CN113163598A - Processing method of circuit board with half hole and half hole circuit board - Google Patents
Processing method of circuit board with half hole and half hole circuit board Download PDFInfo
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- CN113163598A CN113163598A CN202010012663.0A CN202010012663A CN113163598A CN 113163598 A CN113163598 A CN 113163598A CN 202010012663 A CN202010012663 A CN 202010012663A CN 113163598 A CN113163598 A CN 113163598A
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- 238000003672 processing method Methods 0.000 title claims abstract description 25
- 238000003801 milling Methods 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 55
- 238000012545 processing Methods 0.000 claims abstract description 28
- 230000008569 process Effects 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims description 27
- 238000013461 design Methods 0.000 claims description 23
- 230000000717 retained effect Effects 0.000 claims description 10
- 238000005553 drilling Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 33
- 229910052802 copper Inorganic materials 0.000 abstract description 33
- 239000010949 copper Substances 0.000 abstract description 33
- 238000004519 manufacturing process Methods 0.000 abstract description 32
- 239000002893 slag Substances 0.000 abstract description 17
- 238000005530 etching Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/02—Milling surfaces of revolution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2220/00—Details of milling processes
- B23C2220/48—Methods of milling not otherwise provided for
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Milling Processes (AREA)
Abstract
The embodiment of the invention provides a processing method of a circuit board with a half hole and the circuit board with the half hole, wherein the processing method of the circuit board with the half hole comprises the following steps: providing a circuit board with a through hole, determining to reserve a half hole and to remove the half hole, adopting a first type milling cutter with a first rotating direction, carrying out first fishing on the shape along a first feeding direction at the middle part of the half hole to be removed, adopting a second type milling cutter with a second rotating direction, carrying out second fishing on the shape along a second feeding direction at the middle part of the half hole to be removed. The processing method of the circuit board with the half-hole and the half-hole circuit board provided by the invention can effectively remove copper slag in the half-hole processing process, effectively shorten the production flow of products, reduce the production cost of the products, shorten the online manufacturing period of the products, effectively ensure the integrity of the 180-degree half-hole pattern, reduce the risk of specification tolerance in the production process of the products and improve the quality reliability in the production process of the products.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a processing method of a circuit board with a half hole and the half hole circuit board.
Background
With the continuous development of electronic information technology, the design of circuit board products is more and more diversified, and the requirements of different functions and personalized design can be met. In order to continuously enrich the functions of terminal products and improve the performance experience of the products, circuit boards gradually develop towards high-end HDI (high density interconnect) and other characteristic structure products, and have the characteristics of hole structure miniaturization, circuit densification, stacked structure lightness and thinness and the like.
The circuit board with the half-hole is a non-conventional circuit board product designed for providing a larger welding area for electronic products, the characteristics of high-end HDI products are integrated in the product design process, the circuit design is more and more dense, the circuit grade is more and more high, the half-hole aperture design is less and more, and the like. In the prior art, a method for processing a circuit board with a half hole mainly comprises the step of biting copper slag at the edge of the hole by adopting an alkaline etching process after forming and fishing the half hole so as to achieve the purpose of removing the copper slag in the hole.
However, after the half-hole is formed and fished, the copper slag is removed by adopting an alkaline etching process, the whole circuit board needs to be subjected to alkaline etching, the surface copper layer, the circuit shape and the half-hole are bitten along the copper layer in the process, quality abnormalities such as short circuit and poor etching can occur, the success rate is unstable, the processing method has a long processing flow and high cost, and the product delivery cycle is seriously influenced.
Disclosure of Invention
The embodiment of the invention provides a processing method of a circuit board with a half hole and the half hole circuit board, which are used for solving the technical problems of abnormal quality, high processing cost, long lead cycle and the like of the circuit board in the processing of the half hole of the circuit board.
In order to achieve the above object, in one aspect, the present invention provides a method for processing a circuit board having a half hole, including: providing a circuit board with a through hole, and determining a half hole to be reserved and a half hole to be removed.
Adopting a first type milling cutter with a first rotating direction, carrying out first fishing on the middle part of the half hole to be removed along a first feeding direction, and adopting a second type milling cutter with a second rotating direction, carrying out second fishing on the middle part of the half hole to be removed along a second feeding direction.
