CN217687534U

CN217687534U - Novel thermometer chip

Info

Publication number: CN217687534U
Application number: CN202221386901.5U
Authority: CN
Inventors: 邹君辉; 邹勇豪
Original assignee: Shenzhen Kexinda Electronics Co ltd
Current assignee: Shenzhen Kexinda Electronics Co ltd
Priority date: 2022-06-01
Filing date: 2022-06-01
Publication date: 2022-10-28
Anticipated expiration: 2032-06-01

Abstract

The utility model relates to the technical field of thermometers, in particular to a novel thermometer chip, which is characterized in that a protective sponge is laid on the side wall of the inner cavity of a chip shell, the protective sponge is attached to a PCB (printed circuit board), the bottom of a support column is closely attached to the surface of the PCB, and protective rubber blocks are arranged at the top of an installation block and the bottom of the support column, so that the influence of impact force generated by external collision on the PCB and the chip body can be effectively reduced; the kit is fixed on two sides of the bottom of the heat conducting plate through glue, and the moisture-proof reagent is filled in the kit, so that the drying of air in the shell of the chip is ensured, and the influence of moisture on the chip body is prevented; through installing the heat-conducting plate above the chip body, heat-conducting plate top surface evenly is provided with heat radiation fins, and heat-conducting plate bottom surface closely laminates with chip body top surface to can in time effectively distribute away the heat that the chip produced in time, guarantee the steady operation of chip.

Description

Novel thermometer chip

Technical Field

The utility model relates to a clinical thermometer technical field specifically is a novel clinical thermometer chip.

Background

Body temperature is an important reference parameter for human health, body temperature measuring products used in large scale at present mainly comprise mercury thermometers and infrared electronic thermometers, and with social development and technical progress, the two thermometers still have the defects in use at present, and although the mercury thermometers are low in price and accurate in temperature measurement, the mercury thermometers have the following defects: the body temperature data can not be measured continuously, and a change map of the body temperature can not be obtained; the temperature measurement time is long, and about 5 minutes is needed to obtain accurate data; mercury is used, which has toxicity; the infrared thermometer adopts an infrared tube as a sensor and a chip, can quickly measure body temperature data, but has the following disadvantages: the conventional infrared thermometer is frequently used outdoors in daily use, and particularly after being used outdoors in high-temperature weather and high frequency, the temperature of a chip in the infrared thermometer is high, so that the infrared thermometer is easy to damage; in addition, the infrared thermometer is easy to drop in use, the chip of the infrared thermometer is easy to impact, the whole thermometer cannot be used, and a novel thermometer chip is designed aiming at the problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel clinical thermometer chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a novel thermometer chip, includes chip shell, PCB board, chip body and chip pin, chip shell inner chamber bottom edge is provided with the installation piece, installation piece top is provided with the PCB board in chip shell inside, the chip body is installed at PCB board top, chip body bottom is connected with the chip pin in PCB board below, chip shell inner chamber top edge is connected with the support column, the gomphosis groove has been seted up at chip shell top edge, the installation cavity has been seted up to gomphosis inslot chamber lateral wall, the inside connecting block that is provided with of installation cavity, connecting block surface mounting has the block of block, the heat-conducting plate is installed in chip body top at gomphosis groove top, heat-conducting plate top surface evenly is provided with heat radiation fins, and heat-conducting plate bottom surface closely laminates with chip body top surface.

Preferably, the protection sponge has been laid to chip shell inner chamber lateral wall, and the protection sponge laminates with the PCB board, can effectively reduce the impact force that external collision produced to the influence of PCB board and chip body.

Preferably, the bottom of the supporting column is tightly attached to the surface of the PCB, and the top of the mounting block and the bottom of the supporting column are provided with protective rubber blocks.

Preferably, the heat-conducting plate bottom both sides are fixed with the kit through glue, the inside packing of kit has dampproofing reagent, guarantees the drying of chip shell internal air, prevents that moisture from influencing the chip body.

Preferably, the bottom edge of the heat conducting plate is provided with an embedded block, the embedded block is embedded and connected with the embedded groove, and the bottom end of the embedded block is conical.

Preferably, the surface of the embedding block is provided with a clamping groove, the clamping block is clamped and connected with the clamping groove, the surfaces of the clamping block and the clamping groove are arc-shaped, and the connecting block is connected with the inner cavity wall of the mounting cavity through a reset spring, so that the heat-conducting plate can be conveniently mounted and dismounted, and later maintenance is facilitated.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a protection sponge has been laid to chip housing inner chamber lateral wall, and protection sponge and PCB board are laminated, and support column bottom and PCB board surface are closely laminated again, and installation piece top and support column bottom are provided with the protection rubber piece to can effectively reduce the impact force that external collision produced to PCB board and chip body's influence; the kit is fixed on two sides of the bottom of the heat conducting plate through glue, and the moisture-proof reagent is filled in the kit, so that the drying of air in the shell of the chip is ensured, and the influence of moisture on the chip body is prevented; through installing the heat-conducting plate above the chip body, heat-conducting plate top surface evenly is provided with heat radiation fins, and heat-conducting plate bottom surface closely laminates with chip body top surface to can in time effectively distribute away the heat that the chip produced in time, guarantee the steady operation of chip.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the mounting block of the present invention;

fig. 3 is a schematic view of the connection structure between the heat-conducting plate and the chip shell of the present invention.

