CN219718927U - Intelligent storage electronic product and heat conduction structure thereof - Google Patents

Abstract

The utility model discloses an intelligent storage electronic product and a heat conduction structure thereof, wherein the heat conduction structure comprises an upper heat conduction rubber pad (61), a heat conduction frame (5), an upper graphene sheet (41) which are positioned between a main board (7) and a face shell (1), and lower heat conduction rubber pads (62, 63) and lower graphene sheets (42) which are positioned between the main board (7) and the bottom of a middle frame (2); according to the utility model, a radiating plate and a radiator are not required to be arranged for radiating, but on one hand, the heat of a heating device on the side of a main board facing the surface shell is guided to a heat conducting rubber pad and a heat conducting frame, and then the heat is uniformly dispersed on a graphene sheet and finally is dispersed from the surface shell; on the other hand, the heat of the heating device facing to one side of the bottom shell of the main board is led to the heat-conducting rubber pad, and then the heat is uniformly dispersed on the graphene sheet, and finally the heat in the product can be uniformly and multi-directionally radiated out from the middle frame and the bottom shell, so that a good radiating effect is realized under the condition that the size of the product is not obviously increased.

Description

Intelligent storage electronic product and heat conduction structure thereof

Technical Field

The utility model relates to the field of intelligent storage electronic products, in particular to an intelligent storage electronic product and a heat conduction structure thereof.

Background

At present, most intelligent storage electronic products on the market have higher surface temperature, are concentrated at high temperature, do not well utilize other areas to dissipate heat, and have thicker whole machine thickness, so that the thickness dimension and the surface temperature of the product cannot be controlled at proper levels at the same time. In order to achieve the purposes of ensuring that the product is compact and the surface temperature is not too high, the heat is uniformly conducted out through the optimization of an internal heat conducting structure, and the surface of the product can dissipate heat uniformly. The existing heat conduction technology mainly comprises heat conduction and heat dissipation of a circuit board and a chip, heat emitted by a heating electrode is transferred to a heat dissipation plate through a heat conduction layer, the heat dissipation plate is further connected with a radiator, the heat dissipation plate can timely transfer the heat to the radiator for heat dissipation, and the heat dissipation plate and the radiator are placed in a large space.

Disclosure of Invention

The utility model aims to solve the technical problem that the heat conduction structure occupies too large space in the prior art, and provides an intelligent storage electronic product and a heat conduction structure thereof.

The technical scheme adopted for solving the technical problems is as follows:

on one hand, an intelligent storage electronic product heat conduction structure is constructed, the intelligent storage electronic product comprises a middle frame, a surface shell for sealing the middle frame and a bottom shell clung to the bottom of the middle frame, a main board is arranged in the middle frame, an upper heating device is arranged on one side of the main board facing the surface shell, a lower heating device is arranged on one side of the main board facing the bottom shell, and the heat conduction structure comprises an upper heat conduction rubber pad, an upper graphene sheet, a lower heat conduction rubber pad and a lower graphene sheet, wherein the upper heat conduction rubber pad and the upper graphene sheet are arranged between the main board and the bottom of the middle frame;

the upper heating device on one side of the main board facing the surface shell is tightly attached to the bottom of the upper heat-conducting rubber pad, and the upper graphene sheet is tiled on the inner side of the surface shell and is used for uniformly dispersing heat conducted by the heat-conducting rubber pad from the upper heating device and guiding the heat to the surface shell to be dispersed;

the lower heating device of mainboard facing to drain pan one side is hugged closely lower heat conduction cushion top, lower graphite alkene piece tiling is in the center bottom inboard, is used for with the heat that lower heat conduction cushion was led from lower heating device evenly spreads and leads to the center, drain pan are gone out.

Further, in the heat conducting structure of the intelligent storage electronic product, the heat conducting structure further comprises a heat conducting frame located between the upper heat conducting rubber pad and the upper graphene sheet, the heat conducting frame fills a concave area of the main board facing one side of the face shell and compresses the upper heat conducting rubber pad on an upper heating device, and the upper graphene sheet is tiled on the top of the whole heat conducting frame.

Further, in the heat conduction structure of the intelligent storage electronic product, the heat conduction frame is an aluminum alloy product.

Further, in the heat conducting structure of the intelligent storage electronic product, the size of the plane of the upper heat conducting rubber pad is matched with the size of the plane of the upper heating device, and the size of the plane of the upper graphene sheet is matched with the size of the plane of the face shell.

Further, in the heat conducting structure of the intelligent storage electronic product, the size of the plane of the lower heat conducting rubber pad is matched with the size of the plane of the lower heating device, and the lower graphene sheet is tightly attached to the lower heat conducting rubber pad and covers a region, which is not covered by the lower heat conducting rubber pad, of the bottom of the middle frame.

