CN108112175A - A kind of production method and PCB of ladder groove bottom graphical PCB - Google Patents
A kind of production method and PCB of ladder groove bottom graphical PCB Download PDFInfo
- Publication number
- CN108112175A CN108112175A CN201810107793.5A CN201810107793A CN108112175A CN 108112175 A CN108112175 A CN 108112175A CN 201810107793 A CN201810107793 A CN 201810107793A CN 108112175 A CN108112175 A CN 108112175A
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- pcb
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- initial step
- copper
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to PCB technical fields, disclose a kind of production method and PCB of ladder groove bottom graphical PCB, and the production method includes：Multiple core plates are pressed to form PCB, and initial step slot is made by predeterminable area of the controlled depth milling mode on PCB, the depth of initial step slot is less than predetermined step groove depth；The cull layer in the predetermined metal line pattern region of initial step trench bottom is removed, until in the electroplating surfaces with tin of first portion's bottom copper after exposing first portion's bottom copper；The cull layer in the not tin plating region of initial step trench bottom is removed, until removing second portion bottom copper after exposing second portion bottom copper；It carries out moving back tin operation, exposes first portion's bottom copper.The embodiment of the present invention in the production process not only can accurately control the depth of stepped groove, it is made accurately to reach designated layer, and without using gasket, moreover it is possible to efficiently high-quality produces slot bottom figure, and at low cost, process is simple, and high-volume is suitble to make.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields more particularly to one kind
The production method and PCB of ladder groove bottom graphical PCB.
Background technology
With the development of science and technology electronic product indispensable articles for daily use in having become for people's lives, and PCB is electronics
The important component of product, people are more and more to the functional requirement of electronic product in recent years, and thus PCB also proposed more
High requirement.In general, for the ease of installing the device that the device of specific function or needs sink on PCB, it is often necessary to
Stepped groove is set on PCB, and stepped groove is also the pith for realizing product high-power heat-dissipation, is in industry widely used.
For the non-metallic PCB of ladder groove sidewall, there are mainly two types of production methods general at present：
One kind is controlled depth milling mode.It is bigger that this mode not only controls deep difficulty, it is difficult to by controlled depth milling to given line layer,
So as to which design requirement can not be met；And metallic circuit figure can not be made in slot bottom.
Another is the metallic circuit figure of pre-production slot bottom, then is made by the way of filling or being embedded to gasket
Stepped groove.Which not only needs to carry out gasket filling/embedment operation and gasket takes out operation, and complex manufacturing technology, operation is again
Miscellaneous difficulty is not suitable for high-volume and makes.
The content of the invention
It is an object of the invention to provide a kind of production methods and PCB of ladder groove bottom graphical PCB, overcome existing skill
Existing for art can not milling to given line layer, complex manufacturing technology and be not suitable for high-volume make the defects of.
For this purpose, the present invention uses following technical scheme：
A kind of production method of ladder groove bottom graphical PCB, including：
Multiple core plates are pressed to form PCB, and initial rank is made by the predeterminable area of controlled depth milling mode on the pcb
Terraced slot, the depth of the initial step slot are less than predetermined step groove depth；
The cull layer in the predetermined metal line pattern region of the initial step trench bottom is removed, until exposing first
In the electroplating surfaces with tin of first portion bottom copper after partial bottom copper；
The cull layer in the not tin plating region of the initial step trench bottom is removed, until after exposing second portion bottom copper
Remove second portion bottom copper；
It carries out moving back tin operation, exposes first portion bottom copper.
Optionally, the depth of the initial step slot and the difference of predetermined step groove depth are in the range of 0-3mil.
Optionally, the removing method of the cull layer includes：Carbon dioxide laser ablation, plasma etching or strong
Acid stings erosion mode.
Optionally, in the production method, after multiple core plates are pressed to form PCB, preset areas on the pcb
Before domain makes initial step slot, further include：
On the pcb, the multiple perforation PCB through hole of superficies and plating up and down are opened up, form multiple metals
Change through hole；The predeterminable area covers view field of each plated-through hole in corresponding superficies.
Optionally, the production method further includes：Removing the predetermined metal line pattern of the initial step trench bottom
While the cull layer in region, the cull layer in the predetermined orifice ring region of the initial step trench bottom is removed.
Optionally, the production method further includes：At the first portion bottom while electroplating surfaces with tin of copper, in each institute
The inner wall for stating plated-through hole is tin plating.
