CN117060041A - Phased array antenna and communication equipment - Google Patents
Phased array antenna and communication equipment Download PDFInfo
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- CN117060041A CN117060041A CN202311316833.4A CN202311316833A CN117060041A CN 117060041 A CN117060041 A CN 117060041A CN 202311316833 A CN202311316833 A CN 202311316833A CN 117060041 A CN117060041 A CN 117060041A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
Abstract
The invention belongs to the technical field of antennas, and particularly relates to a phased array antenna and communication equipment. The phased array antenna comprises an integrated antenna array surface, a temperature equalizing plate and a protective cover, wherein the integrated antenna array surface comprises an antenna housing, a bracket layer and an antenna plate, the antenna housing is arranged on the antenna plate, the antenna housing and the antenna plate form a containing cavity, the bracket layer is arranged in the containing cavity, and the bracket layer is fixedly adhered between the antenna housing and the antenna plate; the temperature equalizing plate is arranged on one side surface of the antenna plate far away from the antenna housing, the integrated antenna array surface and the protective cover are oppositely arranged, and the protective cover is connected to the integrated antenna array surface and is covered on the temperature equalizing plate. The embodiment of the invention provides a phased array antenna, which simplifies the whole framework of the antenna by installing a temperature equalizing plate and a protective cover on an integrated antenna array surface, reduces interconnection due to separate layout of each functional component and simplifies the assembly difficulty and the assembly process of the phased array antenna.
Description
Technical Field
The invention belongs to the technical field of antennas, and particularly relates to a phased array antenna and communication equipment.
Background
The existing flat-panel phased-array antenna terminal mainly comprises an antenna housing, an antenna array surface, structural members, functional modules and a heat dissipation module, wherein the antenna housing and the antenna board are of a separated structure, and because other functional modules exist independently, more interconnection cables are needed, the layout is greatly limited, and the whole structure of the antenna is complex.
An existing phased array antenna structure comprises an antenna housing, a transmitting antenna array surface, a receiving antenna array surface, a heat dissipation structure and a bottom plate. The heat radiation structure comprises a heat conduction pad placing groove, a strip-shaped groove, a heat radiation fin group, a fan installation cavity and a module installation cavity, and a fan is installed on the outer side of the heat radiation fin group. The module installation cavity is internally provided with a control module, a frequency converter and a receiver, and a lamination installation mode is realized between the control module and the frequency converter through a switching installation plate.
Among the above-mentioned antenna structure, the whole framework of antenna is comparatively complicated, and the equipment process is more, is unfavorable for phased array antenna's integration, and active partial heat is great, in order to ensure the reliable work of each components and parts, sets up corresponding heat radiation structure in different heating device department, probably can lead to the uneven temperature on the antenna, can appear the condition that local temperature suddenly rises.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: aiming at the problem that the temperature on the existing antenna is uneven and local temperature rise occurs, the phased array antenna and the communication equipment are provided.
In order to solve the technical problems, in one aspect, an embodiment of the present invention provides a phased array antenna, including an integrated antenna array surface, a temperature equalizing plate and a protective cover, where the integrated antenna array surface includes an antenna housing, a support layer and an antenna plate, the antenna housing is mounted on the antenna plate, the antenna housing and the antenna plate enclose to form a containing cavity, the support layer is disposed in the containing cavity, and the support layer is fixed between the antenna housing and the antenna plate in an adhesive manner;
the temperature equalization board is installed on one side surface of the antenna board far away from the radome, the integrated antenna array surface and the protective cover are oppositely arranged, the protective cover is connected to the integrated antenna array surface and covers the temperature equalization board, and a vent communicated with the outside is formed in the protective cover.
Optionally, the integrated antenna array surface further includes a plurality of first mounting studs and a plurality of second mounting studs, first mounting holes corresponding to the first mounting studs in number are formed in the temperature equalizing plate, and the first mounting studs are connected in the first mounting holes; the protective cover is provided with second mounting holes, the number of which corresponds to that of the second mounting studs, and the second mounting studs are connected in the second mounting holes.
