CN212846053U - A bridge heat dissipation structure of an optical module - Google Patents
A bridge heat dissipation structure of an optical module Download PDFInfo
- Publication number
- CN212846053U CN212846053U CN202021673840.1U CN202021673840U CN212846053U CN 212846053 U CN212846053 U CN 212846053U CN 202021673840 U CN202021673840 U CN 202021673840U CN 212846053 U CN212846053 U CN 212846053U
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- Prior art keywords
- heat
- heat dissipation
- dissipation structure
- casing
- chip
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 27
- 230000003287 optical effect Effects 0.000 title claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000011889 copper foil Substances 0.000 claims abstract description 24
- 239000013307 optical fiber Substances 0.000 claims abstract description 17
- 239000004519 grease Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 239000011800 void material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000005693 optoelectronics Effects 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型涉及光电领域，具体涉及一种光模块的桥接散热结构，所述光模块包括壳体，以及设置在壳体内的电路板和光纤，所述光纤外围设置有避空区，所述桥接散热结构包括贴于电路板芯片的导热片和覆盖在导热片上的铜箔，所述导热片及铜箔往外延伸并与壳体连接，与现有技术相比，本实用新型通过设计一种高自由度的桥接散热结构，解决了光纤避空区域无法有效将芯片热量传递至壳体的难题，进一步地，通过铜箔与导热片的配合，一方面使得导热片与发热芯片贴合更加紧密，进而增加导热性能，另一方面，铜箔本身就是热的良导体，使得传热效率进一步提高，最终使得产品性能更加稳定。
The utility model relates to the field of optoelectronics, in particular to a bridging heat dissipation structure of an optical module. The optical module comprises a casing, a circuit board and an optical fiber arranged in the casing. The heat dissipation structure includes a heat-conducting sheet attached to the chip of the circuit board and a copper foil covering the heat-conducting sheet. The heat-conducting sheet and the copper foil extend outward and are connected with the casing. The bridging heat dissipation structure with degrees of freedom solves the problem that the optical fiber escape area cannot effectively transfer the heat of the chip to the casing. Furthermore, through the cooperation of the copper foil and the thermal conductive sheet, on the one hand, the thermal conductive sheet and the heating chip can be more closely attached. In turn, the thermal conductivity is increased. On the other hand, the copper foil itself is a good conductor of heat, which further improves the heat transfer efficiency and ultimately makes the product performance more stable.
Description
Technical Field
The utility model relates to a photoelectricity field, concretely relates to bridging heat radiation structure of optical module.
Background
The optical communication industry develops to present, and optical module product is more and more miniaturized and integrates, places a large amount of high-power components and parts in a less volume casing, and this just brings huge challenge to the heat dissipation, because the module volume is less, compact structure, current heat dissipation scheme is mainly conduction heat dissipation, specifically for utilize heat conduction silicone grease to fill the clearance of chip and casing, form the heat conduction passageway, pass to the casing through the heat conduction passageway with the heat that the chip was made, borrow the casing to distribute away the heat again.
This is very easy to realize to simple structure, but some module insides need to twine optic fibre, and the place that optic fibre passed through needs to keep away the sky, and this just leads to the region that optic fibre passed through must be the cavity state, can not fill the heat conduction material to can't be effectual with chip heat transfer to casing, at present, most designs all directly neglect the heat dissipation demand of this position, cause the uncontrollable state of product performance.
Therefore, it is very critical to the art to design a bridging heat dissipation structure of an optical module, which effectively conducts chip heat to a housing in an optical fiber clearance area to improve product performance stability.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a bridging heat radiation structure of optical module, solved in optic fibre keep away the empty regional difficult problem that can't conduct chip heat to casing effectively.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a bridging heat radiation structure of optical module, optical module includes the casing to and set up circuit board and optic fibre in the casing, the optic fibre periphery is provided with keeps away the dead zone, and its preferred scheme lies in: the bridging heat dissipation structure comprises a heat conducting fin attached to the circuit board chip and a copper foil covering the heat conducting fin, wherein the heat conducting fin and the copper foil extend outwards and are connected with the shell.
Wherein, the preferred scheme is that the heat-conducting fin is a flexible material made of heat-conducting silicone grease.
The heat conducting sheet and the copper foil are communicated with the chip and the shell, and the communication mode is bridging.
Wherein, the thickness of the copper foil is 0.02-0.07mm in a better scheme.
The shell comprises an upper shell and a lower shell, a first cavity used for containing the optical fiber is arranged on the upper shell, a second cavity used for containing the circuit board is arranged on the lower shell, the first cavity is communicated with the second cavity, and the space avoiding area is arranged in the first cavity.
Preferably, the gap between the upper housing and the circuit board is smaller than the thickness of the heat-conducting plate.
The thickness of the heat conducting sheet is larger than the height of the circuit board chip.
Preferably, the surface area of the heat conducting sheet is larger than that of the chip.
The beneficial effects of the utility model reside in that, compared with the prior art, the utility model discloses a design the bridging heat radiation structure of a high degree of freedom, solved optic fibre keep away empty regional unable effective chip heat transfer to the difficult problem of casing, furtherly, through the cooperation of copper foil with the conducting strip, make the conducting strip more inseparabler with the chip laminating that generates heat on the one hand, and then increase thermal conductivity, on the other hand, copper foil itself is exactly the good conductor of heat, make heat transfer efficiency further improve, finally make product property ability more stable.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a cross-sectional view of a bridging heat dissipation structure of an optical module in the present invention;
fig. 2 is a schematic structural diagram of a bridging heat dissipation structure of an optical module in the present invention.
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the present invention provides a preferred embodiment of a bridging heat dissipation structure of an optical module.
