CN114340215A - 4D vehicle-mounted radar PCB with small signal loss and manufacturing method thereof - Google Patents
4D vehicle-mounted radar PCB with small signal loss and manufacturing method thereof Download PDFInfo
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- CN114340215A CN114340215A CN202111533041.3A CN202111533041A CN114340215A CN 114340215 A CN114340215 A CN 114340215A CN 202111533041 A CN202111533041 A CN 202111533041A CN 114340215 A CN114340215 A CN 114340215A
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Abstract
The invention discloses a 4D vehicle radar PCB with small signal loss and a manufacturing method thereof in the technical field of printed circuit boards, wherein the manufacturing method comprises the following steps: laminating and laminating the L1-Ln-2 layer copper foils and the prepregs according to a set rule to form a first daughter board, wherein a receiving antenna is manufactured on the L1 layer copper foil, a first signal receiving pattern corresponding to the receiving antenna is manufactured on the L2 layer copper foil, and a signal transmission channel is arranged between L2 and Ln-1; pressing the second sub-board with the second signal receiving pattern with the first sub-board to complete the manufacture of the vehicle-mounted radar PCB; the second sub-board comprises an Ln-1 layer copper foil and an Ln layer copper foil, the second signal receiving pattern is located on the Ln-1 layer copper foil and is arranged opposite to the first signal receiving pattern, and a conductive boss is arranged around the signal transmission channel to prevent glue flowing and provide electromagnetic shielding. The invention has the characteristics of small signal loss, high signal accuracy and stability and the like.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a 4D vehicle-mounted radar PCB with low signal loss and a manufacturing method thereof.
Background
High-resolution 4D imaging radar has emerged for high-order autopilot. 4D means 4 dimensions of detection target, including its speed, distance, horizontal angle and vertical angle, and traditional radar horizontal resolution ability is not enough, does not support vertical resolution, leads to not seeing clearly, sees inaccurately. The high-resolution 4D imaging radar greatly improves the resolution ratio, the confidence coefficient and the detection range of target detection, simultaneously advances out high-density point cloud like laser radar, can bring abundant perception enhancement application, such as environment portrayal, radar composition, location and the like, and can better realize 360-degree detection around the vehicle through point cloud level fusion of multiple radars.
The existing high-resolution 4D imaging radar adopts 12 transmitting channels and 24 receiving channels, and compared with the conventional millimeter wave 3-transmitting and 4-receiving antenna configuration, the high-resolution 4D imaging radar is improved by 24 times and is the largest antenna configuration imaging radar capable of being produced in large quantity at present. The PCB is used as an important component of the vehicle-mounted radar, the radar channel antennas are all designed on the PCB, in the prior art, due to the influence of the manufacturing process, material selection and the like, the signal loss is large in the process of transmitting an antenna signal to a chip, the problems of insufficient accuracy and stability exist, and the requirement of the high-resolution 4D imaging radar on the signal transmission efficiency is difficult to adapt.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the 4D vehicle-mounted radar PCB with small signal loss and the manufacturing method thereof, and the 4D vehicle-mounted radar PCB has the characteristics of small signal loss, high signal accuracy and stability and the like.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, a method for manufacturing a 4D vehicle radar PCB is provided, which includes: laminating and pressing an L1-Ln-2 layer copper foil and a prepreg according to a set rule to form a first daughter board, wherein a receiving antenna is manufactured on an L1 layer copper foil, a first signal receiving pattern corresponding to the receiving antenna is manufactured on an L2 layer copper foil, and an isolation cavity corresponding to the first signal receiving pattern is arranged on the prepreg between the L2 layer copper foil and the L3 layer copper foil; drilling holes from the Ln-2 layer copper foil to the L2 layer copper foil to the isolation cavity to form a signal transmission channel; electroplating copper in the signal transmission channel to form an electroplated copper layer; electroplating tin in the signal transmission channel to form an electroplated tin layer covering the electroplated copper layer; removing the redundant electroplated tin layer at the bottom of the signal transmission channel to form a signal receiving graph protected by tin; removing the redundant electroplated copper layer at the bottom of the signal transmission channel and the electroplated tin layer at the bottom and the side wall of the signal transmission channel; pressing the second sub-board with the second signal receiving pattern with the first sub-board to complete the manufacture of the vehicle-mounted radar PCB; the second sub-board comprises an Ln-1 layer copper foil and an Ln layer copper foil, the second signal receiving pattern is located on the Ln-1 layer copper foil and is arranged opposite to the first signal receiving pattern, and a conductive boss matched with the signal transmission channel is arranged on the second sub-board.