Optionally, a side of the antenna board far away from the radome is provided with a device surface and a sealing surface surrounding the device surface, the device surface is used for installing components, the first mounting stud is arranged on the device surface, and the second mounting stud is arranged on the sealing surface.
Optionally, the samming board includes samming board main part and around the first flange that the outward flange of samming board main part set up, first mounting hole sets up in the samming board main part, first flange keep away from one side surface subsides of samming board main part is in on the antenna board, in order to cover the device face.
Optionally, the temperature equalization plate further comprises a module installation box and a protective cover plate installed on the module installation box, wherein the module installation box is arranged on one side surface of the temperature equalization plate main body, which faces the protective cover.
Optionally, the temperature equalization plate further includes a heat conduction pad, a plurality of protruding portions protruding toward the direction of the antenna plate are arranged on the temperature equalization plate main body, the protruding portions can be abutted to components on the component surface, and the heat conduction pad is arranged between the protruding portions and the components of the antenna plate.
Optionally, the protection cover comprises a protection cover main body and a second flange arranged around the protection cover main body, the second mounting hole is arranged on the second flange, and one side surface of the second flange away from the protection cover main body is attached to the sealing surface so as to form a heat dissipation cavity.
Optionally, the phased array antenna further comprises a cooling fan, the ventilation opening comprises an air inlet and an air outlet, the air inlet and the air outlet are communicated with the cooling cavity and the outside, and the cooling fan is arranged at the air outlet;
the protection casing is still including setting up at least one baffle on the protection casing main part, the baffle can with the heat dissipation chamber is divided into two at least parts, every part all be provided with air intake and air outlet on the protection casing main part that the heat dissipation chamber corresponds.
Optionally, a receiving and transmitting isolation area is arranged on the antenna board, the integrated antenna array surface further comprises a heating film, the heating film is arranged between the antenna housing and the bracket layer and at a position corresponding to the receiving and transmitting isolation area, a sensor is arranged on the antenna housing, and the sensor is electrically connected with the heating film;
the surface of one side of the radome far away from the antenna board is arc-shaped and is coated with a hydrophobic layer.
In another aspect, an embodiment of the present invention provides a communication device including a phased array antenna as described above.
The embodiment of the invention provides a phased array antenna, wherein a temperature equalization plate is arranged on the antenna plate, heat generated by components on the antenna plate can be conducted to the temperature equalization plate, the temperature equalization plate exchanges heat with air in a protective cover, the protective cover can transfer the heat to outside cold air, the heat exchange between the inside of the protective cover and the outside can be accelerated through a vent, the temperature equalization plate has good heat conductivity, the temperature can be balanced, and the rapid temperature rise caused by the overlarge local heat flux density of the phased array antenna can be avoided. In addition, through installing samming board and protection casing on the integration antenna array face after integrating for the whole framework of antenna is simplified, reduces because each functional component disconnect-type overall arrangement's interconnection, has reduced phased array antenna's subassembly part quantity, has simplified phased array antenna's equipment degree of difficulty and assembly process, realizes phased array antenna's integrated structure.
Drawings
Fig. 1 is a schematic diagram of a phased array antenna according to an embodiment of the present invention;
fig. 2 is an exploded view of a phased array antenna provided by an embodiment of the present invention;
fig. 3 is another exploded view of a phased array antenna according to an embodiment of the present invention;
FIG. 4 is an enlarged schematic view at A in FIG. 3;
fig. 5 is an assembly schematic diagram of a temperature equalizing plate and an integrated antenna array plane according to an embodiment of the present invention;
fig. 6 is a schematic diagram of an integrated antenna array plane according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a gas flow direction of a shield according to an embodiment of the present invention.
