CN117060041B - A phased array antenna and communication equipment - Google Patents

Abstract

The invention belongs to the technical field of antennas, and particularly relates to a phased array antenna and communication equipment. The phased array antenna comprises an integrated antenna array surface, a temperature equalizing plate and a protective cover, wherein the integrated antenna array surface comprises an antenna housing, a bracket layer and an antenna plate, the antenna housing is arranged on the antenna plate, the antenna housing and the antenna plate form a containing cavity, the bracket layer is arranged in the containing cavity, and the bracket layer is fixedly adhered between the antenna housing and the antenna plate; the temperature equalizing plate is arranged on one side surface of the antenna plate far away from the antenna housing, the integrated antenna array surface and the protective cover are oppositely arranged, and the protective cover is connected to the integrated antenna array surface and is covered on the temperature equalizing plate. The embodiment of the invention provides a phased array antenna, which simplifies the whole framework of the antenna by installing a temperature equalizing plate and a protective cover on an integrated antenna array surface, reduces interconnection due to separate layout of each functional component and simplifies the assembly difficulty and the assembly process of the phased array antenna.

Description

A phased array antenna and communication equipment

Technical field

The invention belongs to the field of antenna technology, and in particular relates to a phased array antenna and communication equipment.

Background technique

Current flat-panel phased array antenna terminals mainly include radomes, antenna arrays, structural parts, functional modules and heat dissipation modules. The radome and antenna board are separate structures. Since other functional modules exist separately, more interconnection lines are required. Cables have great restrictions on layout, and the entire structure of the antenna is relatively complex.

An existing phased array antenna structure includes a radome, a transmitting antenna array, a receiving antenna array, a heat dissipation structure and a base plate. The heat dissipation structure includes a thermal pad placement groove, a strip groove, a heat dissipation fin set, a fan installation cavity and a module installation cavity. A fan is installed outside the heat dissipation fin set. The control module, frequency converter and receiver are installed inside the module installation cavity. The control module and frequency converter are installed in a stacked form through an adapter mounting plate.

In the above-mentioned antenna structure, the entire structure of the antenna is relatively complex and requires many assembly processes, which is not conducive to the integration of phased array antennas. Moreover, the active part generates a large amount of heat. In order to ensure the reliable operation of each component, different heating devices are installed The corresponding heat dissipation structure may cause uneven temperature on the antenna and cause a sudden rise in local temperature.

Contents of the invention

The technical problem to be solved by the present invention is to provide a phased array antenna and communication equipment in order to solve the problem of uneven temperature on the existing antenna and sudden rise in local temperature.

In order to solve the above technical problems, on the one hand, embodiments of the present invention provide a phased array antenna, which includes an integrated antenna array, a temperature equalizing plate and a protective cover. The integrated antenna array includes a radome, a support layer and an antenna. board, the radome is installed on the antenna board, the radome and the antenna board are enclosed to form an accommodation cavity, the bracket layer is arranged in the accommodation cavity, and the bracket layer is bonded and fixed on the antenna plate. between the radome and the antenna board;

The temperature equalizing plate is installed on a side surface of the antenna board away from the radome, the integrated antenna array and the protective cover are arranged oppositely, and the protective cover is connected to the integrated antenna array. The protective cover is provided with a vent communicating with the outside world.

Optionally, the integrated antenna array further includes a plurality of first mounting studs and a plurality of second mounting studs, and a number of first mounting studs corresponding to the number of the first mounting studs are provided on the temperature equalizing plate. Mounting holes, the first mounting studs are connected in the first mounting holes; the protective cover is provided with second mounting holes corresponding to the number of the second mounting studs, the second mounting studs Connected to the second mounting hole.

Optionally, a side of the antenna board away from the radome has a device surface and a sealing surface surrounding the device surface. The device surface is used to install components, and the first mounting stud is provided on the On the device surface, the second mounting stud is provided on the sealing surface.

Optionally, the vapor chamber includes a vapor chamber body and a first flange provided around an outer edge of the vapor chamber body, the first mounting hole is provided on the vapor chamber body, and the A side surface of the first flange away from the main body of the vapor chamber is attached to the antenna board to cover the device surface.

Optionally, the temperature equalizing plate further includes a module installation box and a protective cover plate installed on the module installation box. The module installation box is provided on a portion of the temperature equalizing plate body facing the protective cover. on the side surface.

