CN209420245U - The copper aluminium mixing shielding case that embedded copper billet directly radiates - Google Patents

Abstract

The utility model provides a copper-aluminum mixed shielding cover with embedded copper blocks for direct heat dissipation, which includes an aluminum upper cover, an aluminum lower cover, a heat sink and a copper heat-conducting protruding platform, and the aluminum upper cover and the aluminum lower cover are installed relative to each other to accommodate In the shielding cavity of the circuit board, the aluminum lower cover and the heat sink are connected through the first heat conduction pad. A flange ring is connected to the first heat conduction pad, the upper surface of the copper heat conduction pad is connected to the high-power chip through the second heat conduction pad, and the aluminum lower cover is integrally connected with the position of the conventional heat dissipation element on the circuit board. , the upper surface of the aluminum heat conduction boss is connected with the conventional heat dissipation element through the third heat conduction pad. The copper-aluminum hybrid structure combining copper heat conduction protrusions and aluminum heat conduction protrusions is used to improve the overall heat dissipation performance and long-term working stability of the circuit board.

Description

Copper-aluminum hybrid shield with embedded copper block for direct heat dissipation

technical field

The utility model relates to a shielding cover, in particular to a copper-aluminum mixed shielding cover with embedded copper blocks for direct heat dissipation.

Background technique

The existing pluggable shielding cover with heat dissipation function is a sealed shell, which includes an upper cover and a lower cover, and an electronic circuit board that needs heat dissipation and shielding is sandwiched between them. Because the circuit board is enclosed between the upper and lower covers, the power heating device on the circuit board can only contact the heating device through the protruding platform extending on the housing, the protruding platform transfers the heat to the housing, and then the housing transfers the heat to the housing. It is transmitted to the heat sink in direct contact with it, so as to achieve the purpose of shielding and heat dissipation. This design is more suitable when the power consumption of the circuit board is not high and scattered, but in the increasingly developed communication system, the chip integration and processing capabilities continue to increase, and the power consumption also increases a lot, so the centralized heat dissipation per unit space requires more high. If you continue to use the existing heat dissipation shielding scheme, the more concentrated and higher temperature heat dissipation will be quickly dissipated to the adjacent area of the shell connected to it through the heat conduction boss, which will heat up other circuits and other circuits around the chip that also use the boss to dissipate heat. The chip also reduces the heat dissipation performance of the main heat dissipation chip itself, thus affecting the long-term working stability of the circuit board as a whole.

Utility model content

In view of the above, the utility model provides a copper-aluminum mixed shielding cover with embedded copper blocks for direct heat dissipation. It adopts a copper-aluminum mixed structure, which not only utilizes the high-efficiency thermal conductivity of copper as a heat dissipation medium for high-power chips, but also retains the original The aluminum shell is used as the main shield and auxiliary heat dissipation shell, which solves the bottleneck problem of centralized heat dissipation of one or more high-power chips in the shield without a fundamental increase in the overall cost, and also solves the direct heat dissipation caused by concentrated high-power consumption. The peripheral circuit and the chip caused by conduction to the peripheral circuit are heated instead, thereby improving the overall heat dissipation performance and long-term working stability of the circuit board.

The technical solution that the utility model relates to:

A copper-aluminum mixed shielding cover with embedded copper blocks for direct heat dissipation, including an aluminum upper cover, an aluminum lower cover, a heat sink, and a copper heat-conducting protrusion. The aluminum upper cover and the aluminum lower cover are installed opposite to each other to form a shield for accommodating a circuit board cavity, the aluminum lower cover and the heat sink are connected by the first heat conduction pad, the aluminum lower cover is provided with a first flange ring corresponding to the position of the high power consumption chip on the circuit board, and the copper heat conduction protrusion passes through the first flange ring Connected with the first heat conduction pad, the upper surface of the copper heat conduction pad is connected to the high power consumption chip through the second heat conduction pad, and the position of the conventional heat dissipation element on the corresponding circuit board on the aluminum lower cover is integrally connected with the aluminum heat conduction protrusion, the aluminum heat conduction protrusion The upper surface of the stage is connected with a conventional heat dissipation element through a third heat conduction pad.

Further, the copper heat-conducting protrusion includes a fixing plate and a copper heat-conducting main body integrally connected to the fixing plate.

Further, the fixing plate extends a predetermined distance from the periphery of the copper heat-conducting main body, so as to provide four fixing holes on the fixing plate, screw holes are provided on the first flange ring corresponding to each fixing hole position, and the copper heat-conducting protrusions The table is fixedly connected with the first flange ring through screws passing through the fixing holes and the screw holes.

Further, conductive glue is provided between the first flange ring and the fixing plate.

Further, the inner hole of the first flange ring is 3 to 5mm larger than the high power consumption chip.

The copper-aluminum hybrid shielding cover with embedded copper blocks for direct heat dissipation of the utility model adopts a copper-aluminum hybrid structure combining copper heat-conducting protrusions and aluminum heat-conducting protrusions, which not only utilizes the high-efficiency thermal conductivity of copper as a heat dissipation medium for high-power consumption chips , and also retain the original aluminum shell as the main shield and auxiliary heat dissipation shell, forming an independent heat dissipation channel composed of high power consumption chip→second heat conduction pad→copper heat conduction protrusion→first heat conduction pad→heat sink, which improves the high The effect of direct heat dissipation of power consumption chips solves the bottleneck problem of centralized heat dissipation of one or more high power consumption chips in the shielding cover without a fundamental increase in the overall cost, and also solves the direct conduction of heat due to concentrated high power consumption to the surrounding area. The peripheral circuit and the chip caused by the circuit are heated instead, thereby improving the overall heat dissipation performance and long-term working stability of the circuit board.