In the figure: 1. a chip housing; 2. a PCB board; 3. a chip body; 4. a chip pin; 5. a protective sponge; 6. a support pillar; 7. mounting a block; 8. a heat conducting plate; 9. a kit; 10. heat dissipation fins; 11. a protective rubber block; 12. a fitting block; 13. a clamping groove; 14. a mounting cavity; 15. a return spring; 16. connecting blocks; 17. a clamping block; 18. a fitting groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a novel thermometer chip, including chip shell 1, PCB board 2, chip body 3 and

chip pin

4, 1 inner chamber bottom edge of chip shell is provided with installation piece 7, installation piece 7 top is provided with PCB board 2 in 1 inside of chip shell, chip body 3 is installed at 2 tops of PCB board, 3 bottoms of chip body are connected with chip pin 4 in 2 below of PCB board, 1 inner chamber top edge of chip shell is connected with

support column

6, 1 top edge of chip shell has seted up gomphosis groove 18, gomphosis groove 18 inner chamber lateral wall has seted up

installation cavity

14, 14 inside connecting block 16 that is provided with of installation cavity, 16 surface mounting of connecting block have block 17, heat-conducting plate 8 is installed in 3 tops of chip body at gomphosis groove 18 top, 8 top surfaces of heat-conducting plate evenly are provided with

heat radiation fins

10, and 8 bottom surfaces of heat-conducting plate closely laminate with 3 top surfaces of chip body.

Further, protection sponge 5 has been laid to 1 inner chamber lateral wall of chip shell, and protection sponge 5 laminates with PCB board 2 mutually, can effectively reduce the impact force that external collision produced to PCB board 2 and chip body 3's influence.

Further, the bottom of the support column 6 is tightly attached to the surface of the PCB 2, and the top of the mounting block 7 and the bottom of the support column 6 are provided with protective rubber blocks 11.

Further, 8 bottom both sides of heat-conducting plate are fixed with kit 9 through glue, and 9 inside packings of kit have dampproofing reagent, guarantee the drying of the interior air of chip shell 4, prevent that moisture from influencing chip body 6.

Furthermore, the bottom edge of the heat conducting plate 8 is provided with an embedded block 12, the embedded block 12 is embedded and connected with an embedded groove 18, and the bottom end of the embedded block 12 is conical.

Furthermore, the surface of the embedded block 12 is provided with a clamping groove 13, the clamping block 17 is clamped and connected with the clamping groove 13, the surfaces of the clamping block 17 and the clamping groove 13 are arc-shaped, and the connecting block 16 is connected with the inner cavity wall of the mounting cavity 14 through the return spring 15, so that the heat-conducting plate 8 can be conveniently mounted and dismounted, and the later maintenance can be conveniently carried out.

The utility model discloses a chip shell 1 inner chamber lateral wall has laid protection sponge 5, and protection sponge 5 and PCB board 2 are laminated mutually, and the support column 6 bottom is closely laminated with PCB board 2 surface again, and installation piece 7 top and support column 6 bottom are provided with protection rubber block 11 to can effectively reduce the impact force that external collision produced to PCB board 2 and chip body 3's influence; the kit 9 is fixed on two sides of the bottom of the heat conducting plate 8 through glue, and the moisture-proof reagent is filled in the kit 9, so that the drying of the air in the chip shell 1 is ensured, and the influence of moisture on the chip body 3 is prevented; through installing heat-conducting plate 8 above

chip body

3, 8 top surfaces of heat-conducting plate evenly are provided with

cooling fin

10, and 8 bottom surfaces of heat-conducting plate closely laminate with 3 top surfaces of chip body to can in time effectively distribute away the heat that the chip produced in time, guarantee the steady operation of chip.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel clinical thermometer chip, includes chip shell (1), PCB board (2), chip body (3) and chip pin (4), its characterized in that: chip package (1) inner chamber bottom edge is provided with installation piece (7), installation piece (7) top is provided with PCB board (2) in chip package (1) inside, chip body (3) are installed at PCB board (2) top, chip body (3) bottom is connected with chip pin (4) in PCB board (2) below, chip package (1) inner chamber top edge is connected with support column (6), gomphosis groove (18) have been seted up at chip package (1) top edge, mounting chamber (14) have been seted up to gomphosis groove (18) inner chamber lateral wall, inside connecting block (16) that is provided with of mounting chamber (14), connecting block (16) surface mounting has block (17), heat-conducting plate (8) are installed in chip body (3) top at gomphosis groove (18) top, heat-conducting plate (8) top surface evenly is provided with heat radiation fins (10), and heat-conducting plate (8) bottom surface closely laminates with chip body (3) top surface.

2. The novel thermometer chip of claim 1, wherein: protection sponge (5) have been laid to chip shell (1) inner chamber lateral wall, and protection sponge (5) laminate mutually with PCB board (2).

3. The novel thermometer chip of claim 1, wherein: the support column (6) bottom is closely laminated with PCB board (2) surface, installation piece (7) top and support column (6) bottom are provided with protection rubber piece (11).

4. The novel thermometer chip of claim 1, wherein: reagent boxes (9) are fixed on two sides of the bottom of the heat conducting plate (8) through glue, and moisture-proof reagents are filled in the reagent boxes (9).

5. The novel thermometer chip of claim 1, wherein: the bottom edge of the heat conducting plate (8) is provided with an embedded block (12), the embedded block (12) is embedded and connected with an embedded groove (18), and the bottom end of the embedded block (12) is conical.

6. The novel thermometer chip of claim 5, wherein: the surface of the embedded block (12) is provided with a clamping groove (13), the clamping block (17) is clamped and connected with the clamping groove (13), the surfaces of the clamping block (17) and the clamping groove (13) are arc-shaped, and the connecting block (16) is connected with the inner cavity wall of the installation cavity (14) through a return spring (15).