JPH02108484A - Method for forming hole by laser beam - Google Patents
Method for forming hole by laser beamInfo
- Publication number
- JPH02108484A JPH02108484A JP63259970A JP25997088A JPH02108484A JP H02108484 A JPH02108484 A JP H02108484A JP 63259970 A JP63259970 A JP 63259970A JP 25997088 A JP25997088 A JP 25997088A JP H02108484 A JPH02108484 A JP H02108484A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- hole
- workpiece
- cutting
- starting position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 4
- 238000007790 scraping Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明はレーザ光線による被加工物のレーザ加工方法に
関し、より詳しくはレーザ光線によって被加工物に穴を
形成する方法に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method of laser processing a workpiece using a laser beam, and more particularly to a method of forming a hole in a workpiece using a laser beam.
「従来の技術」
従来から炭酸ガスレーザ加工機によフて被加工物に穴を
形成することは広く行われている。被加工物に穴を形成
する場合には、通常は加工テーブル上に被加工物を載置
した後、フォーカスヘッドから該被加工物に向けてアシ
ストガスを噴射しながらレーザ光線を照射して、切断す
べき仮想円の内側に貫通孔を穿設する。"Prior Art" Conventionally, it has been widely used to form holes in a workpiece using a carbon dioxide gas laser processing machine. When forming a hole in a workpiece, the workpiece is usually placed on a processing table, and then a laser beam is irradiated onto the workpiece while injecting assist gas from a focus head. A through hole is drilled inside the virtual circle to be cut.
次に、レーザ光線を照射したまま上記フォーカスヘッド
と被加工物とを相対移動させてレーザ光線を上記仮想円
上の所定切断開始位置まで移動させ、さらに引続きレー
ザ光線を当該仮想同上に沿って移動させ、該レーザ光線
が再び上記開始位置となるまで連続移動させて上記被加
工物に穴を形成するようにしている。Next, while irradiating the laser beam, the focus head and the workpiece are moved relative to each other to move the laser beam to a predetermined cutting start position on the virtual circle, and then continue to move the laser beam along the virtual circle. Then, the laser beam is continuously moved until it reaches the starting position again to form a hole in the workpiece.
「発明が解決しようとする課題」
しかしながら、例えば板厚が厚い木材にレーザ光線で穴
を形成する場合には、最初の切断開始位置に連なる切断
終了位置に、大側に突出する小さな凸部が残存すること
があった。``Problem to be Solved by the Invention'' However, for example, when forming a hole in a thick piece of wood using a laser beam, a small protrusion protruding toward the larger side is created at the cutting end position that is connected to the initial cutting start position. Sometimes it remained.
すなわち一般に、レーザ光線によフて被加工物を切断す
る際には、フォーカスヘッドに内蔵した集光レンズの焦
点位置を被加工物の表面にほぼ−致させ、その部分のレ
ーザ光線のエネルギ密度が大きくなるようにしている。In other words, generally when cutting a workpiece with a laser beam, the focal position of the condensing lens built into the focus head is brought approximately to the surface of the workpiece, and the energy density of the laser beam at that part is adjusted. I'm trying to make it bigger.
その結果、レーザ光線は、集光レンズの焦点位置となる
被加工物の表面から裏面にかけて開拡するようになるた
め、被加工物の表面の切断幅よりも裏面の切断幅の方が
大きくなる。したがフて丸穴を形成した際の切断面は、
下方が開拡した円錐面となる。As a result, the laser beam spreads out from the front side of the workpiece, which is the focus position of the condensing lens, to the back side, so the cutting width on the back side of the workpiece is larger than the cutting width on the front side of the workpiece. . However, the cut surface when forming a circular hole is
The lower part becomes a conical surface that expands.
この場合には、上記円錐面に上述した六個に突出する小
さな凸部が残存することはないが、上記木材がダンボー
ル等の切抜きを行うのに使用されるダイボードであって
、かつ上記穴がダイボードに円筒状の切断刃を嵌合する
ための丸穴である場合には、円筒状の切断刃は円錐面を
有する丸穴に嵌合されるようになるので切断刃ががた付
き易くなり、好ましくない。In this case, the six small protrusions mentioned above will not remain on the conical surface, but if the wood is a die board used for cutting out cardboard etc., and the holes are If the die board has a round hole for fitting a cylindrical cutting blade, the cylindrical cutting blade will fit into the round hole with a conical surface, making it easy for the cutting blade to wobble. , undesirable.
