CN110867427B - Sealing structure for NOX sensor chip - Google Patents
Sealing structure for NOX sensor chip Download PDFInfo
- Publication number
- CN110867427B CN110867427B CN201911186345.XA CN201911186345A CN110867427B CN 110867427 B CN110867427 B CN 110867427B CN 201911186345 A CN201911186345 A CN 201911186345A CN 110867427 B CN110867427 B CN 110867427B
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- 238000007789 sealing Methods 0.000 title claims abstract description 58
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract description 14
- 239000000428 dust Substances 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 2
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 2
- 210000002345 respiratory system Anatomy 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 201000004384 Alopecia Diseases 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 201000007100 Pharyngitis Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 231100000360 alopecia Toxicity 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a sealing structure for an NOX sensor chip, which relates to the field of sensor chips and aims at solving the problems that the existing NOX sensor chip sealing device has a general sealing effect, does not have the functions of water prevention and dust prevention, only can be used for mounting a single type sensor chip and is not beneficial to the sealing use of the chip; according to the invention, the chip is placed in the clamping groove, and different chips are favorably mounted through the arrangement of the clamping grooves with different specifications, so that the chip is convenient to mount and use; with the closing plate card at chip cassette upside, rotate the cardboard with the closing plate chucking, make the closing plate chucking in the connecting seat, be favorable to the sealed protection of chip.
Description
Technical Field
The invention relates to the field of sensor chips, in particular to a sealing structure for an NOX sensor chip.
Background
With the acceleration of the urbanization process in China, the consumption of fossil fuel is rapidly increased, and a lot of toxic and harmful gases are released into the atmosphere to pollute the environment, wherein the most typical one is NOX gas, which can not only cause photochemical smog and acid rain, damage the ozone layer, but also generate side effects on the respiratory system of human beings, and the symptoms of alopecia, throat inflammation, impaired vision, respiratory system resistance reduction and the like appear. Therefore, nitrogen oxide emission reduction is listed as one of the requirements for environmental protection. Detection of nitrogen oxides is particularly important and the accompanying NOX sensor functions well in this regard.
The exhaust pipe of automobile exhaust generally all can be provided with the NOX sensor for detect NOX's content, wherein the sealed fixed especially important of chip of NOX sensor, current NOX sensor chip sealing device, sealed effect is general, does not have waterproof dirt-proof function, and can only install single model sensor chip, is unfavorable for the sealed use of chip.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a sealing structure for an NOx sensor chip.
In order to achieve the purpose, the invention adopts the following technical scheme:
a sealing structure for a NOX sensor chip comprises a mounting seat, a sealing groove and a connecting seat, wherein mounting feet are arranged at the left end and the right end of the lower portion of the mounting seat, mounting holes are formed in the mounting feet, the sealing groove is arranged in the mounting seat, a fixing seat is arranged at the bottom end of the sealing groove, a dismounting groove is arranged at the lower end of the fixing seat, and the lower end of the dismounting groove is connected with the sealing groove;
the connecting seat is installed inside two fixing bases, and the left end upside is provided with the supporting seat in the seal groove, and the right-hand member is provided with the seal receptacle in the seal groove, and upper portion is provided with the waterproof layer in the seal groove, and the waterproof layer lower extreme is provided with the ventilative board, and ventilative board lower extreme left side and supporting seat connection, ventilative board lower extreme right side and seal receptacle connection.
Preferably, a mounting groove is arranged in the connecting seat, and a chip clamping seat is arranged in the mounting groove; the chip card seat upper end is provided with the closing plate, is provided with a plurality of draw-in grooves in the chip card seat, the variation in size of a plurality of draw-in grooves.
During the use, place the chip inside the draw-in groove, through the setting of the draw-in groove of multiple different specifications, be favorable to installing different chips, the installation of the chip of being convenient for is used, with the closing plate card at chip cassette upside, is favorable to the sealed of chip.
Preferably, the left side and the right side of the upper end of the connecting seat are symmetrically provided with clamping plates, a rotating shaft is arranged in the clamping plates, and the lower end of the rotating shaft is connected with the connecting seat. When the sealing device is used, the clamping plate is rotated to clamp the sealing plate, so that the sealing plate is clamped in the connecting seat, and the sealing protection of the chip is facilitated.
Preferably, an air vent is arranged in the support seat, and a protective net is arranged in the air vent; the vent left end is provided with two air vents, and the air vent left end sets up at the mount pad left end wall inboard.
During the use, through the cooperation of blow vent and air vent, to the inside heat dissipation that ventilates of device, and the heat dissipation in-process, through the protection of protection network, can effectually prevent the entering of impurity such as dust, moisture, be favorable to the use of device.
Preferably, the upper end of the mounting seat is provided with two reinforcing ribs, the left side and the right side of the upper end of the fixing seat are provided with supporting columns, and the upper ends of the supporting columns are connected with the ventilating plate; the connecting seat is electrically connected with the sealing seat, a transmission interface is arranged at the right end of the sealing seat, and the right end of the transmission interface is arranged inside the right end wall of the mounting seat.
When the mounting seat is used, the reinforcing ribs at the upper end of the mounting seat are favorable for improving the hardness of the mounting seat and are connected with a chip through the transmission interface, and the chip is convenient to connect and use.
The invention has the beneficial effects that:
1. according to the invention, the chip is placed in the clamping groove, and different chips are favorably mounted through the arrangement of the clamping grooves with different specifications, so that the chip is convenient to mount and use; with the closing plate card at chip cassette upside, rotate the cardboard with the closing plate chucking, make the closing plate chucking in the connecting seat, be favorable to the sealed protection of chip.
2. According to the invention, the chip is protected in a waterproof manner through the waterproof layer, the inside of the device is ventilated and radiated through the matching of the vent hole and the vent hole, and in the radiating process, impurities such as dust, moisture and the like can be effectively prevented from entering through the protection of the protective net, so that the use of the device is facilitated.
3. According to the invention, the transmission interface is connected with the chip, so that the chip can be conveniently connected and used, the mounting pins on the two sides of the mounting seat are matched with the mounting holes, the mounting of the sealing device of the chip is facilitated, meanwhile, the reinforcing ribs on the upper end of the mounting seat are beneficial to improving the hardness of the mounting seat, and the arrangement of the dismounting groove on the lower end of the sealing groove is convenient for dismounting the sealing groove and is beneficial to dismounting and using the chip.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic view of the structure of part A of the present invention.
Fig. 3 is a top view of the connecting socket of the present invention.
Fig. 4 is a top view of the chip holder according to the present invention.
Reference numbers in the figures: the mounting structure comprises a mounting seat 1, a mounting foot 2, a mounting hole 3, a sealing groove 4, a dismounting groove 5, a fixing seat 6, a connecting seat 7, a chip clamping seat 8, a sealing plate 9, a clamping groove 10, a mounting groove 11, a rotating shaft 12, a clamping plate 13, a vent plate 14, a waterproof layer 15, a sealing seat 16, a transmission interface 17, a supporting seat 18, a vent hole 19, a protective net 20 and a vent hole 21.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a sealing structure for a NOX sensor chip comprises a mounting base 1, a sealing groove 4 and a connecting base 7, wherein mounting pins 2 are arranged at the left and right ends of the lower part of the mounting base 1, mounting holes 3 are formed in the mounting pins 2, the sealing groove 4 is arranged inside the mounting base 1, a fixing base 6 is arranged at the bottom end of the sealing groove 4, a dismounting groove 5 is arranged at the lower end of the fixing base 6, and the lower end of the dismounting groove 5 is connected with the sealing groove 4;
connecting seat 7 is installed inside two fixing bases 6, and left end upper side is provided with supporting seat 18 in seal groove 4, and the right-hand member is provided with seal receptacle 16 in seal groove 4, and upper portion is provided with waterproof layer 15 in seal groove 4, and 15 lower extremes of waterproof layer are provided with ventilative board 14, and ventilative board 14 lower extreme left side is connected with supporting seat 18, and ventilative board 14 lower extreme right side is connected with seal receptacle 16.
A mounting groove 11 is arranged in the connecting seat 7, and a chip clamping seat 8 is arranged in the mounting groove 11; the upper end of the chip clamping seat 8 is provided with a sealing plate 9, a plurality of clamping grooves 10 are arranged in the chip clamping seat 8, and the clamping grooves 10 are different in size.
During the use, place the chip inside draw-in groove 10, through the setting of the draw-in groove 10 of multiple different specifications, be favorable to installing different chips, the installation of the chip of being convenient for is used, with closing plate 9 card at 8 upsides of chip cassette, be favorable to the sealed of chip.
The left side and the right side of the upper end of the connecting seat 7 are symmetrically provided with clamping plates 13, a rotating shaft 12 is arranged in each clamping plate 13, and the lower end of each rotating shaft 12 is connected with the connecting seat 7. During the use, rotate cardboard 13 with the closing plate 9 chucking, make the closing plate 9 chucking in connecting seat 7, be favorable to the sealed protection of chip.
An air vent 19 is arranged in the supporting seat 18, and a protective net 20 is arranged in the air vent 19; two vent holes 21 are arranged at the left end of the vent hole 19, and the left ends of the vent holes 21 are arranged on the inner side of the left end wall of the mounting seat 1.
When the device is used, the inside of the device is ventilated and radiated through the matching of the vent 19 and the vent hole 21, and in the radiating process, impurities such as dust, moisture and the like can be effectively prevented from entering through the protection of the protective net 20, so that the device is favorably used.
Two reinforcing ribs are arranged at the upper end of the mounting seat 1, supporting columns are arranged on the left side and the right side of the upper end of the fixing seat 6, and the upper ends of the supporting columns are connected with the ventilating plate 14; connecting seat 7 and seal receptacle 16 electric connection, the seal receptacle 16 right-hand member is provided with transmission interface 17, and transmission interface 17 right-hand member sets up inside mount pad 1 right-hand member wall.
During the use, the strengthening rib of mount pad 1 upper end is favorable to improving the hardness of mount pad 1 and inserts through transmission interface 17 and chip, is convenient for the connection of chip and uses.
The working principle is as follows: when the chip card is used, the chip is placed in the card slot 10, and different chips are installed through the arrangement of the card slots 10 with different specifications, so that the chip card is convenient to install and use; when the sealing device is used, the sealing plate 9 is clamped on the upper side of the chip clamping seat 8, the sealing plate 9 is clamped by rotating the clamping plate 13, and the sealing plate 9 is clamped in the connecting seat 7, so that the sealing protection of a chip is facilitated; during the use, carry out water proof through waterproof layer 15 to the chip, cooperation through blow vent 19 and air vent 21, to the inside heat dissipation that ventilates of device, and the heat dissipation in-process, protection through protection network 20, can effectually prevent the dust, the entering of impurity such as moisture, be favorable to the use of device, during the use, insert through transmission interface 17 and chip, be convenient for the connection of chip is used, installation foot 2 and the cooperation of mounting hole 3 through mount pad 1 both sides, be favorable to the sealing device installation of chip, the strengthening rib of mount pad 1 upper end simultaneously, be favorable to improving the hardness of mount pad 1, the setting of the dismantlement groove 5 of seal groove 4 lower extreme, be convenient for the dismantlement of seal groove 4, be favorable to the dismouting use of chip.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A sealing structure for a NOX sensor chip comprises a mounting seat (1), a sealing groove (4) and a connecting seat (7), and is characterized in that mounting feet (2) are arranged at the left end and the right end of the lower portion of the mounting seat (1), mounting holes (3) are formed in the mounting feet (2), the sealing groove (4) is arranged inside the mounting seat (1), a fixing seat (6) is arranged at the bottom end of the sealing groove (4), a dismounting groove (5) is arranged at the lower end of the fixing seat (6), and the lower end of the dismounting groove (5) is connected with the sealing groove (4);
the connecting seat (7) is installed inside the two fixing seats (6), the upper side of the left end in the sealing groove (4) is provided with a supporting seat (18), the right end in the sealing groove (4) is provided with a sealing seat (16), the upper portion in the sealing groove (4) is provided with a waterproof layer (15), the lower end of the waterproof layer (15) is provided with a breathable plate (14), the left side of the lower end of the breathable plate (14) is connected with the supporting seat (18), and the right side of the lower end of the breathable plate (14) is connected with the sealing seat (16).
2. The sealing structure for an NOX sensor chip according to claim 1, wherein a mounting groove (11) is provided in the connecting socket (7), and a chip holder (8) is mounted in the mounting groove (11).
3. The sealing structure for the NOX sensor chip according to claim 2, wherein a sealing plate (9) is provided at an upper end of the chip holder (8), a plurality of card slots (10) are provided in the chip holder (8), and the plurality of card slots (10) have different sizes.
4. The sealing structure of claim 2, wherein the connecting base (7) is provided with a pair of locking plates (13) symmetrically arranged on the left and right sides of the upper end of the connecting base (7), a rotating shaft (12) is arranged in each locking plate (13), and the lower end of each rotating shaft (12) is connected with the connecting base (7).
5. The sealing structure for an NOX sensor chip according to claim 1, characterized in that a vent hole (19) is provided inside the support base (18), and a protective net (20) is installed inside the vent hole (19).
6. The sealing structure for an NOX sensor chip according to claim 5, characterized in that two vent holes (21) are provided at the left end of the vent hole (19), and the left ends of the vent holes (21) are provided inside the left end wall of the mount base (1).
7. The sealing structure for the NOx sensor chip according to claim 1, wherein two reinforcing ribs are arranged at the upper end of the mounting seat (1), supporting columns are arranged on the left and right sides of the upper end of the fixing seat (6), and the upper ends of the supporting columns are connected with the ventilation plate (14).
8. The sealing structure for the NOx sensor chip according to claim 4, wherein the connecting seat (7) is electrically connected with the sealing seat (16), the right end of the sealing seat (16) is provided with a transmission interface (17), and the right end of the transmission interface (17) is arranged inside the right end wall of the mounting seat (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911186345.XA CN110867427B (en) | 2019-11-28 | 2019-11-28 | Sealing structure for NOX sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911186345.XA CN110867427B (en) | 2019-11-28 | 2019-11-28 | Sealing structure for NOX sensor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110867427A CN110867427A (en) | 2020-03-06 |
| CN110867427B true CN110867427B (en) | 2021-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911186345.XA Active CN110867427B (en) | 2019-11-28 | 2019-11-28 | Sealing structure for NOX sensor chip |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111696927B (en) * | 2020-05-18 | 2023-12-15 | 蔚冰 | Chip packaging frame and chip packaging method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10360214A1 (en) * | 2003-12-20 | 2005-07-28 | Robert Bosch Gmbh | Detector measuring (especially IR) radiation e.g. in automobile-application gas concentration determinations can be mounted in a claimed sensor module and is chip- based |
| CN202631214U (en) * | 2012-06-27 | 2012-12-26 | 无锡隆盛科技股份有限公司 | Detection device for detecting air impermeability of oxygen sensor |
| CN108493261A (en) * | 2018-03-13 | 2018-09-04 | 谱诉光电科技（苏州）有限公司 | Photosensor package and packaging method |
| CN207816933U (en) * | 2018-02-06 | 2018-09-04 | 深圳市无眼界科技有限公司 | Gas-detecting device with water-proof function |
| CN108766939A (en) * | 2018-08-15 | 2018-11-06 | 江苏盐芯微电子有限公司 | A kind of chip packaging device and packaging method |
-
2019
- 2019-11-28 CN CN201911186345.XA patent/CN110867427B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10360214A1 (en) * | 2003-12-20 | 2005-07-28 | Robert Bosch Gmbh | Detector measuring (especially IR) radiation e.g. in automobile-application gas concentration determinations can be mounted in a claimed sensor module and is chip- based |
| CN202631214U (en) * | 2012-06-27 | 2012-12-26 | 无锡隆盛科技股份有限公司 | Detection device for detecting air impermeability of oxygen sensor |
| CN207816933U (en) * | 2018-02-06 | 2018-09-04 | 深圳市无眼界科技有限公司 | Gas-detecting device with water-proof function |
| CN108493261A (en) * | 2018-03-13 | 2018-09-04 | 谱诉光电科技（苏州）有限公司 | Photosensor package and packaging method |
| CN108766939A (en) * | 2018-08-15 | 2018-11-06 | 江苏盐芯微电子有限公司 | A kind of chip packaging device and packaging method |
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| CN110867427A (en) | 2020-03-06 |
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Effective date of registration: 20240429 Address after: Room 289, No.1, Zone 2, Zhuqiao Industrial City, Pudong New Area, Shanghai, 200000 Patentee after: Shanghai Xinyao Electronic Technology Co.,Ltd. Country or region after: China Address before: No. 666, Zhongxing East Road, Xikou Town, Fenghua District, Ningbo City, Zhejiang Province, 315000 Patentee before: NINGBO ANCHUANG ELECTRONIC TECHNOLOGY CO.,LTD. Country or region before: China |
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