CN205282483U - Photoelectric sensor encapsulation - Google Patents
Photoelectric sensor encapsulation Download PDFInfo
- Publication number
- CN205282483U CN205282483U CN201520877833.6U CN201520877833U CN205282483U CN 205282483 U CN205282483 U CN 205282483U CN 201520877833 U CN201520877833 U CN 201520877833U CN 205282483 U CN205282483 U CN 205282483U
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- cover plate
- upper cover
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- ceramic substrate
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Abstract
The utility model relates to a photoelectric sensor encapsulation, including the casing with install detector element and the circuit board in the casing, the casing mainly comprises at the bottom board of upper cover plate lower extreme with installing the upper cover plate, the adoption screw fixation is put with the bottom board to the upper cover plate, sealed glue is sealed, detector element includes the ceramic substrate and installs the photoelectric sensor on the ceramic substrate, it has a set of pin jack to make respectively on ceramic substrate's the relative both sides face, installation output pin in the pin jack, the output pin passes through metal wire and photoelectric sensor's circuit connection, the middle part of circuit board is seted up flutedly along length direction, set up semiconductor cooler in the recess, be close to the recess both sides on the circuit board and opened the welding hole respectively, sensor output pin insertion welding is downthehole and continuous with the circuit board switching pin that is located the welding hole outside. The utility model has the advantages that small, the encapsulation is easy, difficult gas leakage, and refrigeration effect is good.
Description
Technical field
The utility model relates to a kind of photosensor package, belongs to sensor technical field.
Background technology
According to the applicant understood, in photo-sensor making processes, producer is in order to cost-saving, usually make nude film (detector namely not encapsulated), line array sensor as shown in Figure 4, its nude film primarily of ceramic substrate, inlay photo-sensor material on a ceramic substrate and the pin that stretches out by ceramic substrate forms below. it is that devices function dark current is very little that photo-sensor realizes the precondition of detection, prior art is method of cooling for reducing the method that working sensor dark current is effective, the most the most frequently used, namely sensor needs to work under cryogenic, therefore designs the trend that the requirement that a kind of scientific and reasonable encapsulation structure meets sensor low-temperature working becomes photo-sensor market development. find through retrieval, the Chinese patent application that publication number is CN104538462A discloses a kind of photosensor package structure and method thereof, this encapsulation structure comprises substrate, cover plate, substrate is offered many cutting grooves substrate is separated to form multiple base board unit, each base board unit upper surface is all bonded with wafer and is electrically connected with base board unit by lead-in wire, the advantage of this kind of encapsulation structure once to encapsulate multiple chip, but this structure lacks refrigeration plant, usually the mode of naturally cooling is adopted to provide low temperature environment for photo-sensor, refrigeration is poor, the requirement of sensor low-temperature working can not be met.
Practical novel content
The purpose of this utility model is: the deficiency existed for above-mentioned prior art, it is proposed to a kind of small-sized, integrated photosensor package integrating encapsulation and dispelling the heat.
In order to reach above object, the technical solution of the utility model is as follows:
A kind of photosensor package, comprises housing and the detector element being arranged in housing and circuit card, housing primarily of upper cover plate and the bottom plate composition being arranged on the lower end of upper cover plate, upper cover plate and bottom plate adopt be screwed, sealant sealing; Detector element comprises ceramic substrate and installs photo-sensor on a ceramic substrate, the relative two sides of ceramic substrate are shaped with group of pin jack respectively, installing output pin in pin jack, output pin is connected with the circuit of photo-sensor by metal wire; Groove has been offered at the middle part of circuit card along its length, semi-conductor refrigerator is set in groove, having long strip shape welding hole near groove both sides on circuit card, pin of transferring in sensor output pin insertion welding hole and with the circuit card being positioned at outside welding hole is connected.
