CN108493261A - Photosensor package and packaging method - Google Patents
Photosensor package and packaging method Download PDFInfo
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- CN108493261A CN108493261A CN201810203574.7A CN201810203574A CN108493261A CN 108493261 A CN108493261 A CN 108493261A CN 201810203574 A CN201810203574 A CN 201810203574A CN 108493261 A CN108493261 A CN 108493261A
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- photoelectric sensor
- plate
- quartz glass
- light transmission
- glass plate
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
Abstract
The present invention provides a kind of photosensor package and packaging methods, are related to sensor field, and the photosensor package includes the lower housing for being provided with the upper shell of optical transmission window and being tightly connected with upper shell；There is light transmission quartz glass plate at optical transmission window；It is provided with positioning thermal-insulating sealing cover between the light transmission quartz glass plate and photoelectric sensor, for fixing photoelectric sensor and light transmission quartz glass plate, positions the cavity being additionally provided in thermal-insulating sealing cover for holding anhydrous nitrogen oxygen hybrid protection gas；Further include semiconductor chilling plate, be provided in the cold-end plane of semiconductor chilling plate and be electromagnetically shielded heat-conductive plate made of the metal material good leading temp effect, one side and photoelectric sensor abut, and the cold end low temperature of semiconductor chilling plate is passed to photoelectric sensor.The photosensor package of the application, solve the problems, such as appearance and size existing for photosensor package in the prior art it is big, to the unconspicuous technical problem of thermal noise improvement of photoelectric sensor.
Description
Technical field
The present invention relates to sensor technical fields, more particularly, to a kind of photosensor package.The invention further relates to one
Kind photosensor package method.
Background technology
Photoelectric sensor belongs to a kind of refrigerant transducer, that is, needs to work under cryogenic.Photoelectric sensor is by light
Signal is converted to is known as dark current during electric signal along with electronic thermal noise, this electronic thermal noise.Due to dark current
Presence affect the detection limit of photoelectric sensor, ensure that one of the key factor of sensor effect is to reduce dark electricity as far as possible
Stream.
Since its higher dark current of senor operating temperature is bigger, the most efficient method for reducing dark current is to passing
Sensor carries out refrigeration cool-down, to realize the effect for reducing the thermal noise of photoelectric sensor, reducing detection limit, improving its sensitivity
Fruit, and the lower improvement of cryogenic temperature is more apparent.
The structure of photosensor package is by photoelectric sensor, circuit board, potsherd, semiconductor refrigerating in the prior art
Transparent glass piece in metal shell, is sticked on the outside of metal-back light portal, sheet glass by piece with sealant sealing with fluid sealant
Applying argon gas prevents sensor photosensitive window fogging between sensor.In order to realize the effect of encapsulation inner cryogenic, there is two at present
The common heat dissipating method of kind：First, by water circulation cooling, second is that passing through wind-cooling heat dissipating.The structure of wherein water circulation cooling be by
Sensor pin, which extends along former direction from package bottom radiating surface, draws, and installs water storage case and aqueduct in radiating surface side, leads to
Cross water circulation cooling.The structure of wind-cooling heat dissipating be by sensor pin after the extraction of package bottom radiating surface, by heat conducting pipe and
Heat is guided to farther place by heat pipe radiating fin, further passes through wind-cooling heat dissipating.
But there are following points for existing photosensor package：1, the overall volume after encapsulating is larger.2, photoelectric transfer
Thermal noise of sensor during converting optical signals to electric signal is still higher.
To sum up, the appearance and size for reducing photosensor package makes the thermal noise problem of the photoelectric sensor after encapsulation change
It is kind with obvious effects, it is those skilled in the art's urgent problem to be solved.Based on this, the present invention provides a kind of photoelectric sensor envelopes
Dress and photosensor package method are to solve above-mentioned technical problem.
Invention content
The purpose of the present invention is to provide a kind of photosensor packages, to alleviate photosensor package in the prior art
Existing appearance and size is big, to the unconspicuous technical problem of thermal noise problem improvement of photoelectric sensor.The present invention's is another
One is designed to provide a kind of photosensor package method.
Photosensor package provided by the invention, including it is provided with the upper shell of optical transmission window, and it is close with the upper shell
Seal the lower housing of connection；Have light transmission quartz glass plate at the optical transmission window, the light transmission quartz glass plate be located at upper shell and
Between the photosensitive-member of photoelectric sensor；It is provided with positioning thermal-insulating sealing between the light transmission quartz glass plate and photoelectric sensor
Cover, the positioning thermal-insulating sealing cover is made of microcellular foam material, for fixing photoelectric sensor and the light transmission quartz glass
Piece, it is described to position the cavity being additionally provided in thermal-insulating sealing cover for holding anhydrous nitrogen oxygen hybrid protection gas；It further include semiconductor
The hot junction plane of cooling piece, the semiconductor chilling plate is fitted on the inner surface of lower housing, the semiconductor chilling plate it is cold
Electromagnetic shielding heat-conductive plate is provided on transverse plane；The electromagnetic shielding heat-conductive plate is made by leading the good metal material of temp effect, electricity
The side of magnetic screen heat-conductive plate and photoelectric sensor abut, and the cold end low temperature of semiconductor chilling plate is passed to photoelectric sensor.
Further, conductor trench is additionally provided on the electromagnetic shielding heat-conductive plate, the conductor trench is bar-shaped trough, institute
State two long sides of the length direction through the plate face for being electromagnetically shielded heat-conductive plate of bar-shaped trough；Photosensor package shell
Fairlead position is provided on lateral wall, the fairlead position is corresponding with the notch position of conductor trench end.
Further, the conductor trench and the fairlead position are both provided with multiple, and quantity is identical.
Further, the electric signal grafting external member of aciculiform, the electric signal grafting external member are provided in the fairlead position
Metal round needle including insulating protective sleeve and inside the insulating protective sleeve, the insulating protective sleeve and the fairlead position
And the equal tight fit connection of metal round needle.
Further, the positioning thermal-insulating sealing cover includes photoelectric sensor posting and the positioning of light transmission quartz glass plate
Frame, photoelectric sensor are inlaid in the photoelectric sensor posting, and light transmission quartz glass plate is inlaid in light transmission quartz glass plate
In posting；
It is provided with hollow isolation between the photoelectric sensor posting and the light transmission quartz glass plate posting centre
Layer, there is the sky through the photoelectric sensor posting and the light transmission quartz glass plate posting in the hollow separation layer
Chamber.