Optionally, the production method further includes：Outer-layer circuit figure is made on the pcb in advance, described first
In the electroplating surfaces with tin of the outer-layer circuit figure while electroplating surfaces with tin of partial bottom copper.
Optionally, in the production method, second portion bottom copper is removed using chemical etching mode.
A kind of PCB, the PCB are made according to as above any production method.
Compared with prior art, beneficial effects of the present invention are：
The embodiment of the present invention, which can produce bottom, has the stepped groove of metallic circuit figure, in the production process not only can be with
The depth of stepped groove is accurately controlled, it is made accurately to reach designated layer, and without using gasket, moreover it is possible to it is efficiently high-quality
Slot bottom figure is produced, at low cost, process is simple, and high-volume is suitble to make.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the production method flow chart for the ladder groove bottom graphical PCB that the embodiment of the present invention one provides；
Fig. 2 is the production method flow chart of ladder groove bottom graphical PCB provided by Embodiment 2 of the present invention；
Fig. 3 is the sectional view provided by Embodiment 2 of the present invention that the PCB formed is pressed by multiple core plates；
Fig. 4 is sectional views of the PCB after plated-through hole is opened up shown in Fig. 3；
Fig. 5 is sectional views of the PCB shown in Fig. 4 after initial step slot is formed；
Fig. 6 is sectional views of the PCB shown in Fig. 5 after the cull layer of removal slot bottom part；
Fig. 7 is sectional views of the PCB shown in Fig. 6 after outer graphics and first portion's bottom copper electroplating surfaces with tin；
Fig. 8 is sectional views of the PCB shown in Fig. 7 after slot bottom remainder cull layer is removed；
Fig. 9 is sectional views of the PCB shown in Fig. 8 after the copper of removal second portion bottom；
Figure 10 is sectional views of the PCB shown in Fig. 9 after tin operation is moved back.
Specific embodiment
Goal of the invention, feature, advantage to enable the present invention is more apparent and understandable, below in conjunction with the present invention
Attached drawing in embodiment is clearly and completely described the technical solution in the embodiment of the present invention, it is clear that disclosed below
Embodiment be only part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Scope.
The present invention core concept be：Be improved on the basis of traditional controlled depth milling mode, first using controlled depth milling with
The mode that laser ablation etc. is combined is made the stepped groove of designated depth, then by the modes such as laser ablation stepped groove slot bottom
Metallic circuit figure is made, simplifies entire technique, reduces production cost.
Embodiment one
Referring to Fig. 1, the production method of the ladder groove bottom graphical PCB of the present embodiment comprises the following steps：
Step 101, according to normal process flow, multiple core plates are pressed to form PCB.
Step 102, by controlled depth milling mode, the predeterminable area on PCB makes initial step slot, the initial step slot
Depth is less than predetermined step groove depth.
In this step, predetermined step groove depth is to meet the ladder groove depth of design requirement, and due to the depth of controlled depth milling
It can not accurately control, as long as thus the depth of controlled depth milling meets the condition less than predetermined step groove depth in this step.
To avoid cull layer blocked up, ensure the processing efficiency of subsequent handling, the depth of initial step slot and predetermined rank
The difference of terraced groove depth is controlled in the range of 0-3mil, i.e., the thickness of the cull layer of initial step trench bottom is 0-
3mil。
Step 103, remove initial step trench bottom predetermined metal line pattern region cull layer, until expose
First portion's bottom copper.
In this step, common process may be employed to remove the cull layer in specified region, so that initial step slot
The specified region of bottom first reaches predetermined step groove depth, exposes first portion's bottom copper, and first portion's bottom copper of the exposing is by shape
As the metallic circuit figure of slot bottom.
Specifically, the removing method of cull layer can be that carbon dioxide laser ablation, plasma etching or strong acid are stung
The modes such as erosion.
Step 104, in the outer-layer circuit figure of PCB and the electroplating surfaces with tin of first portion's bottom copper.
The tin layers by in subsequent etching work procedure to the metallic circuit figures of outer graphics and ladder trench bottom into
Row protection.
Step 105, remove initial step trench bottom remaining area (i.e. not tin plating region) cull layer, until reveal
Go out second portion bottom copper.
At this point, the cull layer of initial step trench bottom has been entirely removed, therefore the depth of initial step slot is smart
Really reach predetermined step groove depth, meet default design requirement.