Further, in the heat conduction structure of the intelligent storage electronic product, the face shell is a non-metal material part. The middle frame and the bottom shell are made of aluminum alloy materials.

Further, in the heat conducting structure of the intelligent storage electronic product, the upper heating device is a bare chip. The lower heating device comprises a bare chip and a shielding case with the chip inside.

In two aspects, an intelligent storage electronic product is constructed, comprising a heat conducting structure as described above.

The intelligent storage electronic product and the heat conduction structure thereof have the following beneficial effects: according to the utility model, a radiating plate and a radiator are not required to be arranged for radiating, but on one hand, the heat of a heating device on the side of a main board facing the surface shell is led to a heat conducting rubber pad, and then the heat is uniformly dispersed on a graphene sheet and finally emitted from the surface shell; on the other hand, the heat of the heating device facing to one side of the bottom shell of the main board is led to the heat-conducting rubber pad, and then the heat is uniformly dispersed on the graphene sheet, and finally the heat in the product can be uniformly and multi-directionally radiated out from the middle frame and the bottom shell, so that a good radiating effect can be realized under the condition that the size of the product is not obviously increased.

Drawings

For a clearer description of an embodiment of the utility model or of a technical solution in the prior art, the drawings that are needed in the description of the embodiment or of the prior art will be briefly described, it being obvious that the drawings in the description below are only embodiments of the utility model, and that other drawings can be obtained, without inventive effort, by a person skilled in the art from the drawings provided:

FIG. 1 is a schematic diagram of an electronic product according to the present utility model;

FIG. 2 is a schematic cross-sectional view of an electronic product according to the present utility model;

FIG. 3 is an exploded view of the electronic product of the present utility model;

FIG. 4 is a schematic diagram of a top heat dissipation related structure of an electronic product;

fig. 5 is a schematic diagram of a bottom heat dissipation related structure of an electronic product.

Detailed Description

Aiming at the defect that the heat conduction structure in the prior art occupies too large space, the utility model provides and provides an intelligent storage electronic product and a heat conduction structure thereof, and the main thinking is as follows: on one hand, a heat-conducting rubber pad and a graphene sheet are arranged between the main board and the face shell, heat of a heating device on one side of the main board facing the face shell is conducted to the heat-conducting rubber pad, and then the heat is uniformly dispersed on the graphene sheet and finally emitted from the face shell; on the other hand, set up heat conduction cushion, graphite alkene piece between mainboard and center bottom, with the heat conduction cushion of the heating element of mainboard towards drain pan one side, afterwards evenly scatter on the graphite alkene piece, finally distribute away from center, drain pan, so can more evenly diversified heat dissipation go out of the heat in the product, can realize good radiating effect under the circumstances that does not obviously increase product size.

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Exemplary embodiments of the present utility model are illustrated in the accompanying drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It should be understood that the embodiments of the present utility model and the specific features in the embodiments are detailed descriptions of the technical solutions of the present utility model, and not limited to the technical solutions of the present utility model, and the embodiments of the present utility model and the technical features in the embodiments may be combined with each other without conflict.

Referring to fig. 1, the electronic product of the present utility model includes a middle frame 2, a face case 1, and a bottom case 3, wherein the middle frame 2 is a main frame of the whole electronic product, and a substantially rectangular space is provided for mounting functional components of the product. The top of the middle frame 2 is open, and the surface shell 1 covers the top of the middle frame 2. The bottom of the middle frame 2 is closed, and the bottom shell 3 is tightly attached to the bottom of the middle frame 2 through double faced adhesive tape and the like.

Referring to fig. 2-3, a main board 7 is disposed inside the middle frame 2, an upper heating device 100 is disposed on a side of the main board 7 facing the face shell 1, and lower heating devices 101 and 102 are disposed on a side of the main board 7 facing the bottom shell 3. Specifically, the upper heat generating device 100 is a bare chip, specifically an SSD chip. The lower heat generating devices 101 and 102 include bare chips and a shielding case with built-in chips, that is, the main board 7 has a plurality of chips on a side facing the bottom case 3, and some chips are bare and some are provided with shielding cases.

With continued reference to fig. 2, and in conjunction with fig. 3-5, the heat conducting structure includes an upper heat conducting rubber pad 61, a heat conducting frame 5, an upper graphene sheet 41, which are located between the main board 7 and the face shell 1, and lower heat conducting rubber pads 62, 63, a lower graphene sheet 42, which are located between the main board 7 and the bottom of the middle frame 2. The upper graphene sheet 41 and the lower graphene sheet 42 are each a very thin one-layer sheet structure.

