Fig. 2).
When the falling member M1 , which is to be scrapped, is unable to support its own weight, it falls. At that time, a notch is generated on the product side, and a protrusion C 1 is generated between the actual processing start point A 1 and the point B 1 , but the protrusion C 1 is located along the line L of the hole shape. more medial (i.e.
The points mentioned above should not fall outside the outline of the product.
The second predetermined trajectory L 3 from B 1 to the actual processing start point A 1 is set.
第３図ａ，ｂ，ｃはそれぞれ仮想円Ｎの中の第
１および第２の所定軌跡L2，L3の種々の形状を
示す図で、同図ａは第１および第２の所定軌跡
L2，L3の形状が第１図に示した円弧状であると
きの例であり、同図ｂは第１および第２の所定軌
跡L2，L3の形状が直線で、かつ実質上の加工開
始点A1を頂点とする三角形の２辺をなすときの
例である。また、同図ｃは第１の所定軌跡L2の
形状が実質上の加工開始点A1と穴形状の線Ｌ上
の点Ａとを結ぶ直線であり、第２の所定軌跡L3
の形状が円弧状であるときの例である。 Figures 3a, b, and c are diagrams showing various shapes of the first and second predetermined trajectories L 2 and L 3 in the virtual circle N, respectively;
This is an example in which the shapes of L 2 and L 3 are arcuate as shown in FIG. 1, and FIG. This is an example of forming two sides of a triangle with the machining start point A1 as the vertex. In addition, in the same figure c, the shape of the first predetermined locus L2 is a straight line connecting the actual machining start point A1 and the point A on the line L of the hole shape, and the second predetermined locus L3
This is an example when the shape is an arc.
第１図に示したレーザ切断方法の一実験データ
として、脱落部材M1の形状を直径６mmの円形と
し、板状の被加工物の板厚を２mmとした場合に
は、仮想円Ｎの中の第１および第２の所定軌跡
L2，L3の形状を半径を0.12mm以上の円弧状とし、
最大突出量（点Ａと実質上の加工開始点A1との
間の距離）を0.08mm以上とすれば、突出部C1は穴
形状の線Ｌより内側（脱落部材M1側）には突出
しないことが確認された。 As one experimental data of the laser cutting method shown in Fig. 1, when the shape of the falling part M1 is a circle with a diameter of 6 mm, and the thickness of the plate-shaped workpiece is 2 mm, the inside of the virtual circle N is the first and second predetermined trajectories of
The shapes of L 2 and L 3 are circular arcs with a radius of 0.12 mm or more,
If the maximum protrusion amount (distance between point A and actual machining start point A1 ) is 0.08 mm or more, the protrusion C1 will be located inside the line L of the hole shape (on the falling part M1 side). It was confirmed that there was no protrusion.
第４図は本発明のレーザ切断方法の第２の実施
例におけるレーザビーム走査の軌跡を示す図であ
る。 FIG. 4 is a diagram showing a trajectory of laser beam scanning in a second embodiment of the laser cutting method of the present invention.
本実施例のレーザ切断方法は、脱落部材M1を
製品として使用する場合の実施例であり、予め定
めた穴形状の線Ｌよりも製品である脱落部材M1
と反対側に加工開始点Ｏを設定し、また前記穴形
状の線Ｌよりも製品である前記脱落部材M1側の
仮想円Ｎで囲つた範囲内に、実質上の加工開始点
A1を設定している点が、第１図に示した脱落部
材M1を廃材とする場合の実施例を異なつている。 The laser cutting method of this embodiment is an example in which the falling member M1 is used as a product, and the falling member M1 , which is a product, is cut from the predetermined hole-shaped line L.
A machining start point O is set on the opposite side from
This embodiment differs from the embodiment shown in FIG. 1 in which the fallen member M 1 is disposed of as waste material in that A 1 is set.
