CN209420245U - The copper aluminium mixing shielding case that embedded copper billet directly radiates - Google Patents
The copper aluminium mixing shielding case that embedded copper billet directly radiates Download PDFInfo
- Publication number
- CN209420245U CN209420245U CN201822009377.XU CN201822009377U CN209420245U CN 209420245 U CN209420245 U CN 209420245U CN 201822009377 U CN201822009377 U CN 201822009377U CN 209420245 U CN209420245 U CN 209420245U
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- Prior art keywords
- aluminium
- copper
- thermally conductive
- convex
- conductive convex
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 68
- 239000010949 copper Substances 0.000 title claims abstract description 68
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 61
- 239000004411 aluminium Substances 0.000 title claims abstract description 60
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims abstract description 3
- 239000007787 solid Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a kind of copper aluminium mixing shielding case that embedded copper billet directly radiates, including aluminium upper cover, aluminium lower cover, cooling fin and the thermally conductive convex of copper, the installation opposite with aluminium lower cover of aluminium upper cover forms the shielding cavity for accommodating circuit board, it is connected between aluminium lower cover and cooling fin by the first heat conductive pad, the high power consumption chip position covered on corresponding circuits plate under aluminium is equipped with first flange circle, the thermally conductive convex of copper passes through first flange circle and connect with the first heat conductive pad, the upper surface of the thermally conductive convex of copper is connect by the second heat conductive pad with high power consumption chip, the conventional heat dissipation element position covered on corresponding circuits plate under aluminium is connected with the thermally conductive convex of aluminium, the upper surface of the thermally conductive convex of aluminium is connect by third heat conductive pad with conventional heat dissipation element.Shape structure is mixed using the copper aluminium that the thermally conductive convex of copper and the thermally conductive convex of aluminium combine, improves the heat dissipation performance and long-term working stability of circuit board entirety.
Description
Technical field
The utility model relates to shielding case, in particular to a kind of copper aluminium mixing shielding case that embedded copper billet directly radiates.
Background technique
It is existing with heat sinking function can plug shielding case be it is a kind of seal shape shell, include upper cover and lower cover, centre folder
Pressing against the electronic circuit board for needing to radiate and shield.Power hair because circuit board is closed between upper and lower cover, on circuit board
Thermal device can only transfer heat to shell by convex, then by shell heat by the convex contact heating device extended on shell
It is transmitted on the cooling fin being in direct contact with it, to reach shielding and heat dissipation purpose.This design is not high in circuit board power consumption
And be relatively suitble to when dispersion, but in the communication system increasingly developed, chip integration and processing capacity are continuously improved, function
Consumption also increases accordingly very much, so unit space concentrates cooling requirements higher.If continued using existing heat dissipation Shielding plan,
More concentration, higher temperature sink can be dispersed into rapidly the shell adjacent domain with its disjunctor by thermally conductive convex, heat instead
The same other circuits and other chips to be radiated with convex of chip perimeter, also reduce the thermal diffusivity of main heat radiation chip itself
Can, to influence the long-term working stability of circuit board entirety.
Utility model content
In view of the above, the utility model provides a kind of copper aluminium mixing shielding case that embedded copper billet directly radiates, and adopts
Shape structure is mixed with copper aluminium, the high-efficiency heat conduction performance of copper had both been utilized as high power consumption chip cooling medium, has also retained original aluminium
Shell solves in shielding case one under the premise of overall cost does not have essence rising as main shield and auxiliary heat dissipation shell
Or the bottleneck problem to radiate in multiple high power consumption chipsets, it also solves because concentrating high power consumption heat to be directly conducted to peripheral circuit
Caused by peripheral circuit and chip the problem of being heated instead, to improve the heat dissipation performance of circuit board entirety and long-term
Job stability.
The utility model relates to technical solution:
A kind of copper aluminium mixing shielding case that embedded copper billet directly radiates, including aluminium upper cover, aluminium lower cover, cooling fin and copper are led
Hot convex, the installation opposite with aluminium lower cover of aluminium upper cover form the shielding cavity for accommodating circuit board, lead between aluminium lower cover and cooling fin
The connection of the first heat conductive pad is crossed, the high power consumption chip position covered on corresponding circuits plate under aluminium is equipped with first flange circle, and copper is thermally conductive prominent
Platform passes through first flange circle and connect with the first heat conductive pad, and the upper surface of the thermally conductive convex of copper passes through the second heat conductive pad and high power consumption chip
It connects, covers the conventional heat dissipation element position on corresponding circuits plate under aluminium and be connected with the thermally conductive convex of aluminium, the thermally conductive convex of aluminium
Upper surface is connect by third heat conductive pad with conventional heat dissipation element.