The exposed second portion bottom copper of step 106, etching removal initial step trench bottom.
Since the second portion bottom copper is inactive portion, so will be gone in this step using conventional etch process
It removes.
Step 107 carries out moving back tin operation, exposes first portion's bottom copper, so far forms metallic circuit figure in slot bottom.
Using the above method, you can producing bottom has the stepped groove of metallic circuit figure, in the production process not only
The depth of stepped groove can accurately be controlled, it is made accurately to reach designated layer, and without using gasket, moreover it is possible to it is efficiently high
Matter produces slot bottom figure, and at low cost, process is simple, and high-volume is suitble to make.
Embodiment two
A kind of production method of PCB is provided in embodiment one, thus PCB made of mode includes stepped groove and slot bottom shape
Into there is metallic circuit figure.On the basis of embodiment one, the present embodiment two will provide the system of PCB of slot bottom equipped with via a kind of
Make method.
Referring to Fig. 2, the production method includes step：
Step 201, according to normal process flow, multiple core plates are pressed to form PCB, as shown in Figure 3.
Step 202, the through hole that multiple perforation above and below PCB superficies are opened up on PCB and plating, it is logical to form metallization
Hole, as shown in Figure 4.
Step 203, by controlled depth milling mode, the predeterminable area on PCB makes initial step slot, the initial step slot
Depth is less than predetermined step groove depth, and the predeterminable area of initial step slot covers throwing of the above-mentioned plated-through hole in respective surfaces
Shadow zone domain, as shown in Figure 5.
To ensure the processing efficiency of subsequent technique, the depth of initial step slot exists with the difference control of predetermined step groove depth
In the range of 0-3mil, i.e., the thickness of the cull layer of initial step trench bottom is 0-3mil.
The cull of step 204, the orifice ring region for removing initial step trench bottom and predetermined metal line pattern region
Layer, until exposing first portion's bottom copper, first portion's bottom copper of the exposing is formed into required orifice ring and metallic circuit figure,
As shown in Figure 6.
Step 205, the outer graphics to PCB, the metallic circuit figure of orifice ring and ladder trench bottom carry out tin coating, such as scheme
Shown in 7.
Step 206, remove initial step trench bottom remaining area (i.e. not tin plating region) cull layer, until reveal
Go out second portion bottom copper, as shown in Figure 8.
The exposed second portion bottom copper of step 207, etching removal initial step trench bottom, as shown in Figure 9.
Step 208 carries out moving back tin operation, exposes first portion's bottom copper, forms the metallic circuit figure and orifice ring of slot bottom, such as
Shown in Figure 10.
Compared with embodiment one, the present embodiment two, which can not only produce bottom, has the stepped groove of metallic circuit figure,
The slot bottom of stepped groove can also form the via (can crimp, weld or grafting) with orifice ring, and need not make in the production process
Via is protected with resin or other special materials, at low cost, process is simple, and high-volume is suitble to make demand.
Embodiment three
The present embodiment three provides a kind of PCB, which is made according to the production method that embodiment one or two is provided.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Embodiment is stated the present invention is described in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or carry out equivalent substitution to which part technical characteristic；And these
Modification is replaced, and the essence of appropriate technical solution is not made to depart from the spirit and scope of various embodiments of the present invention technical solution.
Claims (9)
1. a kind of production method of ladder groove bottom graphical PCB, which is characterized in that the production method includes：
Multiple core plates are pressed to form PCB, and initial step is made by the predeterminable area of controlled depth milling mode on the pcb
Slot, the depth of the initial step slot are less than predetermined step groove depth；
The cull layer in the predetermined metal line pattern region of the initial step trench bottom is removed, until exposing first portion
In the electroplating surfaces with tin of first portion bottom copper after the copper of bottom；
The cull layer in the not tin plating region of the initial step trench bottom is removed, until being removed after exposing second portion bottom copper
Second portion bottom copper；
It carries out moving back tin operation, exposes first portion bottom copper.
2. the production method of ladder groove bottom graphical PCB according to claim 1, which is characterized in that the initial rank
The depth of terraced slot is with the difference of predetermined step groove depth in the range of 0-3mil.
3. the production method of ladder groove bottom graphical PCB according to claim 1, which is characterized in that the residual tree
The removing method of lipid layer includes：Carbon dioxide laser ablation, plasma etching or strong acid sting erosion mode.
