CN103179802A - Metal half-hole forming method and printed circuit board manufacture method - Google Patents
Metal half-hole forming method and printed circuit board manufacture method Download PDFInfo
- Publication number
- CN103179802A CN103179802A CN2011104357315A CN201110435731A CN103179802A CN 103179802 A CN103179802 A CN 103179802A CN 2011104357315 A CN2011104357315 A CN 2011104357315A CN 201110435731 A CN201110435731 A CN 201110435731A CN 103179802 A CN103179802 A CN 103179802A
- Authority
- CN
- China
- Prior art keywords
- metal
- pcb
- metal half
- hole
- half hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The invention provides a metal half-hole forming method which is characterized by including that metals are sleeved on an outer layer pad used for manufacturing a metal half-hole and connected with a metal hole towards a waste material area along a forming line, and finally the metal half-hole of a printed circuit board (PCB) is formed through a plate milling procedure. The invention further provides a PCB manufacture method. By adopting the forming method to manufacture the metal half-hole of the PCB, forming quality of the metal half-hole is improved.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB) field, in particular to the forming method in a kind of metal half hole and the manufacture method of a kind of PCB.
Background technology
Metal half hole is called again half PTH (plating through hole, plated-through-hole).Fig. 1 shows the PCB that metal half hole is arranged according to the unit four whole rows in limit of correlation technique, and Fig. 2 shows the enlarged diagram of the local A in Fig. 1.As shown in the figure, refer to only stay half on PCB profile limit, and second half will be by the plated-through hole of mill off (or groove) when sharp processing in so-called metal half hole.
The machining mode of general circuit board molding is that numerical control forming machine mills plate, and a kind of metal half hole forming method of correlation technique is after the lettering symbol, straight forming metal half hole in milling the profile process of plate PCB, and idiographic flow is as follows:
Front processing procedure → outer-layer circuit making → anti-welding processing → immersion Ni/Au → lettering accords with → mills plate (shape molding and metal half hole forming) → E/T (electrical testing) → FQC (final quality inspection) → QA AUDIT (quality assurance) → packing and shipment.
Fig. 3 shows the schematic diagram that mills sheet metal forming metal half hole according to correlation technique.As shown in the figure, at the direct of travel of milling cutter, easy residual copper wire burr in the hole in metal half hole.The pin welding of these metal half Kong Yaoyu components and parts.If residual copper wire burr in these metals half hole, hole will produce when welding that leg is not firm, the problem of rosin joint, bridge joint short circuit.
For the problem of residual copper wire burr in the hole that solves metal half hole, at present the most of PCB of industry producer solves half hole inner burr in the artificial treatment mode, length consuming time, and efficient is low.
Summary of the invention
The present invention aims to provide a kind of metal half hole forming method and a kind of PCB manufacture method, to solve the burr problem of metal half hole making.
In an embodiment of the present invention, provide a kind of metal half hole forming method, before metal half hole of the operation moulding PCB by milling plate, also comprised: the outer layer pad that the metal aperture that is used for making metal half hole is connected, along form wire to garbage area nested domain metal.
In an embodiment of the present invention, provide the manufacture method of a kind of PCB, adopted above-mentioned forming method to make metal half hole of PCB.
Metal half hole forming method of the above embodiment of the present invention and PCB manufacture method are because first reduced to drag for the metal skin width that type operation milling cutter will drag for before milling plate, so overcome the problem of the metal half residual copper wire burr in hole, reached the effect of the Forming Quality in raising metal half hole.
Description of drawings
Accompanying drawing described herein is used to provide a further understanding of the present invention, consists of the application's a part, and illustrative examples of the present invention and explanation thereof are used for explaining the present invention, do not consist of improper restriction of the present invention.In the accompanying drawings:
Fig. 1 shows the PCB that metal half hole is arranged according to the unit four whole rows in limit of correlation technique;
Fig. 2 shows the enlarged diagram of the local A in Fig. 1;
Fig. 3 shows the schematic diagram that mills sheet metal forming metal half hole according to correlation technique;
Fig. 4 shows the schematic diagram according to forming metal half hole of the embodiment of the present invention;
Fig. 5 shows the schematic diagram in forming metal half hole according to the preferred embodiment of the invention.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
Fig. 4 shows the schematic diagram according to forming metal half hole of the embodiment of the present invention, before metal half hole of the operation moulding PCB by milling plate, also comprise: the outer layer pad that the metal aperture of be used for making metal half hole is connected, along form wire to garbage area nested domain metal, as shown in the figure, cover has fallen the metal skin of regional A and B.