The first rotating direction is opposite to the second rotating direction, the first feeding direction is opposite to the second feeding direction, the first rotating direction and the first feeding direction are matched and arranged to generate cutting force, and the second rotating direction and the second feeding direction are matched and arranged to generate cutting force.
Specifically, the first rotation direction and the first feeding direction are arranged in a matching manner, and specifically include: the half hole to be reserved is positioned at the lower side of the half hole to be removed, the first feeding direction is from right to left, the first rotating direction is clockwise, and the first milling cutter is a right-handed cutter; or, the first feeding direction is from left to right, the first rotating direction is counterclockwise, and the first type milling cutter is a left-handed cutter.
In particular, the cutting edges of the milling cutter of the first kind and the milling cutter of the second kind are flush with the boundary line between the half-hole to be retained and the half-hole to be removed.
Specifically, the through hole is a circular hole, the half hole to be reserved and the half hole to be removed are respectively semicircular holes, and the cutting edges of the first type milling cutter and the second type milling cutter are flush with the diameter of the through hole.
Optionally, the first and second kinds of milling cutters have a diameter larger than a radius of the through-hole.
Specifically, before the step of performing the first scooping, the method further comprises: and determining the first feeding direction, and selecting the first type milling cutter according to the first feeding direction.
Before the step of performing the second forming fishing, the method further comprises the following steps: and determining the second feeding direction, and selecting the second type milling cutter according to the second feeding direction.
Specifically, before carrying out first drag for the shape still include: and fishing the connecting inner grooves among the plurality of design units of the circuit board to form a plurality of independent design units with the through holes.
Optionally, after the performing the second scooping, the method further includes: and finishing the connecting inner groove, and fishing out the residual edges around the design unit.
Specifically, the providing of the circuit board with the through hole specifically includes: and drilling a plurality of through holes with preset diameters at preset positions of the circuit board by adopting a drilling process.
The processing method of the circuit board with the half holes, provided by the embodiment of the invention, comprises the steps of determining the half holes to be reserved and the half holes to be removed, adopting a first type milling cutter with a first rotating direction, carrying out first fishing from the middle parts of the half holes to be removed along a first feeding direction, adopting a second milling cutter with a second rotating direction, carrying out second fishing from the middle parts of the half holes to be removed along a second feeding direction, wherein copper scraps generated by cutting can be rolled out of the half holes to be reserved along with the rotating milling cutter by the first fishing and the second fishing, so as to ensure that no copper slag is adhered to the half holes to be reserved, the method can effectively remove the copper slag in the half hole processing process, effectively shorten the production flow of products, reduce the production cost of the products, shorten the online manufacturing period of the products, effectively ensure the specification integrity of 180-degree half hole patterns, and reduce the tolerance risk in the production process of the products, the quality reliability in the production process of the product is improved.
In another aspect, the invention provides a half-hole circuit board manufactured by the processing method of the circuit board with the half-hole.
The processing method of the circuit board with the half hole mainly comprises the following steps: providing a circuit board with a through hole, and determining a half hole to be reserved and a half hole to be removed. And adopting a first type milling cutter with a first rotating direction to perform first-time fishing from the middle part of the half hole to be removed along a first feeding direction. And adopting a second type milling cutter with a second rotating direction to carry out secondary shape fishing along a second feeding direction from the middle part of the half hole to be removed.
The first rotating direction is opposite to the second rotating direction, the first feeding direction is opposite to the second feeding direction, the first rotating direction and the first feeding direction are matched and arranged to generate cutting force, and the second rotating direction and the second feeding direction are matched and arranged to generate cutting force.