上記丸穴の内周面が可及的に円柱面となるように切断す
るには、比較的高速度で被加工物を切断するようにすわ
ばよい。すなわち、この場合であってもレーザ光線は被
加工物の表面から裏面にかけて開拡しているが、切断面
は切断部に向けて噴射されるアシストガスの流れに大き
く影晋されるため、アシストガスが被加工物の裏面に、
表面側の切断幅と同程度の切断幅で貫通した時点でレー
ザ光線を被加工物に対して相対移動させるようにその相
対移動速度を設定すれば、丸穴の内周面を可及的に円柱
面とすることができる。In order to cut the inner circumferential surface of the round hole to be as cylindrical as possible, the workpiece may be cut at a relatively high speed. In other words, even in this case, the laser beam spreads out from the front side to the back side of the workpiece, but the cut surface is greatly affected by the flow of assist gas injected toward the cutting part, so the assist Gas is applied to the back side of the workpiece,
By setting the relative movement speed so that the laser beam moves relative to the workpiece when it penetrates with a cutting width similar to the cutting width on the surface side, the inner peripheral surface of the round hole can be cut as much as possible. It can be a cylindrical surface.
しかしながらこの場合には、被加工物の裏面側の切断が
表面側の切断よりも遅れるので、表面の切断位置が再び
開始位置に戻った瞬間には、裏面の切断位置は開始位置
の寸前位置となる。そして裏面側の切断が元の開始位置
に連続した瞬間にアシストガスが切断終了側から切断開
始側に流れるので、その切断終了位置のアシストガス圧
が不足して燃焼効率が低下する。その結果、裏面側のそ
の部分における切断幅が狭くなるので、上述した小さな
凸部が形成され、そのような凸部はやはり切断刃のがた
付きの原因となっていた。However, in this case, the cutting on the back side of the workpiece is delayed than the cutting on the front side, so the moment the cutting position on the front side returns to the starting position, the cutting position on the back side will be at a position just before the starting position. Become. The assist gas flows from the cutting end side to the cutting start side at the moment when the cutting on the back side continues to the original starting position, so that the assist gas pressure at the cutting ending position becomes insufficient and the combustion efficiency decreases. As a result, the cutting width at that portion on the back side becomes narrower, resulting in the formation of the above-mentioned small protrusion, and such a protrusion also causes the cutting blade to wobble.
上記穴の内周面に形成された小さな凸部は、レーザ光線
によって削り落すことができるが、該凸部のみを削り落
すようにした場合には、削り落した部分とこれに連続す
る他の部分との境目に僅かな段部が形成されるようにな
り、好ましくない。The small protrusion formed on the inner circumferential surface of the hole can be scraped off with a laser beam, but if only the protrusion is scraped off, the scraped part and the other A slight step is formed at the boundary between the parts, which is not desirable.
他方、レーザ光線を上記穴の仮想円上で2周させること
によって、1周目に形成された凸部を2周目で削り落す
ことも可能である。この場合には、穴の内周面を滑らか
に形成することができるが、レーザ光線が同−軌跡上を
たどるため、該レーザ光線を相対的に低速度で移動させ
た場合と同様に、穴の切断面が下方が開拡した円錐面と
なってしまうという欠点がある。On the other hand, by making the laser beam go around twice on the virtual circle of the hole, it is also possible to shave off the convex portion formed in the first round in the second round. In this case, the inner circumferential surface of the hole can be formed smoothly, but since the laser beam follows the same trajectory, the hole can be formed smoothly in the same way as when the laser beam is moved at a relatively low speed. The disadvantage is that the cut surface becomes a conical surface that is widened at the bottom.