The present embodiment so overcome the problem of the metal half residual copper wire burr in hole, has reached the effect of the Forming Quality in raising metal half hole because first reduced to drag for the metal skin width that type operation milling cutter will drag for before milling plate.
Preferably, the degree of depth of cover metal is 0.5-1.0MIL.
Preferably, to garbage area nested domain metal 2.0-5.0MIL.
Preferably, the external diameter of metal aperture keeps 0.5-1.5MIL to overlapping metallic region.
Fig. 5 shows the schematic diagram in forming metal half hole according to the preferred embodiment of the invention, and the degree of depth of cover metal is 0.5MIL, and to garbage area nested domain metal 3MIL, the external diameter of metal aperture keeps 1MIL to overlapping metallic region.The inventor finds above-mentioned parameter setting metal half hole forming preferably according to repeatedly experiment.
Preferably, when the plate to PCB carries out the outer-layer circuit making, the step of execution set metal.Idiographic flow is as follows:
Front processing procedure → outer-layer circuit is made (cover metal) → anti-welding processing → immersion Ni/Au → lettering and is accorded with → mill plate (shape molding and metal half hole forming) → E/T (electrical testing) → FQC (final quality inspection) → QA AUDIT (quality assurance) → packing and shipment.
Preferably, adopt etched mode to overlap metal.It should be noted that in etching process, metal aperture will cover with dry film, in order to avoid liquid medicine enters, the metal etch in the hole is fallen.
The embodiment of the present invention also provides the manufacture method of a kind of PCB, adopts above-mentioned forming method to make metal half hole of PCB.
As can be seen from the above description, metal of the present invention half hole will burr can not occur in molding process, can not cause copper sheet to dig, guarantee that section is neat, bright and clean, coating is intact, reduced the probability that the plating in metal half hole is pullled.
The above is only the preferred embodiments of the present invention, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. metal half hole forming method, is characterized in that, before metal half hole of the described printed circuit board (PCB) of operation moulding by milling plate, also comprises:
The outer layer pad that the metal aperture that is used for making described metal half hole is connected is along form wire to garbage area nested domain metal.
2. method according to claim 1, is characterized in that, the degree of depth of cover metal is 0.5-2.0MIL.
3. method according to claim 1, is characterized in that, the degree of depth of cover metal is 0.5MIL.
4. method according to claim 1, is characterized in that, to garbage area nested domain metal 2.0-5.0MIL.
5. method according to claim 1, is characterized in that, to garbage area nested domain metal 3MIL.
6. method according to claim 1, is characterized in that, the external diameter of described metal aperture to described cover metallic region keeps 0.5-2.5MIL.
7. method according to claim 1, is characterized in that, the external diameter of described metal aperture to described cover metallic region keeps 1MIL.
8. method according to claim 1, is characterized in that, when the plate to described printed circuit board (PCB) carries out the outer-layer circuit making, carries out the step of described cover metal.
9. method according to claim 8, is characterized in that, adopts etched mode to overlap metal.