本実施例のレーザ切断方法では、切断が開始さ
れると、レーザビームを、前記加工開始点Ｏから
前記穴形状の線Ｌ上の点Ａを介して前記実質上の
加工開始点A1まで直線的に走査したのち、該実
質上の加工開始点A1から、前記穴形状の線Ｌよ
り少なくとも加工スポツト半径ｒだけ前記加工開
始点Ｏ側（図示外側）に偏位した走査軌跡L1ま
で、前記穴形状の線Ｌを横切る第１の所定軌跡
L2に沿つて走査する。その後、前記レーザビー
ムを前記走査軌跡L1上を走査させることにより
所定の形状に切抜くが、前記レーザビームが前記
点Ａに近い前記走査軌跡L1の終了近傍である該
走査軌跡L1上の点Ｂに戻つてくると、前記実質
上の加工開始点A1まで前記仮想円Ｎの中を前記
穴形状の線Ｌを横切る第２の所定軌跡L3に沿つ
て前記レーザビームを走査する。 In the laser cutting method of this embodiment, when cutting is started, the laser beam is directed in a straight line from the processing start point O to the actual processing start point A1 via a point A on the line L of the hole shape. from the actual machining start point A 1 to a scanning locus L 1 deviated toward the machining start point O side ( outside in the drawing) by at least a machining spot radius r from the line L of the hole shape, A first predetermined locus that crosses the hole-shaped line L
Scan along L 2 . Thereafter , the laser beam is scanned on the scanning locus L1 to cut out a predetermined shape . When returning to point B, the laser beam is scanned along a second predetermined locus L3 that crosses the line L of the hole shape in the virtual circle N to the actual processing start point A1 . .
本実施例においても、レーザビームが実質上の
加工開始点A1に達する前に、製品となるべき脱
落部材M1はその自重を支えきれずに落下し、そ
の際に突出部（不図示）が生じるが、該突出部が
前記穴形状の線Ｌより外側（すなわち、製品の輪
郭外）に入ることがなように、第２の所定軌跡
L3が設定されている。 In this embodiment as well, before the laser beam reaches the actual processing start point A1 , the falling part M1 , which is to become a product, cannot support its own weight and falls, and at that time, the protruding part (not shown) occurs, but the second predetermined trajectory is set so that the protrusion does not go outside the line L of the hole shape (i.e., outside the contour of the product).
L 3 is set.
［発明の効果］
本発明は、上記のとおり構成されているので、
次に記載する効果を奏する。[Effect of the invention] Since the present invention is configured as described above,
This produces the following effects.
走査軌跡の終了近傍において、レーザビームを
走査軌跡から実質上の加工開始点まで穴形状の線
を横切る第２の所定軌跡に沿つて走査することに
より、前記レーザビームが前記実質上の加工開始
点に戻る手前で脱落部材がその自重により落下す
る際に、製品側に切欠きが生じるように前記レー
ザビームを走査することができるので、前記製品
の輪郭外へ突出する突出部が生じることがないた
め、該突出部をさらに追加工により切断する必要
がなく、突出部を切断する作業工程を省略するこ
とができるという効果がある。 Near the end of the scanning locus, the laser beam is scanned along a second predetermined locus that crosses the line of the hole shape from the scanning locus to the actual machining start point, so that the laser beam reaches the actual machining start point. Since the laser beam can be scanned so that a notch is created on the product side when the falling member falls due to its own weight before returning to the product, no protrusion protrudes outside the outline of the product. Therefore, there is no need to further cut the protruding part by additional machining, and there is an effect that the work step of cutting the protruding part can be omitted.
第１図は本発明のレーザ切断方法の第１の実施
例におけるレーザビーム走査の軌跡を示す図、第
２図は第１図のレーザ切断方法により穿孔された
穴の形状を示す図、第３図は第１および第２の所
定軌跡の種々の形状を示す図であり、ａは第１お
よび第２の所定軌跡の形状が第１図に示した円弧
状であるときの例を示す図、ｂは第１および第２
の所定軌跡の形状が直線で、かつ実質上の加工開
始点を頂点とする三角形の２辺をなすときの例を
示す図、ｃは第１の所定軌跡の形状が直線であ
り、第２の所定軌跡の形状が円弧状であるときの
例を示す図、第４図は本発明のレーザ切断方法の
第２の実施例におけるレーザビーム走査の軌跡を
示す図、第５図は従来のレーザ切断方法における
レーザビーム走査の軌跡を示す図、第６図は被加
工物に穿孔された穴の形状を示す図である。
Ｌ…穴形状の線、L1…走査軌跡、L2…第１の
所定軌跡、L3…第２の所定軌跡、Ｏ…加工開始
点、Ａ，Ｂ，B1…点、A1…実質上の加工開始点、
C1…突出部、Ｎ…仮想円、ｒ…加工スポツト半
径、M1…脱落部材。
FIG. 1 is a diagram showing the locus of laser beam scanning in a first embodiment of the laser cutting method of the present invention, FIG. 2 is a diagram showing the shape of a hole drilled by the laser cutting method of FIG. 1, and FIG. The figures are diagrams showing various shapes of the first and second predetermined trajectories, and a is a diagram illustrating an example when the shapes of the first and second predetermined trajectories are circular arcs shown in FIG. b is the first and second
Figure c shows an example where the shape of the predetermined locus is a straight line and forms two sides of a triangle whose apex is the actual machining start point. A diagram showing an example when the shape of the predetermined trajectory is an arcuate shape, FIG. 4 is a diagram showing the trajectory of laser beam scanning in the second embodiment of the laser cutting method of the present invention, and FIG. A diagram showing the locus of laser beam scanning in the method, and FIG. 6 is a diagram showing the shape of a hole drilled in a workpiece. L...Line of hole shape, L1 ...Scanning locus, L2 ...First predetermined locus, L3 ...Second predetermined locus, O...Machining start point, A, B, B1 ...Point, A1 ...Substance Upper processing start point,
C 1 ...protruding part, N...imaginary circle, r...processing spot radius, M 1 ...falling member.