According to the applicant understood, photo-sensor provides the refrigeration modes of low temperature environment to have the modes such as naturally cooling, liquid nitrogen refrigerating, compulsory type air cooling and semi-conductor refrigerator cooling. For Problems existing in photo-sensor cooling technology, from refrigeration, frock size, operability and the angle with detector suitability, the semi-conductor refrigerator type of cooling is selected to have obvious advantage. Meanwhile, photosensor package of the present utility model, volume is little, photo-sensor, temperature is passed device, semi-conductor refrigerator and circuit card unification and is encapsulated in housing, applying argon gas in housing, prevents semi-conductor refrigerator from producing water condensation in process of refrigeration. And dispelled the heat by water cycle, reach best refrigeration.
The perfect further technical scheme of the utility model is as follows:
Preferably, the hot and cold two ends of semi-conductor refrigerator are coated with thermal grease, and the bottom surface that this cold junction is close to ceramic substrate is arranged, and this hot junction is close to bottom plate and is arranged.
Preferably, semi-conductor refrigerator is connected with external source by supply lead.
Preferably, upper cover plate comprises cover plate plate body and several sidewalls extended downward vertically from upper cover plate plate body edge, and several sidewalls are interconnected and jointly form a container cavity with upper cover plate plate body, have, on a sidewall, the pore being connected with container cavity wherein; The bottom of upper cover plate plate body is shaped with square mouth, and the edge of square mouth has multiple side plate extended vertically upward, and multiple side plate is interconnected and jointly forms a boss chamber with panel fixed thereon, and boss chamber communicates with container cavity. The top panel of upper cover plate has window, installs glass port in window. Bottom plate is rectangle plate, and long limit, the both sides of rectangle plate has a groove hole, and short limit, both sides is shaped with one group of screw hole respectively, and circuit card switching pin is stretched out by groove hole.
Housing design of the present utility model becomes upper cover plate and bottom plate structure, and the sealing of encapsulation structure is more prone to, and semi-conductor refrigeration is better.
Preferably, the lower surface of bottom plate being positioned at and is provided with water storage case in the middle of two groove holes, the two ends of water storage case are respectively equipped with into water head and Water outlet. Semi-conductor refrigerator easily condenses in process of refrigeration and produces water, thus destroys the structure of photo-sensor, reduces the work-ing life of sensor. In order to prevent semi-conductor refrigerator from water-setting junction phenomena occurring in process of refrigeration, filling high purity argon in cavity.
Further, in order to reach best refrigeration, need semi-conductor refrigerator hot junction is carried out radiating treatment, absorb the heat that hot junction conducts out by bottom plate, therefore water storage case is set in the bottom of bottom plate, one end of this water storage case arranges water-in, the other end sets out the mouth of a river, and exterior cooling water enters water storage case by water-in, after taking away the heat of bottom plate, flow out from water outlet again, complete a water cycle radiation processes. This kind of water circle device, makes heat leave rapidly, to ensure that semi-conductor refrigeration reaches best.
Preferably, upper cover plate and base plate cover adopt copper material; Upper cover plate is upper is shaped with one group of installation through hole corresponding with screw hole respectively in square mouth both sides, retaining screw is passed and installs through hole and be tightened against screw hole, and blend compounds encapsulates.
Preferably, ceramic substrate being also provided with temperature sensor, temperature sensor adopts temperature-sensitive resistance.
The utility model has the advantages that volume is little, encapsulation easily, is not easily leaked gas, good refrigeration effect.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further described.
Fig. 1 is the structural representation of the utility model embodiment.
Fig. 2 is the structural representation of upper cover plate in the utility model.
Fig. 3 is the structural representation of bottom plate in the utility model.
Fig. 4 is the structural representation of detector element in the utility model.
Fig. 5 is the structural representation of circuit card in the utility model.
Fig. 6 is the structural representation of semi-conductor refrigerator in the utility model.
In figure: 1. sapphire glass window, 2. go up cover plate, 3. photo-sensor, 4. ceramic substrate, 5. circuit card, 6. switching pin, 7. semi-conductor refrigerator, 8. bottom plate, 9. pore, 10. water inlet head, 11. water storage cases, 12. extension pins, 13. Water outlets, cover plate plate body on 14., 15. windows, 16. installation through holes, 17. sidewalls, 18. side plates, 19. panels, 20. groove holes, 21. screw holes, 22. output pins, 23. grooves, 24. welding holes, 25. supply leads.