The invention provides a half-hole circuit board which is manufactured by adopting the processing method of the circuit board with the half-holes, the method comprises the steps of determining the half-holes to be reserved and the half-holes to be removed, adopting a first type milling cutter with a first rotating direction, carrying out first fishing from the middle part of the half-holes to be removed along a first feeding direction, adopting a second milling cutter with a second rotating direction, carrying out second fishing from the middle part of the half-holes to be removed along a second feeding direction, wherein the first fishing and the second fishing can roll copper scraps produced by cutting out of the half-holes to be reserved along with the rotating milling cutter, so as to ensure that no copper scraps are attached in the half-holes to be reserved, the method can effectively remove the copper scraps in the half-hole processing process, effectively shorten the production flow of products, reduce the production cost of the products, shorten the online manufacturing period of the products, and effectively ensure the integrity of 180-degree half-hole pass, the risk of specification tolerance in the production process of the product is reduced, and the quality reliability in the production process of the product is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method for processing a circuit board having a half-hole according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit board with through holes;
fig. 3 is a schematic view of a first fishing shape of the method for processing a circuit board with a half-hole according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a second fishing of the method for processing a circuit board with a half-hole according to the embodiment of the present invention;
FIG. 5 is another flow chart of a method for processing a circuit board having a half-hole according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating a method for processing a circuit board having a half-hole according to an embodiment of the present invention;
fig. 7 is a flowchart of another method for processing a circuit board having a half-hole according to an embodiment of the present invention.
Description of reference numerals:
10-a through hole;
11-half wells to be preserved;
12-half-wells to be removed;
20-a first rotational direction;
30-a first kind of milling cutter;
40-a first feed direction;
50-a second rotational direction;
60-a second type of milling cutter;
70-second feed direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The existing method for forming the half hole is used for taking out copper slag by alkaline etching, and the whole circuit board needs to be subjected to alkaline etching, so that the copper layer on the surface, the circuit form and the half hole are bitten along the copper layer in the process, quality abnormalities such as short circuit and poor etching can occur, the success rate is unstable, the circuit grade and the thickness specification of the copper layer of the through hole are strictly limited, and otherwise, certain quality reliability risk exists, and the method is long in processing flow, high in cost and seriously affects the delivery cycle of the product.
In view of the above, the present invention provides a method for processing a circuit board having a half hole, wherein a first kind of milling cutter having a first rotation direction is used to perform a first scooping process along a first feeding direction from the middle of the half hole to be removed, and a second kind of milling cutter having a second rotation direction is used to perform a second scooping process along a second feeding direction from the middle of the half hole to be removed. The method can effectively remove the copper slag in the half-hole machining process, effectively shorten the production flow of the product, reduce the production cost of the product, shorten the online manufacturing period of the product, effectively ensure the integrity of the 180-degree half-hole pattern, reduce the risk of specification tolerance in the production process of the product, and improve the quality reliability in the production process of the product.
The invention is described below in connection with specific embodiments with reference to the following drawings.
Example one
Fig. 1 is a flowchart of a processing method of a circuit board with a half-hole according to an embodiment of the present invention, and referring to fig. 1, the processing method of the circuit board with a half-hole according to an embodiment of the present invention includes the following steps:
Specifically, fig. 2 is a schematic structural diagram of a circuit board with a through hole, and referring to fig. 2, in order to provide a larger solderable area for an electronic product, the circuit board with the through hole 10 needs to be cut out in half, and half is reserved, and a half-hole to be reserved 11 and a half-hole to be removed 12 are determined.
Specifically, fig. 3 is a schematic diagram of a first bailing of the processing method of the circuit board with the half-hole according to the embodiment of the present invention, and referring to fig. 3, a first kind of milling cutter 30 having a first rotation direction 20 is adopted to perform a first bailing from the middle of the half-hole 12 to be removed along a first feeding direction 40. It will be readily understood that the first type of milling cutter 30 having the first rotation direction 20 is first scooped from the middle of the half-hole 12 to be removed in the first feed direction 40, so that copper shavings generated by cutting are rolled out of the half-hole 11 to be retained with the rotating milling cutter, and it is ensured that no copper slag adheres to the half-hole 11 to be retained.
105, adopting a second milling cutter 60 with a second rotating direction 50 to perform secondary fishing from the middle part of the half-hole 12 to be removed along the second feeding direction 70;
specifically, fig. 4 is a schematic diagram of a second fishnet shape of the method for processing a circuit board with half-holes according to the embodiment of the invention, and referring to fig. 4, a second type milling cutter 60 with a second rotation direction 50 is adopted to perform a second fishnet shape along a second feed direction 70 from the middle of the half-hole 12 to be removed. It will be readily understood that the second type of milling cutter 60 having the second rotation direction 50 performs the second scooping along the second feeding direction 70 from the middle of the half-hole 12 to be removed, so that the copper scraps generated by cutting can be rolled out of the half-hole 11 to be retained along with the rotating milling cutter, and it is ensured that no copper slag adheres to the half-hole 11 to be retained.
