CN201568766U - Small-volume light source device made of high-temperature resisting LED elements - Google Patents
Small-volume light source device made of high-temperature resisting LED elements Download PDFInfo
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- CN201568766U CN201568766U CN2009201805337U CN200920180533U CN201568766U CN 201568766 U CN201568766 U CN 201568766U CN 2009201805337 U CN2009201805337 U CN 2009201805337U CN 200920180533 U CN200920180533 U CN 200920180533U CN 201568766 U CN201568766 U CN 201568766U
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- high temperature
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- light source
- temperature resistant
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Abstract
The utility model discloses a small-volume light source device made of high-temperature resisting LED elements. The small-volume light source device comprises a sealed thermal insulation cover body, the high-temperature resisting LED elements, a substrate, a radiating module, a heat conduction pipe, a baseplate, a circuit board and a base which are arranged from the top down, wherein the high-temperature resisting LED elements are fixed on the surface of the substrate after being connected in series and in parallel; the substrate is fixed at the inner upper end of a cavity of the radiating module; the sealed thermal insulation cover body is mounted at the upper end of the upper surface of the radiating module and seals the high-temperature resisting LED elements and the substrate therein; the heat conduction pipe is mounted in the cavity of the radiating module at the lower end o the substrate; the base is mounted at the lower end of the radiating module; the bottom end of the heat conduction pipe is connected with the upper surface of the baseplate; the lower surface of the baseplate is connected with the base; and the circuit board is fixedly mounted in a cavity of the base. In the utility model, the problem of heat dissipation of LED elements is well solved, and the problem of heat dissipation of an LED light source combined by LED elements is fundamentally solved, so that the possibility that a high-power LED light source is applicable to small-volume lamps is achieved.
Description
Technical field:
The utility model belongs to lighting field, particularly a kind of small size light source device that utilizes high temperature resistant LED element to make.
Background technology:
Led light source is more and more paid close attention to because of its high light efficiency, long-life, advantage such as radiationless, has been widely used in the city lighting engineerings such as neon light, guard rail lamp, garden lamp, street lamp.But led light source particularly high-power LED light source in use drawbacks such as the too fast decay of radiation light intensity that causes because heat radiation is undesirable, life-span rapid drawdown are also more obvious, become that the restriction led light source is promoted and the important technology bottleneck of development.Existing in the market high-power LED light source is in order to improve its heat dissipation problem, all adopt the light source heat radiation area measure that strengthens, do like this and increased the light source volume, though improved heat dissipation problem, but heat dissipation problem still exists, and making high-power LED light source be applied in becomes a kind of extravagant hope, the application of also having dwindled led light source undoubtedly greatly on the small size light fixture.
Summary of the invention:
For solving the problem that prior art exists, the spy provides a kind of small size light source device that utilizes high temperature resistant LED element to make, the used LED of this light source adopts high temperature resistant LED element, at first solve the heat dissipation problem of LED element, high temperature resistant LED element is that led chip directly is fixed on the semiconductor thermoelectric refrigeration device chip, the monomer encapsulation, heat during every LEDs chip operation is all in time shed, because led chip closely contacts with the semiconductor thermoelectric refrigeration device, no dividing plates etc. hinder the heat radiation factor, the radiating effect highly significant, and the integrated encapsulation of led chip and semiconductor chip, the LED element is not vulnerable to external environment influence, thereby has well solved LED element radiating problem, has more solved the heat dissipation problem by the led light source of LED element combination on root.Because the solution of heat dissipation problem, and high temperature resistant LED element takes is the active heat removal pattern, but not increases the passive heat radiation of area.So the application of high-power LED light source on the small size light fixture becomes possibility.
The technical solution adopted in the utility model is:
A kind of small size light source device that utilizes high temperature resistant LED element to make, it is characterized in that: comprise the heat insulation lid of sealing, high temperature resistant LED element, substrate, radiating module, heat pipe, base plate, circuit board, base, the heat insulation lid of described sealing, high temperature resistant LED element, substrate, radiating module, heat pipe, base plate, circuit board, base is arranged from top to bottom, be fixed on the substrate surface after the connection in series-parallel of described high temperature resistant LED element, substrate is fixed in the interior upper end of die cavity of radiating module, the heat insulation lid of described sealing be installed in the upper surface upper end of radiating module and with high temperature resistant LED element and base plate seals interior, heat pipe is installed in the radiating module die cavity of substrate lower end, base plate is installed in the radiating module lower end, the heat pipe bottom is connected with plate upper surface, the base plate lower surface is connected with base, is installed with circuit board in the die cavity of base.
Described high temperature resistant LED element, comprise a monomer led chip, it is characterized in that: also comprise monomer semiconductor thermoelectric refrigeration device chip, and the cold junction of semiconductor thermoelectric refrigeration device chip directly contacts with led chip, semiconductor thermoelectric refrigeration device hot junction is fixed on the pcb board, and the pcb board upper end is equipped with lens.
Described base is an E27 screw socket base.
Described radiating module and heat pipe are the high metal material of thermal conductivity and make.
The heat insulation lid of described transparent sealing, it is made for the low transparent material of thermal conductivity.
Heat insulation lid of described sealing and base are to fix by screw socket or gluing mode and radiating module.
Advantage of the present utility model is:
A kind of small size light source device that utilizes high temperature resistant LED element to make that the utility model provides, the used LED of this light source adopts high temperature resistant LED element, at first solve the heat dissipation problem of LED element, high temperature resistant LED element is that led chip directly is fixed on the semiconductor thermoelectric refrigeration device chip, the monomer encapsulation, heat during every LEDs chip operation is all in time shed, because led chip closely contacts with the semiconductor thermoelectric refrigeration device, no dividing plates etc. hinder the heat radiation factor, the radiating effect highly significant, and the integrated encapsulation of led chip and semiconductor chip, the LED element is not vulnerable to external environment influence, thereby well solved LED element radiating problem, more on root, solved heat dissipation problem by the led light source of LED element combination.Because the solution of heat dissipation problem, and high temperature resistant LED element takes is the active heat removal pattern, but not increases the passive heat radiation of area.So the application of high-power LED light source on the small size light fixture becomes possibility.