「課題を解決するための手段」
本発明は上述した事情に鑑み、レーザ光線を被加工物の
切断開始位置に照射して該被加工物を切断するとともに
、該レーザ光線を再び上記開始位置となるまで連続移動
させて上記被加工物に穴を形成し、引続き上記レーザ光
線を、上記開始位置から再び開始位置となるまで上記穴
の切断面を削り落しながら移動させて該穴を所要の大き
さの穴に成形するようにしたものである。"Means for Solving the Problems" In view of the above-mentioned circumstances, the present invention is directed to cutting the workpiece by irradiating a laser beam to the cutting start position of the workpiece, and returning the laser beam to the above-mentioned start position. The laser beam is continuously moved until it reaches the starting position to form a hole in the workpiece, and the laser beam is then moved from the starting position to the starting position again while scraping off the cut surface of the hole to make the hole a desired size. It was designed to be molded into a hole.
「作用」
上記構成によれば、比較的高速度で被加工物を切断する
ことによって穴の内周面に生じた小さな凸部は、引続き
レーザ光線で六の切断面を削り落すことによって同時に
削り落すことができ、しかもその際、レーザ光線を上記
穴の切断面を削り落しながら該穴を所要の大きさの穴に
成形しているので、該穴の内周面が滑らかに連続すると
と同時に、穴の内周面を可及的にレーザ光線の光軸に平
行な平面とすることが可能となる。"Operation" According to the above configuration, the small convexity that is generated on the inner peripheral surface of the hole by cutting the workpiece at a relatively high speed is simultaneously removed by scraping off the six cut surfaces with a laser beam. Moreover, since the laser beam is used to scrape down the cut surface of the hole and form the hole into a hole of the required size, the inner circumferential surface of the hole is smooth and continuous. , it is possible to make the inner circumferential surface of the hole as flat as possible parallel to the optical axis of the laser beam.
「実施例」
以下図示実施例について本発明を説明すると、第3図に
おいて、従来周知の構成を備えた炭酸ガスレーザ加工機
1は、被加工物2を載置して水平面上のX方向およびそ
れと直交するY方向に移動可能なワークテーブル3を備
えるとともに、そのワークテーブル3の上方に、鉛直方
向であるZ方向に昇降可能なフォーカスヘッド4を備え
ている。``Example'' The present invention will be described below with reference to an illustrated example. In FIG. 3, a carbon dioxide laser processing machine 1 having a conventionally well-known configuration is configured to place a workpiece 2 on a horizontal surface in the X direction and A work table 3 is provided that is movable in the orthogonal Y direction, and a focus head 4 that is movable in the vertical Z direction is provided above the work table 3.
上記ワークテーブル3のX−Y方向の移動、並びにフォ
ーカスヘッド4のZ方向の移動はそれぞれ制御装置5に
よって制御されるようになっており、ワークテーブル3
上の被加工物2はレーザ光線りに対して水平面上でX−
Y方向に相対移動され、第1図に示すように、所要の直
径を有する円形の穴6が形成されるようになっている。The movement of the work table 3 in the X-Y direction and the movement of the focus head 4 in the Z direction are each controlled by a control device 5.
The upper workpiece 2 is placed on the horizontal plane with respect to the laser beam.
It is relatively moved in the Y direction, and as shown in FIG. 1, a circular hole 6 having a desired diameter is formed.
上記穴6を形成する際には、先ず形成すべき穴6の内側
の所要位置にレーザ光線りを照射して貫通孔7を穿設し
、次にレーザ光線りを上記形成すべき穴6上の所定切断
開始位置Aに移動させたら、そこから上記穴6よりも僅
かに小径かつ円形に、再び上記開始位置Aとなるまで1
周移動させ、それによって小径の六8を形成する。When forming the hole 6, first, a laser beam is irradiated at a predetermined position inside the hole 6 to be formed to form a through hole 7, and then a laser beam is radiated onto the hole 6 to be formed. After moving to the predetermined cutting start position A, from there, cut the hole 6 in a circular shape with a slightly smaller diameter than the hole 6 until it reaches the start position A again.
It is moved circumferentially, thereby forming a small diameter 68.
この際、上記レーザ光線りを被加工物2に対して相対的
に高速で移動させることにより、第2図に示すように、
レーザ光線りは本来的には図示しない集光レンズの焦点
位置となる被加工物2の表面近傍から裏面にかけて開拡
するにも拘らず(想像線参照)、アシストガスの流れに
よって六8の内周面を可及的に円柱面とすることができ
る。At this time, by moving the laser beam at a high speed relative to the workpiece 2, as shown in FIG.