Further, the thermally conductive convex of the copper includes fixed plate and the thermally conductive main body of copper for being integrally connected to fixed plate.
Further, the fixed plate is from the thermally conductive main body surrounding of copper from outer extension preset distance, for opening in fixed plate
If four fixation holes, each fixed hole position is corresponded on first flange circle and has installed screw hole, the thermally conductive convex of copper is arranged in by screw
Fixation hole and screw hole and it is affixed with first flange circle.
Further, conducting resinl is equipped between the first flange circle and fixed plate.
Further, the interior boring ratio high power consumption chip big 3 to 5mm of the first flange circle.
The copper aluminium mixing shielding case that the embedded copper billet of the utility model directly radiates, it is thermally conductive prominent using the thermally conductive convex of copper and aluminium
The copper aluminium that platform combines mixes shape structure, and the high-efficiency heat conduction performance of copper had both been utilized as high power consumption chip cooling medium, has also protected
It stays original aluminum hull as main shield and auxiliary heat dissipation shell, forms by the thermally conductive convex of high power consumption chip → second heat conductive pad → copper
The independent heat dissipation channel that → the first heat conductive pad → cooling fin is constituted, improves the effect directly to radiate to high power consumption chip, total
Body cost does not have solve the bottleneck to radiate in one or more high power consumption chipsets in shielding case under the premise of essence rising
Problem also solves peripheral circuit and chip because caused by high power consumption heat is concentrated to be directly conducted to peripheral circuit and is added instead
The problem of heat, to improve the heat dissipation performance and long-term working stability of circuit board entirety.
Detailed description of the invention
Fig. 1 is the exploded view for the copper aluminium mixing shielding case that the embedded copper billet of the utility model directly radiates；
Fig. 2 is the schematic cross-sectional view for the copper aluminium mixing shielding case that the embedded copper billet of the utility model directly radiates.
Specific embodiment
Below with reference to the attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu is fully described by.It should be appreciated that specific embodiment described herein is only used to explain the utility model, it is not used to
Limit scope of protection of the utility model.
Fig. 1 and Fig. 2 is please referred to, the utility model provides a kind of copper aluminium mixing shielding case that embedded copper billet directly radiates,
It is isolated including aluminium upper cover 1, aluminium lower cover 2, the thermally conductive convex 3 of copper and cooling fin 5, aluminium upper cover 1 with cooling fin 5, under aluminium upper cover 1 and aluminium
Lid 2 is opposite to be installed together, and is formed the shielding cavity for accommodating circuit board 6, is led between aluminium lower cover 2 and cooling fin 5 by first
Heat pad 7 connects, and 61 position of high power consumption chip on aluminium lower cover 2 on corresponding circuits plate 6 is equipped with first flange circle 21, the thermally conductive convex of copper
3 pass through first flange circle 21 connect with the first heat conductive pad 7, and the upper surface of the thermally conductive convex 3 of copper passes through the second heat conductive pad 8 and high power consumption
Chip 61 connects；62 position of conventional heat dissipation element on aluminium lower cover 2 on corresponding circuits plate 6 is connected with the thermally conductive convex 4 of aluminium, aluminium
The upper surface of thermally conductive convex 4 is connect by third heat conductive pad 9 with conventional heat dissipation element 62.
The interior boring ratio high power consumption chip 61 big 3 to 5mm of first flange circle 21, with ensure be embedded in the thermally conductive convex 3 of copper on table
The area of entire high power consumption chip 61 can be completely covered in the area in face.
The thermally conductive convex 3 of copper is designed to that an independent fine copper individual, simple structure are easy to process.The thermally conductive convex 3 of copper includes
Fixed plate 31 and the thermally conductive main body 32 of the copper for being integrally connected to fixed plate 31, fixed plate 31 is from thermally conductive 32 surrounding of main body of copper from outer extension
Preset distance corresponds to each 33 position of fixation hole for opening up four fixation holes 33 in fixed plate 31 on first flange circle 21
Equipped with screw hole 23, first flange circle 21 is equipped with conducting resinl 24, and the thermally conductive convex 3 of copper is arranged in fixation hole 33 and spiral shell by screw 34
Hole 23 and it is affixed with first flange circle 21,31 surrounding of fixed plate is fitted closely with first flange circle 21 by conducting resinl 24, is both increased
The inside and outside airtightness of strong shell, also improves shield effectiveness；There is no direct contact surfaces with aluminium lower cover 2 for the thermally conductive convex of copper 3, only every
Very narrow circle conducting resinl 24, so the heat of the thermally conductive convex 3 of copper will not have with the heat of aluminium lower cover 2 and directly exchange and mutual
It influences, is formed in this way by thermally conductive 3 → the first 7 → cooling fin of heat conductive pad of convex, 5 structure of 61 → the second 8 → copper of heat conductive pad of high power consumption chip
At independent heat dissipation channel, improve the effect directly to radiate to high power consumption chip 61.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Using equivalent structure or equivalent flow shift made by the utility model description, it is applied directly or indirectly in other phases
The technical field of pass, is also included in the patent protection scope of the utility model.
Claims (5)
1. a kind of copper aluminium mixing shielding case that embedded copper billet directly radiates, including aluminium upper cover (1), aluminium lower cover (2) and cooling fin
(5), aluminium upper cover (1) and aluminium lower cover (2) opposite installation form the shielding cavity for accommodating circuit board (6), which is characterized in that also wrap
The thermally conductive convex of copper (3) is included, is connect between aluminium lower cover (2) and cooling fin (5) by the first heat conductive pad (7), it is corresponding on aluminium lower cover (2)
High power consumption chip (61) position on circuit board (6) is equipped with first flange circle (21), and the thermally conductive convex of copper (3) passes through first flange circle
(21) it is connect with the first heat conductive pad (7), the upper surface of the thermally conductive convex of copper (3) passes through the second heat conductive pad (8) and high power consumption chip
(61) it connects, conventional heat dissipation element (62) position on aluminium lower cover (2) on corresponding circuits plate (6) is connected with the thermally conductive convex of aluminium
(4), the upper surface of the thermally conductive convex of aluminium (4) is connect by third heat conductive pad (9) with conventional heat dissipation element (62).
2. the copper aluminium mixing shielding case that embedded copper billet according to claim 1 directly radiates, which is characterized in that the copper
Thermally conductive convex (3) includes fixed plate (31) and the thermally conductive main body of copper (32) for being integrally connected to fixed plate (31).
3. the copper aluminium mixing shielding case that embedded copper billet according to claim 2 directly radiates, which is characterized in that described solid
Fixed board (31) is from the thermally conductive main body of copper (32) surrounding from outer extension preset distance, for opening up four fixation holes on fixed plate (31)
(33), each fixation hole (33) position is corresponded on first flange circle (21) equipped with screw hole (23), the thermally conductive convex of copper (3) passes through screw
(34) fixation hole (33) and screw hole (23) are arranged in and affixed with first flange circle (21).
4. the copper aluminium mixing shielding case that embedded copper billet according to claim 3 directly radiates, which is characterized in that described
Conducting resinl (24) are equipped between one flange circle (21) and fixed plate (31).
5. the copper aluminium mixing shielding case that embedded copper billet according to claim 1 directly radiates, which is characterized in that described
The interior boring ratio high power consumption chip (61) big 3 to 5mm of one flange circle (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822009377.XU CN209420245U (en) | 2018-11-30 | 2018-11-30 | The copper aluminium mixing shielding case that embedded copper billet directly radiates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822009377.XU CN209420245U (en) | 2018-11-30 | 2018-11-30 | The copper aluminium mixing shielding case that embedded copper billet directly radiates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209420245U true CN209420245U (en) | 2019-09-20 |
Family
ID=67936221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822009377.XU Active CN209420245U (en) | 2018-11-30 | 2018-11-30 | The copper aluminium mixing shielding case that embedded copper billet directly radiates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209420245U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112804817A (en) * | 2021-03-04 | 2021-05-14 | 上海七十迈数字科技有限公司 | Chip heat radiation structure |
| CN113709968A (en) * | 2021-09-10 | 2021-11-26 | 上海移远通信技术股份有限公司 | PCB heat radiation assembly |
-
2018
- 2018-11-30 CN CN201822009377.XU patent/CN209420245U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112804817A (en) * | 2021-03-04 | 2021-05-14 | 上海七十迈数字科技有限公司 | Chip heat radiation structure |
| CN113709968A (en) * | 2021-09-10 | 2021-11-26 | 上海移远通信技术股份有限公司 | PCB heat radiation assembly |
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