Further, the madial wall of the photoelectric sensor posting and the light transmission quartz glass plate posting is coated with
Silicon rubber film layer.
Further, the upper shell be one end open shell, the lower housing be plate, the upper shell and it is described under
Shell is riveted by riveted column, and the riveted column is inserted into inside the lower housing.
Further, upper shell includes the upper flat plate positioned at top, and the optical transmission window is provided in the middle part of the upper flat plate,
The area of plane of the light transmission quartz glass plate and upper flat plate matches；The light transmission quartz glass plate is fitted in the upper flat plate
Inner wall has thermal grease layer, the upper flat plate and light transmission quartz between the light transmission quartz glass plate and the upper flat plate
Heat transfer can be carried out between sheet glass.
Further, after the photoelectric sensor assembles, flowable state microporous foam material is filled in internal vacant space
Material forms heat insulating stuffing body after its solidification.
A kind of photosensor package is provided in the present invention, and the photosensor package includes being provided with optical transmission window
Upper shell, and with upper shell be tightly connected lower housing.Upper shell is provided with optical transmission window, for making the photosensitive of photoelectric sensor
Component (such as photosensitive sensing unit array) receives light.There are light transmission quartz glass plate, the light transmission quartz glass at optical transmission window
Piece is located inside upper shell between the photosensitive-member of photoelectric sensor, i.e., light transmission quartz glass plate is located inside upper shell.
Photosensor package provided by the invention, it is fixed to be provided between the light transmission quartz glass plate and photoelectric sensor
Position thermal-insulating sealing cover, the positioning thermal-insulating sealing cover are protected for fixing photoelectric sensor and light transmission quartz glass plate, the positioning
The cavity for holding anhydrous nitrogen oxygen hybrid protection gas is additionally provided in warm seal closure；Anhydrous nitrogen oxygen hybrid protection gas prevents from sensing
Device photosensitive window fogging.Positioning thermal-insulating sealing cover is made of microcellular foam material, therefore has the function of heat preservation.Positioning heat preservation is close
There are three sealing cover effects at least：First, the position of fixed photoelectric sensor and light transmission quartz glass plate in upper shell.Second is that association
Help the anhydrous nitrogen oxygen hybrid protection gas of sealing.Third, being kept the temperature to photoelectric sensor.
Photosensor package provided in this embodiment, in order to realize the purpose for the thermal noise for reducing photoelectric sensor,
Cooling refrigeration element is semiconductor chilling plate.Its hot junction plane is fitted on the inner surface of lower housing, is arranged in cold-end plane
There is electromagnetic shielding heat-conductive plate；The electromagnetic shielding heat-conductive plate is made by leading the good metal material of temp effect, and electromagnetic shielding leads temperature
The side of plate and photoelectric sensor abut, and the cold end low temperature of semiconductor chilling plate is passed to photoelectric sensor.Electromagnetic shielding is led
Warm plate is arranged between photoelectric sensor and semiconductor chilling plate, is made, can be shielded by leading the good metal material of temp effect
Electromagnetic interference of the semiconductor chilling plate towards photoelectric sensor direction.
But existing photosensor package has following problem：Due to being to reduce heat to the original intention that photoelectric sensor freezes
Noise improves to-noise ratio and detection limit.But the power of semiconductor chilling plate consumption is larger, and the electric current of consumption is the ampere order of magnitude,
Electromagnetic interference easily is generated to surrounding during refrigeration work, in sealing metal shell more to the electromagnetic interference of adjacent component
By force；Heat conduction connection or cooling piece are carried out using potsherd between cooling piece and sensor in the prior art and sensor is direct
Fitting, does not take electromagnetic shielding measure to sensor, and additional electromagnetism is added to sensor again during refrigeration work
Interfering noise signal is unfavorable for the further improvement of signal-to-noise ratio, to be unfavorable for reducing the thermal noise of photoelectric sensor.
The present invention is to solve the problems, such as semiconductor chilling plate electromagnetic interference photoelectric sensor, in photoelectric sensor and semiconductor
One electromagnetic shielding heat-conductive plate of setting between cooling piece.Magnetic screen heat-conductive plate is made by leading the preferable metal material of temp effect,
Its primary effect is electromagnetic interference, improvement photo-sensor signal of the shielding semiconductor cooling piece towards photoelectric sensor direction
Quality, while the low temperature of semiconductor chilling plate cold end can also be transmitted to photoelectric sensor.
Therefore, photosensor package of the invention uses semiconductor chilling plate and is electromagnetically shielded the structure of heat-conductive plate.
Semiconductor chilling plate is utilized in reliability height, good refrigeration effect, small advantage, and is evaded using electromagnetic shielding heat-conductive plate
Semiconductor chilling plate the problem of.That is, electromagnetic shielding heat-conductive plate can reduce telecommunications of the semiconductor chilling plate to photoelectric sensor
Number interference.It is prevented due to having carried out electromagnetic shielding to photoelectric sensor, is effectively reduced semiconductor chilling plate to photoelectric sensor
Electric signal interference.Positioning thermal-insulating sealing cover is additionally used, positioning thermal-insulating sealing cover can fix photoelectric sensor and light transmitting stone
Position of the English sheet glass in upper shell, the anhydrous nitrogen oxygen hybrid protection gas of sealing, additionally it is possible to photoelectric sensor be kept the temperature, to fill
Divide the refrigeration effect that ensure that semiconductor chilling plate.Therefore, photosensor package of the invention improves photoelectric sensor
Signal-to-noise ratio can greatly reduce the thermal noise of photoelectric sensor, to improve detection limit, the sensitivity of photoelectric sensor.
Photosensor package method provided by the invention, includes the following steps：
The first step：In vacuum glove box, light transmission quartz glass plate and photoelectric sensor are installed on positioning thermal-insulating sealing
On cover, anhydrous nitrogen oxygen hybrid protection gas is filled in light transmission quartz glass plate, photoelectric sensor and positioning thermal-insulating sealing cover institute
In the cavity surrounded；Photoelectric sensor, positioning thermal-insulating sealing cover and light transmission quartz glass plate are linked to be one using silicon rubber film layer
A seal；
Second step places the cavity of upper shell upward, among the seal in the first step is packed into upper shell, uses
The chip pin of sensor side is drawn the side for being connected to and patching external member close to aciculiform electric signal, dress by the thin wire of tape insulation cortex
Upper electromagnetic shielding heat-conductive plate and semiconductor chilling plate；
Third walks, and the electric signal that the conducting wire spot welding of the pin of sensor tape insulation cortex is connected to cavity side patches
In external member on corresponding conductive metal round needle；
4th step：Vacant place filling flowable state microcellular foam material, waits for microporous foam material in the cavity of upper shell
The part for the hot junction plane for exposing semiconductor chilling plate is cut after material solidification；
5th step：By upper shell and lower housing riveted.