Although the laser beam originally spreads out from near the surface of the workpiece 2, which is the focal point of the condensing lens (not shown), to the back surface (see imaginary line), the flow of the assist gas causes the laser beam to spread out within 68 degrees. The circumferential surface can be made into a cylindrical surface as much as possible.
しかしながらその反面、第1図に示すように上記穴8の
内周面に、レーザ光線りが開始位置Aから1周してその
再び開始位置Aとなる寸前位置に、六8側に突出する小
さな凸部9が残存するようになる。However, on the other hand, as shown in FIG. The convex portion 9 will remain.
次に、上記レーザ光線りを開始位置Aから再び開始位置
Aとなるまで1周させて上記穴8を形成したら、引続き
その開始位置Aから上記穴8を形成したのとは逆回りに
、つまり第1図の反時計方向にレーザ光線りを移動させ
、再度開始位置Aとなるまで上記穴8の切断面および上
記凸部9を削り落しながら移動させて該穴8を所要の大
きさの穴6に成形する。Next, once the hole 8 is formed by making the laser beam go around once from the starting position A to the starting position A again, continue from the starting position A in the opposite direction to that in which the hole 8 was formed, i.e. The laser beam is moved counterclockwise in FIG. 1, and the cut surface of the hole 8 and the convex portion 9 are scraped off until the laser beam reaches the starting position A again. Shape into 6 pieces.
したがって上記穴8の切断開始位置Aと穴6の切断開始
位置Aとは同一位置となり、六8は穴6に切断開始位置
Aにおいて内接するようになる。Therefore, the cutting start position A of the hole 8 and the cutting start position A of the hole 6 are at the same position, and the six 8 comes to be inscribed in the hole 6 at the cutting start position A.
このようにして形成した穴6の内周面は、穴6の仮想円
上に沿うレーザ光線りの連続した移動によって上記凸部
9のない滑らかな面となり、しかも六8の切断面を削り
落すようにして形成しているので、六6の仮想円上を2
周させた場合のように円錐面となることがなく、その内
周面を可及的に円柱面に形成することができる。The inner circumferential surface of the hole 6 thus formed becomes a smooth surface without the above-mentioned convex part 9 by continuous movement of the laser beam along the virtual circle of the hole 6, and the cut surface of the hole 68 is shaved off. Since it is formed in this way, 2
The inner circumferential surface can be formed into a cylindrical surface as much as possible without forming a conical surface unlike in the case where it is circumferential.
また、上記穴8の内周面を削り落す幅Wは、穴6の内周
面が円錐面とならない程度に大きくする必要があるが、
六8の内周面を削り落せないほど大きくすると、その切
断線が再び六8の内周面と連続する際にその連続部が滑
らかに連続しなくなるので、そのようなことのない範囲
に設定する必要がある。−例として、被加工物が180
1[+1厚のダイボードの場合、切断幅Wは約0.2m
mが好適であった。Furthermore, the width W of the inner circumferential surface of the hole 8 needs to be large enough to prevent the inner circumferential surface of the hole 6 from becoming a conical surface.
If the inner peripheral surface of the 68 is made so large that it cannot be scraped off, when the cutting line continues with the inner periphery of the 68, the continuous part will not continue smoothly, so set it in a range that will not cause such a problem. There is a need to. - As an example, if the workpiece is 180
In the case of a die board with a thickness of 1 [+1], the cutting width W is approximately 0.2 m.
m was suitable.
なお、第4図は本発明の第2実施例を示したもので、こ
の第2実施例においては、レーザ光線りを時計方向に移
動させて六8を形成した後に、レーザ光線りをさらに同
一方向に移動させて該穴8の内周面を削り落し、それに
よって凸部9を削り落すとともに、穴6を形成するよう
にしたものである。In addition, FIG. 4 shows a second embodiment of the present invention. In this second embodiment, after moving the laser beam clockwise to form 68, the laser beam is further moved in the same direction. The inner peripheral surface of the hole 8 is scraped off by moving in the direction, thereby scraping off the protrusion 9 and forming the hole 6.
この第2実施例によっても、上記第1実施例と同様の作
用効果を得ることができる。This second embodiment also provides the same effects as the first embodiment.