Claims (1)
ムを走査して板状の被加工物を切抜くレーザ切断
方法において、 加工開始点Ｏを前記穴形状の線Ｌよりも製品と
反対側に設定し、 実質上の加工開始点A1を前記穴形状の線Ｌよ
りも前記製品側に設定し、 前記レーザビームを、 前記加工開始点Ｏから前記実質上の加工開始点
A1まで走査したのち、 該実質上の加工開始点A1から、前記穴形状の
線Ｌより少なくとも加工スポツト半径ｒだけ前記
加工開始点Ｏ側に偏位した走査軌跡L1まで、前
記穴形状の線Ｌを横切る第１の所定軌跡L2に沿
つて走査して、 その後、前記走査軌跡L1上を走査させたのち、 該走査軌跡L1の終了近傍において、該走査軌
跡L1から前記実質上の加工開始点A1まで前記穴
形状の線Ｌを横切る第２の所定軌跡L3に沿つて
走査することを特徴とするレーザ切断方法。[Claims] 1. In a laser cutting method in which a plate-shaped workpiece is cut by scanning a laser beam along a line L of a predetermined hole shape, the processing start point O is set from the line L of the hole shape. is also set on the side opposite to the product, and a practical machining start point A1 is set closer to the product than the line L of the hole shape, and the laser beam is directed from the machining start point O to the actual machining start point. point
After scanning to A1 , the hole shape is scanned from the actual machining start point A1 to a scanning locus L1 that is deviated from the line L of the hole shape by at least a machining spot radius r toward the machining start point O side. After scanning along a first predetermined locus L2 that intersects the line L of A laser cutting method characterized by scanning along a second predetermined locus L3 that crosses the line L of the hole shape up to a substantial processing start point A1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61247447A JPS63104793A (en) | 1986-10-20 | 1986-10-20 | Laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61247447A JPS63104793A (en) | 1986-10-20 | 1986-10-20 | Laser cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63104793A JPS63104793A (en) | 1988-05-10 |
| JPH0257477B2 true JPH0257477B2 (en) | 1990-12-05 |
Family
ID=17163577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61247447A Granted JPS63104793A (en) | 1986-10-20 | 1986-10-20 | Laser cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63104793A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014171325A1 (en) * | 2013-04-19 | 2014-10-23 | 村田機械株式会社 | Laser processor and hole-opening processing method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06179092A (en) * | 1992-12-14 | 1994-06-28 | Fanuc Ltd | Method and device for laser beam machining by laser robot |
| JPH06269967A (en) * | 1993-03-25 | 1994-09-27 | Fanuc Ltd | Method and device for laser beam machining |
| WO2023124288A1 (en) * | 2021-12-30 | 2023-07-06 | 深圳市创客工场科技有限公司 | Motion control method and apparatus in desktop smart laser device, and device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921286A (en) * | 1982-05-27 | 1984-02-03 | エヌ・ベ−・フィリップス・フル−イランペンファブリケン | High frequency oscillator/inverter |
-
1986
- 1986-10-20 JP JP61247447A patent/JPS63104793A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921286A (en) * | 1982-05-27 | 1984-02-03 | エヌ・ベ−・フィリップス・フル−イランペンファブリケン | High frequency oscillator/inverter |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014171325A1 (en) * | 2013-04-19 | 2014-10-23 | 村田機械株式会社 | Laser processor and hole-opening processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63104793A (en) | 1988-05-10 |
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