10. the manufacture method of a printed circuit board (PCB), is characterized in that, metal half hole of adopting the described forming method of claim 1-9 any one to make described printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104357315A CN103179802A (en) | 2011-12-21 | 2011-12-21 | Metal half-hole forming method and printed circuit board manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104357315A CN103179802A (en) | 2011-12-21 | 2011-12-21 | Metal half-hole forming method and printed circuit board manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103179802A true CN103179802A (en) | 2013-06-26 |
Family
ID=48639340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104357315A Pending CN103179802A (en) | 2011-12-21 | 2011-12-21 | Metal half-hole forming method and printed circuit board manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103179802A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125724A (en) * | 2014-07-23 | 2014-10-29 | 广东兴达鸿业电子有限公司 | Production process for PCB (Printed Circuit Board) metal half-hole products |
| CN104918422A (en) * | 2015-05-21 | 2015-09-16 | 东莞市五株电子科技有限公司 | Method for manufacturing semi-metallized hole of printed circuit board |
| CN106034379A (en) * | 2015-03-20 | 2016-10-19 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
| CN113784512A (en) * | 2021-08-09 | 2021-12-10 | 景旺电子科技(龙川)有限公司 | Method for manufacturing semi-metallized hole of circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122831A (en) * | 1993-10-25 | 1995-05-12 | Taiyo Yuden Co Ltd | Circuit board and manufacture thereof |
| CN1204227A (en) * | 1997-05-12 | 1999-01-06 | 阿尔卑斯电气株式会社 | Printed circuit board |
| JP2007329318A (en) * | 2006-06-08 | 2007-12-20 | Hitachi Aic Inc | Substrate |
| CN101335125A (en) * | 2007-06-26 | 2008-12-31 | 上海神沃电子有限公司 | Surface mounted over-current over-temperature protection element and manufacturing process |
-
2011
- 2011-12-21 CN CN2011104357315A patent/CN103179802A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122831A (en) * | 1993-10-25 | 1995-05-12 | Taiyo Yuden Co Ltd | Circuit board and manufacture thereof |
| CN1204227A (en) * | 1997-05-12 | 1999-01-06 | 阿尔卑斯电气株式会社 | Printed circuit board |
| JP2007329318A (en) * | 2006-06-08 | 2007-12-20 | Hitachi Aic Inc | Substrate |
| CN101335125A (en) * | 2007-06-26 | 2008-12-31 | 上海神沃电子有限公司 | Surface mounted over-current over-temperature protection element and manufacturing process |
Non-Patent Citations (1)
| Title |
|---|
| 徐立锦: "金属切削毛刺的生成机理与对策", 《湖北汽车》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125724A (en) * | 2014-07-23 | 2014-10-29 | 广东兴达鸿业电子有限公司 | Production process for PCB (Printed Circuit Board) metal half-hole products |
| CN104125724B (en) * | 2014-07-23 | 2017-05-03 | 广东兴达鸿业电子有限公司 | Production process for PCB (Printed Circuit Board) metal half-hole products |
| CN106034379A (en) * | 2015-03-20 | 2016-10-19 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN104918422A (en) * | 2015-05-21 | 2015-09-16 | 东莞市五株电子科技有限公司 | Method for manufacturing semi-metallized hole of printed circuit board |
| CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
| CN113784512A (en) * | 2021-08-09 | 2021-12-10 | 景旺电子科技(龙川)有限公司 | Method for manufacturing semi-metallized hole of circuit board |
| CN113784512B (en) * | 2021-08-09 | 2022-10-04 | 景旺电子科技(龙川)有限公司 | Method for manufacturing semi-metallized hole of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103179802A (en) | Metal half-hole forming method and printed circuit board manufacture method | |
| CN103179805A (en) | Metal half hole molding method and manufacture method of printed circuit board | |
| CN104918422B (en) | The production method in printed circuit board (PCB) semi-metal hole | |
| CN106973507B (en) | A kind of production method of filling holes with resin wiring board | |
| CN102438411B (en) | Manufacturing method of metallized semi-hole | |
| CN105792545B (en) | Pcb board half bore moulding process | |
| CN105208790B (en) | A method of making solder mask on PCB | |
| CN101695218A (en) | Method for manufacturing printed circuit board with half-edge hole | |
| CN105792521B (en) | Pcb board pad Compensation Design technique and its application | |
| CN103052260A (en) | Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board | |
| JP2007059477A (en) | Solid electrolytic capacitor | |
| CN106535482A (en) | Resin-filled back drilling hole processing method of PCB (Printed Circuit Board) | |
| CN108112175B (en) | A kind of production method of ladder groove bottom graphical PCB | |
| CN101626662A (en) | Process for removing flash of half PTH hole by dry film etching method | |
| CN111787698B (en) | Z-shaped slot hole machining method | |
| CN104703390B (en) | Circuit board and preparation method thereof | |
| CN107222975B (en) | A kind of gradation etches the pattern-producing method of thick metal plated micro-strip plate | |
| CN111712041A (en) | Circuit board half-hole machining process | |
| CN102687605A (en) | Die and manufacturing method therefor | |
| CN105704947A (en) | Forming process of burr-free printed circuit board (PCB) | |
| CN104684277A (en) | Method for manufacturing gold fingers of printed circuit board | |
| CN103717014A (en) | Method for manufacturing substrate structure | |
| CN108323040A (en) | A kind of production method and PCB of the PCB with stepped groove | |
| CN102510676A (en) | Method for adding teardrop in printed circuit board (PCB) during computer aided manufacturing (CAM) | |
| CN112739000A (en) | PCB (printed circuit board) half-hole plate processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130626 |