A bridging heat radiation structure of an optical module comprises a shell 100, a circuit board 300 and an optical fiber 200, wherein the circuit board 300 and the optical fiber 200 are arranged in the shell 100, an avoidance area A is arranged on the periphery of the optical fiber 200, the bridging heat radiation structure comprises a heat conducting sheet 500 attached to a circuit board chip 400 and a copper foil 600 covering the heat conducting sheet 500, the heat conducting sheet 500 and the copper foil 600 extend outwards and are connected with the shell 100, and a bridging mode is established to communicate the circuit board chip 400 and an upper shell 110 to form a passage for transferring heat.
The heat conducting sheet 500 can be applied to the circuit board chip 400, and can also be applied to other components that are commonly used in circuit boards and are prone to generate heat, and in this embodiment, the chip 400 is taken as an example for detailed description.
Specifically, the housing 100 includes an upper housing 110 and a lower housing 120, a first cavity 111 for accommodating the optical fiber 200 is disposed on the upper housing 110, a second cavity 121 for accommodating the circuit board 300 is disposed on the lower housing 120, the first cavity 111 is communicated with the second cavity 121, and the space avoiding area a is disposed in the first cavity 111.
At present, for the heat dissipation of a small-sized integrated optical module with a relatively simple structure, the heat dissipation is mainly performed by conducting heat dissipation, a gap between a heat source (chip) and a shell is filled with heat-conducting silicone grease to form a heat-conducting channel, the heat produced by the chip is transferred to the shell through the heat-conducting channel, and then the heat is dissipated by means of the shell.
However, some modules need to wind optical fibers inside, and the place where the optical fibers pass needs to be kept away, so that the area where the optical fibers pass must be in a cavity state, and the heat conduction material cannot be filled, and the heat-generating chip cannot dissipate heat in time, so that the performance of the product is unstable, and therefore, in order to stabilize the performance of the product, the heat-generating chip needs to dissipate heat in time, in this embodiment, a keep-away area a is arranged around the optical fibers 200, and the existence of the keep-away area a forms a cavity state that the heat conduction material cannot be supplemented, so that the circuit board 300 and the optical fibers 200 on which the chip 400 is welded are respectively arranged in the different but communicated second cavity 121 and first cavity 111, and then the heat-conducting sheet 500 and the copper foil 600 are attached to the circuit board chip 400, and the heat-conducting sheet 500 and the copper foil 600 are extended to the periphery to be connected with the housing, so as to effectively dissipate heat from, the keep-away area a in the first cavity 111 can be kept unaffected.
Further, in this embodiment, the heat conducting sheet 500 is made of a flexible material made of heat conducting silicone grease, and the heat conducting sheet 500 is attached to the chip 400, so that heat dissipated by the chip 400 can be effectively absorbed, further, the heat conducting sheet 500 is extended to an area outside the chip 400, and the upper shell 110 around the first cavity 111 is utilized to physically contact the heat conducting sheet 500, further, in this embodiment, a copper foil 600 for fixing and protecting the heat conducting sheet 500 is further disposed on the heat conducting sheet 500, the copper foil 600 is closely attached to the heat conducting sheet 500, and a layer of copper foil 600 is attached to the heat conducting sheet 500, so that the attachment between the heat conducting sheet 500 and the chip is more close, and the heat conducting performance is enhanced, and meanwhile, the copper foil 600 is a good thermal conductor, so that the heat conducting efficiency is further improved; wherein, the heat is diffused to the periphery by taking the chip 400 area as the center, and a path is formed by the contact of the heat-conducting sheet 500 and the copper foil 600 peripheral area with the upper shell 110, so that the heat is effectively conducted to the upper shell 110; it should be noted that the height of the space in the clamping area between the upper housing 110 and the circuit board 300 is required to be less than the thickness of the heat conducting sheet 500, that is, the heat conducting sheet 500 is required to maintain a certain amount of compression, so that the heat conducting sheet 500 can be attached to the upper housing 110, and further, the heat generated by the heat generating chip can be effectively conducted to the upper housing 110, and further, since the heat conducting sheet 500 is required to ensure the amount of compression and prevent breakage after being installed, the thickness of the heat conducting sheet 500 cannot be too thin, and is required to be greater than the height of the chip 400.
Wherein, the heat conducting sheet (namely the heat conducting silica gel sheet) is a high heat conducting insulating organic silicon material; the heat-conducting silica gel has the characteristics of low oil separation degree (tending to zero), high and low temperature resistance, water resistance, ozone resistance, weather aging resistance and the like, and can keep a grease state in use for a long time at the temperature of-50 ℃ to +230 ℃; the bridge-connection heat dissipation structure has good use stability and good construction performance, and is very suitable for being applied to the bridge-connection heat dissipation structure of the optical module in the embodiment.
The copper foil is made of copper and other metals in a certain proportion, has low surface oxygen characteristic, and has a wide temperature use range and good toughness. In this embodiment, the copper foil 600 has a thickness of 0.02 to 0.07 mm.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, which is intended to cover all equivalent changes and modifications made within the scope of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021673840.1U CN212846053U (en) | 2020-08-12 | 2020-08-12 | A bridge heat dissipation structure of an optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021673840.1U CN212846053U (en) | 2020-08-12 | 2020-08-12 | A bridge heat dissipation structure of an optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212846053U true CN212846053U (en) | 2021-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021673840.1U Active CN212846053U (en) | 2020-08-12 | 2020-08-12 | A bridge heat dissipation structure of an optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212846053U (en) |
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2020
- 2020-08-12 CN CN202021673840.1U patent/CN212846053U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: No.35 Cuijing Road, Pingshan District, Shenzhen City, Guangdong Province Patentee before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |
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| CP03 | Change of name, title or address |