Based on this, photosensor package of the invention has appearance and size small, to the thermal noise problem of photoelectric sensor
Improvement clear advantage.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of photosensor package；
Fig. 2 is the sectional view of photosensor package；
Fig. 3 is the schematic diagram of photoelectric sensor；
Fig. 4 is the schematic diagram for positioning thermal-insulating sealing cover；
Fig. 5 is the sectional view for positioning thermal-insulating sealing cover；
Fig. 6 is the schematic diagram of semiconductor chilling plate；
Fig. 7 is the schematic diagram for being electromagnetically shielded heat-conductive plate；
Fig. 8 is the structural schematic diagram of upper shell；
Fig. 9 is the schematic diagram of electric signal grafting external member；
Figure 10 is after photoelectric sensor assembles, after internal vacant space filling flowable state microcellular foam material solidification
The structural schematic diagram of the heat insulating stuffing body of formation；
Figure 11 is the schematic diagram of shell conductive base plate.
Label：Photoelectric sensor 1；Pedestal 1-1；Hollow cavity 1-2；Adhere to matrix 1-3；Photosensitive sensing unit array
1-4；Window transparency diaphragm seal 1-5；Chip pin 1-6；Position thermal-insulating sealing cover 2；Hollow separation layer 2-1；Photoelectric sensing
Device posting 2-2；Light transmission quartz glass plate posting 2-3；Empty slot position 2-4 and 2-5；Closed space 2-6；Light transmitting stone
English sheet glass 3；Anhydrous nitrogen oxygen hybrid protection gas 4；Semiconductor chilling plate 5；Cold-end plane 5-1；Semiconductor thermoelectric crystal grain string, simultaneously
Join array layer 5-2；Hot junction plane 5-3；It is electromagnetically shielded heat-conductive plate 6；Upper plane 6-1；Frame 6-2；Temperature sensor is installed
Side opening 6-3；Hollow out evacuation band 6-4；Conductor trench 6-5；Upper shell 7；Upper flat plate 7-1；Optical transmission window 7-2；Fairlead position
7-3；Crenel 7-4；Riveted through-hole 7-5；Aciculiform electric signal grafting external member 8；Insulating protective sleeve 8-1；Metal round needle 8-2；It protects
Warm filler material body 9；Shell conductive base plate 10；Sinking plane 10-1；Notch 10-2；Riveted hole 10-3；Riveted column 11.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that such as occur term "center", "upper", "lower", "left", "right",
"vertical", "horizontal", "inner", "outside" etc., indicated by orientation or positional relationship be orientation based on ... shown in the drawings or position
Relationship is merely for convenience of description of the present invention and simplification of the description, and not indicating or implying the indicated device or element must have
There is specific orientation, with specific azimuth configuration and operation, therefore is not considered as limiting the invention.In addition, as occurred
Term " first ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " peace such as occur
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, can also be electrical connection；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, it can understand above-mentioned art with concrete condition
The concrete meaning of language in the present invention.
Embodiment
The structure of photoelectric sensor in the present embodiment is as follows：Such as Fig. 3, the photoelectric sensor in the present embodiment is with array
It can be linear array photosemiconductor detector for photosemiconductor detector, can also be face battle array photosemiconductor detector.Array
Photoelectric sensor include pedestal 1-1, the hollow cavity 1-2 positioned at the middle of the base, the attachment matrix 1-3 positioned at cavity bottom,
Window transparency sealing positioned at the photosensitive sensing unit array 1-4 of matrix skin, above base top sensing unit array
Piece 1-5 and chip pin 1-6 positioned at pedestal both sides.
In some array optical semiconductor detectors, chip pin 1-6 may be located on pedestal surrounding, also or bottom
Portion edge.When what chip pin 1-6 was drawn from base edge can generally carry out 90 degree of bendings.But no matter chip pin is the bottom of from
Seat bottom margin is drawn or is drawn from base edge, and chip pin is all vertical with pedestal baseplane, this can cause as follows
Problem：
Photosensitive sensing unit array 1-4 is the present embodiment ultimate aim body to be freezed, due to photosensitive sensing unit array
1-4 is connected by adhering to matrix with base bottom, contactless with other several faces in encapsulating housing.So freezing
When, cryogenic temperature conduction need to be introduced from sensor base bottom.When refrigeration in entire sensor the acquisition of pedestal baseplane temperature
Minimum, base bottom shell layer is thinner, and the temperature and pedestal of photosensitive sensing unit battle array are closer, in the present embodiment, in order to make
The temperature of photosensitive sensing unit array is as low as possible, when sensor base bottom thickness be more than 1mm when polishing method by its
It is about 1mm to be cut to thickness.
As shown in Figure 1-Figure 11, a kind of photosensor package, the photoelectric sensor envelope are provided in the present embodiment
Dress includes the lower housing for being provided with the upper shell 7 of optical transmission window 7-2, and be tightly connected with upper shell 7.Upper shell 7 is provided with light inlet window
Mouth 7-2, for making the photosensitive-member (such as photosensitive sensing unit array 1-4) of photoelectric sensor 1 receive light.Optical transmission window
There are light transmission quartz glass plate 3, the light transmission quartz glass plate 3 to be located at photosensitive with photoelectric sensor 1 inside upper shell 7 at 7-2
Between component, i.e., light transmission quartz glass plate 3 is located inside upper shell 7.