Wherein the first rotation direction 20 and the second rotation direction 50 are opposite, the first feeding direction 40 and the second feeding direction 70 are opposite, the first rotation direction 20 and the first feeding direction 40 are arranged in a matching manner to generate a cutting force, and the second rotation direction 50 and the second feeding direction 70 are arranged in a matching manner to generate a cutting force.
Specifically, the first rotation direction 20 and the first feeding direction 40 are arranged in a matching manner to generate a cutting force, and simultaneously, copper scraps can be rolled out of the half hole 11 to be reserved along with a rotating milling cutter, so that no copper slag is attached to the half hole 11 to be reserved.
The second rotating direction 50 and the second feeding direction 70 are matched to generate cutting force, and meanwhile copper scraps can be rolled out of the half hole 11 to be reserved along with the rotating milling cutter, so that no copper slag is attached to the half hole 11 to be reserved.
In the processing method of the circuit board with the half hole provided in the above embodiment, the first rotation direction and the first feeding direction are arranged in a matching manner, and specifically includes:
the half hole to be reserved is positioned at the lower side of the half hole to be removed, the first feeding direction is from right to left, the first rotating direction is clockwise, and the first type milling cutter is a right-handed cutter; or the first feeding direction is from left to right, the first rotating direction is counterclockwise, and the first type milling cutter is a left-handed cutter.
Specifically, if the half hole to be reserved is located on the lower side of the half hole to be removed, if the first feeding direction is from right to left, the first rotating direction is clockwise, the first type of milling cutter is right-handed cutting, correspondingly, the second feeding direction is from left to right, the second rotating direction is counterclockwise, and the second type of milling cutter is left-handed cutting. If the first feeding direction is from left to right, the first rotating direction is counterclockwise, the first milling cutter is a left-handed cutter, correspondingly, the second feeding direction is from right to left, the second rotating direction is clockwise, and the second milling cutter is a right-handed cutter.
It should be noted that, if the half hole to be retained is located on the upper side of the half hole to be removed, the first feeding direction, the first rotating direction, the first type of milling cutter, the second feeding direction, the second rotating direction, and the second type of milling cutter can be inferred, and are not described herein again.
In the method for processing a circuit board having a half-hole provided in the above embodiment, the cutting edges of the first kind of milling cutter 30 and the second kind of milling cutter 60 are flush with the boundary line between the half-hole 11 to be retained and the half-hole 12 to be removed.
It is easy to understand that the cutting edges of the first kind of milling cutter 30 and the second kind of milling cutter 60 are flush with the boundary line between the half-hole 11 to be reserved and the half-hole 12 to be removed, so as to ensure that the end of the half-hole 11 to be reserved is cut smoothly, thereby improving the quality of the circuit board.
In the method for processing a circuit board having a half-hole according to the above embodiment, the through-hole 10 is a circular hole, the half-hole 11 to be retained and the half-hole 12 to be removed are respectively semicircular holes, and the cutting edges of the first-type milling cutter 30 and the second-type milling cutter 60 are flush with the diameter of the through-hole 10.
It is easy to understand that the cutting edges of the first type milling cutter 30 and the second type milling cutter 60 are flush with the boundary line between the half-hole 11 to be reserved and the half-hole 12 to be removed and the diameter of the through-hole 10, so as to ensure that the end of the half-hole 11 to be reserved is cut smoothly, and the copper scraps generated by cutting are rolled out of the half-hole 11 to be reserved along with the rotating milling cutter, so as to ensure that no copper slag is attached to the half-hole 11 to be reserved.
Optionally, the first and second kinds of milling cutters 30, 60 have a diameter larger than the radius of the through-hole 10.
It is easily understood that when the diameters of the first type milling cutter 30 and the second type milling cutter 60 are larger than the radius of the through-hole 10, the portion to be removed can be cut at one time, reducing the work flow.
Optionally, fig. 5 is another flowchart of a processing method of a circuit board with a half-hole according to an embodiment of the present invention, and referring to fig. 5, before performing the first scooping step, the method further includes:
and 102, determining a first feeding direction, and selecting a first type of milling cutter according to the first feeding direction.