「発明の効果」
以上のように、本発明によれば、被加工物が例えば板厚
の厚い木材等であっても、内周面が滑らかで、しかも可
及的にレーザ光線の光軸に平行な平面となる穴を形成す
ることができると言う効果が得られる。"Effects of the Invention" As described above, according to the present invention, even if the workpiece is a thick wooden board, the inner peripheral surface is smooth and the optical axis of the laser beam is as close as possible to the workpiece. This provides the advantage of being able to form holes with parallel planes.
第1図は本発明の一実施例を示す平面図、第2図は第1
図のn−n線に沿う拡大断面図、第3図は従来周知の炭
酸ガスレーザ加工機を示す斜視図、第4図は本発明の他
の実施例を示す平面図である。
1・・・炭酸ガスレーザ加工機 2・−・被加工物6.
8・・・穴 9・・・凸部A・・・切断
開始位置 L・−・レーザ光線W・・・切断幅Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
FIG. 3 is a perspective view showing a conventionally known carbon dioxide laser processing machine, and FIG. 4 is a plan view showing another embodiment of the present invention. 1... Carbon dioxide laser processing machine 2... Workpiece 6.
8... Hole 9... Protrusion A... Cutting start position L... Laser beam W... Cutting width
Claims (1)
工物を切断するとともに、該レーザ光線を再び上記開始
位置となるまで連続移動させて上記被加工物に穴を形成
し、引続き上記レーザ光線を、上記開始位置から再び開
始位置となるまで上記穴の切断面を削り落しながら移動
させて該穴を所要の大きさの穴に成形することを特徴と
するレーザ光線による穴の形成方法。The laser beam is irradiated to the cutting start position of the workpiece to cut the workpiece, and the laser beam is continuously moved again until the cutting start position is reached to form a hole in the workpiece, and then the A method for forming a hole using a laser beam, characterized in that the laser beam is moved from the starting position to the starting position again while scraping off the cut surface of the hole, thereby forming the hole into a hole of a desired size. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63259970A JPH02108484A (en) | 1988-10-14 | 1988-10-14 | Method for forming hole by laser beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63259970A JPH02108484A (en) | 1988-10-14 | 1988-10-14 | Method for forming hole by laser beam |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02108484A true JPH02108484A (en) | 1990-04-20 |
JPH0364236B2 JPH0364236B2 (en) | 1991-10-04 |
Family
ID=17341456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63259970A Granted JPH02108484A (en) | 1988-10-14 | 1988-10-14 | Method for forming hole by laser beam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02108484A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5658474A (en) * | 1994-12-16 | 1997-08-19 | Alza Corporation | Method and apparatus for forming dispenser delivery ports |
US5837964A (en) * | 1998-01-16 | 1998-11-17 | Chromalloy Gas Turbine Corporation | Laser drilling holes in components by combined percussion and trepan drilling |
US5856649A (en) * | 1994-02-25 | 1999-01-05 | Fanuc Ltd. | Laser beam machine |
EP1291117A1 (en) * | 2001-09-07 | 2003-03-12 | Siemens Aktiengesellschaft | Method and apparatus for producing a hole in a workpiece with a laser beam |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5220719A (en) * | 1975-08-11 | 1977-02-16 | Kuniaki Miyazawa | Television system |
JPS5724464U (en) * | 1980-07-17 | 1982-02-08 |
-
1988
- 1988-10-14 JP JP63259970A patent/JPH02108484A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5220719A (en) * | 1975-08-11 | 1977-02-16 | Kuniaki Miyazawa | Television system |
JPS5724464U (en) * | 1980-07-17 | 1982-02-08 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5856649A (en) * | 1994-02-25 | 1999-01-05 | Fanuc Ltd. | Laser beam machine |
US5658474A (en) * | 1994-12-16 | 1997-08-19 | Alza Corporation | Method and apparatus for forming dispenser delivery ports |
US5698119A (en) * | 1994-12-16 | 1997-12-16 | Alza Corporation | Apparatus for forming dispenser delivery ports |
US5837964A (en) * | 1998-01-16 | 1998-11-17 | Chromalloy Gas Turbine Corporation | Laser drilling holes in components by combined percussion and trepan drilling |
EP1291117A1 (en) * | 2001-09-07 | 2003-03-12 | Siemens Aktiengesellschaft | Method and apparatus for producing a hole in a workpiece with a laser beam |
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JPH0364236B2 (en) | 1991-10-04 |
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