Photosensor package provided in this embodiment is arranged between the light transmission quartz glass plate 3 and photoelectric sensor 1
There is positioning thermal-insulating sealing cover 2, the positioning thermal-insulating sealing cover 2 is for fixing photoelectric sensor 1 and light transmission quartz glass plate 3, institute
State the cavity being additionally provided in positioning thermal-insulating sealing cover 2 for holding anhydrous nitrogen oxygen hybrid protection gas 4；Anhydrous nitrogen oxygen hybrid protection
Gas 4 prevents sensor photosensitive window fogging.Positioning thermal-insulating sealing cover 2 is made of microcellular foam material, therefore with the work of heat preservation
With.It positions there are three 2 effects at least of thermal-insulating sealing cover：First, fixed photoelectric sensor 1 and light transmission quartz glass plate 3 are in upper shell
Position in 7.Second is that assisting to seal anhydrous nitrogen oxygen hybrid protection gas 4.Third, being kept the temperature to photoelectric sensor 1.
Photosensor package provided in this embodiment, in order to realize the purpose for the thermal noise for reducing photoelectric sensor,
Cooling refrigeration element is semiconductor chilling plate 5.Semiconductor chilling plate 5 is also thermoelectric module, is a kind of heat pump.Its main feature is that nothing
Moving component, reliability is high, and since its overall volume is small, is particularly suitable for applications in some spaces and is restricted, reliability
It is required that high, the occasion of no refrigerant pollution.Its principle is the Peltier effects using semi-conducting material, when direct current passes through two
When the galvanic couple that the different semi-conducting materials of kind are connected into, heat can be absorbed respectively at the both ends of galvanic couple and releases heat to realize system
Cold purpose.The contour structures of semiconductor chilling plate are a sheet bodies, and sheet body is hot junction plane on one side, and another side is that cold end is flat
Face.
The hot junction plane of the semiconductor chilling plate 5 of photosensor package provided in this embodiment is fitted in the interior of lower housing
Electromagnetic shielding heat-conductive plate 6 is provided on surface, in cold-end plane；It is described to be electromagnetically shielded the good by leading temp effect of heat-conductive plate 6
Metal material is made, and the side and photoelectric sensor 1 for being electromagnetically shielded heat-conductive plate 6 abut, by the cold end low temperature of semiconductor chilling plate 5
Pass to photoelectric sensor 1.It is electromagnetically shielded heat-conductive plate 6 to be arranged between photoelectric sensor and semiconductor chilling plate 5, by leading temperature
The good metal material of effect is made, can shielding semiconductor cooling piece 5 towards 1 direction of photoelectric sensor electromagnetic interference.
But existing photosensor package has following problem：Due to being to reduce heat to the original intention that photoelectric sensor freezes
Noise improves to-noise ratio and detection limit.But the power of semiconductor chilling plate consumption is larger, and the electric current of consumption is the ampere order of magnitude,
Electromagnetic interference easily is generated to surrounding during refrigeration work, in sealing metal shell more to the electromagnetic interference of adjacent component
By force；Heat conduction connection or cooling piece are carried out using potsherd between cooling piece and sensor in the prior art and sensor is direct
Fitting, does not take electromagnetic shielding measure to sensor, and additional electromagnetism is added to sensor again during refrigeration work
Interfering noise signal is unfavorable for the further improvement of signal-to-noise ratio, to be unfavorable for reducing the thermal noise of photoelectric sensor.
Photosensor package provided in this embodiment, to solve asking for semiconductor chilling plate electromagnetic interference photoelectric sensor
An electromagnetic shielding heat-conductive plate 6 is arranged in topic between photoelectric sensor 1 and semiconductor chilling plate 5.Heat-conductive plate 6 is electromagnetically shielded by leading
The preferable metal material of temp effect is made, and primary effect is electricity of the shielding semiconductor cooling piece towards photoelectric sensor direction
Magnetic radiation interference improves photo-sensor signal quality, while can also the low temperature of semiconductor chilling plate cold end be transmitted to light
Electric transducer.
Therefore, photosensor package provided in this embodiment uses semiconductor chilling plate 5 and electromagnetic shielding heat-conductive plate
6 structure.Semiconductor chilling plate 5 is utilized in reliability height, good refrigeration effect, small advantage, and utilizes electromagnetic shielding
The problem of semiconductor chilling plate that heat-conductive plate is evaded.That is, electromagnetic shielding heat-conductive plate can reduce semiconductor chilling plate to photoelectric transfer
The electric signal of sensor interferes.It is prevented due to having carried out electromagnetic shielding to photoelectric sensor, is effectively reduced semiconductor chilling plate pair
The electric signal of photoelectric sensor interferes.Positioning thermal-insulating sealing cover 2 is additionally used, positioning thermal-insulating sealing cover 2 can fix photoelectric transfer
The anhydrous nitrogen oxygen hybrid protection gas of position in upper shell 7 of sensor 1 and light transmission quartz glass plate 3, sealing 4, additionally it is possible to photoelectricity
Sensor 1 is kept the temperature, to fully ensure that the refrigeration effect of semiconductor chilling plate 5.Therefore, photoelectric sensing provided in this embodiment
Device encapsulates the signal-to-noise ratio for improving photoelectric sensor, the thermal noise of photoelectric sensor can be greatly reduced, to improve light
The detection limit of electric transducer, sensitivity.
Based on this, photosensor package of the invention has appearance and size small, to the thermal noise problem of photoelectric sensor
Improvement clear advantage.
Such as Fig. 4-Fig. 5, in the alternative of the present embodiment, the positioning thermal-insulating sealing cover 2 includes photoelectric sensor positioning
Frame 2-2 and light transmission quartz glass plate posting 2-3, photoelectric sensor are inlaid in the photoelectric sensor posting 2-2,
Light transmission quartz glass plate is inlaid in light transmission quartz glass plate posting 2-3；The photoelectric sensor posting 2-2 and described
It is provided with hollow separation layer 2-1 between the centres light transmission quartz glass plate posting 2-3, is passed through in the hollow separation layer 2-1
Wear the cavity of the photoelectric sensor posting 2-2 and the light transmission quartz glass plate posting 2-3.
Further, the inside of the photoelectric sensor posting 2-2 and the light transmission quartz glass plate posting 2-3
Wall is coated with silicon rubber film layer.
It is the position of fixed photoelectric sensor 1 and light transmission quartz glass plate 3 in upper shell 7 to position 2 effect of thermal-insulating sealing cover
It sets, while taking into account the heat preservation to photoelectric sensor 1 and assisting to seal anhydrous nitrogen oxygen hybrid protection gas 4.Position thermal-insulating sealing cover
2 be in hollow out frame structure, and there is empty space absciss layer 2-1, photoelectric sensor posting 2-2 and light transmission quartz glass plate to position
Frame 2-3；The hollow groove location 2-4 and 2-5 of Fig. 5 install light transmission quartz glass plate and photoelectric sensor respectively；By quartz glass plate
The closed space 2-6 that lower surface, photoelectric sensor upper surface, sensor posting inner surface surround is for closing anhydrous nitrogen oxygen
Hybrid protection gas 4；The geomery of photoelectric sensor posting 2-2 complies with photoelectric sensor, is formed closely with photoelectric sensor
Cooperation.