Optionally, the temperature equalization plate further includes a thermal pad, and the main body of the temperature equalization plate is provided with a plurality of protrusions protruding toward the direction of the antenna board, and the protrusions can abut against the device. components on the surface, and the thermal pad is disposed between the protruding portion and the components of the antenna board.

Optionally, the protective cover includes a protective cover main body and a second flange provided around the protective cover main body, the second mounting hole is provided on the second flange, and the second flange is further away from the second flange. One side surface of the protective cover body is attached to the sealing surface to form a heat dissipation cavity.

Optionally, the phased array antenna further includes a cooling fan, the vent includes an air inlet and an air outlet, the air inlet and the air outlet communicate with the heat dissipation cavity and the outside world, and the cooling fan is disposed at the Describe the air outlet;

The protective cover also includes at least one partition provided on the main body of the protective cover. The partition can divide the heat dissipation cavity into at least two parts. Each part of the heat dissipation cavity is provided on the main body of the protective cover. There are air inlets and air outlets.

Optionally, the antenna board is provided with a transceiver isolation area, and the integrated antenna array also includes a heating film, which is disposed between the radome and the bracket layer and is isolated from the transceiver. At a position corresponding to the area, a sensor is provided on the radome, and the sensor is electrically connected to the heating film;

The surface of the side of the radome away from the antenna board is arc-shaped and coated with a hydrophobic layer.

On the other hand, an embodiment of the present invention provides a communication device, including the phased array antenna as mentioned above.

Embodiments of the present invention provide a phased array antenna. A temperature equalization plate is installed on the antenna board. The heat generated by the components on the antenna board can be conducted to the temperature equalization plate. The temperature equalization plate performs heat exchange with the air in the protective cover, and the protection The shield can transfer heat to the cold air outside, and the vents can accelerate the heat exchange between the inside of the shield and the outside world. The vapor chamber has good thermal conductivity, can balance the temperature, and can avoid excessive local heat flow density of the phased array antenna. Large enough to cause a sudden rise in temperature. In addition, by installing the vapor chamber and protective cover on the integrated antenna array, the entire structure of the antenna is simplified, the interconnection due to the separate layout of each functional component is reduced, and the components of the phased array antenna are reduced. quantity, simplifying the assembly difficulty and assembly process of phased array antennas, and realizing an integrated structure of phased array antennas.

Description of the drawings

Figure 1 is a schematic diagram of a phased array antenna provided by an embodiment of the present invention;

Figure 2 is an exploded view of a phased array antenna provided by an embodiment of the present invention;

Figure 3 is another exploded schematic diagram of a phased array antenna provided by an embodiment of the present invention;

Figure 4 is an enlarged schematic diagram of position A in Figure 3;

Figure 5 is a schematic assembly diagram of a vapor chamber and an integrated antenna array provided by an embodiment of the present invention;

Figure 6 is a schematic diagram of an integrated antenna array provided by an embodiment of the present invention;

Figure 7 is a schematic diagram of the gas flow direction of the protective cover provided by an embodiment of the present invention.

The reference symbols in this manual are as follows:

1. Integrated antenna array; 11. Radome; 111. Radome body; 112. Frame; 12. Bracket layer; 13. Antenna board; 131. Device surface; 132. Sealing surface; 133. Transceiver isolation area; 14 , heating film; 15. first mounting stud; 16. second mounting stud;

2. Uniform temperature plate; 21. Main body of the uniform temperature plate; 211. Protruding portion; 212. First mounting hole; 22. First flange; 23. Module installation box; 24. Protective cover; 25. Interface waterproof cover ;

3. Protective cover; 31. Protective cover main body; 311. Air inlet; 312. Air outlet; 32. Second flange; 321. Second mounting hole; 33. Cooling fan; 34. Partition plate.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention and are not intended to limit the present invention.

As shown in Figures 1 to 7, a phased array antenna provided by an embodiment of the present invention includes an integrated antenna array 1, a temperature equalizing plate 2 and a protective cover 3. The integrated antenna array 1 includes a radome 11 , the bracket layer 12 and the antenna board 13, the radome 11 is installed on the antenna plate 13, an accommodation cavity is formed between the radome 11 and the antenna plate 13, the bracket layer 12 is filled in the accommodation cavity, the shape of the bracket layer 12 and The shape of the accommodation cavity is matched, and the bracket layer 12 is bonded and fixed between the radome 11 and the antenna plate 13 for integrated fixation, thereby effectively realizing the integrated integration of the antenna plate 13 and the radome 11 . By installing the vapor chamber 2 and the protective cover 3 on the integrated integrated antenna array 1, the entire structure of the antenna is simplified, the interconnection due to the separate layout of each functional component is reduced, and the components of the phased array antenna are reduced. The number of components simplifies the assembly difficulty and assembly process of the phased array antenna, and realizes the integrated structure of the phased array antenna.