Further, the step of pressing the second sub-board with the second signal receiving pattern with the first sub-board to complete the manufacture of the vehicle-mounted radar PCB comprises the following steps: arranging a prepreg between the Ln-1 layer copper foil and the Ln layer copper foil and carrying out first pressing; after the first pressing, arranging a conductive boss on the Ln-1 layer of copper foil around the second signal receiving pattern to form a second daughter board; laying a prepreg on the outer side of the conductive boss of the second daughter board, then carrying out second pressing on the prepreg and the first daughter board, and connecting the conductive boss with the Ln-2 layer copper foil after pressing; after the second pressing, a pressure relief hole communicated with the signal transmission channel is drilled from the L1 th layer copper foil to the Ln th layer copper foil or from the Ln th layer copper foil to the L1 th layer copper foil.
Further, the conductive bump is a copper bump or a tin bump.
Further, the step of pressing the second sub-board with the second signal receiving pattern with the first sub-board to complete the manufacture of the vehicle-mounted radar PCB comprises the following steps: arranging a prepreg between the Ln-1 layer copper foil and the Ln layer copper foil and carrying out first pressing; after the first pressing, arranging a prepreg on the Ln-1 th layer of copper foil around the second signal receiving pattern, and then performing second pressing with the first daughter board; after the second pressing, drilling blind holes from the Ln-layer copper foil to the Ln-2-layer copper foil around a second signal receiving pattern on the Ln-1-layer copper foil, and plating copper in the drilled blind holes to form conductive bosses matched with the signal transmission channels; and (3) drilling a pressure relief hole communicated with the signal transmission channel from the L1 th layer copper foil to the Ln th layer copper foil or from the Ln th layer copper foil to the L1 th layer copper foil.
Further, the prepreg between the copper foil of the L2 th layer and the copper foil of the L3 th layer is a low-flow material with the flow length less than 25 mil.
Furthermore, prepregs between the L1 th layer copper foil and the L2 th layer copper foil and between the Ln-1 th layer copper foil are high-frequency materials with Dk less than or equal to 3.5 and Df less than or equal to 0.004, wherein Dk refers to dielectric constant and Df refers to dielectric loss.
Furthermore, the semi-cured sheets between the L3 th to Ln-1 th layers of copper foil are made of FR4 material.
In a second aspect, a 4D vehicle radar PCB is provided, the 4D vehicle radar PCB is manufactured by the manufacturing method of the 4D vehicle radar PCB of the first aspect, and includes: the method comprises the following steps that (1) prepregs are arranged between every two adjacent layers of L1-Ln copper foils; a first receiving antenna is manufactured on the L1 th layer of copper foil, and a first signal receiving pattern corresponding to the first receiving antenna is manufactured on the L2 th layer of copper foil; and a second signal receiving pattern is manufactured on the Ln-1 layer of copper foil, the first signal receiving pattern and the second signal receiving pattern are respectively positioned at two ends of a signal transmission channel, the side wall of the signal receiving channel is provided with an electroplated copper layer, and the Ln-1 layer of copper foil is provided with a conductive boss matched with the signal transmission channel.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the first sub-board with the signal transmission channel is manufactured, the electroplated copper layer is manufactured on the side wall of the signal transmission channel, and the signal transmission channel is directly communicated with the signal receiving pattern on the first sub-board and the signal receiving pattern on the second sub-board, so that the interference and the signal loss in the signal transmission process are reduced, and the signal transmission efficiency is improved; by manufacturing the second sub-board with the conductive bosses to be matched with the first sub-board, the flowing glue formed by melting the prepregs between the copper foils is prevented from shielding a signal receiving pattern, and the Ln-1 and Ln-2 layer transmission channel walls are connected to form a complete conductive cavity, so that the loss in the signal transmission process is further reduced; therefore, the invention has the characteristics of small signal loss, high signal accuracy and stability and the like.