Reference numerals in the specification are as follows:
1. an integrated antenna array surface; 11. an antenna housing; 111. an antenna housing; 112. a frame; 12. a scaffold layer; 13. an antenna board; 131. a device face; 132. sealing surfaces; 133. receiving and transmitting isolation areas; 14. heating the film; 15. a first mounting stud; 16. a second mounting stud;
2. a temperature equalizing plate; 21. a temperature equalizing plate main body; 211. a protruding portion; 212. a first mounting hole; 22. a first flange; 23. a module mounting box; 24. a protective cover plate; 25. an interface waterproof cover;
3. a protective cover; 31. a shield body; 311. an air inlet; 312. an air outlet; 32. a second flange; 321. a second mounting hole; 33. a heat radiation fan; 34. a partition board.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1 to 7, a phased array antenna provided by an embodiment of the present invention includes an integrated antenna array plane 1, a temperature equalization board 2 and a protection cover 3, where the integrated antenna array plane 1 includes an antenna housing 11, a support layer 12 and an antenna board 13, the antenna housing 11 is mounted on the antenna board 13, a housing cavity is formed by enclosing between the antenna housing 11 and the antenna board 13, the support layer 12 is filled in the housing cavity, the shape of the support layer 12 is adapted to the shape of the housing cavity, and the support layer 12 is fixed between the antenna housing 11 and the antenna board 13 in an adhesive manner for integral fixation, thereby effectively realizing integral integration of the antenna board 13 and the antenna housing 11. Through installing samming board 2 and protection casing 3 on integrated antenna array face 1 after integrating for the whole framework of antenna is simplified, reduces because each functional component disconnect-type overall arrangement's interconnection, has reduced phased array antenna's subassembly part quantity, has simplified phased array antenna's equipment degree of difficulty and assembly process, realizes phased array antenna's integrated structure.
The integrated antenna array surface 1 and the protective cover 3 are oppositely arranged, the temperature equalizing plate 2 is arranged on one side surface of the antenna plate 13 far away from the antenna housing 11, the protective cover 3 is connected to the integrated antenna array surface 1 and is covered on the temperature equalizing plate 2, and a vent communicated with the outside is arranged on the protective cover 3. Install samming board 2 on antenna board 13, the heat that components and parts produced on the antenna board 13 can be conducted to samming board 2 on, samming board 2 carries out the heat exchange with the air in the protection casing 3, and in the protection casing 3 can be with heat transfer to external cold air, can accelerate the inside and external heat exchange of protection casing 3 through the vent, and samming board 2 has better heat conductivity, can equilibrium temperature, can avoid phased array antenna local heat flux too big and cause the temperature to rise suddenly.
In an embodiment, as shown in fig. 3, the radome 11 includes a radome body 111 and a frame 112, the frame 112 is a closed frame structure and surrounds the support layer 12, the outer peripheral surface of the support layer 12 abuts against the frame 112, the outer edge of the radome body 111 is connected to a surface of the frame 112, which is far away from the antenna board 13, the radome body 111 is attached to a surface of the support layer 12, which is far away from the antenna board 13, the outer edge of the antenna board 13 is connected to a surface of the frame 112, which is far away from the radome 11, the antenna board 13 is attached to a surface of the support layer 12, which is far away from the antenna board 11, and the accommodating cavity is formed by enclosing an inner wall surface of the radome body 111, an inner wall surface of the antenna board 13 and an inner peripheral surface of the frame 112. The bracket layer 12 is PMI foam, and is disposed between the radome body 111 and the antenna board 13, so as to support the radome 11 and increase the strength of the radome 11. The antenna housing 11 and the antenna plate 13 can be connected through the frame 112, so that the antenna plate 13 is integrated on the antenna housing 11 to form the integrated antenna array surface 1, the temperature equalizing plate 2 and the protective cover 3 are convenient to assemble, and the framework and the assembling process of the antenna are simplified.