Description of drawings

Fig. 1 is the exploded view of the copper-aluminum hybrid shielding cover of the utility model embedded copper block direct heat dissipation;

Fig. 2 is a cross-sectional structural schematic diagram of the copper-aluminum hybrid shielding cover of the utility model with embedded copper blocks for direct heat dissipation.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the protection scope of the utility model.

Please refer to Fig. 1 and Fig. 2. The utility model provides a copper-aluminum mixed shielding cover with embedded copper blocks for direct heat dissipation, including an aluminum upper cover 1, an aluminum lower cover 2, a copper heat-conducting protrusion 3 and a heat sink 5. The cover 1 is isolated from the heat sink 5, and the aluminum upper cover 1 and the aluminum lower cover 2 are relatively installed together to form a shielding cavity for accommodating the circuit board 6, and the first heat conduction pad is passed between the aluminum lower cover 2 and the heat sink 5 7 connection, the aluminum lower cover 2 is provided with a first flange ring 21 at the position corresponding to the high power consumption chip 61 on the circuit board 6, and the copper heat conduction protrusion 3 passes through the first flange ring 21 to connect with the first heat conduction pad 7, The upper surface of the copper heat conduction protrusion 3 is connected to the high power consumption chip 61 through the second heat conduction pad 8; the position of the conventional heat dissipation element 62 on the corresponding circuit board 6 on the aluminum lower cover 2 is integrally connected with the aluminum heat conduction protrusion 4, and the aluminum heat conduction protrusion The upper surface of the stage 4 is connected with a conventional heat dissipation element 62 through a third thermal pad 9 .

The inner hole of the first flange ring 21 is 3 to 5 mm larger than the high power consumption chip 61 to ensure that the area of the upper surface of the embedded copper heat conduction protrusion 3 can completely cover the entire area of the high power consumption chip 61 .

The copper heat conduction boss 3 is designed as an independent pure copper body, which has a simple structure and is easy to process. The copper heat-conducting protrusion 3 includes a fixed plate 31 and a copper heat-conducting body 32 integrally connected to the fixed plate 31. The fixed plate 31 extends a predetermined distance from the periphery of the copper heat-conducting body 32 to provide four fixing holes 33 on the fixed plate 31. , the first flange ring 21 is provided with a screw hole 23 corresponding to each fixing hole 33, the first flange ring 21 is provided with a conductive adhesive 24, and the copper heat-conducting protrusion 3 is passed through the fixing hole 33 and the screw through the screw 34. Hole 23 is fixedly connected with the first flange ring 21, and the periphery of the fixed plate 31 is closely attached to the first flange ring 21 through conductive glue 24, which not only enhances the airtightness of the inside and outside of the shell, but also improves the shielding effect; the copper heat conduction protrusion The table 3 and the aluminum lower cover 2 have no direct contact surface, only a narrow circle of conductive glue 24 is separated, so the heat of the copper heat-conducting protrusion 3 will not directly exchange and interact with the heat of the aluminum lower cover 2, so An independent heat dissipation channel consisting of high power consumption chip 61 → second heat conduction pad 8 → copper heat conduction protrusion 3 → first heat conduction pad 7 → heat sink 5 is formed, which improves the effect of direct heat dissipation on high power consumption chip 61 .

The above is only an embodiment of the utility model, and does not limit the patent scope of the utility model. Any equivalent structure or equivalent process conversion made by using the content of the utility model description, or directly or indirectly used in other related technologies Fields are all included in the scope of patent protection of the utility model in the same way.

Claims (5)

1. a kind of copper aluminium mixing shielding case that embedded copper billet directly radiates, including aluminium upper cover (1), aluminium lower cover (2) and cooling fin (5), aluminium upper cover (1) and aluminium lower cover (2) opposite installation form the shielding cavity for accommodating circuit board (6), which is characterized in that also wrap The thermally conductive convex of copper (3) is included, is connect between aluminium lower cover (2) and cooling fin (5) by the first heat conductive pad (7), it is corresponding on aluminium lower cover (2) High power consumption chip (61) position on circuit board (6) is equipped with first flange circle (21), and the thermally conductive convex of copper (3) passes through first flange circle (21) it is connect with the first heat conductive pad (7), the upper surface of the thermally conductive convex of copper (3) passes through the second heat conductive pad (8) and high power consumption chip (61) it connects, conventional heat dissipation element (62) position on aluminium lower cover (2) on corresponding circuits plate (6) is connected with the thermally conductive convex of aluminium (4), the upper surface of the thermally conductive convex of aluminium (4) is connect by third heat conductive pad (9) with conventional heat dissipation element (62).

2. the copper aluminium mixing shielding case that embedded copper billet according to claim 1 directly radiates, which is characterized in that the copper Thermally conductive convex (3) includes fixed plate (31) and the thermally conductive main body of copper (32) for being integrally connected to fixed plate (31).

3. the copper aluminium mixing shielding case that embedded copper billet according to claim 2 directly radiates, which is characterized in that described solid Fixed board (31) is from the thermally conductive main body of copper (32) surrounding from outer extension preset distance, for opening up four fixation holes on fixed plate (31) (33), each fixation hole (33) position is corresponded on first flange circle (21) equipped with screw hole (23), the thermally conductive convex of copper (3) passes through screw (34) fixation hole (33) and screw hole (23) are arranged in and affixed with first flange circle (21).

4. the copper aluminium mixing shielding case that embedded copper billet according to claim 3 directly radiates, which is characterized in that described Conducting resinl (24) are equipped between one flange circle (21) and fixed plate (31).

5. the copper aluminium mixing shielding case that embedded copper billet according to claim 1 directly radiates, which is characterized in that described The interior boring ratio high power consumption chip (61) big 3 to 5mm of one flange circle (21).