CN114269070A - Production process of gold-electroplated PCB with half holes - Google Patents
Production process of gold-electroplated PCB with half holes Download PDFInfo
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- CN114269070A CN114269070A CN202111474521.7A CN202111474521A CN114269070A CN 114269070 A CN114269070 A CN 114269070A CN 202111474521 A CN202111474521 A CN 202111474521A CN 114269070 A CN114269070 A CN 114269070A
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Abstract
The invention discloses a gold-electroplated PCB (printed circuit board) production process with a half hole, which is characterized in that a production and manufacturing process with the half hole is carried out in the production and manufacturing process of the gold-electroplated PCB, an outer layer primary circuit step is arranged before a half hole routing step, an anti-electroplating layer is favorably arranged between a first round hole and the first round hole, so that tin electroplating is not carried out on a wet film position between the first round hole and the first round hole in the tin electroplating step, a wet film pattern is removed after the half hole routing step, copper exposed between the first round hole and the first round hole is etched to ensure insulation between the first round hole and the first round hole, meanwhile, a flash generated in the half hole routing step is also etched, the half hole with good quality is obtained, the practicability is good, then tin removing and gold-electroplated PCB processing are carried out, and the gold-electroplated PCB with the half hole is convenient to obtain the gold-electroplated PCB with the half hole.
Description
Technical Field
The invention relates to a production process of an electrogilding PCB with a half hole.
Background
In the present PCB process with the half-hole process, a burr is generated in the half-hole routing process, and the burr can be etched away in the etching process, thus, the existence of flash can be avoided, which is the current conventional process of tin plating anti-etching protection circuit, the flash is etched off, and then the tin is removed, so that the complete circuit can be obtained, however, if the half-holes need to be plated with gold, the plated gold becomes an etching-resistant layer, and after etching, the electroplated gold layer can not be removed, and the electroplated gold is not only an anti-etching layer but also a surface treatment mode, and the electroplated gold is used as an anti-etching layer, after etching, residual gold burrs are suspended at the positions of the half holes and cannot be processed, so that the design requirements of the PCB cannot be met, namely, the traditional half-hole process flow is selective to a surface treatment mode, and the flow can fail when the electrogilding process is met.
Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by those skilled in the art.
Disclosure of Invention
The invention overcomes the defects of the technology and provides a production process of the electrogilding PCB with the half-hole.
In order to achieve the purpose, the invention adopts the following technical scheme:
a production process of an electrogilding PCB with a half hole comprises the following steps:
cutting: cutting the double-sided board body according to the design size requirement;
drilling: drilling a plurality of first round holes which comprise a linear arrangement corresponding to a plurality of target half holes of the linear arrangement;
deburring: removing burrs generated by the drilled hole and cleaning the board surface;
chemical copper deposition: carrying out chemical copper deposition on the board body after drilling to realize the conduction between the top layer and the bottom layer of the board body and provide a conductive copper layer for the electroplating of the subsequent procedure;
copper electroplating for the first time: electroplating copper on the plate body after chemical copper deposition, and increasing the conductive capacity of electroplating again in the post-processing procedure;
first pretreatment: the plate surface is coarsened and cleaned, so that good adhesive force is provided for the subsequent working procedures;
outer primary circuit: transferring a positive pattern by adopting a wet film, and transferring a wet film pattern between the first round hole and the first round hole to be used as an electroplating-resistant layer;
electroplating tin: except the position of the wet film pattern, all the other copper surfaces are electroplated with tin to be used as an anti-etching layer;
routing half holes: carrying out CNC edge milling on the plurality of first round holes along the arrangement direction of the first round holes, removing a plurality of unnecessary half holes, and reserving a plurality of half holes with functions required by design;
first film removing: removing the electroplating-resistant wet film pattern in the outer primary circuit step to expose copper below the wet film pattern;
first etching: etching away the exposed copper after the wet film is removed, and simultaneously etching away the flash generated in the step of routing the half hole;
stripping tin: removing the etch-resistant layer electroplated in the previous step of electroplating tin;
second pretreatment: the plate surface is coarsened and cleaned, so that good adhesive force is provided for the subsequent working procedures;
outer secondary circuit: transferring the final required outer layer circuit pattern onto the board surface by adopting a positive dry film process, and covering the non-circuit pattern position with a dry film so as to facilitate electroplating resistance;
and (3) second copper electroplating: carrying out pattern electroplating, and thickening hole wall copper and surface copper to the design requirement;
gold electroplating: electroplating gold on the surface of the second copper electroplating, wherein the thickness of the gold meets the design requirement, the gold electroplating process is not only the surface process of the PCB, but also the gold layer on the circuit is an anti-etching layer;
and (3) second film stripping: removing the dry film which resists electroplating in the outer layer secondary circuit step to expose copper below the dry film;
and (3) second etching: etching away the copper covered by the dry film, namely the copper at the position of the non-circuit pattern, and completely forming the circuit pattern of the PCB at the moment;
pretreatment for the third time: cleaning the board surface to provide a clean board surface for the subsequent working procedures;
resistance welding: printing a layer of photosensitive solder resist ink on the whole PCB surface by screen printing, exposing and developing to expose a required bonding pad, and preparing for surface mounting and testing of a later process;
character processing: according to the design requirement, characters are transferred to the board surface in a mode of screen printing thermosetting ink, so that convenient digital information is provided for the paster of the later process;
and (3) curing: the character ink and the solder resist ink are solidified in a high-temperature mode, so that the hardness of the ink is improved;
molding: and carrying out CNC machining forming on the PCB according to the designed appearance requirement.
Preferably, the molding step is followed by the step of,
cleaning: dust generated in the molding process is removed, and the cleanness of the PCB is ensured;
and (3) testing: according to the requirement of a design network, carrying out electrical performance test, repair and screening on the PCB, and ensuring that the function of the PCB put in storage is normal;
final inspection: the PCB is subjected to full inspection, so that the appearance is ensured to be flawless;
packaging: and the PCB is packaged by adopting a vacuum packaging machine, so that the gold surface is prevented from being oxidized due to air contact.
Compared with the prior art, the invention has the beneficial effects that:
the present case production technology is being carried out the production preparation processing that has half a hole incidentally in the gold electroplating PCB board production manufacturing process, it is provided with outer primary circuit step before the gong half a hole step, be favorable to setting up the anti-electroplating layer between first round hole and first round hole, make in the electrotinning step not carry out the electrotinning to the wet film position between first round hole and the first round hole, the gong half a hole back is moved away wet film figure, to the copper etching that shows out between first round hole and the first round hole and guarantee insulating between first round hole and the first round hole, also etch away the flash that produces in the gong half a hole step simultaneously, obtain the better half a hole of quality, the practicality is good, back tin and continue the gold electroplating PCB board process afterwards, be convenient for obtain the gold electroplating PCB board of subsidiary half a hole.
Detailed Description
The features of the present invention and other related features are further described in detail below by way of examples to facilitate understanding by those skilled in the art:
a production process of an electrogilding PCB with a half hole is characterized by comprising the following steps:
cutting: cutting the double-sided board body according to the design size requirement;
drilling: drilling a plurality of first round holes which comprise a linear arrangement corresponding to a plurality of target half holes of the linear arrangement;
deburring: removing burrs generated by the drilled hole and cleaning the board surface;
chemical copper deposition: carrying out chemical copper deposition on the board body after drilling to realize the conduction between the top layer and the bottom layer of the board body and provide a conductive copper layer for the electroplating of the subsequent procedure;
copper electroplating for the first time: electroplating copper on the plate body after chemical copper deposition, and increasing the conductive capacity of electroplating again in the post-processing procedure;
first pretreatment: the plate surface is coarsened and cleaned, so that good adhesive force is provided for the subsequent working procedures;
outer primary circuit: transferring a positive pattern by adopting a wet film, and transferring a wet film pattern between the first round hole and the first round hole to be used as an electroplating-resistant layer;
electroplating tin: except the position of the wet film pattern, all the other copper surfaces are electroplated with tin to be used as an anti-etching layer;
routing half holes: carrying out CNC edge milling on the plurality of first round holes along the arrangement direction of the first round holes, removing a plurality of unnecessary half holes, and reserving a plurality of half holes with functions required by design;
first film removing: removing the electroplating-resistant wet film pattern in the outer primary circuit step to expose copper below the wet film pattern;
first etching: etching away the exposed copper after the wet film is removed, and simultaneously etching away the flash generated in the step of routing the half hole;
stripping tin: removing the etch-resistant layer electroplated in the previous step of electroplating tin;
second pretreatment: the plate surface is coarsened and cleaned, so that good adhesive force is provided for the subsequent working procedures;
outer secondary circuit: transferring the final required outer layer circuit pattern onto the board surface by adopting a positive dry film process, and covering the non-circuit pattern position with a dry film so as to facilitate electroplating resistance;
and (3) second copper electroplating: carrying out pattern electroplating, and thickening hole wall copper and surface copper to the design requirement;
gold electroplating: electroplating gold on the surface of the second copper electroplating, wherein the thickness of the gold meets the design requirement, the gold electroplating process is not only the surface process of the PCB, but also the gold layer on the circuit is an anti-etching layer;
and (3) second film stripping: removing the dry film which resists electroplating in the outer layer secondary circuit step to expose copper below the dry film;
and (3) second etching: etching away the copper covered by the dry film, namely the copper at the position of the non-circuit pattern, and completely forming the circuit pattern of the PCB at the moment;
pretreatment for the third time: cleaning the board surface to provide a clean board surface for the subsequent working procedures;
resistance welding: printing a layer of photosensitive solder resist ink on the whole PCB surface by screen printing, exposing and developing to expose a required bonding pad, and preparing for surface mounting and testing of a later process;
character processing: according to the design requirement, characters are transferred to the board surface in a mode of screen printing thermosetting ink, so that convenient digital information is provided for the paster of the later process;
and (3) curing: the character ink and the solder resist ink are solidified in a high-temperature mode, so that the hardness of the ink is improved;
molding: and carrying out CNC machining forming on the PCB according to the designed appearance requirement.
As mentioned above, the present case production technology is carrying out the production preparation processing that has half a hole incidentally in the gold electroplating PCB board production manufacturing process, it is provided with outer circuit step once before the gong half a hole step, be favorable to setting up the anti-electroplating layer between first round hole and first round hole, make in the electrotinning step wet film position between first round hole and the first round hole carry out electrotinning, gong half a hole back is moved away wet film figure, copper etching that shows out between first round hole and the first round hole and guaranteeing to insulate between first round hole and the first round hole, also etch away the flash that produces in the gong half a hole step simultaneously, obtain the better half a hole of quality, the practicality is good, then move back tin and continue the gold electroplating PCB board process, be convenient for obtain the gold electroplating PCB board of subsidiary half a hole.
As described above, the present invention is suitable for additionally manufacturing a PTH hole.
As mentioned above, in practice, after the forming step, the method further comprises the following steps of: dust generated in the molding process is removed, and the cleanness of the PCB is ensured; and (3) testing: according to the requirement of a design network, carrying out electrical performance test, repair and screening on the PCB, and ensuring that the function of the PCB put in storage is normal; final inspection: the PCB is subjected to full inspection, so that the appearance is ensured to be flawless; packaging: and the PCB is packaged by adopting a vacuum packaging machine, so that the gold surface is prevented from being oxidized due to air contact.
As mentioned above, the present invention protects a process for producing an electroplated gold PCB with a half-hole, and all technical solutions identical or similar to the present invention should be shown to fall within the protection scope of the present invention.