Specifically, the upper heating device 100 on the side of the main board 7 facing the face shell 1 is tightly attached to the bottom of the upper heat-conducting rubber pad 61, the upper graphene sheet 41 is tiled on the inner side of the face shell 1, the heat-conducting frame 5 is located between the upper heat-conducting rubber pad 61 and the upper graphene sheet 41, and the heat-conducting frame 5 fills the concave area of the side of the main board 7 facing the face shell 1 and presses the upper heat-conducting rubber pad 61 on the upper heating device 100. The upper graphene sheet 41 is tiled on the top of the whole heat conduction frame 5, and is used for uniformly dispersing the heat conducted by the heat conduction rubber pad 61 from the upper heating device 100 and guiding the heat to the surface shell 1 to be dispersed;

the planar size of the upper thermal pad 61 is adapted to the planar size of the upper heat generating device 100, and the planar size of the upper graphene sheet 41 is adapted to the planar size of the face housing 1. The term "fit" refers to ensuring a sufficient contact area, for example, by designing the planar dimensions to be approximately equal, a difference in size can be made to ensure a sufficient contact area, so that the heat can be conducted out and dissipated as much as possible, for example, the planar dimension of the upper heat-conducting rubber pad 61 can be slightly larger than the planar dimension of the upper heat-generating device 100, so that the heat generated by the upper heat-generating device 100 can be conducted out as much as possible vertically by the upper heat-generating device 100, and for example, the planar dimension of the upper graphene sheet 41 can be the planar dimension of the Xu Xiaoyu surface shell 1, and since the purpose of the upper graphene sheet 41 is to uniformly dissipate the heat to make the heat be dissipated from the entire surface shell 1 as much as possible, so that heat concentration can be avoided. Of course, the upper graphene sheet 41 should avoid the installation of relevant devices that need to be exposed from the face shell 1, such as a fingerprint identifier, and these can be solved by forming an avoidance hole or an avoidance position on the upper graphene sheet 41.

Theoretically, the heat conducting frame 5 may be omitted, and the upper heat conducting rubber pad 61 may be designed to be thick enough to be in contact with the upper graphene sheet 41, but in view of the fact that the concave area of the main board 7 on the side facing the face-piece 1 is relatively large, and in view of the good heat dissipation performance of aluminum alloy, it is preferable to guide the heat conducting frame 5 for transition.

Specifically, the lower heating devices 101 and 102 of the main board 7 facing to one side of the bottom shell 3 are tightly attached to the tops of the lower heat conducting rubber pads 62 and 63, and the lower graphene sheets 42 are tiled on the inner side of the bottom of the middle frame 2 and used for uniformly dispersing heat conducted by the lower heat conducting rubber pads 62 and 63 from the lower heating devices 101 and 102 and guiding the heat to the middle frame 2 and the bottom shell 3 to be emitted.

The planar dimensions of the lower thermal pads 62, 63 are adapted to the planar dimensions of the lower heat-generating devices 101, 102, and the matching here is also referred to as ensuring a sufficient contact area.

Referring to fig. 5, the lower graphene sheet 42 is closely attached to the lower thermal conductive rubber pads 62, 63 and covers a region of the bottom of the middle frame 2, which is mostly uncovered by the lower thermal conductive rubber pads 62, 63. Because the lower heat-conducting rubber pads 62, 63 can also vertically conduct heat to the bottom of the middle frame 2, the lower graphene sheets 42 can cover the whole bottom as much as possible without the upper graphene sheets 41, and only the area of the bottom of the middle frame 2, which is not covered by the lower heat-conducting rubber pads 62, 63, needs to be covered.

In addition, the lower heat-generating device 102 is a chip, and the lower heat-generating device 101 is not a chip, but a shielding case, so that the thickness of the lower heat-conducting rubber pad 62 corresponding to the lower heat-generating device 101 is smaller than the thickness of the lower heat-conducting rubber pad 63 corresponding to the lower heat-generating device 102, and thus, the contact plane of all the lower heat-conducting rubber pads 62, 63 and the lower graphene sheet 42 is ensured to be at a horizontal height.

It can be appreciated that the number of chips is not limited, and this embodiment is only an example, and when the number of chips is changed, the number or size of the thermal conductive rubber pads can be changed, so that all the chips can be ensured to vertically guide out heat through the thermal conductive rubber pads, and then the heat is parallel dispersed through the graphene sheets. In addition, it is not necessarily that one heat generating device corresponds to one heat conducting rubber pad, and when the heat generating devices are relatively close, the plurality of heat generating devices can share one heat conducting rubber pad, for example, two shielding cases are relatively close in this embodiment, so that one lower heat conducting rubber pad 62 is shared.

In this embodiment, the middle frame 2, the bottom shell 3, and the heat conducting frame 5 are all made of aluminum alloy materials, and have heat conductivity coefficients: 201w/m.k. The middle frame 2 and the bottom shell 3 are made of aluminum alloy, so that the aluminum alloy has good heat dissipation performance. The face shell 1 is a non-metal material piece, for example, in this embodiment, the face shell 1 is made of ABS, PC and 30% gf mixed. The heat conductivity coefficient of the upper graphene sheet 41 and the lower graphene sheet 42 in the parallel direction is 1000w/m.k.