It positions 2 whole part of thermal-insulating sealing cover and manufacturing technology is integrally formed using microporous foam molding, foam structure is
Closed pore, material used can be polyurethane (PUR), polystyrene (PS), polyvinyl chloride (PVPA18005787), polyethylene
(PE), any types such as phenolic resin (PF) often use microcellular foam material, but are not limited only to above-mentioned material, also include all be suitble to
In the microcellular foam material of hole-closing structure.Any in the forming methods such as it can be molding that the molding, which is integrally formed, inject
Kind.Positioning thermal-insulating sealing cover after integrated molding belongs to rigid foam, has adiabatic (thermal conductivity is extremely low), light (density
It is low), shock resistance (have certain elasticity), the characteristics such as airtight (hole-closing structure).
The whole medial surfaces for positioning thermal-insulating sealing cover 2 are formed on the face at the intermediate hollow out such as 2-4,2-5,2-6 position
It is coated with silicon rubber film layer, is close together to be formed not under the effect of the pressure with smooth light transmission quartz glass and photoelectric sensor
The seal of gas leakage.The silicon rubber is low temperature resistant sulphurated siliastic, vulcanizing system by vulcanizing agents such as ethyl orthosilicates and
The catalyst such as dibutyl tin dilaurate form, and glass transition temperature is at -60 DEG C hereinafter, curing temperature is room temperature；Silicon rubber film layer
Thickness uniformly, smooth surface, interior pore-free and bubble, it is soft in heterogeneity within the temperature range of -30 DEG C -+60 DEG C, have it is good
Good elasticity, realizes good sealing under the action of external extrusion stress.Since microcellular foam material and silica gel all have one
Fixed elasticity is absorbed interior when the front and back big temperature difference of refrigeration leads to sealing gas air pressure change by the deformation of silicon rubber film layer
The volume change (reduce or expand) of portion's sealing gas, ensures air tight in big temperature difference sealing gas.
In the alternative of the present embodiment, anhydrous nitrogen oxygen hybrid protection gas 4 is mixed by nitrogen, oxygen of the depth water removal after dry
It closes gas to form, the ratio of the nitrogen and the oxygen is 3：1 to 4：Between 1.
Anhydrous nitrogen oxygen hybrid protection gas 4 is made of nitrogen, oxygen mixed gas of the depth water removal after dry, wherein oxygen and
The ratio of nitrogen is close with air, and air pressure is normal pressure so that nitrogen, oxygen molecule and air outside in the hybrid protection gas in sealant
The osmotic pressure of air is close to zero so that molecule is created a further reduction without the trend for interpenetrating diffusion inside and outside encapsulating housing
The risk of gas leakage (gas exchanges).
Semiconductor chilling plate 5 as shown in fig. 6,5-1 be cold-end plane, with electromagnetic shielding heat-conductive plate 6 fit；5-2 is
Semiconductor thermoelectric crystal grain series and parallel array layer, converts electrical energy into the temperature difference；5-3 is hot junction plane, with shell conductive base plate 10
It fits.Thermoelectricity crystal grain is power device, and for the electric current flowed through generally in ampere grade or more, die array is inevitable when working
Ground can generate electromagnetic radiation to proximity space around；By the concatenated restriction of thermoelectricity crystal grain, the transverse plane (cold end of semiconductor chilling plate
And hot junction) must be to lead the good insulating materials of temp effect, such as potsherd does not have the function of shielding electromagnetic interference, therefore works as
Semiconductor chilling plate can be to photoelectric sensing when directly fitting with photoelectric sensor or being bonded indirectly by nonmetallic heat conductive material
Device generates a degree of interference.
Such as Fig. 7, in the alternative of the present embodiment, it is electromagnetically shielded on heat-conductive plate 6 and is additionally provided with conductor trench 6-5, conducting wire
Groove 6-5 is bar-shaped trough, and the length direction of the bar-shaped trough runs through two long sides of the plate face of the electromagnetic shielding heat-conductive plate 6；
Fairlead position 7-3, the fairlead position 7-3 and the conductor trench are provided on the lateral wall of photosensor package shell
The notch position of the ends 6-5 corresponds to.
Further, the conductor trench 6-5 and fairlead position 7-3 is both provided with multiple, and the quantity of the two
Matching.
As shown in fig. 7, the electromagnetic shielding setting of heat-conductive plate 6 is between photoelectric sensor 1 and semiconductor chilling plate 5, electromagnetism
Shielding a kind of structure of heat-conductive plate 6 is：It includes upper plane 6-1, frame 6-2, temperature sensor installation to be electromagnetically shielded heat-conductive plate 6
Side opening 6-3, hollow out evacuation band 6-4 and conductor trench 6-5.Upper plane 6-1 is photoelectric sensor binding face, and surrounding is distributed with
Discrete frame 6-2 carries out screens to photoelectric sensor；Lower plane is semiconductor chilling plate binding face；Two middle side parts are inwardly indented
Hollow out evacuation band 6-4 is formed, to accommodate the chip pin of photoelectric sensor 1.One end of upper plane 6-1 is provided with semi-cylindrical temperature
It spends sensor and side opening 6-3 is installed, heat-conducting silicone grease coating in the hole along hole axis direction inwardly fills in temperature sensor after filling up, temperature
Degree sensor is limited in by the pressing of photoelectric sensor bottom surface in hole slot shown in 6-3；The temperature sensor is graininess heat
Quick resistance, platinum resistance or non-Surface Mount small package type digital temperature sensor, preferably negative temperature coefficient (NTPA18005787) temperature-sensitive
Resistance.The middle part of upper plane 6-1 is equipped with several (depending on the number of pin to be transferred) conducting wires for leading to the other side from side
Upper plane is partitioned into several discrete planes by groove 6-5；The chip of the side alignment photoelectric sensor side of groove
The chip pin of sensor side is turned to 90 ° by the conducting wire of several tyre insulation cortex and leads to two sides, finally by pin
Unified to be drawn from the side of upper shell 7, conductor trench is set as that follow-up entire package side surface lead, to reserve bottom surface high efficiency special
Duty heat dissipation lays the foundation.
Such as Fig. 8, in the present embodiment, a kind of structure of photosensor package shell is：The upper shell 7 is one end open
Shell, the lower housing be shell conductive base plate 10, the upper shell 7 and the shell conductive base plate 10 pass through riveted column riveting
It connects, the riveted column is inserted into inside the shell conductive base plate 10.
Further, the material of upper shell 7 is red copper, brass or aluminium.Since light transmission quartz glass plate 3 and positioning are kept the temperature
The group that seal closure 2, photoelectric sensor 1, anhydrous nitrogen oxygen hybrid protection gas 4, electromagnetic shielding heat-conductive plate 6, semiconductor chilling plate 5 form
Attach together the inside cavity that ligand is placed in upper shell 7.Therefore, upper shell 7 made by the preferable robust metallic material of heat-conducting effect and
At.Optionally, the material of upper shell 7 is red copper, brass or aluminium, can also be other metal materials certainly.Above-mentioned material is preferred
Red copper.
Further, upper shell 7 includes the upper flat plate 7-1 positioned at top, and tablet centre position, which is dug, to be had through tablet plate
The area of plane of the optical transmission window 7-2 in face, light transmission quartz glass plate 3 and upper flat plate 7-1 match；Light transmission quartz glass plate is bonded
There are thermal grease layer, upper flat plate and light transmission quartz glass plate between the inner wall of upper flat plate, light transmission quartz glass plate and upper flat plate
Between can carry out heat transfer.
As shown in figure 8, top is upper flat plate 7-1, tablet centre position is dug to be had through tablet the structure of upper shell 7
Optical transmission window 7-2.Light transmission quartz glass plate 3 is overlayed upwards from inside cavity in upper flat plate 7-1 chambers under the action of stress
It is applied on an interior side plane, between light transmission quartz glass plate 3 and upper flat plate 7-1 coated with thin layer heat-conducting silicone grease, warm effect is led with enhancing
Fruit.
Since the effect of the optical transmission window on shell is that the photosensitive-member of photoelectric sensor is allowed to receive light source, light inlet window
Mouthful area according to the photosensitive-member size design of electric transducer.Therefore the area of optical transmission window is compared with the surface area of encapsulating housing
It is usually smaller.Therefore existing photosensor package, as long as the optical transmission window 7-2 of shell light transmission quartz glass plates are sealed
Firmly, the area of light transmission quartz glass plate and optical transmission window 7-2 areas are similar, and light transmission quartz glass plate is from shell
External mounting to shell on.But the photosensor package with above structure, the exposed portion of light transmission quartz glass plate
The problem of position (position corresponding with optical transmission window 7-2) is susceptible to fogging, frost accumulated.
Photosensor package provided in this embodiment, the area of plane of light transmission quartz glass plate 3 and upper flat plate 7-1
Match；Light transmission quartz glass plate is fitted in the inner wall of upper flat plate, has thermal grease layer between light transmission quartz glass plate and upper flat plate, on
Heat transfer can be carried out between tablet and light transmission quartz glass plate.That is, light transmission quartz glass plate 3 and upper flat plate 7-1
The area of plane it is similar, certain light transmission quartz glass plate 3 is smaller to be allowed it to be attached to inside upper shell.The effect of above structure
Fruit is, due in addition to the position where the optical transmission window 7-2 of middle part, the difference in areas of upper flat plate 7-1 and light transmission quartz glass plate 3
Seldom, therefore there is larger contact area therebetween, this so that heat can be carried out between upper flat plate and light transmission quartz glass plate
It transmits, and temperature transmission effect between the two is good.
Heat transfer can be carried out between upper flat plate and light transmission quartz glass plate, it will be able to transparent glass piece fogging be avoided to accumulate
The problem of frost.Due to upper shell 7 because two bottom sides be connected with shell conductive base plate 10 thus its temperature be higher than room temperature, upper flat plate
7-1 reversely heats light transmission quartz glass plate 3 after well being contacted with 3 large area of light transmission quartz glass plate so that entire saturating
The temperature of light quartz glass plate 3 maintains room temperature or more, therefore when the temperature of photoelectric sensor 1 reaches subzero 20 DEG C (- 20 DEG C)
Below, when the temperature of anhydrous nitrogen oxygen hybrid protection gas 4 is down to 0 DEG C or less, the temperature of light transmission quartz glass plate 3 still can maintain room
More than temperature or room temperature, so that light transmission quartz glass plate exposed position (corresponding with optical transmission window 7-2) can remain not
Fogging not frost accumulated, i.e.,：The upper flat plate 7-1 of upper shell 7 efficiently avoids because of system the reversed heating of light transmission quartz glass plate 3
The problem of cold temperature is too low to lead to transparent glass piece exposed light transmission position fogging frost accumulated so that photoelectric sensor can be refrigerated to
Very low temperature solves in traditional post package technology and is difficult to the technical problem freezed to 0 DEG C or less.
Such as Fig. 8 and Fig. 9, in the alternative of the present embodiment, it is provided with aciculiform electric signal in the fairlead position 7-3 and inserts
Joint kit 8, the electric signal grafting external member 8 include insulating protective sleeve 8-1 and the gold inside the insulating protective sleeve 8-1
Belong to round needle 8-2, the insulating protective sleeve 8-1 and the fairlead position 7-3 and the equal tight fits of the metal round needle 8-2 connect
It connects.
The electricity of photoelectric sensor 1, semiconductor chilling plate 5 and the temperature sensor on electromagnetic shielding heat-conductive plate 6
Tracheae foot patches external member 8 via aciculiform electric signal and is drawn out to package outside across fairlead position 7-3；Aciculiform electric signal patches set
Part 8 the insulating protective sleeve 8-1 positioned at outer ring and the metal round needle 8-2 positioned at inner shaft as shown in figure 9, be made of, insulation protection
Set 8-1 forms close interference fit with metal round needle 8-2 and fairlead position 7-3 respectively, and metal round needle 8-2 is fastened on
Ensure that metal round needle 8-2 is not in contact with the metal shell of upper shell 7 while the centers 7-3 of fairlead position, it is short to avoid
Road connects；It is originally vertical for photoelectric sensor 1 since fairlead position 7-3 is arranged on the side side of preposition hollow cavity
Electric signal pin in bottom surface is ultimately steering to 90 ° and is drawn from the side of packaging body, avoids bottom pin and draws occupancy heat conduction bottom
Plate space influences the problem of cooling piece heat dissipation.
As shown in Figure 1, Figure 2, shown in Fig. 8, Figure 11, the bottom both ends of upper shell 7 are provided with crenel 7-4 and shell conductive base plate 10
Central waist formed complementary fit；The two sides bottom of preposition hollow cavity be respectively provided with row's riveted through-hole 7-5 for it is fixed outside
Shell conductive base plate 10.Shell conductive base plate 10 is as shown in figure 11, by the preferably firm gold of the heat-conducting effects such as red copper, brass or aluminium
Belong to material to be made, the preferred red copper of making material；There is a sinking plane 10-1 in the middle part of the upper end, after assembly and is placed in
The hot junction plane 5-3 of semiconductor chilling plate 5 in upper shell 7 fits, and the heat that cooling piece generates passes through sinking plane 10-
1 imports shell conductive base plate；The central waist both sides of conductive base plate 10 are inwardly indented to form notch 10-2, its waist when assembly
It is placed in the slot position that 7 both ends crenel 7-4 of preposition hollow cavity is linked to be, preposition hollow cavity two sides bottom end protruding parts block notch
10-2, upper shell 7 and conductive base plate 10 form occlusive state；Corresponding with riveted through-hole 7-5 in preposition hollow cavity, shell is led
10 both sides of hot bottom plate inside contract the centre positions notch 10-2 or more and are respectively provided with row's riveted hole 10-3.
Photosensor package method includes the following steps in the present embodiment：
The first step：It first will in the vacuum glove box (or other energy similar devices) full of the anhydrous nitrogen oxygen mixed gas of normal pressure
Photoelectric sensor 1 and light transmission quartz glass plate 3 are mounted among the correspondence locating slot position of positioning thermal-insulating sealing cover 2, by anhydrous nitrogen
Oxygen gas mixture 4 is sealed among closed space 2-6；Using silicon rubber film layer by photoelectric sensor 1, positioning thermal-insulating sealing cover 2
It is linked to be a seal with light transmission quartz glass plate 3.
Second step：Upper shell 7 is inverted top down, is taken out from glove box (or other energy similar devices) above-mentioned
The inverted seal, 1 bottom surface of photoelectric sensor is upward at this time.Among the inverted seal is packed into upper shell 7, use
The chip pin of sensor side is drawn the side for being connected to and patching external member 8 close to aciculiform electric signal by the thin wire of tape insulation cortex,
Load onto electromagnetic shielding heat-conductive plate 6 and semiconductor chilling plate 5.
Third walks：After loading onto electromagnetic shielding heat-conductive plate 6 and semiconductor chilling plate 5, related electric electric signal pin is used
The conducting wire spot welding of tape insulation cortex is connected on cavity side on corresponding conductive metal round needle 8-2.
4th step：After the completion of above-mentioned steps, to place filling flowable state microporous foam material vacant in 7 cavity of upper shell
Material cuts redundance (part for exposing the hot junction plane of semiconductor chilling plate) after microcellular foam material solidification, is formed
Heat insulating stuffing body 9 as shown in Figure 10.
Heat insulating stuffing body 9 has good adiabatic (thermal conductivity is extremely low) performance, can together with positioning thermal-insulating sealing cover
Effectively to stop 1 hot junction of semiconductor chilling plate and the metal shell of shell conductive base plate 10 and upper shell 7 to photoelectric sensing
The heat diffusion of device 1 is transmitted so that smaller refrigeration work consumption photoelectric sensor 1 can be freezed to extremely low temperature (-
20 DEG C or less), when not only having improved refrigeration effect but also electric power consumption is greatly reduced, while also having significantly reduced follow-up use
Radiate difficulty.It since the power of cooling piece consumption is smaller, is greatly decreased compared to existing encapsulation technology calorific value, refrigeration encapsulation
Photoelectric sensor afterwards is not necessarily to water cooling or wind-cooling heat dissipating during use, and 10 bottom of shell conductive base plate of packaging body is put down
Face paste is in natural heat dissipation on spectral instrument metal shell.
5th step：By upper shell 7 and lower housing riveted.Assemble assemble when with 30-50 kilograms of pressure by shell heat conduction
Bottom plate 10 is pressed into the crenel slot position of inverted preposition hollow cavity 7, and when being compacted to sinking plane 10-1, to withstand crenel 7-4 piles flat
When face, coaxial corresponding states is presented in riveted hole 10-3 and riveted through-hole 7-5, from hollow cavity both sides to every a pair of holes cave through-hole
An assembly riveted column 11 is squeezed into in, riveted lays down assembling pressure upper shell 7 and the formation of shell conductive base plate 10 after finishing
One firm refrigeration packaging body, assembling process finish.Aforementioned assembly riveted column 11 uses identical material with upper shell.With from
The conventional method of the turn of the screw is compared on radiating bottom plate, using the method post package body case two of high density multipoint riveting tie point
Divide connection more closely, while avoiding the problem that unbalance stress leads to bottom plate deformation.
The photosensor package and packaging method of the present embodiment at least have the effect of as follows：
1, there is efficient Insulation, be effectively improved refrigerating efficiency, the smaller refrigeration work consumption of use can reach more
Low temperature is not necessarily to water cooling and wind-cooling heat dissipating.
Positioning thermal-insulating sealing cover and heat insulating stuffing body are made come to photoelectric transfer using obturator-type microporous foam formation technology
Sensor is thermally shielded heat preservation, is effectively improved refrigerating efficiency, and the smaller refrigeration work consumption of use can reach lower temperature, be not necessarily to
Water cooling and wind-cooling heat dissipating.
2, there is silicone rubber seal film layer, sealing means rather than adhesive sealing in such a way that stress overlays, sealing is more
It is persistently reliable.
Using miniature closed-cell materials combination silicon rubber film layer, the mode sealed light-transmitting quartz glass plate and light overlayed with stress
Electric transducer incident end face, sealing is more persistently reliable, and avoiding binder aging in bonding mode causes asking for seal failure
Topic.
3, using the anhydrous nitrogen oxygen mixed gas close with ratio of nitrogen to oxygen in air as between protective gas, with extraneous air
Osmotic pressure prevents gas leakage hidden danger close to zero.Ratio of nitrogen to oxygen is close with air in protection gas, is crimped relative to outside air infiltration
It is bordering on zero, has further prevented the problem of gas leakage leads to photoelectric sensor incident window frosting.
4, light transmission quartz glass plate is overlayed with metal flat bed, reversed heating is carried out to solve 0 DEG C once to sheet glass
Sheet glass exposed position accumulates the problem of mist frosting when low temperature so that photoelectric sensor is refrigerated to -20 DEG C or less and appoints not fogging.
5, electromagnetic shielding has been carried out to photoelectric sensor to prevent, be effectively reduced semiconductor system using electromagnetic shielding heat-conductive plate
The cold electric signal to photoelectric sensor interferes, and further improves the signal-to-noise ratio of photoelectric sensor.
6, photoelectric sensor pin is turned to 90 continued accesses to draw from side, is not take up bottom heat conduction and heat radiation space, heat dissipation is more
Efficiently.
7, it is assembled using the method for side lock riveting, keeps the connection of metal shell closer, uniform force is unlikely to deform.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of photosensor package, which is characterized in that the upper shell including being provided with optical transmission window, and it is close with the upper shell
Seal the lower housing of connection；Have light transmission quartz glass plate at the optical transmission window, the light transmission quartz glass plate be located at upper shell and
Between the photosensitive-member of photoelectric sensor；
Positioning thermal-insulating sealing cover, the positioning thermal-insulating sealing cover are provided between the light transmission quartz glass plate and photoelectric sensor
It is made of microcellular foam material, for fixing photoelectric sensor and the light transmission quartz glass plate, the positioning thermal-insulating sealing cover
Inside it is additionally provided with the cavity for holding anhydrous nitrogen oxygen hybrid protection gas；
Further include semiconductor chilling plate, the hot junction plane of the semiconductor chilling plate is fitted on the inner surface of lower housing, described
Electromagnetic shielding heat-conductive plate is provided in the cold-end plane of semiconductor chilling plate；The electromagnetic shielding heat-conductive plate is good by leading temp effect
Metal material is made, and the side and photoelectric sensor for being electromagnetically shielded heat-conductive plate abut, and the cold end low temperature of semiconductor chilling plate is passed
Pass photoelectric sensor.
2. photosensor package according to claim 1, which is characterized in that also set up on the electromagnetic shielding heat-conductive plate
It is bar-shaped trough to have conductor trench, the conductor trench, and the length direction of the bar-shaped trough is through the electromagnetic shielding heat-conductive plate
Two long sides of plate face；
Fairlead position, the fairlead position and the conductor trench end are provided on the lateral wall of photosensor package shell
Notch position correspond to.
3. photosensor package according to claim 2, which is characterized in that the conductor trench and the fairlead position
It is both provided with multiple, and quantity is identical.
4. photosensor package according to claim 2, which is characterized in that be provided with aciculiform in the fairlead position
Electric signal grafting external member, the electric signal grafting external member include insulating protective sleeve and the metal inside the insulating protective sleeve
Round needle, the insulating protective sleeve and the fairlead position and the equal tight fit connection of metal round needle.
5. photosensor package according to claim 1, which is characterized in that the positioning thermal-insulating sealing cover includes photoelectricity
Sensor posting and light transmission quartz glass plate posting, photoelectric sensor are inlaid in the photoelectric sensor posting, thoroughly
Light quartz glass plate is inlaid in light transmission quartz glass plate posting；
It is provided with hollow separation layer, institute between the photoelectric sensor posting and the light transmission quartz glass plate posting centre
State the cavity having in hollow separation layer through the photoelectric sensor posting and the light transmission quartz glass plate posting.
6. photosensor package according to claim 5, which is characterized in that the photoelectric sensor posting and described
The madial wall of light transmission quartz glass plate posting is coated with silicon rubber film layer.
7. photosensor package according to claim 1, which is characterized in that the upper shell is the shell of one end open
Body, the lower housing are plate, and the upper shell and the lower housing riveted by riveted column, the riveted column be inserted into it is described under
Enclosure interior.
8. photosensor package according to claim 1, which is characterized in that upper shell includes positioned at the upper flat of top
Plate is provided with the optical transmission window, the area of plane matching of the light transmission quartz glass plate and upper flat plate in the middle part of the upper flat plate；
The light transmission quartz glass plate is fitted in the inner wall of the upper flat plate, the light transmission quartz glass plate and the upper flat plate it
Between have thermal grease layer, heat transfer can be carried out between the upper flat plate and the light transmission quartz glass plate.
9. photosensor package according to claim 1, which is characterized in that after the photoelectric sensor assembles,
Flowable state microcellular foam material is filled in internal vacant space, and heat insulating stuffing body is formed after its solidification.
10. a kind of photosensor package method, which is characterized in that use the photosensor package described in claim 4, packet
Include following steps：
The first step：In vacuum glove box, light transmission quartz glass plate and photoelectric sensor are installed on positioning thermal-insulating sealing cover,
Anhydrous nitrogen oxygen hybrid protection gas is filled in what light transmission quartz glass plate, photoelectric sensor and positioning thermal-insulating sealing cover were surrounded
In cavity；Photoelectric sensor, positioning thermal-insulating sealing cover and light transmission quartz glass plate are linked to be a sealing using silicon rubber film layer
Body；
Second step places the cavity of upper shell upward, among the seal in the first step is packed into upper shell, absolutely with band
The chip pin of sensor side is drawn the side for being connected to and patching external member close to aciculiform electric signal by the thin wire of edge cortex, loads onto electricity
Magnetic screen heat-conductive plate and semiconductor chilling plate；
Third walks, and the electric signal that the conducting wire spot welding of the pin of sensor tape insulation cortex is connected to cavity side patches external member
On upper corresponding conductive metal round needle；
4th step：Vacant place filling flowable state microcellular foam material, waits for that microcellular foam material is solid in the cavity of upper shell
The part for the hot junction plane for exposing semiconductor chilling plate is cut after change；
5th step：By upper shell and lower housing riveted.
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| CN201810203574.7A CN108493261A (en) | 2018-03-13 | 2018-03-13 | Photosensor package and packaging method |
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| CN201810203574.7A CN108493261A (en) | 2018-03-13 | 2018-03-13 | Photosensor package and packaging method |
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