CN2596415Y

CN2596415Y - Heat pipe type microprocessor radiator

Info

Publication number: CN2596415Y
Application number: CN 02292267
Authority: CN
Inventors: 渠志鹏; 魏崎峰; 仝爱星; 杨互助; 渠玉芝
Original assignee: New Qu Heat Conduction Technology & Development (dalian) Co Ltd
Current assignee: Dalian Sun Leader Heat Transfer Technology Co Ltd
Priority date: 2002-12-30
Filing date: 2002-12-30
Publication date: 2003-12-31
Anticipated expiration: 2012-12-30

Abstract

The utility model relates to a radiator for a heat pipe type microprocessor, which is characterized in that a heat pipe bottom plate which can be directly contacted with the surface of the microprocessor is connected with a pressing plate, and the entire outer walls of the heat pipe body which is vertical to the pressing plate are provided with heat radiating fins. The inner wall surface of the heat pipe body and the surface of the connecting part of the bottom plate and the inner cavity of the heat pipe body are attached with liquid sucking cores, and the inner part of the heat pipe body is provided with a spring matched with a copper net heat sucking core. The utility model has the advantages of fast heat conducting rate and large heat radiating power, and can solve the heat radiating problem of a large power microprocessor. The utility model also has the advantages of compact whole structure and light weight, and can satisfy the requirements of the weight and the installation space of the radiator of the microprocessor. The using angle is not limited, the utility model can be used at any angle, such as verticality, level, inversion, etc., and the heat radiating capability is not changed.

Description

Heat pipe type microprocessor heating radiator

Technical field the utility model relates to a kind of heat abstractor, particularly the heat abstractor of computer microprocessor use.

Background technology is well-known, and computer microprocessor can produce a large amount of heats in operational process, so each microprocessor all is equipped with special-purpose heating radiator, to avoid because of the bad too high phenomenon of shutting down of temperature of micro that causes of dispelling the heat.Owing to the model difference of computing machine, the kind of its heating radiator is also respectively different to some extent at present, and conventional heating radiator is made up of the metal solid heat radiator of good heat conductivity, because himself structure is limit, rate of heat transfer and heat radiation power are all lower.Therefore people design the heating radiator that heat pipe is housed again, its version also has a lot, but basic structure all is: be located at that minor diameter (below 6 millimeters) heat pipe under the pressing plate flattens one section contacts with microprocessor, and as endotherm section, another of heat pipe section is contained on the entity heating radiator, as radiating segment, though its radiating effect is better than the entity heating radiator, weak point is also arranged, promptly heating surface area is little, heat-exchange capacity is limited, and the volume that takes up room is big.Along with the develop rapidly of electronics industry, high-speed, the high-power microprocessor of a new generation constantly emerges in large numbers market, if still adopt existing heating radiator just will certainly restrict the update of microprocessor.

The summary of the invention the purpose of this utility model is to provide a kind of heat pipe type microprocessor heating radiator that can satisfy high-speed, high-power microprocessor heat radiation needs.

The utility model mainly includes heat pipe, pressing plate, heat radiator and imbibition core.Wherein heat pipe is filled with the pipe of heat-transfer working medium for closed at both ends inside, and the one end is a free end, and this free end is provided with the end cap of band vent port, and vent port promptly can be used for getting rid of the air of inside heat pipe, can be used as the passage that injects heat-transfer working medium to inside heat pipe again.The other end of heat pipe is the stiff end that links to each other with pressing plate, and this stiff end is provided with base plate, and this base plate can be circular square quincunx and polygon.This base plate as the cover plate of sealing heat pipe, as the direct heat-absorbent surface that closely contacts with the microprocessor surface, also had been the parts that pressing plate is connected with heat pipe again simultaneously both.The above-mentioned pressing plate vertical with tube body of heat pipe, itself and contacted of microprocessor are the plane, this pressing plate is provided with the bindiny mechanism corresponding with microprocessor, as draw-in groove or screw etc., by them heating radiator and microprocessor are fixed together, and guarantee that the heat pipe base plate closely contacts with the microprocessor surface.All be provided with the heat radiator that increases area of dissipation on the outer wall of the whole body of above-mentioned heat pipe, this heat radiator can be some that axially are provided with, and also can be some that radially are provided with, and can also be flight.In above-mentioned heat pipe except that filling heat-transfer working medium, also be provided with and improve rate of heat transfer increase endotherm area assurance heat pipe at the arbitrarily angled imbibition core that can both conduct heat down such as vertical-horizontal or inversion, should multiple version be arranged attached to tube body of heat pipe internal face and base plate and the lip-deep imbibition core of tube cavity connected component, it can be an even sintering copper powder layer thereon, it also can be the copper mesh that attaches thereon, this copper mesh can be one deck, also can be multilayer.For making copper mesh, in body, be provided with the spring that cooperates with it closely attached on inboard wall of tube body face and base plate and the tube cavity connected component surface.As required, the imbibition core on the internal face of a heat pipe and base plate and tube cavity connected component surface, it can be the single copper mesh or the copper powder layer of sintering, also can be the combined crosswise of copper mesh and sintered copper bisque.