Description of drawings:
Fig. 1 is the structural representation of the high temperature resistant LED element of the utility model core component;
Fig. 2 is a kind of application example of the present utility model.
The specific embodiment:
The contrast accompanying drawing is elaborated to the utility model below, referring to accompanying drawing 1, Fig. 2:
As shown in Figure 1, high temperature resistant LED element 202 structures, be that led chip 101 directly is fixed on semiconductor thermoelectric refrigeration device chip 102 cold junctions 103, afterwards semiconductor thermoelectric refrigeration device 102 hot junctions 104 are fixed on the pcb board 105, wherein the conducting strip 107 of semiconductor thermoelectric refrigeration device chip 102 links to each other with led chip 101 both positive and negative polarities, 106 be connected shared external power source by going between with external power source.In order to improve LED bright dipping angle of radiation, lens 108 outside led chip 101, have been added as outer cover.
Example: as shown in Figure 2, the small size light source device that utilizes high temperature resistant LED element to make at first is fixed in high temperature resistant LED element 202 connection in series-parallel on substrate 203 surfaces, afterwards substrate 203 is fixed in the die cavity of radiating module 204; Circuit board 207 places base 208, and the wide perforation by base plate 206 and heat pipe 205 is electrically connected with high temperature resistant LED element Unit 202.Wherein base plate 206 1 ends link to each other with heat pipe 205 bottoms, and base plate 206 other ends are used to seal base 208 openings of containment circuit board 207.At last, heat insulation lid 201 of transparent sealing and base 208 are separately fixed at the upper and lower side of radiating module 204, and carry out sealing.During the work of light source device, the heat that the LED element sends initiatively sheds through the semiconductor thermoelectric refrigeration device, and the heat that sheds is discharged by radiating module 204 through substrate 203, heat pipe 205 backs.
Described base 208 is an E27 screw socket base.
Described radiating module 204 and heat pipe 205 are the high metal material of thermal conductivity and make.
The heat insulation lid 201 of described transparent sealing, it is made for the low transparent material of thermal conductivity.
Heat insulation lid 201 of described sealing and base 208 are to fix by screw socket or gluing mode and radiating module 204.
Claims (6)
1. small size light source device that utilizes high temperature resistant LED element to make, it is characterized in that: comprise the heat insulation lid of sealing, high temperature resistant LED element, substrate, radiating module, heat pipe, base plate, circuit board, base, the heat insulation lid of described sealing, high temperature resistant LED element, substrate, radiating module, heat pipe, base plate, circuit board, base is arranged from top to bottom, be fixed on the substrate surface after described high temperature resistant LED element string or the parallel connection, substrate is fixed in the interior upper end of die cavity of radiating module, the heat insulation lid of described sealing be installed in the upper surface upper end of radiating module and with high temperature resistant LED element and base plate seals interior, heat pipe is installed in the radiating module die cavity of substrate lower end, base plate is installed in the radiating module lower end, the heat pipe bottom is connected with plate upper surface, the base plate lower surface is connected with base, is installed with circuit board in the die cavity of base.
2. according to the described a kind of small size light source device that utilizes high temperature resistant LED element to make of claim 1, it is characterized in that: described high temperature resistant LED element, comprise a monomer led chip, also comprise monomer semiconductor thermoelectric refrigeration device chip, and the cold junction of semiconductor thermoelectric refrigeration device chip directly contacts with led chip, semiconductor thermoelectric refrigeration device hot junction is fixed on the pcb board, and the pcb board upper end is equipped with lens.
3. a kind of small size light source device that utilizes high temperature resistant LED element to make according to claim 1, it is characterized in that: described base is the screw socket base of E27 standard.
4. a kind of small size light source device that utilizes high temperature resistant LED element to make according to claim 1 is characterized in that: described radiating module and heat pipe are the high metal material of thermal conductivity and make.
5. a kind of small size light source device that utilizes high temperature resistant LED element to make according to claim 1, it is characterized in that: the heat insulation lid of described transparent sealing, it is made for the low transparent material of thermal conductivity.
6. a kind of small size light source device that utilizes high temperature resistant LED element to make according to claim 1 is characterized in that: heat insulation lid of described sealing and base are to fix by screw socket or gluing mode and radiating module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201805337U CN201568766U (en) | 2009-11-13 | 2009-11-13 | Small-volume light source device made of high-temperature resisting LED elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201805337U CN201568766U (en) | 2009-11-13 | 2009-11-13 | Small-volume light source device made of high-temperature resisting LED elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201568766U true CN201568766U (en) | 2010-09-01 |
Family
ID=42661055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201805337U Expired - Lifetime CN201568766U (en) | 2009-11-13 | 2009-11-13 | Small-volume light source device made of high-temperature resisting LED elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201568766U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734641A (en) * | 2011-03-31 | 2012-10-17 | 富瑞精密组件（昆山）有限公司 | Light emitting diode light fixture |
-
2009
- 2009-11-13 CN CN2009201805337U patent/CN201568766U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734641A (en) * | 2011-03-31 | 2012-10-17 | 富瑞精密组件（昆山）有限公司 | Light emitting diode light fixture |
| CN102734641B (en) * | 2011-03-31 | 2016-01-20 | 富瑞精密组件（昆山）有限公司 | LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100901 |
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| CX01 | Expiry of patent term |