In an embodiment, when the radome 11, the support layer 12 and the antenna board 13 are bonded, the inner wall surface of the radome 11 is connected to the surface of the support layer 12, which is far away from the antenna board 13, by gluing, the inner wall surface of the antenna board 13 is connected to the surface of the support layer 12, which is far away from the radome 11, and the three layers of the radome 11, the support layer 12 and the antenna board 13 are bonded and fixed by an acrylic pressure sensitive adhesive film or a two-component epoxy adhesive. The acrylic pressure sensitive adhesive films with the thickness smaller than 50um are respectively adhered to the upper surface of the antenna board 13 and the lower surface of the antenna housing body 111, the frame 112 is positioned and adhered to the antenna board 13, the support layer 12 is placed in the frame 112, the support layer 12 can be adhered to the antenna board 13, and then the antenna housing body 111 is adhered to the frame 112, so that the integrated antenna array surface 1 is obtained, the manufacturing process is simplified, and the manufacturing difficulty is reduced.
The radome 11 is made of glass fiber reinforced plastic with the density of about 1800Kg/m 3 The radome 11 is prepreg cloth with the thickness of more than 0.2mm, and can resist external impact, so that the radome 11 is not easy to deform to influence the performance of the antenna. Preferably, the thickness of the radome 11 is 0.2-0.5 mm.
In an embodiment, as shown in fig. 5 and 6, the integrated antenna array plane 1 further includes a plurality of first mounting studs 15 and a plurality of second mounting studs 16, the temperature equalizing plate 2 is provided with first mounting holes 212 corresponding to the number of the first mounting studs 15, the first mounting studs 15 are connected in the first mounting holes 212, and the temperature equalizing plate 2 and the integrated antenna array plane 1 are connected through the first mounting studs 15. The protective cover 3 is provided with second mounting holes 321 corresponding to the second mounting studs 16 in number, the second mounting studs 16 are connected in the second mounting holes 321, and the protective cover 3 is connected to the integrated antenna array plane 1 through the second mounting studs 16.
In an embodiment, the antenna board 13 is a PCBA board, integrates functions of a transceiver antenna, ACU control, a power supply module, up-down conversion and the like, and realizes full integration of communication control functions. The antenna board 13 has the sealed face 132 of device face 131 and surrounding device face 131 in one side of keeping away from radome 11, and sealed face 132 is located the outer fringe department of antenna board 13, and device face 131 is used for installing components and parts such as CMOS chip, power chip, controlling means, and the one side surface layout receiving antenna radiating element and the transmitting antenna radiating element that is close to radome 11 of antenna board 13, and the heat dissipation of components and parts is convenient for on all overall arrangement and the device face 131. The coverage of the protective cover 3 on the integrated antenna array surface 1 is larger than the coverage of the temperature equalization plate 2, the first mounting studs 15 are arranged on the device surface 131, so that the coverage protection of the temperature equalization plate 2 on the device surface 131 can be realized, the second mounting studs 16 are arranged on the sealing surface 132, and the interconnection of the protective cover 3 and the integrated antenna array surface 1 and the cover protection of the temperature equalization plate 2 can be realized.
In an alternative embodiment, the side surface of the frame 112 remote from the radome 11 is provided with a groove for positioning the outer edge of the antenna plate 13, the side surface of the antenna plate 13 remote from the radome 11 is flush with the side surface of the frame 112 remote from the radome 11, and the side surface of the frame 112 remote from the radome 11 may also be provided with a second mounting stud 16.