Drawings
Fig. 1 is a schematic structural diagram of a PCB before a signal transmission channel is fabricated in a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a PCB board after a signal transmission channel is fabricated in the first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a PCB after copper is electroplated in a signal transmission channel according to a first embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a PCB after electroplating tin in a signal transmission channel according to a first embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a PCB after removing excess electroplated tin from the bottom of a signal transmission channel according to a first embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a PCB after removing excess electroplated copper from the bottom of a signal transmission channel according to a first embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a PCB with a tin-plating layer removed from the signal transmission channel according to a first embodiment of the present invention;
fig. 8 is a schematic structural diagram of a first sub-board and a second sub-board before being laminated according to a first embodiment of the present invention;
fig. 9 is a schematic structural diagram of the first sub-board and the second sub-board after being pressed together according to the first embodiment of the present invention;
fig. 10 is a schematic structural view of the second sub-board and the first sub-board after being pressed together according to the second embodiment of the present invention;
fig. 11 is a schematic structural diagram of a PCB board after a conductive bump is fabricated in the second embodiment of the present invention;
fig. 12 is a schematic diagram of an operating principle of a PCB board manufactured by using the manufacturing method of the 4D vehicle radar PCB board with small signal loss according to the first embodiment of the present invention;
fig. 13 is a schematic view of the working principle of the PCB board manufactured by the manufacturing method of the 4D vehicle radar PCB board with small signal loss according to the second embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The first embodiment is as follows:
a manufacturing method of a 4D vehicle-mounted radar PCB with small signal loss comprises the following steps: the method comprises the steps of stacking and pressing L1-Ln-2 layer copper foils and prepregs according to a set rule to form a first daughter board, wherein a receiving antenna is manufactured on the L1 layer copper foil, a first signal receiving pattern corresponding to the receiving antenna is manufactured on the L2 layer copper foil, an isolation cavity 1 corresponding to the first signal receiving pattern is arranged on the prepreg between the L2 layer copper foil and the L3 layer copper foil, as shown in the figure 1, the prepreg between the L2 layer copper foil and the L3 layer copper foil is hollowed in advance to form the isolation cavity 1, and when blind drilling is carried out on the L2 layer copper foil from the Ln-2 layer copper foil, damage to the L2 layer pattern caused by drilling through the L2 layer can be well avoided.
And (3) drilling holes from the Ln-2 th layer copper foil to the direction of the L2 th layer copper foil to an isolated cavity to form a signal transmission channel 2, wherein in the drilling process, the Ln-2 th layer copper foil is mechanically drilled into the L3 th layer copper foil and not the L2 th layer copper foil, as shown in figure 2.
Copper is electroplated in the signal transmission channel 2 to form an electroplated copper layer 3, and a conductor cavity having the electroplated copper layer 3 is formed in the signal transmission channel to shield the external interference signal, as shown in fig. 3.
Tin is electroplated within the signal transmission channel 2 to form a tin-electroplated layer 4 overlying the copper-electroplated layer 3, as shown in fig. 4.
And removing the redundant electroplated tin layer 4 at the bottom of the signal transmission channel 2 by laser cutting to form a signal receiving pattern protected by tin, as shown in fig. 5.