4. the production method of ladder groove bottom graphical PCB according to claim 1, which is characterized in that the making side
In method, after multiple core plates are pressed to form PCB, before predeterminable area on the pcb makes initial step slot, also wrap
It includes：
On the pcb, the multiple perforation PCB through hole of superficies and plating up and down are opened up, it is logical to form multiple metallization
Hole；The predeterminable area covers view field of each plated-through hole in corresponding superficies.
5. the production method of ladder groove bottom graphical PCB according to claim 4, which is characterized in that the making side
Method further includes：While the cull layer in predetermined metal line pattern region of the initial step trench bottom is removed, go
Except the cull layer in the predetermined orifice ring region of the initial step trench bottom.
6. the production method of ladder groove bottom graphical PCB according to claim 4, which is characterized in that the making side
Method further includes：It is tin plating in the inner wall of each plated-through hole at the first portion bottom while electroplating surfaces with tin of copper.
7. the production method of ladder groove bottom graphical PCB according to claim 1, which is characterized in that the making side
Method further includes：In advance on the pcb make outer-layer circuit figure, at the first portion bottom while electroplating surfaces with tin of copper
The electroplating surfaces with tin of the outer-layer circuit figure.
8. the production method of ladder groove bottom graphical PCB according to claim 1, which is characterized in that the making side
In method, second portion bottom copper is removed using chemical etching mode.
9. a kind of PCB, which is characterized in that the PCB is made according to any production method of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810107793.5A CN108112175B (en) | 2018-02-02 | 2018-02-02 | A kind of production method of ladder groove bottom graphical PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810107793.5A CN108112175B (en) | 2018-02-02 | 2018-02-02 | A kind of production method of ladder groove bottom graphical PCB |
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| Publication Number | Publication Date |
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| CN108112175A true CN108112175A (en) | 2018-06-01 |
| CN108112175B CN108112175B (en) | 2019-08-16 |
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| CN201810107793.5A Active CN108112175B (en) | 2018-02-02 | 2018-02-02 | A kind of production method of ladder groove bottom graphical PCB |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219250A (en) * | 2018-08-17 | 2019-01-15 | 昆山沪利微电有限公司 | A kind of pcb board heat dissipation T-type hole forming method |
| WO2019242258A1 (en) * | 2018-06-20 | 2019-12-26 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-frequency micro stepped groove |
| CN112449478A (en) * | 2019-08-27 | 2021-03-05 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| TWI843282B (en) * | 2022-11-10 | 2024-05-21 | 健鼎科技股份有限公司 | Manufacturing method of heat-conductive circuit board |
| CN118434027A (en) * | 2024-07-05 | 2024-08-02 | 广州添利电子科技有限公司 | High-precision manufacturing method of stepped groove PCB and stepped groove PCB |
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| CN105472909A (en) * | 2014-09-09 | 2016-04-06 | 深南电路有限公司 | Processing method of step groove circuit board |
| CN105765258A (en) * | 2013-11-25 | 2016-07-13 | 麦格纳动力系有限两合公司 | Method for producing semiconductor device |
| CN106973526A (en) * | 2017-05-09 | 2017-07-21 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
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| CN102497737A (en) * | 2011-12-23 | 2012-06-13 | 东莞生益电子有限公司 | Method for manufacturing printed circuit board (PCB) with step-shaped grooves |
| CN105765258A (en) * | 2013-11-25 | 2016-07-13 | 麦格纳动力系有限两合公司 | Method for producing semiconductor device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019242258A1 (en) * | 2018-06-20 | 2019-12-26 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-frequency micro stepped groove |
| CN109219250A (en) * | 2018-08-17 | 2019-01-15 | 昆山沪利微电有限公司 | A kind of pcb board heat dissipation T-type hole forming method |
| CN109219250B (en) * | 2018-08-17 | 2021-05-07 | 昆山沪利微电有限公司 | PCB heat dissipation T-shaped hole machining method |
| CN112449478A (en) * | 2019-08-27 | 2021-03-05 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN112449478B (en) * | 2019-08-27 | 2022-03-04 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| TWI843282B (en) * | 2022-11-10 | 2024-05-21 | 健鼎科技股份有限公司 | Manufacturing method of heat-conductive circuit board |
| CN118434027A (en) * | 2024-07-05 | 2024-08-02 | 广州添利电子科技有限公司 | High-precision manufacturing method of stepped groove PCB and stepped groove PCB |
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|---|---|
| CN108112175B (en) | 2019-08-16 |
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