Before the step of performing the second fishing, the method further comprises the following steps:
and 104, determining a second feeding direction, and selecting a second type of milling cutter according to the second feeding direction.
Specifically, a forming machine is developed, which has the functions of forward drilling (clockwise) and backward drilling (counterclockwise), and before the first forming fishing step, the program rule is designed, the first feeding direction is determined, and then the first type of milling cutter is determined according to the first feeding direction.
Before the second forming fishing step, the design rule is to determine the second feeding direction and determine the second type of milling cutter according to the second feeding direction.
Optionally, fig. 6 is a further flowchart of a processing method of a circuit board with a half-hole according to an embodiment of the present invention, and referring to fig. 6, before performing the first scooping, the method further includes:
Specifically, in order to improve the production efficiency of the circuit board, a plurality of design units need to be integrated together, then a plurality of design units are fished for shape to separate the design units, so before the shape is fished for the first time, connecting inner grooves among a plurality of design units of the circuit board need to be fished for shape, a plurality of independent design units with through holes 10 are formed, when one of the design units is fished for shape for the first time and fished for shape for the second time, the expansion and contraction and the extrusion change of the through holes 10 are prevented, the influence on the adjacent design units is avoided, and the quality reliability of the circuit board is improved.
Optionally, fig. 7 is another flowchart of a processing method of a circuit board with a half-hole according to an embodiment of the present invention, and referring to fig. 7, after performing the second scooping, the method further includes:
and 106, finishing the connecting inner groove, and fishing out the residual edges around the design unit.
It is easy to understand that after the secondary shape fishing, the residual edges around the design units are fished out, and the connecting inner grooves among the design units are refined, so that the quality reliability of the product in the production process can be further improved.
In the above embodiment, providing a circuit board with a through hole specifically includes: and drilling a plurality of through holes with preset diameters at preset positions of the circuit board by adopting a drilling process.
The processing method of the circuit board with the half holes, provided by the embodiment of the invention, comprises the steps of determining the half holes to be reserved and the half holes to be removed, adopting a first type milling cutter with a first rotating direction, carrying out first fishing from the middle parts of the half holes to be removed along a first feeding direction, adopting a second milling cutter with a second rotating direction, carrying out second fishing from the middle parts of the half holes to be removed along a second feeding direction, wherein copper scraps generated by cutting can be rolled out of the half holes to be reserved along with the rotating milling cutter by the first fishing and the second fishing, so as to ensure that no copper slag is adhered to the half holes to be reserved, the method can effectively remove the copper slag in the half hole processing process, effectively shorten the production flow of products, reduce the production cost of the products, shorten the online manufacturing period of the products, effectively ensure the specification integrity of 180-degree half hole patterns, and reduce the tolerance risk in the production process of the products, the quality reliability in the production process of the product is improved.
Example two
The embodiment of the invention also provides a half-hole circuit board which is manufactured by adopting the processing method of the circuit board with the half-hole provided by the embodiment I.
The processing method of the circuit board with the half hole comprises the following steps:
And 105, performing secondary fishing from the middle part of the half-hole 12 to be removed along the second feeding direction 70 by using a second milling cutter 60 with a second rotating direction 50.
The specific technical features of the processing method of the circuit board with the half-hole are the same as those of the first embodiment, and the same technical effects can be achieved, which are not described in detail herein.