In one embodiment, as shown in fig. 4 and 5, the temperature equalization plate 2 includes a temperature equalization plate body 21 and a first flange 22 disposed around an outer edge of the temperature equalization plate body 21, and a first mounting hole 212 is disposed on the temperature equalization plate body 21, and the temperature equalization plate body 21 is connected to the antenna plate 13 through a first mounting stud 15 on the sealing surface 132. The surface of one side of the first flange 22 far away from the temperature equalization plate main body 21 is attached to the antenna plate 13 so as to cover the device surface 131, and the first flange 22 protrudes from the temperature equalization plate main body 21 towards the antenna plate 13, so that a cavity is formed between the temperature equalization plate main body 21 and the antenna plate 13, components on the antenna plate 13 can be accommodated, and the covering protection of the components is realized. The heat generated by the components on the antenna plate 13 can be conducted to the temperature equalizing plate 2, and the temperature equalizing plate 2 is formed by high conductivityThe hot aluminum alloy sheet material is manufactured, the thickness of the aluminum alloy sheet is 1-1.5 mm, and the heat conductivity coefficient of the aluminum alloy is larger than that of the aluminum alloy sheet materialThe heat of the integrated antenna array surface 1 can be well subjected to temperature equalization, and the temperature rise caused by overlarge local heat flux density is avoided. And the density of the aluminum alloy sheet is about 2700Kg/m 3 The weight of the antenna can be greatly reduced by satisfying the demand for weight reduction.
In an embodiment, glue is coated on the first flange 22 to adhere the first flange 22 to the sealing surface 132, so as to realize the overall waterproof effect of the temperature equalization plate 2.
In an embodiment, as shown in fig. 5, the temperature equalization board 2 further includes a module installation box 23 and a protective cover plate 24 installed on the module installation box 23, the module installation box 23 is disposed on a side surface of the temperature equalization board main body 21 facing the protective cover 3, the module installation box 23 can be adhered or welded on the temperature equalization board main body 21, a functional module can be installed in the module installation cavity, the functional module is connected with the integrated antenna array face 1 through a cable, the protective cover plate 24 can realize sealing and waterproofing of the module installation box 23, and the module installation box can be suitable for an antenna with low functional integration level of the antenna board 13.
In an embodiment, as shown in fig. 4 and 5, a plurality of protruding portions 211 protruding towards the direction of the antenna board 13 are provided on the temperature equalization board main body 21, the protruding portions 211 can be abutted against components on the component surface 131, and the protruding portions 211 are abutted against components on the component surface 131, so that gaps between the heated components and the temperature equalization board 2 can be reduced, further conduction thermal resistance is reduced, heat conduction between the components and the temperature equalization board 2 is facilitated, and meanwhile, structural strength of the temperature equalization board 2 can be improved. Preferably, the plurality of protrusions 211 have different protrusion heights in order to make contact with different components.
In an embodiment, the temperature equalizing plate 2 further includes a thermal pad, the thermal pad is disposed between the protruding portion 211 and the component of the antenna plate 13, the thermal pad is attached to the protruding portion 211 or the component, and the coverage area of the thermal pad is determined according to the size of the component. Heat conduction of heat conduction padCoefficient greater thanThe thickness is greater than 1.5mm, because the installation error of components and parts and temperature equalizing plate 2 to and the manufacturing error etc. of bulge 211, have the condition that bulge 211 can not the butt components and parts, through setting up the heat conduction pad, the heat conduction pad can take place to warp, and the heat conduction pad oppression components and parts when avoiding installing temperature equalizing plate 2, adapt to the error between temperature equalizing plate 2 and the components and parts simultaneously, avoid bulge 211 and components and parts to have the clearance, and the thermal resistance is great, unfavorable for the condition of heat conduction.
Preferably, the thickness of the heat conducting pad is 1.5-3 mm.
Alternatively, an interface material is disposed between the protruding portion 211 and the component of the antenna board 13, and the interface material may be, but is not limited to, a thermally conductive gel or silicone grease, which also has the effect of reducing contact thermal resistance.
In one embodiment, as shown in fig. 3, the shield 3 includes a shield body 31 and a second flange 32 disposed around the shield body 31, the second mounting hole 321 is disposed on the second flange 32, a surface of a side of the second flange 32 away from the shield body 31 is attached to the sealing surface 132, and the second mounting stud 16 on the sealing surface 132 is connected in the second mounting hole 321, so that a heat dissipation cavity is formed between the integrated antenna array plane 1 and the shield 3, and functions as protection and structural integrity. Glue is smeared on the sealing surface 132, so that the sealing surface 132 and the second flange 32 are bonded, and the waterproof between the protective cover 3 and the integrated antenna array surface 1 is realized.
Alternatively, the sealing surface 132 and the side surface of the frame 112 away from the radome 11 are provided with second mounting studs 16, and the second flange 32 is provided with corresponding second mounting holes 321, so as to connect the antenna board 13 and the frame 112.
Preferably, the protective cover 3 can be made of non-metal polymers or modified materials, such as PC+ABS, modified ABS, PBT+GF, so that strength and lightweight design can be ensured, and the weight of the antenna can be greatly reduced.
In an embodiment, as shown in fig. 3 and 5, the phased array antenna further includes a cooling fan 33, the ventilation opening is disposed on the protective cover main body 31, the ventilation opening includes an air inlet 311 and an air outlet 312, the air inlet 311 and the air outlet 312 are communicated with a cooling cavity and the outside, the cooling fan 33 is disposed at the air outlet 312, the cooling fan 33 can send the air in the cooling cavity out from the air outlet 312 and drive the outside air to enter the cooling cavity from the air inlet 311, so as to realize heat exchange between the cold air and the temperature equalizing plate 2.
In order to ensure reliable operation of the antenna in a high-temperature environment, in this embodiment, the heat dissipation path of the integrated antenna array surface 1 is mainly two by adopting the heat dissipation fan 33, one of the heat dissipation paths is provided with an antenna control chip for receiving and transmitting an array surface and a large number of control, power supply and interface processing chips on the sealing surface 132 of the antenna board 13, and meanwhile, the antenna board 13 is provided with a large number of ground holes, shielding holes and signal holes, so that the vertical heat conduction rate of the antenna board 13 can be increased, the heat of all components can be transferred to the surface of one side of the antenna board 13 facing the antenna housing 11, and then is transferred to the surface of one side of the antenna housing 11 far from the antenna board 13 by the PMI foam and is subjected to heat exchange with the external environment, and the surface of one side of the antenna housing 11 far from the antenna board 13 is sprayed with a white coating layer with high emissivity and low absorptivity, so that the radiation heat dissipation of the surface of the antenna housing 11 can be improved, and the absorption of solar radiation can be reduced. Secondly, the heat generated by the components is conducted to the temperature-equalizing plate 2, the temperature-equalizing plate 2 is subjected to temperature equalization, the temperature-equalizing plate 2 is made of high-heat-conductivity aluminum alloy sheet materials, and the natural heat exchange coefficient between the temperature-equalizing plate and the environment is aboutBy exhausting air by the cooling fan 33, the heat exchange between the cold air and the temperature equalization plate 2 can be accelerated, and the heat exchange coefficient can be improved.
When the heat dissipation fan 33 is not disposed in the protective cover 3 to perform forced air cooling, glue may not be applied to the first flange 22 of the temperature equalization plate 2, and water prevention between the temperature equalization plate 2 and the protective cover 3 can be achieved by applying glue between the second flange 32 and the sealing surface 132, so that the assembly process can be simplified.
In an embodiment, a plurality of heat dissipation fins are arranged on the surface of one side of the temperature equalization plate 2 facing the protective cover 3, so that the heat exchange area can be increased, and the heat exchange can be accelerated.
In an embodiment, as shown in fig. 3, an interface waterproof cover 25 is arranged on the temperature equalization plate 2, the interface waterproof cover 25 is arranged at a joint of the cable in a covering manner, and a sealing gasket is arranged between the interface waterproof cover 25 and the temperature equalization plate 2 to realize water prevention.
In an embodiment, as shown in fig. 3, the protection cover 3 further includes at least one partition 34 disposed on the protection cover main body 31, the partition 34 can divide the heat dissipation cavity into at least two parts, the protection cover main body 31 corresponding to each part of the heat dissipation cavity is provided with an air inlet 311 and an air outlet 312, the heat dissipation cavities of each part are not communicated with each other through the interval of the partition 34, so that the air inlet and the air outlet of each heat dissipation cavity are not mutually disturbed, and the fan in each heat dissipation cavity can timely regulate and control the air discharge quantity according to the heat dissipation requirement fed back by the integrated antenna array plane 1.
Specifically, as shown in fig. 7, the partition 34 is provided with one, the partition 34 can divide the heat dissipation cavity into a first heat dissipation cavity and a second heat dissipation cavity, the air inlet 311 includes a first air inlet and a second air inlet, the air outlet 312 includes a first air outlet and a second air outlet, the heat dissipation fan 33 includes a first heat dissipation fan and a second heat dissipation fan, the first heat dissipation fan is disposed in the first heat dissipation cavity and is close to the first air outlet, the first heat dissipation fan can drive cold air to enter the first heat dissipation cavity from the first air inlet, and the heated air is driven to flow out of the first heat dissipation cavity from the first air outlet. The second cooling fan is arranged in the second cooling cavity and is close to the second air outlet, and can drive cold air to enter the second cooling cavity from the second air inlet and drive heated air to flow out of the second cooling cavity from the second air outlet.
In an embodiment, as shown in fig. 1 and 3, a surface of one side of the radome 11 away from the antenna board 13 is in an arc shape protruding toward a direction away from the antenna board 13, the middle of the trapezoid is low, and a hydrophobic layer is disposed on the radome 11. Conventionally, after rainwater falls on the surface of the radome 11, because the overall structure is a planar structure, water drops cannot obtain additional power, meanwhile, because the surface coating of the conventional radome 11 has certain hydrophilicity, a small hydrophobic angle is formed between the water drops and a contact surface, and continuous water films are formed after the rainwater is continuously accumulated, so that the performance of the antenna is affected. In this embodiment, the radome 11 adopts a continuous cambered surface structure, so that the water drops have a certain rolling angle on the radome 11, and the water drops roll off from the radome 11 conveniently. The super-hydrophobic nano coating is sprayed on the surface of the radome 11, so that the hydrophilicity is reduced, the minimum rolling angle of water drops is theta=2°, the rolling angles on the radome 11 are different at different positions, and the control is performed by an antenna simulation method and a calculation method of any point tangent line of the cambered surface in order to reduce the height of the whole phased array antenna.
In an embodiment, as shown in fig. 3, a transceiver isolation area 133 is disposed on the antenna board 13, the integrated antenna array plane 1 further includes a heating film 14, the heating film 14 is disposed between the antenna housing 11 and the support layer and at a position corresponding to the transceiver isolation area 133, the heating film 14 is a PI (polyimide) heating film, the heating film 14 provides additional heat to melt snow, and no antenna unit is disposed on the transceiver isolation area 133 on the antenna board 13, so as to avoid the influence of the heating film 14 on the wave-transmitting loss of the antenna housing 11.
In one embodiment, a sensor is provided on the radome 11, the sensor being electrically connected to the heating film 14. The heat generated by the components on the antenna board 13 can be transferred to the antenna housing 11, the sensor on the antenna housing 11 detects the accumulated snow, the cooling fan 33 is turned off, the convection of forced air cooling and external heat is reduced, and the heat dissipation capacity of the path to the antenna housing 11 is improved. The radome 11 is the arc, the antenna board 13 is the platy, the laminating of support layer 12 also is middle high cambered surface structure low all around in the one side surface of radome 11, the foam of position all around is thinner, the thermal resistance that heat transfer to radome 11 surface is little, most heat can transfer to radome 11 surface and melt the snow, the foam of intermediate position is thicker relatively, the heat is at the in-process of transferring to radome 11 surface, the thermal resistance is great, PI heating film 14 provides extra heat and melts the snow and can not influence radome 11 wave-transparent loss, heat through heating film 14 and antenna board 13 self heat and melt snow for phased array antenna does not snow when ice and snow use in the sky, eliminate because the influence of sleet pile up to antenna performance. The PI heater film 14 can be switched according to the detection sensor and the temperature feedback.