The integrated antenna array 1 and the protective cover 3 are arranged oppositely, the uniform temperature plate 2 is installed on the side surface of the antenna board 13 away from the radome 11, the protective cover 3 is connected to the integrated antenna array 1, and the protective cover 3 is connected to The integrated antenna array 1 is covered with a uniform temperature plate 2, and the protective cover 3 is provided with a vent communicating with the outside world. The temperature equalizing plate 2 is installed on the antenna board 13. The heat generated by the components on the antenna board 13 can be conducted to the equalizing temperature plate 2. The equalizing temperature plate 2 conducts heat exchange with the air in the protective cover 3. The protective cover 3 can The heat is transferred to the cold air outside, and the heat exchange between the inside of the protective cover 3 and the outside can be accelerated through the vents, and the vapor chamber 2 has good thermal conductivity, can balance the temperature, and can avoid excessive local heat flow density of the phased array antenna. Large enough to cause a sudden rise in temperature.

In one embodiment, as shown in FIG. 3 , the radome 11 includes a radome body 111 and a frame 112 . The frame 112 is a closed frame structure and surrounds the bracket layer 12 . The outer peripheral surface of the bracket layer 12 abuts the frame 112 . The antenna The outer edge of the cover body 111 is connected to the side surface of the frame 112 away from the antenna board 13 , the radome body 111 is attached to the side surface of the bracket layer 12 away from the antenna board 13 , and the outer edge of the antenna board 13 is connected to On the side surface of the frame 112 away from the radome 11 , the antenna board 13 is attached to the side surface of the bracket layer 12 away from the radome 11 , and the accommodating cavity passes through the inner wall surface of the radome body 111 and the inner wall surface of the antenna board 13 and the inner peripheral surface of the frame 112. The support layer 12 is made of PMI foam and is disposed between the radome body 111 and the antenna plate 13 to support the radome 11 and increase the strength of the radome 11 . The radome 11 and the antenna board 13 can be connected through the frame 112, so that the antenna board 13 is integrated on the radome 11 to form an integrated antenna array 1, which facilitates the integration of the integrated antenna array 1, the temperature equalizing plate 2 and the protective cover 3. Assembly, simplifying the antenna architecture and assembly process.

In one embodiment, when the radome 11 , the bracket layer 12 and the antenna board 13 are bonded, the inner wall surface of the radome 11 is connected to the surface of the side of the bracket layer 12 away from the antenna board 13 through glue. The inner wall surface is connected to the surface of the side of the bracket layer 12 away from the radome 11 through adhesive. The three layers of the radome 11, the bracket layer 12 and the antenna board 13 are bonded and fixed through an acrylic pressure-sensitive adhesive film or two-component epoxy glue. . Acrylic pressure-sensitive adhesive films with a thickness less than 50um are pasted on the upper surface of the antenna board 13 and the lower surface of the radome body 111 respectively. The frame 112 is positioned and bonded to the antenna board 13. The bracket layer 12 is placed in the frame 112. The bracket layer 12 can It is bonded on the antenna board 13, and then the radome body 111 is pasted on the frame 112 to obtain the integrated antenna array 1, which simplifies the manufacturing process and reduces the difficulty of manufacturing.

The radome 11 is made of fiberglass with a density of about 1800Kg/m ³ . The radome 11 is a prepreg cloth with a thickness greater than 0.2mm, which can resist external impact. The radome 11 is not easily deformed and affects the performance of the antenna. Preferably, the thickness of the radome 11 is 0.2~0.5mm.

In one embodiment, as shown in FIGS. 5 and 6 , the integrated antenna array 1 further includes a plurality of first mounting studs 15 and a plurality of second mounting studs 16 . The temperature equalizing plate 2 is provided with There is a first mounting hole 212 corresponding to the number of mounting studs 15 . The first mounting studs 15 are connected in the first mounting hole 212 . The temperature equalizing plate 2 and the integrated antenna array 1 are connected through the first mounting studs 15 . The protective cover 3 is provided with second mounting holes 321 corresponding to the number of the second mounting studs 16. The second mounting studs 16 are connected in the second mounting holes 321. The protective cover 3 is connected together through the second mounting studs 16. on antenna array 1.