The excess electroplated copper layer on the bottom of the signal transmission channel 2 is removed by etching, as shown in fig. 6, and the electroplated tin layer on the sidewall and the bottom of the signal transmission channel 2 is removed by bulk etching, as shown in fig. 7.
Pressing the second sub-board with the second signal receiving pattern with the first sub-board to complete the manufacture of the vehicle-mounted radar PCB; the second daughter board comprises an Ln-1 layer copper foil and an Ln layer copper foil, a second signal receiving pattern is positioned on the Ln-1 layer copper foil and is arranged opposite to the first signal receiving pattern, and a conductive boss 5 matched with the signal transmission channel 2 is arranged around the second signal receiving pattern so as to prevent the flowing glue from shielding the second signal receiving pattern, thereby reducing the signal transmission quality due to signal loss; meanwhile, the conductive boss 5 and the signal transmission channel 2 together provide electromagnetic shielding, so as to improve the signal transmission quality, as shown in fig. 8 and 9, specifically including:
arranging a prepreg between the Ln-1 layer copper foil and the Ln layer copper foil and carrying out first pressing;
after the first pressing, arranging a conductive boss 5 matched with the signal limiting transmission channel on the Ln-1 layer of copper foil around the second signal receiving pattern to form a second daughter board;
paving a prepreg on the outer side of the conductive boss 5 of the second daughter board, then carrying out second pressing on the prepreg and the first daughter board, and connecting the conductive boss 5 with the Ln-2 layer copper foil after pressing; by manufacturing the second sub-board with the conductive bosses 5 to be matched with the first sub-board, the blocking of a second signal receiving pattern by glue flow formed by heating and melting of a prepreg between the Ln-1 layer copper foil and the Ln-2 layer copper foil is prevented, and the loss in the signal transmission process is further reduced;
after the second pressing, a pressure relief hole communicated with the signal transmission channel 2 is drilled from the L1 th layer copper foil to the Ln th layer copper foil or from the Ln th layer copper foil to the L1 th layer copper foil, and the pressure relief hole can prevent the air in the signal transmission channel 2 from being heated and expanded to cause the PCB to explode.
In this embodiment, the conductive bumps are copper bumps or tin bumps.
In this embodiment, the prepreg between the L2 th layer of copper foil and the L3 th layer of copper foil is a low-flow material with a flow length less than 25mil, so that the flow is reduced during lamination.
In the embodiment, the prepregs between the L1 th layer copper foil and the L2 th layer copper foil and between the Ln layer copper foil and the Ln-1 th layer copper foil are high-frequency materials with Dk less than or equal to 3.5 and Df less than or equal to 0.004, wherein Dk represents dielectric constant and Df represents dielectric loss, and radar signals can be stably transmitted by using the high-frequency materials.
In this embodiment, the semi-cured sheets between the L3 th to Ln-1 th copper foils are made of FR4 material.
The manufacturing method of the PCB comprises the technical points of material selection, overlapping and overlapping plate design, a manufacturing method of the blind slot, shielding design of signals in the PCB and the like. The invention is characterized in that: (1) material selection and laminate design: high-frequency materials are selected for the layers L1 to L2 and the layers Ln to Ln-1 of the antenna surface to facilitate signal transmission, and Low flow materials (Low flow materials) are selected for the layers L2 to L3 to reduce flow; (2) manufacturing a blind groove: forming blind grooves from L2 to Ln-2 surfaces by using a blind drill mode, and directly transmitting signals to a chip; (3) and (3) signal shielding design: the L2 surface has signal receiving pattern, and does not contact with other pattern of L2 layer and copper on the blind slot wall, forms the conductor cavity to shield the electromagnetic signal by coppering on the blind slot wall; (4) a copper boss is arranged between the Ln-1 layer and the Ln-2 layer and connected with the Ln-2 layer so as to prevent glue between the Ln-1 layer and the Ln-2 layer from flowing into the cavity and form a shielded conductor cavity so as to shield external electromagnetic signal interference, and the copper boss can be replaced by a tin boss.
Example two:
the difference between this embodiment and the first embodiment is mainly the manufacturing method of the second sub-board, and this embodiment provides another manufacturing method of the conductive bump, which is as follows.
Completing the manufacture of the first daughter board according to the first embodiment;
arranging a prepreg between the Ln-1 layer copper foil and the Ln layer copper foil and carrying out first pressing;
after the first press-fit, arranging a prepreg on the Ln-1 th layer of copper foil around the second signal receiving pattern, and then performing a second press-fit with the first daughter board, as shown in FIG. 10;
after the second pressing, drilling blind holes around the second signal receiving pattern from the Ln-th layer copper foil to the Ln-2-th layer copper foil, and plating copper in the drilled blind holes to form a conductive boss 5 matched with the signal transmission channel, as shown in FIG. 11;
and (3) drilling a pressure relief hole communicated with the signal transmission channel from the L1 th layer copper foil to the Ln th layer copper foil or from the Ln th layer copper foil to the L1 th layer copper foil.
Example three:
based on the method for manufacturing the 4D vehicle radar PCB with small signal loss according to the first embodiment and the second embodiment, the present embodiment provides a 4D vehicle radar PCB with small signal loss, and the 4D vehicle radar PCB with small signal loss is manufactured by the method for manufacturing the 4D vehicle radar PCB according to the first embodiment or the second embodiment, as shown in fig. 12 and 13, the method includes:
the method comprises the following steps that (1) prepregs are arranged between every two adjacent layers of L1-Ln copper foils; a first receiving antenna is manufactured on an L1 th copper foil, and a first signal receiving pattern a corresponding to the first receiving antenna is manufactured on an L2 th copper foil; and a second signal receiving pattern b is manufactured on the Ln-1 layer copper foil, the first signal receiving pattern a and the second signal receiving pattern b are respectively positioned at two ends of a signal transmission channel 2, the side wall of the signal transmission channel 2 is provided with an electroplated copper layer 3, and the Ln-1 layer copper foil is provided with a conductive boss 5 which surrounds the second signal receiving pattern and is matched with the signal transmission channel. In this embodiment, Ln layer copper foil lug connection chip, this design can reduce interference and loss that signal transmission process received with antenna signal direct transmission to the chip to make things convenient for the laminating installation of chip, promote signal stability and radar imaging's accuracy nature, finally reach the purpose that improves vehicle autopilot security level.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A manufacturing method of a 4D vehicle-mounted radar PCB is characterized by comprising the following steps:
laminating and pressing an L1-Ln-2 layer copper foil and a prepreg according to a set rule to form a first daughter board, wherein a receiving antenna is manufactured on an L1 layer copper foil, a first signal receiving pattern corresponding to the receiving antenna is manufactured on an L2 layer copper foil, and an isolation cavity corresponding to the first signal receiving pattern is arranged on the prepreg between the L2 layer copper foil and the L3 layer copper foil;
drilling holes from the Ln-2 layer copper foil to the L2 layer copper foil to the isolation cavity to form a signal transmission channel;
electroplating copper in the signal transmission channel to form an electroplated copper layer;
electroplating tin in the signal transmission channel to form an electroplated tin layer covering the electroplated copper layer;
removing the redundant electroplated tin layer at the bottom of the signal transmission channel to form a signal receiving graph protected by tin;
removing the redundant electroplated copper layer at the bottom of the signal transmission channel and the electroplated tin layer at the bottom and the side wall of the signal transmission channel;
pressing the second sub-board with the second signal receiving pattern with the first sub-board to complete the manufacture of the vehicle-mounted radar PCB; the second sub-board comprises an Ln-1 layer copper foil and an Ln layer copper foil, the second signal receiving pattern is located on the Ln-1 layer copper foil and is arranged opposite to the first signal receiving pattern, and a conductive boss matched with the signal transmission channel is arranged on the second sub-board.