The course of work of the present utility model is: with heat pipe base plate and pressing plate that high-power microprocessor surface closely contacts, the heat that microprocessor is produced conducts to heat pipe, and heat pipe conducts its heat to heat radiator set on it rapidly again.The fan that cooperates with this heating radiator then blows to heat radiator with the cold air of working environment, with the diffusing environment towards periphery of the heat on the heat radiator.

The utility model has following advantage compared to existing technology: 1, since the base plate of heat pipe as heating surface; whole body is as radiating surface; therefore heat conduction speed is fast, heat radiation power is big; can solve the heat dissipation problem of high-power microprocessor, avoid because of the bad too high phenomenon of shutting down of temperature of micro that causes of dispelling the heat.2, heat pipe is a hollow-core construction, and overall weight is light, compact conformation, effectively utilizes institute to have living space, and can satisfy the requirement of microprocessor to heatsink weight and installing space.3, inside heat pipe is provided with the imbibition core, and its use angle is not limit, and it can use down in that vertical, level or inversion etc. are arbitrarily angled, and its heat-sinking capability is constant.

Description of drawings

Fig. 1 is that the utility model master looks simplified schematic diagram.

Fig. 2 is the cross-sectional schematic of the utility model example 1 heat pipe section.

Fig. 3 is the cross-sectional schematic of the utility model example 2 heat pipe section.

Fig. 4 is the cross-sectional schematic of the utility model example 3 heat pipe section.

Fig. 5 is the cross-sectional schematic of the utility model example 4 heat pipe section.

Embodiment is looked in the simplified schematic diagram the master of heat pipe type microprocessor heating radiator shown in Figure 1, the central through hole of pressing plate 1 is enclosed within on the heat pipe 2 and with the base plate 3 of heat pipe and links to each other, the outer wall of this heat pipe is provided with 14 radially heat radiator 4, and they constitute the microprocessor heating radiator that outward appearance is turriform.In the cross-sectional schematic of heat pipe type microprocessor heating radiator example 1 heat pipe section shown in Figure 2, the heat pipe free end is provided with the end cap 5 that is welded on the body end, and this end cap middle part is provided with gas outlet 6, and the heat pipe stiff end is welded with base plate.Except that filling heat-transfer working medium, be equipped with copper mesh formula imbibition core 7 at inboard wall of tube body and base plate and tube cavity connected component surface in this heat pipe, be provided with the helical spring 8 of copper mesh on the fixing tube wall in body, the bottom is provided with the cup spring 9 of copper mesh on the fixed base plate.In the cross-sectional schematic of heat pipe type microprocessor heating radiator example 2 heat pipe section shown in Figure 3, the structure of its heat pipe and base plate is basic identical with example 1, just at inboard wall of tube body face and the even sintering of base plate and tube cavity connected component surface copper powder layer 10 is arranged.In the cross-sectional schematic of heat pipe type microprocessor heating radiator example 3 heat pipe section shown in Figure 4, the structure of its heat pipe and base plate is basic identical with example 1, just the part surface sintering has the copper powder layer in the substrate tubes, only establishes a helical spring that fixedly is attached to copper mesh imbibition core on the tube wall in the body.In the cross-sectional schematic of heat pipe type microprocessor heating radiator example 4 heat pipe section shown in Figure 5, the liquid sucting core structure of its heat pipe free end and inboard wall of tube body is basic identical with example 3, just the base plate of heat pipe is the hollow shell that is connected with tube cavity, and even sintering has the copper powder layer on the wall within it.

Claims

1, a kind of heat pipe type microprocessor heating radiator, it includes heat pipe, heat radiator and the pressing plate that inside fills heat-transfer working medium, it is characterized in that: the heat pipe base plate that can directly contact with the microprocessor surface links to each other with pressing plate, and the tube body of heat pipe vertical with pressing plate all is provided with heat radiator on its whole outer wall.

2, heat pipe type microprocessor heating radiator according to claim 1 is characterized in that: tube body of heat pipe internal face and base plate and tube cavity connected component surface are provided with the imbibition core.

3, heat pipe type microprocessor heating radiator according to claim 1 and 2 is characterized in that: be provided with the spring that cooperates with the copper mesh heat exchanger core in tube body of heat pipe.

4, heat pipe type microprocessor heating radiator according to claim 2, it is characterized in that: the inboard wall of tube body face of heat pipe and base plate and tube cavity connected component surface all are provided with copper mesh imbibition core, be provided with the helical spring of copper mesh on the fixing tube wall in body, the bottom is provided with the cup spring of fixed base plate and tube cavity connected component surface copper mesh in body.

5, heat pipe type microprocessor heating radiator according to claim 2 is characterized in that: there is the copper powder layer on the inboard wall of tube body face of heat pipe and base plate and tube cavity connected component surface evenly sintering.

6, heat pipe type microprocessor heating radiator according to claim 2, it is characterized in that: the inboard wall of tube body face of heat pipe is provided with copper mesh imbibition core, establish a fixedly helical spring of copper mesh imbibition core on the tube wall in the body, there is the copper powder layer on base plate and tube cavity connected component surface evenly sintering.

7, heat pipe type microprocessor heating radiator according to claim 2, it is characterized in that: the inboard wall of tube body face of heat pipe is provided with copper mesh imbibition core, establish a fixedly helical spring of copper mesh imbibition core on the tube wall in the body, there is the copper powder layer on hollow base plate and tube cavity connected component surface evenly sintering.