In one embodiment, the antenna board 13 is a PCBA board that integrates transceiver antennas, ACU control, power supply module, up and down frequency conversion and other functions, realizing full integration of communication control functions. The side of the antenna board 13 away from the radome 11 has a device surface 131 and a sealing surface 132 surrounding the device surface 131. The sealing surface 132 is located at the outer edge of the antenna board 13. The device surface 131 is used to install CMOS chips, power chips, and control chips. For components such as devices, the receiving antenna radiating unit and the transmitting antenna radiating unit are arranged on the side surface of the antenna board 13 close to the radome 11, and the other components are arranged on the device surface 131 to facilitate heat dissipation of the components. The coverage area of the protective cover 3 on the integrated antenna array 1 is larger than the coverage area of the temperature equalizing plate 2. Setting the first mounting stud 15 on the device surface 131 can realize the coverage and protection of the device surface 131 by the temperature equalizing plate 2. , arranging the second mounting stud 16 on the sealing surface 132 can realize the interconnection between the protective cover 3 and the integrated antenna array 1 and the cover protection of the temperature equalizing plate 2 .

In an alternative embodiment, the side surface of the frame 112 away from the radome 11 is provided with a groove for positioning the outer edge of the antenna plate 13 , and the side surface of the antenna plate 13 away from the radome 11 and the side surface of the frame 112 The side surface away from the radome 11 is flush, and the second mounting stud 16 may also be provided on the side surface of the frame 112 away from the radome 11 .

In one embodiment, as shown in FIGS. 4 and 5 , the vapor chamber 2 includes a vapor chamber main body 21 and a first flange 22 provided around the outer edge of the vapor chamber main body 21 , and the first mounting hole 212 is provided in The vapor chamber main body 21 is connected to the antenna board 13 through the first mounting studs 15 on the sealing surface 132 . The side surface of the first flange 22 away from the vapor chamber main body 21 is attached to the antenna board 13 to cover the device surface 131 . The first flange 22 protrudes from the vapor chamber main body 21 toward the antenna board 13 so that the temperature is uniform. There is a cavity between the board main body 21 and the antenna board 13, which can accommodate the components on the antenna board 13 to achieve coverage and protection of the components. The heat generated by the components on the antenna board 13 can be conducted to the vapor chamber 2. The vapor chamber 2 is made of a highly thermally conductive aluminum alloy sheet material. The thickness of the aluminum alloy sheet is 1~1.5mm, and the thermal conductivity of the aluminum alloy is greater than , ensuring good temperature uniformity, and can evenly distribute the heat of the integrated antenna array 1 to avoid sudden temperature rise caused by excessive local heat flow density. And the density of the aluminum alloy sheet is about 2700Kg/m ³ , which can meet the demand for lightweight and significantly reduce the weight of the antenna.

In one embodiment, the first flange 22 is coated with glue, and the first flange 22 is bonded to the sealing surface 132 to achieve the overall waterproofing of the vapor chamber 2 .

In one embodiment, as shown in FIG. 5 , the vapor chamber 2 also includes a module installation box 23 and a protective cover 24 installed on the module installation box 23 . The module installation box 23 is disposed on the vapor chamber body 21 in the direction of On one side surface of the protective cover 3, the module installation box 23 can be bonded or welded to the main body 21 of the uniform temperature plate. Functional modules can be installed in the module installation cavity. The functional modules are connected to the integrated antenna array 1 through cables. The cover plate 24 can realize the sealing and waterproofing of the module installation box 23, and can be applied to antennas with low functional integration of the antenna board 13.

In one embodiment, as shown in FIGS. 4 and 5 , the vapor chamber main body 21 is provided with a plurality of protrusions 211 protruding toward the direction of the antenna board 13 , and the protrusions 211 can contact the device surface 131 The components are in contact with the components on the device surface 131 through the protruding portion 211, which can reduce the gap between the heating components and the temperature equalizing plate 2, thereby reducing the thermal conduction resistance, which is conducive to achieving temperature uniformity between the components and the temperature equalizing plate 2. The heat conduction between the plates 2 can also improve the structural strength of the vapor chamber 2 . Preferably, in order to make contact with different components, the protruding heights of the plurality of protruding parts 211 are different.

In one embodiment, the vapor chamber 2 further includes a thermal pad. The thermal pad is disposed between the protruding portion 211 and the components of the antenna board 13 . The thermal pad is attached to the protruding portion 211 or the components. The thermal pad is attached to the protruding portion 211 or the components. The coverage is determined based on the size of the component. The thermal conductivity of the thermal pad is greater than , the thickness is greater than 1.5mm. Due to the installation error of the components and the vapor chamber 2, as well as the manufacturing error of the protruding portion 211, etc., there are cases where the protruding portion 211 cannot contact the component. By setting the thermal pad, the thermal pad can occur deformation to prevent the thermal pad from compressing the components when installing the vapor chamber 2, and at the same time adapt to the error between the vapor chamber 2 and the components to avoid the situation where the protruding portion 211 has a gap between the components and the thermal resistance is large, which is not conducive to heat conduction. .

Preferably, the thickness of the thermal pad is 1.5~3mm.

Alternatively, an interface material is provided between the protruding portion 211 and the components of the antenna board 13 . The interface material may be but is not limited to thermal conductive gel or silicone grease, which also has the effect of reducing contact thermal resistance.

In one embodiment, as shown in FIG. 3 , the protective cover 3 includes a protective cover main body 31 and a second flange 32 provided around the protective cover main body 31 . The second mounting hole 321 is provided on the second flange 32 . The side surface of the flange 32 away from the shield body 31 is attached to the sealing surface 132. The second mounting stud 16 on the sealing surface 132 is connected to the second mounting hole 321. Between the integrated antenna array 1 and the shield A heat dissipation cavity is formed between the covers 3, which plays a role in protection and structural integrity. Applying glue on the sealing surface 132 can bond the sealing surface 132 to the second flange 32 to achieve waterproofing between the protective cover 3 and the integrated antenna array 1 .

Alternatively, the sealing surface 132 and the side surface of the frame 112 away from the radome 11 are provided with second mounting studs 16 , and the second flange 32 is provided with corresponding second mounting holes 321 that can connect the antenna board 13 and Border 112.

Preferably, the protective cover 3 can be made of non-metallic polymer or modified materials, such as PC+ABS, modified ABS, PBT+GF, which can ensure strength and lightweight design, and can greatly reduce the weight of the antenna.

In one embodiment, as shown in Figures 3 and 5, the phased array antenna also includes a cooling fan 33, and a vent is provided on the main body 31 of the protective cover. The vent includes an air inlet 311 and an air outlet 312. The air inlet 311 and The air outlet 312 connects the heat dissipation cavity and the outside world. The cooling fan 33 is arranged at the air outlet 312. The heat dissipation fan 33 can send the gas in the heat dissipation cavity out of the air outlet 312 and drive the outside air into the heat dissipation cavity from the air inlet 311 to achieve cooling. Heat exchange between air and vapor chamber 2.

In order to ensure reliable operation of the antenna in a high-temperature environment, in this embodiment, a cooling fan 33 is used for forced air cooling. There are two main heat dissipation paths for the integrated antenna array 1. One of them is provided on the sealing surface 132 of the antenna board 13. There are antenna control chips for the transceiver array, as well as a large number of control, power supply, and interface processing chips. At the same time, there are a large number of ground holes, shielding holes, and signal holes on the antenna board 13, which can increase the vertical heat conductivity of the antenna board 13. All The heat of the components can be transferred to the side surface of the antenna board 13 facing the radome 11, and then conducted to the side surface of the radome 11 away from the antenna board 13 through the PMI foam, and conducts heat exchange with the external environment, and the antenna The side surface of the cover 11 away from the antenna board 13 is sprayed with a white paint layer with high emissivity and low absorptivity, which can improve the radiation heat dissipation on the surface of the antenna cover 11 and reduce the absorption of solar radiation. The second is that the heat generated by the components is conducted to the vapor chamber 2, and the vapor chamber 2 performs temperature equalization. The vapor chamber 2 is made of aluminum alloy sheet material with high thermal conductivity, and the natural heat exchange coefficient with the environment is about On the left and right, the cooling fan 33 is used to extract air, which can speed up the heat exchange between the vapor chamber 2 and the cold air and improve the heat transfer coefficient.

It should be noted that when the cooling fan 33 is not provided in the protective cover 3 for forced air cooling, glue does not need to be applied to the first flange 22 of the vapor chamber 2 and glue is applied between the second flange 32 and the sealing surface 132 Glue can realize the waterproofing of the temperature equalizing plate 2 and the protective cover 3, and can simplify the assembly process.

In one embodiment, a plurality of heat dissipation fins are provided on the side surface of the vapor chamber 2 facing the protective cover 3, which can increase the heat exchange area and speed up the heat exchange.

In one embodiment, as shown in Figure 3, an interface waterproof cover 25 is provided on the temperature equalizing plate 2. The interface waterproof cover 25 is provided at the joint of the cable, and a seal is provided between the interface waterproof cover 25 and the temperature equalizing plate 2. The pad is waterproof.

In one embodiment, as shown in FIG. 3 , the protective cover 3 also includes at least one partition 34 provided on the main body 31 of the protective cover. The partition 34 can divide the heat dissipation cavity into at least two parts, and each part of the heat dissipation cavity corresponds to The main body 31 of the protective cover is provided with an air inlet 311 and an air outlet 312, which are separated by partitions 34 so that the heat dissipation cavities of each part are not connected to each other, so that the air inlet and air outlet of each heat dissipation cavity do not interfere with each other. The fan in the heat dissipation cavity can promptly adjust the exhaust volume according to the heat dissipation demand fed back by the integrated antenna array 1.

Specifically, as shown in Figure 7, a partition 34 is provided. The partition 34 can separate the heat dissipation cavity into a first heat dissipation cavity and a second heat dissipation cavity. The air inlet 311 includes a first air inlet and a second air inlet. The air outlet 312 includes a first air outlet and a second air outlet. The heat dissipation fan 33 includes a first heat dissipation fan and a second heat dissipation fan. The first heat dissipation fan is disposed in the first heat dissipation cavity and close to the first air outlet. The first heat dissipation fan The cold air can be driven into the first heat dissipation cavity from the first air inlet, and the heated air can be driven out of the first heat dissipation cavity from the first air outlet. The second heat dissipation fan is disposed in the second heat dissipation cavity and is disposed close to the second air outlet. The second heat dissipation fan can drive cold air into the second heat dissipation cavity from the second air inlet, and drive heated air from the second air outlet. out of the second heat dissipation cavity.

In one embodiment, as shown in FIGS. 1 and 3 , the side surface of the radome 11 away from the antenna board 13 is an arc-shaped bulge in the direction away from the antenna board 13 , with a higher center and lower sides. Provided with a hydrophobic layer. Conventionally, after rainwater falls on the surface of the radome 11, the water droplets cannot obtain additional power because the overall structure is a planar structure. At the same time, because the surface coating of the conventional radome 11 has a certain degree of hydrophilicity, the water droplets will come into contact with the radome 11. A small hydrophobic angle is formed between the surfaces, and continuous accumulation of rainwater will form a continuous water film, thereby affecting the performance of the antenna. In this embodiment, the radome 11 adopts a continuous arc structure, so that the water droplets have a certain rolling angle on the radome 11 , which facilitates the water droplets to roll off the radome 11 . Moreover, the surface of the radome 11 is sprayed with a super-hydrophobic nano-coating, which reduces the hydrophilicity and can achieve a minimum rolling angle of water droplets θ=2°. The rolling angle on the radome 11 is different at different positions. In order to reduce the phased array The height of the entire antenna is controlled through antenna simulation and calculation of the tangent line at any point on the arc surface.

In one embodiment, as shown in FIG. 3 , the antenna board 13 is provided with a transceiver isolation area 133 . The integrated antenna array 1 also includes a heating film 14 . The heating film 14 is disposed between the radome 11 and the bracket layer and connected with the bracket layer. At the position corresponding to the transceiver isolation area 133, the heating film 14 is a PI (polyimide) heating film. The heating film 14 provides additional heat to melt the snow. There is no antenna unit in the transceiver isolation area 133 on the antenna board 13 to avoid heating. The membrane 14 affects the wave transmission loss of the radome 11 .

In one embodiment, a sensor is provided on the radome 11 , and the sensor is electrically connected to the heating film 14 . The heat generated by the components on the antenna board 13 can be transferred to the radome 11. When the sensor on the radome 11 detects snow, the cooling fan 33 is turned off to reduce the heat convection between the forced air cooling and the outside world and improve the heat transfer to the radome 11. The heat dissipation of the path. The radome 11 is arc-shaped, and the antenna board 13 is flat-shaped. The surface of the support layer 12 attached to one side of the radome 11 also has a curved structure with a high center and low surroundings. The foam at the surrounding positions is thinner, and the heat is transferred to the antenna. The thermal resistance on the surface of the radome 11 is small, and most of the heat can be transferred to the surface of the radome 11 to melt the snow. The foam in the middle position is relatively thick. When the heat is transferred to the surface of the radome 11, the thermal resistance is large, and the PI heating film 14 provides additional heat to melt the snow without affecting the wave transmission loss of the radome 11. It heats and melts snow through the heating film 14 and the antenna board 13's own heat, so that the phased array antenna does not accumulate snow when used in ice and snow, eliminating the risk of rain and snow. Effect of build-up on antenna performance. The PI heating film 14 can be switched on and off based on the detection sensor and temperature feedback.

On the other hand, an embodiment of the present invention provides a communication device, including the phased array antenna of the above embodiment.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention. Inside.

Claims (10)

1. The phased array antenna is characterized by comprising an integrated antenna array surface, a temperature equalizing plate and a protective cover, wherein the integrated antenna array surface comprises an antenna housing, a support layer and an antenna plate, the antenna housing is arranged on the antenna plate, a containing cavity is formed by encircling the antenna housing and the antenna plate, the support layer is arranged in the containing cavity, and the support layer is fixedly adhered between the antenna housing and the antenna plate;

the temperature equalization plate is arranged on one side surface of the antenna plate far away from the antenna housing, the integrated antenna array surface and the protective cover are arranged oppositely, the protective cover is connected to the integrated antenna array surface and is covered on the temperature equalization plate, and a vent communicated with the outside is arranged on the protective cover;

the antenna panel keep away from one side of radome has the device face, the device face is used for installing components and parts, the samming board includes samming board main part, be provided with on the samming board main part towards the protruding a plurality of bulge of direction of antenna panel, the bulge can the butt components and parts on the device face.

2. The phased array antenna of claim 1, wherein the integrated antenna array surface further comprises a plurality of first mounting studs and a plurality of second mounting studs, wherein the temperature equalizing plate is provided with first mounting holes corresponding to the first mounting studs in number, and the first mounting studs are connected in the first mounting holes; the protective cover is provided with second mounting holes, the number of which corresponds to that of the second mounting studs, and the second mounting studs are connected in the second mounting holes.

3. The phased array antenna of claim 2, wherein a side of the antenna panel remote from the radome further has a sealing surface surrounding the device face, the first mounting stud being disposed on the device face and the second mounting stud being disposed on the sealing surface.

4. The phased array antenna of claim 3, wherein the temperature plate further comprises a first flange disposed about an outer edge of the temperature plate body, the first mounting hole being disposed on the temperature plate body, a side surface of the first flange remote from the temperature plate body being affixed to the device face.

5. The phased array antenna of claim 4, wherein the temperature equalization plate further comprises a module mounting case and a protective cover plate mounted on the module mounting case, the module mounting case being disposed on a side surface of the temperature equalization plate body facing the protective cover.

6. The phased array antenna of claim 4, wherein the temperature equalization plate further comprises a thermal pad disposed between the protrusion and a component of the antenna plate.

7. The phased array antenna of claim 3, wherein the shield comprises a shield body and a second flange disposed around the shield body, the second mounting hole being disposed on the second flange, a side surface of the second flange remote from the shield body being attached to the sealing surface to form the heat dissipation cavity.

8. The phased array antenna of claim 7, further comprising a cooling fan, the vent comprising an air inlet and an air outlet, the air inlet and the air outlet communicating the heat dissipation cavity with the outside, the cooling fan disposed at the air outlet;

the protection casing is still including setting up at least one baffle on the protection casing main part, the baffle can with the heat dissipation chamber is divided into two at least parts, every part all be provided with air intake and air outlet on the protection casing main part that the heat dissipation chamber corresponds.

9. The phased array antenna of claim 1, wherein a transceiver isolation area is provided on the antenna board, the integrated antenna array further comprises a heating film, the heating film is provided between the radome and the support layer and at a position corresponding to the transceiver isolation area, a sensor is provided on the radome, and the sensor is electrically connected with the heating film;

the surface of one side of the radome far away from the antenna board is arc-shaped and is coated with a hydrophobic layer.

10. A communication device comprising a phased array antenna as claimed in any one of claims 1 to 9.