CN211378029U - Rate module of can adjusting luminance for 5G - Google Patents

Abstract

The utility model discloses a speed adjustable light module for 5G, which comprises a module body, a shell and a temperature measuring component, wherein the module body is connected with the shell buckle, the shell is fixedly connected with the temperature measuring component, the shell comprises a semiconductor refrigerator, a heat conducting fin and a bearing body, the semiconductor refrigerator is fixedly arranged at the lower side of the heat conducting fin, the heat conducting fin is arranged at the lower side of the bearing body, the bearing body is externally covered on the module body, on the basis of the prior art, the temperature measuring component is used for measuring the temperature of the shell, when the temperature of the module body is overhigh, the shell is used for radiating heat, and the semiconductor refrigerator is contacted with the heat conducting fin, thereby reducing the temperature of the bearing body fixedly arranged with the heat conducting fin, namely reducing the temperature of an optical module, the problem that a maintainer is scalded by mistakenly touching the light module is solved from the aspect of reducing the temperature.

Description

Rate module of can adjusting luminance for 5G

Technical Field

The utility model relates to an optical communication technical field especially relates to an adjustable optical module of rate for 5G.

Background

The optical module is a carrier for transmission between a switch and equipment, and is a core device in an optical fiber communication system. The main function is that the transmitting end converts the electrical signal of the equipment into optical signal, and the technical requirement of the optical module needed in 5G is not much different from the optical module used in the existing transmission network and data center, but the speed requirement of the optical module is improved because the demand of the bearing bandwidth is increased, the transmission network is fused with flattening and the metropolitan area network WDM/OTN sinks and extends, the working strength of the optical module is increased, more heat can be generated, that is, the temperature of the optical module is generally higher due to the 5G network, at present, the heat dissipation of the optical module in the industry generally adopts an aluminum extruded heat sink or an optical module metal shell for natural heat dissipation, the passive heat dissipation mode is affected by the environmental temperature, the internal temperature fluctuation is large, when the optical module is in long-time high-speed transmission work, the heat dissipation requirement can not be met by the mode of large heat flux density, when the temperature, therefore, there is an urgent need for an optical module that can prevent a maintainer from being burned by touching the optical module with a high temperature by mistake.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that a maintainer is easily scalded by touching an optical module with high temperature by mistake, a speed adjustable optical module for 5G is provided.

The utility model provides a rate module of can adjusting luminance for 5G, includes module body, casing and temperature measurement subassembly, the module body with the casing buckle is connected, and set up in the inside of casing, the casing with temperature measurement subassembly fixed connection, just the temperature measurement subassembly set up in the upside of casing, the casing includes semiconductor refrigerator, conducting strip and bears the body, the semiconductor refrigerator fixed set up in the downside of conducting strip, the conducting strip then set up in bear the downside of body, bear the body cover outward in the module body.

The shell is further provided with a radiating fin and a groove, the radiating fin is arranged on the upper side of the bearing body, the groove is arranged on the lower side of the bearing body, and the size of the groove is matched with that of the heat conducting fin.

The heat conducting sheet is made of a copper material, and heat conducting adhesive glue is coated on one side, close to the groove, of the heat conducting sheet.

The bearing body is made of at least one of metal or alloy, and is of a rectangular square frame structure with an opening at one end, and the size of the bearing body is matched with that of the module body.

The temperature measuring assembly comprises an indicator light and a temperature sensor, the indicator light is electrically connected with the temperature sensor, and the temperature sensor is fixedly arranged on the upper side of the bearing body.

The indicating lamp comprises a first state lamp and a second state lamp, and the first state lamp and the second state lamp are adjacently arranged on the upper side of the bearing body.

The model of the semiconductor refrigerator is TES 1-12704.

The utility model has the advantages that: on the basis of the prior art, the temperature measuring assembly is used for measuring the temperature of the shell, when the temperature of the module body is too high, the shell is used for dissipating heat, and the semiconductor refrigerator is in contact with the heat conducting fin, so that the temperature of the bearing body fixedly arranged with the heat conducting fin is reduced, namely the temperature of the optical module is reduced, and the problem that a maintainer is scalded due to mistakenly touching the optical module is solved from the aspect of reducing the temperature.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is the utility model relates to a 5G is with adjustable optical module of speed's axle survey schematic structure.