2. The method as claimed in claim 1, wherein the step of laminating the second sub-board having the second signal receiving pattern with the first sub-board to complete the manufacture of the PCB comprises:
arranging a prepreg between the Ln-1 layer copper foil and the Ln layer copper foil and carrying out first pressing;
after the first pressing, arranging a conductive boss on the Ln-1 layer of copper foil around the second signal receiving pattern to form a second daughter board;
laying a prepreg on the outer side of the conductive boss of the second daughter board, then carrying out second pressing on the prepreg and the first daughter board, and connecting the conductive boss with the Ln-2 layer copper foil after pressing;
after the second pressing, a pressure relief hole communicated with the signal transmission channel is drilled from the L1 th layer copper foil to the Ln th layer copper foil or from the Ln th layer copper foil to the L1 th layer copper foil.
3. The method for manufacturing the 4D vehicle radar PCB as recited in claim 2, wherein the conductive bumps are copper bumps or tin bumps.
4. The method as claimed in claim 1, wherein the step of laminating the second sub-board having the second signal receiving pattern with the first sub-board to complete the manufacture of the PCB comprises:
arranging a prepreg between the Ln-1 layer copper foil and the Ln layer copper foil and carrying out first pressing;
after the first pressing, arranging a prepreg on the Ln-1 th layer of copper foil around the second signal receiving pattern, and then performing second pressing with the first daughter board;
after the second pressing, drilling blind holes from the Ln-layer copper foil to the Ln-2-layer copper foil around a second signal receiving pattern on the Ln-1-layer copper foil, and plating copper in the drilled blind holes to form conductive bosses matched with the signal transmission channels;
and (3) drilling a pressure relief hole communicated with the signal transmission channel from the L1 th layer copper foil to the Ln th layer copper foil or from the Ln th layer copper foil to the L1 th layer copper foil.
5. The method as claimed in claim 1, wherein the prepreg between the L2 th copper foil and the L3 th copper foil is a low flow material with a flow length of less than 25 mil.
6. The method as claimed in claim 1, wherein prepregs between an L1 th copper foil and an L2 th copper foil and between an Ln-th copper foil and an Ln-1 th copper foil are high frequency materials having Dk of 3.5 or less and Df of 0.004 or less, wherein Dk is a dielectric constant and Df is a dielectric loss.
7. The method as claimed in claim 1, wherein the semi-cured sheets between the L3-Ln-1 copper foils are made of FR4 material.
8. A4D vehicle radar PCB board, characterized in that, the 4D vehicle radar PCB board is manufactured by the manufacturing method of the 4D vehicle radar PCB board according to any one of claims 1 to 7, and comprises:
the method comprises the following steps that (1) prepregs are arranged between every two adjacent layers of L1-Ln copper foils; a first receiving antenna is manufactured on the L1 th layer of copper foil, and a first signal receiving pattern corresponding to the first receiving antenna is manufactured on the L2 th layer of copper foil; and a second signal receiving pattern is manufactured on the Ln-1 layer of copper foil, the first signal receiving pattern and the second signal receiving pattern are respectively positioned at two ends of a signal transmission channel, the side wall of the signal receiving channel is provided with an electroplated copper layer, and the Ln-1 layer of copper foil is provided with a conductive boss matched with the signal transmission channel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111533041.3A CN114340215A (en) | 2021-12-15 | 2021-12-15 | 4D vehicle-mounted radar PCB with small signal loss and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111533041.3A CN114340215A (en) | 2021-12-15 | 2021-12-15 | 4D vehicle-mounted radar PCB with small signal loss and manufacturing method thereof |
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| CN114340215A true CN114340215A (en) | 2022-04-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
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2021
- 2021-12-15 CN CN202111533041.3A patent/CN114340215A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
| CN114916146B (en) * | 2022-05-05 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
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