Claims (2)
1. A production process of an electrogilding PCB with a half hole is characterized by comprising the following steps:
cutting: cutting the double-sided board body according to the design size requirement;
drilling: drilling a plurality of first round holes which comprise a linear arrangement corresponding to a plurality of target half holes of the linear arrangement;
deburring: removing burrs generated by the drilled hole and cleaning the board surface;
chemical copper deposition: carrying out chemical copper deposition on the board body after drilling to realize the conduction between the top layer and the bottom layer of the board body and provide a conductive copper layer for the electroplating of the subsequent procedure;
copper electroplating for the first time: electroplating copper on the plate body after chemical copper deposition, and increasing the conductive capacity of electroplating again in the post-processing procedure;
first pretreatment: the plate surface is coarsened and cleaned, so that good adhesive force is provided for the subsequent working procedures;
outer primary circuit: transferring a positive pattern by adopting a wet film, and transferring a wet film pattern between the first round hole and the first round hole to be used as an electroplating-resistant layer;
electroplating tin: except the position of the wet film pattern, all the other copper surfaces are electroplated with tin to be used as an anti-etching layer;
routing half holes: carrying out CNC edge milling on the plurality of first round holes along the arrangement direction of the first round holes, removing a plurality of unnecessary half holes, and reserving a plurality of half holes with functions required by design;
first film removing: removing the electroplating-resistant wet film pattern in the outer primary circuit step to expose copper below the wet film pattern;
first etching: etching away the exposed copper after the wet film is removed, and simultaneously etching away the flash generated in the step of routing the half hole;
stripping tin: removing the etch-resistant layer electroplated in the previous step of electroplating tin;
second pretreatment: the plate surface is coarsened and cleaned, so that good adhesive force is provided for the subsequent working procedures;
outer secondary circuit: transferring the final required outer layer circuit pattern onto the board surface by adopting a positive dry film process, and covering the non-circuit pattern position with a dry film so as to facilitate electroplating resistance;
and (3) second copper electroplating: carrying out pattern electroplating, and thickening hole wall copper and surface copper to the design requirement;
gold electroplating: electroplating gold on the surface of the second copper electroplating, wherein the thickness of the gold meets the design requirement, the gold electroplating process is not only the surface process of the PCB, but also the gold layer on the circuit is an anti-etching layer;
and (3) second film stripping: removing the dry film which resists electroplating in the outer layer secondary circuit step to expose copper below the dry film;
and (3) second etching: etching away the copper covered by the dry film, namely the copper at the position of the non-circuit pattern, and completely forming the circuit pattern of the PCB at the moment;
pretreatment for the third time: cleaning the board surface to provide a clean board surface for the subsequent working procedures;
resistance welding: printing a layer of photosensitive solder resist ink on the whole PCB surface by screen printing, exposing and developing to expose a required bonding pad, and preparing for surface mounting and testing of a later process;
character processing: according to the design requirement, characters are transferred to the board surface in a mode of screen printing thermosetting ink, so that convenient digital information is provided for the paster of the later process;
and (3) curing: the character ink and the solder resist ink are solidified in a high-temperature mode, so that the hardness of the ink is improved;
molding: and carrying out CNC machining forming on the PCB according to the designed appearance requirement.
2. The process for producing an electrogilded PCB with half holes as claimed in claim 1, further comprising the following steps after the molding step,
cleaning: dust generated in the molding process is removed, and the cleanness of the PCB is ensured;
and (3) testing: according to the requirement of a design network, carrying out electrical performance test, repair and screening on the PCB, and ensuring that the function of the PCB put in storage is normal;
final inspection: the PCB is subjected to full inspection, so that the appearance is ensured to be flawless;
packaging: and the PCB is packaged by adopting a vacuum packaging machine, so that the gold surface is prevented from being oxidized due to air contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111474521.7A CN114269070B (en) | 2021-12-03 | 2021-12-03 | Production process of electroplated gold PCB with half holes |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111474521.7A CN114269070B (en) | 2021-12-03 | 2021-12-03 | Production process of electroplated gold PCB with half holes |
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| CN114269070A true CN114269070A (en) | 2022-04-01 |
| CN114269070B CN114269070B (en) | 2023-10-13 |
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| CN112969312A (en) * | 2021-01-27 | 2021-06-15 | 红板（江西）有限公司 | PCB metallized half-hole processing technology |
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2021
- 2021-12-03 CN CN202111474521.7A patent/CN114269070B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101547569A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Technology for processing semi-hole of PCB board |
| KR20110073875A (en) * | 2009-12-24 | 2011-06-30 | 엘지이노텍 주식회사 | Routing process of pcb |
| CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子（深圳）有限公司 | Manufacturing method of metallized semi-hole |
| CN103327753A (en) * | 2013-05-20 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Manufacturing method for metal semi-hole circuit board |
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| CN114269070B (en) | 2023-10-13 |
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