Fig. 2 is a schematic diagram of a top view structure of the rate-adjustable optical module for 5G of the present invention.

Fig. 3 is a schematic cross-sectional structure view of the housing and the temperature measurement component of the adjustable rate optical module for 5G.

10-module body, 20-shell, 30-temperature measuring component, 21-semiconductor refrigerator, 22-heat conducting fin, 23-bearing body, 24-heat radiating fin, 25-groove, 31-temperature sensor, 32-indicator light, 221-heat conducting adhesive, 321-first state light and 322-second state light.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to 3, the present invention provides a technical solution:

the utility model provides a rate module of can adjusting luminance for 5G, includes module body 10, casing 20 and temperature measurement subassembly 30, module body 10 with casing 20 buckle is connected, and set up in the inside of casing 20, casing 20 with temperature measurement subassembly 30 fixed connection, just temperature measurement subassembly 30 set up in the upside of casing 20, casing 20 includes semiconductor refrigerator 21, conducting strip 22 and bears body 23, semiconductor refrigerator 21 fixed set up in the downside of conducting strip 22, conducting strip 22 set up in the downside that bears body 23, bear body 23 cover outward in module body 10.

In this embodiment, a large amount of heat is emitted during the photoelectric conversion process of the module body 10, the housing 20 carries the module body 10, the housing 20 is connected to the module body 10 in a snap-fit manner, so that effective heat transfer can be performed between the housing 20 and the module body 10, the temperature measuring assembly 30 measures the temperature of the housing 20, when the temperature of the housing 20 is high, the semiconductor cooler 21 is started, the cold end of the semiconductor cooler 21 is in contact with the heat conducting sheet 22, and the heat conducting sheet 22 is connected to the housing 20, so that the purpose of reducing the temperature of the housing 20 and the optical module can be achieved by absorbing the heat of the heat conducting sheet 22, and the purpose of avoiding scalding a maintainer can be achieved by reducing the temperature of the optical module.

Further, the housing 20 further has a heat sink 24 and a groove 25, the heat sink 24 is disposed on the upper side of the supporting body 23, the groove 25 is disposed on the lower side of the supporting body 23, and the size of the groove 25 matches with the size of the heat conducting fin 22.

In the present embodiment, the purpose of the heat sink 24 is to dissipate heat by using an ambient temperature, when the temperature of the housing 20 is not high, the heat sink 24 may be used to reduce the temperature of the optical module by exchanging heat with the atmosphere, so as to achieve the purpose of reducing the usage of the semiconductor cooler 21, that is, saving energy, and the groove 25 is used to facilitate the placement of the heat conducting sheet 22, and the heat conducting sheet 22 is placed inside the groove 25 to better exchange heat with the housing 20, that is, to achieve a better heat conducting effect.

Further, the heat conducting strip 22 is made of a copper material, and a side of the heat conducting strip 22 relatively close to the groove 25 is coated with a heat conducting adhesive 221.

In the present embodiment, since copper has excellent thermal conductivity and thermal stability, and is low in price, the heat conducting strip 22 made of copper material can effectively reduce the production cost on the premise of good thermal conductivity, and the heat conducting adhesive 221 is coated on the side of the heat conducting strip 22 relatively close to the groove 25, so that the heat conducting strip 22 can be effectively fixed in the groove 25, and at the same time, the heat conducting adhesive 221 can be used for heat transfer.

Further, the bearing body 23 is made of at least one of metal or alloy, and the bearing body 23 is a rectangular square frame structure with an opening at one end, and the size of the bearing body is matched with that of the module body 10.

In the present embodiment, the purpose of selecting metal or alloy to manufacture the bearing body 23 is that metal or alloy has excellent thermal conductivity and stability, and can efficiently transfer heat from the module body 10 to the bearing body 23 and out through the bearing body 23.

Further, the temperature measuring assembly 30 includes an indicator light 32 and a temperature sensor 31, the indicator light 32 is electrically connected to the temperature sensor 31, and the temperature sensor 31 is fixedly disposed on the upper side of the bearing body 23.