Embodiment
Embodiment one
The photosensor package of the present embodiment, its structure is as shown in Figure 1, comprise housing and the detector element being arranged in housing and circuit card 5, its middle shell forms with the bottom plate 8 being arranged on upper cover plate 2 times ends primarily of upper cover plate 2, upper cover plate 2 and bottom plate 8 all adopt brass to make, and upper cover sheet thickness and bottom plate 8 consistency of thickness, not only make refrigeration reach best, can also dispel the heat as early as possible, prevent water from condensing. upper cover plate 2 comprises cover plate plate body 14 and four sidewalls 17 extended downward vertically from upper cover plate plate body 14 edge, four sidewalls 17 are interconnected and jointly form a container cavity with upper cover plate plate body 14, a sidewall 17 has the pore 9 being connected with container cavity wherein, the bottom of upper cover plate plate body 14 is shaped with square mouth, the edge of square mouth has four side plates extended vertically upward 17, 18, four side plates 18 are interconnected and jointly form a boss chamber with panel 19 fixed thereon, boss chamber communicates with container cavity and forms enclosure interior space, panel 19 has window 15, sapphire glass window 1 is installed in window 15, another upper cover plate plate body 14 is positioned at square mouth both sides and is shaped with three installations through hole 16 (see Fig. 2) respectively. bottom plate 8 is rectangle plate, long limit, the both sides of rectangle plate has a groove hole 20, short limit, both sides is shaped with three screw holes 21 corresponding with installing through hole 16 respectively, after making retaining screw pass installation through hole 16 and be tightened against screw hole 21, upper cover plate 2 is connected with bottom plate 8, adopt silica gel sealing screw hole 21 again, through hole 16 and upper cover plate 2 and gap, bottom plate 8 junction are installed, seal with glue, the lower surface of rectangle plate is positioned at two mid-ways, groove hole 20 and is provided with water storage case 11, one end of water storage case 11 is provided with into water head 10, the other end is provided with Water outlet 13 (see Fig. 3).
Detector element comprises the good ceramic substrate of thermal conductivity 4 and the photo-sensor 3 being arranged on ceramic substrate 4 and temperature sensor (temperature sensor employing temperature-sensitive resistance, for the temperature detected in housing on ceramic substrate, the detection signal of temperature in output housing), the relative two sides of ceramic substrate 4 are shaped with group of pin jack respectively, arranging output pin 22 in pin jack, output pin 22 is connected (see Fig. 4) by the circuit electrical of metal wire with photo-sensor 3. Groove 23 has been offered at the middle part of circuit card 5 along its length, semi-conductor refrigerator 7 is set in groove 23, and having long strip shape welding hole 24 near groove 23 both sides on circuit card 5, output pin 22 inserts in welding hole 24 and is connected (see Fig. 5) with the switching pin 6 of the circuit card 5 being positioned at outside welding hole 24. The switching pin 6 insertion groove hole 20 of circuit card 5 is extended outside bottom plate 8 simultaneously, after groove hole 20 grafting pin, adopt silica gel sealing.
Semi-conductor refrigerator 7 as shown in Figure 6, is connected with external source by supply lead 25. Its hot and cold two ends are coated with thermal grease, and the bottom surface that cold junction is close to ceramic substrate 4 is arranged, and hot junction is close to bottom plate 8 and is arranged.
Photosensor package method, detailed process is as follows:
One, ceramic substrate 4 is made, the relative two sides of ceramic substrate 4 make the pin jack array being made up of one group of pin jack, and output pin 22 is inserted in corresponding pin jack, again photo-sensor 3 and temperature sensor are arranged on ceramic substrate 4, the circuit of photo-sensor 3 is electrically connected with output pin 22 by metal wire, form detector element, turn the 2nd step.