The invention provides a half-hole circuit board which is manufactured by adopting the processing method of the circuit board with the half-holes, the method comprises the steps of determining the half-holes to be reserved and the half-holes to be removed, adopting a first type milling cutter with a first rotating direction, carrying out first fishing from the middle part of the half-holes to be removed along a first feeding direction, adopting a second milling cutter with a second rotating direction, carrying out second fishing from the middle part of the half-holes to be removed along a second feeding direction, wherein the first fishing and the second fishing can roll copper scraps produced by cutting out of the half-holes to be reserved along with the rotating milling cutter, so as to ensure that no copper slag is attached in the half-holes to be reserved, the method can effectively remove the copper slag in the half-hole processing process, effectively shorten the production flow of products, reduce the production cost of the products, shorten the online manufacturing period of the products, and effectively ensure the integrity of 180-degree half-hole patterns, the risk of specification tolerance in the production process of the product is reduced, and the quality reliability in the production process of the product is improved.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "axial", "circumferential", and the like, are used to indicate an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the invention and to simplify the description, and do not indicate or imply that the position or element referred to must have a particular orientation, be of particular construction and operation, and thus, are not to be construed as limiting the invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; may be mechanically coupled, may be electrically coupled or may be in communication with each other; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for processing a circuit board with a half-hole is characterized by comprising the following steps:
providing a circuit board with a through hole, and determining a half hole to be reserved and a half hole to be removed;
adopting a first type milling cutter with a first rotating direction to perform first fishing from the middle part of the half hole to be removed along a first feeding direction;
adopting a second type milling cutter with a second rotating direction to carry out secondary shape fishing along a second feeding direction from the middle part of the half hole to be removed;
the first rotating direction is opposite to the second rotating direction, the first feeding direction is opposite to the second feeding direction, the first rotating direction and the first feeding direction are matched and arranged to generate cutting force, and the second rotating direction and the second feeding direction are matched and arranged to generate cutting force.
2. The processing method of the circuit board with the half hole according to claim 1, wherein the first rotation direction and the first feeding direction are arranged in a matching manner, and specifically comprises:
the half hole to be reserved is positioned at the lower side of the half hole to be removed, the first feeding direction is from right to left, the first rotating direction is clockwise, and the first milling cutter is a right-handed cutter; or, the first feeding direction is from left to right, the first rotating direction is counterclockwise, and the first type milling cutter is a left-handed cutter.
3. The method as claimed in claim 1, wherein the cutting edges of the first and second milling cutters are flush with the boundary line between the half-hole to be retained and the half-hole to be removed.
4. The method as claimed in claim 3, wherein the through hole is a circular hole, the half hole to be retained and the half hole to be removed are semicircular holes, and cutting edges of the first milling cutter and the second milling cutter are flush with the diameter of the through hole.
5. The method for processing a circuit board having a half hole as set forth in claim 4, wherein said first kind of milling cutter and said second kind of milling cutter have a diameter larger than a radius of said through hole.
6. The method for processing a circuit board having a half hole as set forth in claim 1, further comprising, before the step of performing the first scooping:
determining the first feeding direction, and selecting the first type of milling cutter according to the first feeding direction;
before the step of performing the second forming fishing, the method further comprises the following steps:
and determining the second feeding direction, and selecting the second type milling cutter according to the second feeding direction.
7. The method for processing a circuit board with a half-hole according to claim 1, further comprising, before performing the first scooping:
and fishing the connecting inner grooves among the plurality of design units of the circuit board to form a plurality of independent design units with the through holes.
8. The method for processing a circuit board with a half-hole according to claim 7, wherein after the performing of the second scooping, the method further comprises:
and finishing the connecting inner groove, and fishing out the residual edges around the design unit.
9. The method for processing the circuit board with the half-hole according to claim 1, wherein the providing of the circuit board with the through hole specifically comprises: and drilling a plurality of through holes with preset diameters at preset positions of the circuit board by adopting a drilling process.
10. A half-hole circuit board manufactured by the method for processing a circuit board having a half-hole according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010012663.0A CN113163598A (en) | 2020-01-07 | 2020-01-07 | Processing method of circuit board with half hole and half hole circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010012663.0A CN113163598A (en) | 2020-01-07 | 2020-01-07 | Processing method of circuit board with half hole and half hole circuit board |
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| CN113163598A true CN113163598A (en) | 2021-07-23 |
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| CN202010012663.0A Pending CN113163598A (en) | 2020-01-07 | 2020-01-07 | Processing method of circuit board with half hole and half hole circuit board |
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| CN114793390A (en) * | 2022-04-14 | 2022-07-26 | 广东通元精密电路有限公司 | Direct milling processing method for semi-metallized hole, semi-hole printed circuit board and application |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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| CN103179791A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
| CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
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| CN103179791A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
| CN102744583A (en) * | 2012-06-30 | 2012-10-24 | 胜宏科技（惠州）股份有限公司 | PCB (Printed circuit board) semi-metallized hole forming method |
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