CN216058085U - Photoelectric conversion module heat radiation structure - Google Patents
Photoelectric conversion module heat radiation structure Download PDFInfo
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- CN216058085U CN216058085U CN202122511924.6U CN202122511924U CN216058085U CN 216058085 U CN216058085 U CN 216058085U CN 202122511924 U CN202122511924 U CN 202122511924U CN 216058085 U CN216058085 U CN 216058085U
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- chip
- heat dissipation
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- heat
- module
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a photoelectric conversion module heat dissipation structure which comprises a module shell, wherein a boss corresponding to a chip is arranged on the inner side of the module shell, the gap between the boss and the chip is 0.15mm, heat conduction gel is filled between the boss and the chip, the heat conduction coefficient of the heat conduction gel is 6W, the heat of the internal chip can be quickly conducted to a shell, and heat dissipation paint or nano carbon powder is sprayed on the surface of the module shell 1 exposed outside a squirrel cage. Through increasing the boss at module casing inboard, only reserve 0.15 mm's clearance apart from the chip, fill perpendicular flow control very good heat conduction gel in this clearance, the coefficient of heat conductivity is up to 6W, can be fast with inside chip heat conduction to shell. Plate-Fin is added on the outer surface of the module shell to increase the heat dissipation surface area, and heat dissipation paint or nano carbon powder is sprayed on the surface of the module shell exposed outside the squirrel cage to improve the radiation heat dissipation capability, and the temperature can be effectively reduced by about 5-8 ℃ through actual test.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure of a photoelectric conversion module.
Background
The XGS-PON module is a photoelectric conversion module inserted on a squirrel cage, has small volume and high power consumption of 2.9W, and has the advantages of high heat conduction capability due to the fact that the shell is made of metal, actual test temperature of about 93 degrees which is far higher than the SPEC of a device and shortened service life of the product.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a heat dissipation structure of a photoelectric conversion module, which overcomes the above-mentioned shortcomings of the prior art.
In order to solve the problems, the technical scheme adopted by the utility model is as follows:
a photoelectric conversion module heat radiation structure comprises a module shell, wherein a boss corresponding to a chip is arranged on the inner side of the module shell, heat conduction gel is filled between the boss and the chip, and heat radiation paint or nano carbon powder is sprayed on the surface of the module shell exposed outside a squirrel cage.
According to a further technical scheme, the module shell is provided with radiating fins.
The further technical scheme is that the gap between the boss and the chip is 0.15 mm.
According to a further technical scheme, the heat conduction coefficient of the heat conduction gel is 6W.
Adopt the produced beneficial effect of above-mentioned technical scheme to lie in: through increasing the boss at module casing inboard, only reserve 0.15 mm's clearance apart from the chip, fill perpendicular flow control very good heat conduction gel in this clearance, the coefficient of heat conductivity is up to 6W, can be fast with inside chip heat conduction to shell. Plate-Fin is added on the outer surface of the module shell to increase the heat dissipation surface area, and heat dissipation paint or nano carbon powder is sprayed on the surface of the module shell exposed outside the squirrel cage to improve the radiation heat dissipation capability, and the temperature can be effectively reduced by about 5-8 ℃ through actual test.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is an exploded view in the other direction.
In the figure: 1. a module housing; 2. a chip; 3. a boss; 4. and (4) radiating fins.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1-3, a heat dissipation structure of a photoelectric conversion module includes a module housing 1, a boss 3 corresponding to a chip 2 is disposed on an inner side of the module housing 1, a gap between the boss 3 and the chip 2 is 0.15mm, a heat conductive gel is filled between the boss 3 and the chip 2, a heat conductivity coefficient of the heat conductive gel is 6W, heat of the internal chip can be quickly conducted to a housing, and a heat dissipation paint or nano carbon powder is sprayed on a surface of the module housing 1 exposed outside a squirrel cage to enhance radiation heat dissipation capability.
Preferably, the module housing 1 is provided with heat dissipation fins 4 to increase the heat dissipation area.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (4)
1. The utility model provides a photoelectric conversion module heat radiation structure which characterized in that: including module casing (1), module casing (1) inboard is equipped with boss (3) that correspond with chip (2), it has heat conduction gel to fill between boss (3) and chip (2), module casing (1) exposes and has sprayed on the surface outside the squirrel cage heat dissipation lacquer or nanometer carbon powder.
2. The heat dissipation structure of a photoelectric conversion module according to claim 1, wherein: and the module shell (1) is provided with radiating fins (4).
3. The heat dissipation structure of a photoelectric conversion module according to claim 1, wherein: the clearance between the boss (3) and the chip (2) is 0.15 mm.
4. The heat dissipation structure of a photoelectric conversion module according to claim 1, wherein: the thermal conductivity of the thermal conductive gel is 6W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122511924.6U CN216058085U (en) | 2021-10-19 | 2021-10-19 | Photoelectric conversion module heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122511924.6U CN216058085U (en) | 2021-10-19 | 2021-10-19 | Photoelectric conversion module heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216058085U true CN216058085U (en) | 2022-03-15 |
Family
ID=80609757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122511924.6U Active CN216058085U (en) | 2021-10-19 | 2021-10-19 | Photoelectric conversion module heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216058085U (en) |
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2021
- 2021-10-19 CN CN202122511924.6U patent/CN216058085U/en active Active
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