In this embodiment, the temperature sensor 31 is used to measure the temperature of the bearing body 23, and the temperature sensor 31 is electrically connected to the indicator light 32 and the semiconductor refrigerator 21, that is, the operating state of the indicator light 32 and the semiconductor refrigerator 21 can be controlled by the temperature measured by the temperature sensor 31, the electrical control system is not described in detail in the present invention, and after the indicator light 32 is lighted, the light signal is used to inform the maintainer whether the temperature of the optical module can be touched.

Further, the indicator lights 32 include a second status light 322 and a first status light 321, and the second status light 322 and the first status light 321 are adjacently disposed on the upper side of the bearing body 23.

In this embodiment, it is preferable that the second status light 322 corresponds to a green light, the first status light 321 corresponds to a red light, when the temperature of the carrier body 23 is lower than the preset temperature, the indicator light 32 is set to a green light, when the temperature of the carrier body 23 reaches or is higher than the preset temperature, the indicator light 32 is set to a red light, since there is a risk of low-temperature scald in theory 40 ℃ to 50 ℃, the preset temperature is set to 40 ℃ to 50 ℃, once the preset temperature exceeds 40 ℃ to 50 ℃, a maintainer has a risk of being scalded, that is, when the temperature of the optical module is lower than 40 ℃ to 50 ℃, the second status light 322 is turned on, the first status light 321 is turned off, which indicates that the working temperature of the optical module does not have a risk of being scalded, a maintainer can touch the optical module, the temperature of the optical module reaches or exceeds 40 ℃ to 50 ℃, the first status light 321 is turned on, the second status light 322 is turned off to warn the maintainer to avoid touching the optical module, so as to achieve the purpose of avoiding the maintainer from being scalded by the optical module from the angle of the light signal.

Further, the semiconductor refrigerator 21 is model TES 1-12704.

In the present embodiment, the purpose of selecting the semiconductor cooler 21 of this type is to adapt the size of the optical module, and to avoid the use of the optical module being affected by the oversize of the semiconductor cooler 21.

The utility model discloses on prior art's basis, show these two aspects of temperature of optical module through reducing the optical module temperature and conversion light signal, avoid the maintainer when maintaining the optical module, because the optical module temperature is higher and be scalded, simultaneously, because the optical rate of optical module receives the influence of temperature, under the in service behavior of 5G network, keep the optical rate that the optical module can let the optical module in the lower condition with the temperature of optical module and receive regulation and control, also promptly the utility model discloses also be favorable to the speed regulation and control of the optical module under the 5G.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims (7)

1. The utility model provides an adjustable optical module of rate for 5G, its characterized in that, includes module body, casing and temperature measurement subassembly, the module body with the casing buckle is connected, and set up in the inside of casing, the casing with temperature measurement subassembly fixed connection, just the temperature measurement subassembly set up in the upside of casing, the casing includes semiconductor refrigerator, conducting strip and bears the body, the semiconductor refrigerator fixed set up in the downside of conducting strip, the conducting strip then set up in the downside that bears the body, it covers in to bear the body outside the module body.

2. The 5G rate tunable optical module according to claim 1, wherein the housing further comprises a heat sink and a groove, the heat sink is disposed on an upper side of the carrier body, the groove is disposed on a lower side of the carrier body, and the size of the groove is matched with the heat conductive sheet.

3. The 5G adjustable rate optical module of claim 2, wherein the heat conducting sheet is made of copper material, and a side of the heat conducting sheet opposite to the groove is coated with a heat conducting adhesive.

4. The 5G rate tunable optical module according to claim 1, wherein the carrier body is made of at least one of metal and alloy, and the carrier body has a rectangular frame structure with an opening at one end, and the size of the rectangular frame structure is matched with that of the module body.

5. The adjustable rate optical module for 5G according to claim 1, wherein the temperature measurement component comprises an indicator light and a temperature sensor, the indicator light is electrically connected to the temperature sensor, and the temperature sensor is fixedly disposed on the upper side of the carrying body.

6. The adjustable rate optical module for 5G according to claim 5, wherein the indicator light comprises a first status light and a second status light, and the first status light and the second status light are adjacently disposed on the upper side of the bearing body.

7. The adjustable rate optical module for 5G as claimed in claim 1, wherein the model of said semiconductor refrigerator is TES 1-12704.

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