Two, offer groove 23 along its length at the middle part of circuit card 5, and on circuit card 5, be positioned at groove 23 both sides offer welding hole 24, then by semi-conductor refrigerator 7 by cold junction upward, hot junction be arranged in the way of down in groove 23, turn the 3rd step.
Three, the upper surface of circuit card 5 is connected on the bottom surface of ceramic substrate 4, and it is inserted in welding hole 24 after the output pin 22 of ceramic substrate 4 is connected with the switching pin 6 of circuit card 5, obtain electronic component module, turn the 4th step.
Four, cover plate 2 and bottom plate 8 in making, upper cover plate plate body 14 thickness and bottom plate 8 consistency of thickness, and upper cover plate 2 and base plate cover 8 all adopt copper material: upper cover plate 2 comprises cover plate plate body 14 and four sidewalls 17 extended downward vertically from upper cover plate plate body 14 edge, four sidewalls 17 are interconnected and jointly form a container cavity with upper cover plate plate body 14, extend side plate 18 top at the edge, middle part of upper cover plate plate body 14 respectively upward and connect the panel 19 for sealing container cavity, panel 19 is offered window 15, and sapphire glass window 1 is arranged in window 15, employing seal gum is fixed, for printing opacity, select rectangle plate as bottom plate 8, opening a groove hole 20 in the preglabellar field both sides of rectangle plate, outer both sides of edges opens three screw holes 21, and fixedly mounts water storage case 11 in the bottom surface of rectangle plate, one end of water storage case 11 is provided with into water head 10, and the other end is provided with Water outlet 13, turn the 5th step.
Five, electronic component module is arranged in the container cavity of upper cover plate 2, it is inserted in groove hole 20 after again the switching pin 6 of circuit card 5 being connected with the extension pin 12 of bottom plate 8, then retaining screw is made to pass the installation through hole 16 being positioned at cover plate plate body 14 dual-side, and it is tightened against screw hole 21, bottom plate 8 is made to be fixedly connected with, with upper cover plate 2, the module obtaining assembling, at the gap place of housing after assembling, screw hole 21 screw of the installation through hole 16 and bottom plate 8 of namely going up cover plate 2 is fixed, the link position of groove hole 20 and upper cover plate 2 and bottom plate 8 all adopts close silica gel sealing, turn the 6th step.
Six, after the module assembled being put into glove box, glove box is handled as follows: glove box is evacuated to 0.1 normal atmosphere, it is filled with argon gas to 1 normal atmosphere, it is evacuated to 0.1 normal atmosphere again, pour argon gas to 1 normal atmosphere, then adopt silica gel to be sealed by the pore 9 being positioned on cover plate 2 sidewall 17 in the glove box of full argon gas.
Seven, module is placed 24 hours in glove box, takes out, and encapsulation terminates.
The photosensor package of the present embodiment is arranged on airborne imaging spectrum instrument, obtains good checking, reach desired result.
In addition to the implementation, the utility model also can have other enforcement modes. All employings are equal to replacement or the technical scheme of equivalent transformation formation, the protection domain all required at the utility model.
Claims (10)
1. a photosensor package, comprise housing and the detector element being arranged in housing and circuit card, it is characterized in that: described housing primarily of upper cover plate and be arranged on the lower end of upper cover plate bottom plate composition, described upper cover plate and bottom plate adopt be screwed, sealant sealing; Described detector element comprises ceramic substrate and installs photo-sensor on a ceramic substrate, the relative two sides of described ceramic substrate are shaped with group of pin jack respectively, installing output pin in described pin jack, described output pin is connected with the circuit of photo-sensor by metal wire; Groove has been offered at the middle part of described circuit card along its length, semi-conductor refrigerator is set in described groove, having welding hole near groove both sides on described circuit card, pin of transferring in described output pin insertion welding hole and with the circuit card being positioned at outside welding hole is connected.