On the other hand, the embodiment of the invention provides communication equipment, which comprises the phased array antenna of the embodiment.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. The phased array antenna is characterized by comprising an integrated antenna array surface, a temperature equalizing plate and a protective cover, wherein the integrated antenna array surface comprises an antenna housing, a support layer and an antenna plate, the antenna housing is arranged on the antenna plate, a containing cavity is formed by encircling the antenna housing and the antenna plate, the support layer is arranged in the containing cavity, and the support layer is fixedly adhered between the antenna housing and the antenna plate;
the temperature equalization plate is installed on one side surface of the antenna plate, which is far away from the antenna housing, the integrated antenna array surface and the protective cover are oppositely arranged, the protective cover is connected to the upper part of the integrated antenna array surface and covers the temperature equalization plate, and a vent communicated with the outside is arranged on the protective cover.
2. The phased array antenna of claim 1, wherein the integrated antenna array surface further comprises a plurality of first mounting studs and a plurality of second mounting studs, wherein the temperature equalizing plate is provided with first mounting holes corresponding to the first mounting studs in number, and the first mounting studs are connected in the first mounting holes; the protective cover is provided with second mounting holes, the number of which corresponds to that of the second mounting studs, and the second mounting studs are connected in the second mounting holes.
3. The phased array antenna of claim 2, wherein a side of the antenna panel remote from the radome has a device face for mounting components and a sealing face surrounding the device face, the first mounting stud being disposed on the device face and the second mounting stud being disposed on the sealing face.
4. The phased array antenna of claim 3, wherein the temperature equalization plate comprises a temperature equalization plate body and a first flange disposed around an outer edge of the temperature equalization plate body, the first mounting hole is disposed on the temperature equalization plate body, and a side surface of the first flange remote from the temperature equalization plate body is attached to the device side.
5. The phased array antenna of claim 4, wherein the temperature equalization plate further comprises a module mounting case and a protective cover plate mounted on the module mounting case, the module mounting case being disposed on a side surface of the temperature equalization plate body facing the protective cover.
6. The phased array antenna of claim 4, wherein the temperature equalization plate further comprises a thermal pad, a plurality of protruding portions protruding toward the antenna plate are provided on the temperature equalization plate main body, the protruding portions are capable of abutting against components on the device face, and the thermal pad is provided between the protruding portions and the components of the antenna plate.
7. The phased array antenna of claim 3, wherein the shield comprises a shield body and a second flange disposed around the shield body, the second mounting hole being disposed on the second flange, a side surface of the second flange remote from the shield body being attached to the sealing surface to form the heat dissipation cavity.
8. The phased array antenna of claim 7, further comprising a cooling fan, the vent comprising an air inlet and an air outlet, the air inlet and the air outlet communicating the heat dissipation cavity with the outside, the cooling fan disposed at the air outlet;
the protection casing is still including setting up at least one baffle on the protection casing main part, the baffle can with the heat dissipation chamber is divided into two at least parts, every part all be provided with air intake and air outlet on the protection casing main part that the heat dissipation chamber corresponds.
9. The phased array antenna of claim 1, wherein a transceiver isolation area is provided on the antenna board, the integrated antenna array further comprises a heating film, the heating film is provided between the radome and the support layer and at a position corresponding to the transceiver isolation area, a sensor is provided on the radome, and the sensor is electrically connected with the heating film;
the surface of one side of the radome far away from the antenna board is arc-shaped and is coated with a hydrophobic layer.
10. A communication device comprising a phased array antenna as claimed in any one of claims 1 to 9.
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| CN202311316833.4A CN117060041B (en) | 2023-10-12 | 2023-10-12 | Phased array antenna and communication equipment |
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| CN202311316833.4A CN117060041B (en) | 2023-10-12 | 2023-10-12 | Phased array antenna and communication equipment |
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