In this embodiment, the vertical direction refers to the thickness direction of the entire product, and the parallel direction refers to the direction perpendicular to the thickness direction of the entire product. Because the upper and lower thermal pads 61, 62, 63 are mainly physically thermally conductive in the vertical direction, the upper and lower thermal pads 61, 62, 63 need to be in as close contact as possible with the heat generating device without affecting the heat generating device, which is also the reason for selecting pad thermal conductivity, e.g., the lower thermal pads 62, 63 may be excessively hard-fitted with the shield.

In summary, the intelligent storage electronic product and the heat conduction structure thereof have the following beneficial effects: according to the utility model, a radiating plate and a radiator are not required to be arranged for radiating, but on one hand, the heat of a heating device on the side of a main board facing the surface shell is led to a heat conducting rubber pad, and then the heat is uniformly dispersed on a graphene sheet and finally emitted from the surface shell; on the other hand, the heat of the heating device facing to one side of the bottom shell of the main board is led to the heat-conducting rubber pad, and then the heat is uniformly dispersed on the graphene sheet, and finally the heat in the product can be uniformly and multi-directionally radiated out from the middle frame and the bottom shell, so that a good radiating effect can be realized under the condition that the size of the product is not obviously increased.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims (10)

1. The utility model provides an intelligent storage electronic product heat conduction structure, intelligent storage electronic product includes center (2), closing cap face-piece (1) of center (2), hugs closely drain pan (3) of center (2) bottom, center (2) inside is provided with mainboard (7), mainboard (7) are provided with upward heating device (100) towards face-piece (1) one side, are provided with downward heating device (101, 102) towards drain pan (3) one side, characterized in that, heat conduction structure includes upper heat conduction cushion (61), upper graphene sheet (41) that are located between mainboard (7) and face-piece (1), and be located lower heat conduction cushion (62, 63), lower graphene sheet (42) between mainboard (7) and center (2) bottom;

an upper heating device (100) on one side of the main board (7) facing the face shell (1) is tightly attached to the bottom of the upper heat-conducting rubber pad (61), and the upper graphene sheet (41) is flatly paved on the inner side of the face shell (1) and used for uniformly dispersing heat conducted by the heat-conducting rubber pad (61) from the upper heating device (100) and guiding the heat to the face shell (1) to be emitted;

the lower heating devices (101, 102) of one side of the main board (7) facing the bottom shell (3) are tightly attached to the tops of the lower heat conducting rubber pads (62, 63), and the lower graphene sheets (42) are flatly paved on the inner side of the bottom of the middle frame (2) and used for uniformly dispersing heat conducted by the lower heat conducting rubber pads (62, 63) from the lower heating devices (101, 102) and guiding the heat to the middle frame (2) and the bottom shell (3) to be dispersed.

2. The intelligent storage electronic product heat conducting structure according to claim 1, further comprising a heat conducting frame (5) located between the upper heat conducting rubber pad (61) and the upper graphene sheet (41), wherein the heat conducting frame (5) fills a concave area of the main board (7) facing to one side of the face shell (1) and compresses the upper heat conducting rubber pad (61) on an upper heating device (100), and the upper graphene sheet (41) is tiled on the top of the whole heat conducting frame (5).

3. The heat conducting structure of the intelligent storage electronic product according to claim 2, wherein the heat conducting frame (5) is an aluminum alloy product.

4. The heat conducting structure of the intelligent storage electronic product according to claim 1, wherein the planar size of the upper heat conducting rubber pad (61) is matched with the planar size of the upper heating device (100), and the planar size of the upper graphene sheet (41) is matched with the planar size of the face shell (1).

5. The heat conducting structure of the intelligent storage electronic product according to claim 1, wherein the plane size of the lower heat conducting rubber pads (62, 63) is matched with the plane size of the lower heating devices (101, 102), the lower graphene sheets (42) are clung to the lower heat conducting rubber pads (62, 63) and cover the area, which is mostly uncovered by the lower heat conducting rubber pads (62, 63), of the bottom of the middle frame (2).

6. The heat conducting structure of an intelligent storage electronic product according to claim 1, wherein the face shell (1) is a non-metallic material piece.

7. The heat conducting structure of intelligent storage electronic product according to claim 1, wherein the middle frame (2) and the bottom shell (3) are made of aluminum alloy materials.

8. The heat conducting structure of intelligent storage electronic product according to claim 1, wherein the upper heating device (100) is a bare chip.

9. The smart storage electronics heat transfer structure of claim 1 wherein the lower heat generating devices (101, 102) comprise bare chips and a shield for the built-in chips.

10. An intelligent storage electronic product, characterized by a heat conducting structure according to any of claims 1-9.