2. a kind of photosensor package according to claim 1, is characterized in that: the hot and cold two ends of described semi-conductor refrigerator are coated with thermal grease, the bottom surface that this cold junction is close to ceramic substrate is arranged, and this hot junction is close to bottom plate and is arranged.
3. a kind of photosensor package according to claim 2, is characterized in that: described semi-conductor refrigerator is connected with external source by supply lead.
4. a kind of photosensor package according to claim 1, it is characterized in that: described upper cover plate comprises cover plate plate body and several the sidewalls extended downward vertically from upper cover plate plate body edge, several sidewalls are interconnected and jointly form a container cavity with upper cover plate plate body, have, on a sidewall, the pore being connected with container cavity wherein.
5. a kind of photosensor package according to claim 4, it is characterized in that: the bottom of described upper cover plate plate body is shaped with square mouth, the edge of described square mouth has multiple side plate extended vertically upward, multiple side plate is interconnected and jointly forms a boss chamber with panel fixed thereon, and described boss chamber communicates with container cavity.
6. a kind of photosensor package according to claim 5, is characterized in that: have window on described panel, installs glass port in described window.
7. a kind of photosensor package according to claim 6, it is characterized in that: described bottom plate is rectangle plate, the both sides, long limit of described rectangle plate have a groove hole, and both sides, short limit are shaped with one group of screw hole respectively, and described circuit card switching pin is stretched out by groove hole.
8. a kind of photosensor package according to claim 7, is characterized in that: being positioned on the lower surface of described bottom plate and be provided with water storage case in the middle of two groove holes, the two ends of described water storage case are respectively equipped with into water head and Water outlet.
9. a kind of photosensor package according to claim 8, is characterized in that: the bottom bezel height of described upper cover plate is 2 times of bottom plate thickness, described upper cover plate and base plate cover adopt copper material; Described upper cover plate is upper is shaped with one group of installation through hole corresponding with screw hole respectively in both sides, retaining screw is passed and installs through hole and tightened fixing.
10. a kind of photosensor package according to claim 1, is characterized in that: be also provided with temperature sensor on described ceramic substrate, described temperature sensor adopts temperature-sensitive resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520877833.6U CN205282483U (en) | 2015-11-05 | 2015-11-05 | Photoelectric sensor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520877833.6U CN205282483U (en) | 2015-11-05 | 2015-11-05 | Photoelectric sensor encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205282483U true CN205282483U (en) | 2016-06-01 |
Family
ID=56067025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520877833.6U Withdrawn - After Issue CN205282483U (en) | 2015-11-05 | 2015-11-05 | Photoelectric sensor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205282483U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261658A (en) * | 2015-11-05 | 2016-01-20 | 中国地质调查局南京地质调查中心 | Photoelectric sensor package and method therefor |
| CN106449778A (en) * | 2016-11-16 | 2017-02-22 | 中国电子科技集团公司第四十四研究所 | Photoelectric coupler package structure used for large-scale integration |
| CN108538928A (en) * | 2017-03-03 | 2018-09-14 | 欧姆龙株式会社 | Sensor and its manufacturing method |
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
-
2015
- 2015-11-05 CN CN201520877833.6U patent/CN205282483U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261658A (en) * | 2015-11-05 | 2016-01-20 | 中国地质调查局南京地质调查中心 | Photoelectric sensor package and method therefor |
| CN105261658B (en) * | 2015-11-05 | 2017-03-22 | 中国地质调查局南京地质调查中心 | Photoelectric sensor package and method therefor |
| CN106449778A (en) * | 2016-11-16 | 2017-02-22 | 中国电子科技集团公司第四十四研究所 | Photoelectric coupler package structure used for large-scale integration |
| CN108538928A (en) * | 2017-03-03 | 2018-09-14 | 欧姆龙株式会社 | Sensor and its manufacturing method |
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
| CN109346534B (en) * | 2018-11-23 | 2024-05-07 | 中国电子科技集团公司第四十四研究所 | Ceramic tube shell structure and packaging structure thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160601 Effective date of abandoning: 20170322 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |