CN215986266U

CN215986266U - Quick testing arrangement of phased array AOP encapsulation antenna

Info

Publication number: CN215986266U
Application number: CN202121803191.7U
Authority: CN
Inventors: 蔣志勇; 管玉静; 李�灿
Original assignee: Beijing Tiandiyige Technology Co ltd
Current assignee: Beijing Tiandiyige Technology Co ltd
Priority date: 2021-08-04
Filing date: 2021-08-04
Publication date: 2022-03-08
Anticipated expiration: 2031-08-04

Abstract

The utility model discloses a rapid test device for a phased array AOP packaged antenna, which comprises: the active fixing component is arranged on the testing composite circuit board, the AOP packaging antenna and the probes are detachably arranged in the AOP packaging antenna fixing component, BGA solder balls of the AOP packaging antenna are contacted with the probes, and the probes penetrate through the active fixing component to be contacted with the testing composite circuit board; the AOP packaging antenna and the probe are detachably arranged in the AOP packaging antenna fixing component, BGA solder balls of the AOP packaging antenna are contacted with the probe, and the probe penetrates through the active fixing component to be contacted with the testing composite circuit board to realize an antenna testing link, so that the power supply control test and the antenna performance test of the AOP packaging antenna are realized; and the AOP packaging antenna is actively connected with the testing composite circuit board without welding, thereby effectively avoiding the damage of the AOP packaging antenna caused by reciprocating welding.

Description

Quick testing arrangement of phased array AOP encapsulation antenna

Technical Field

The utility model relates to the technical field of antenna testing, in particular to a rapid testing device for a phased array AOP packaged antenna.

Background

The phased array Antenna adopts Antenna-on-Package (AOP) as a sub-array set, and then a plurality of AOP packaged antennas are integrated on a PCB (printed circuit board) of a array surface according to a certain array arrangement sequence, so that the phased array Antenna with a certain aperture size is formed.

Before integrating a plurality of AOP packaged antennas, a single AOP packaged antenna needs to be subjected to power supply control test and antenna performance test, and meanwhile, quick replacement is needed to be realized for batch AOP packaged antenna test.

In the existing probe station test scheme and SOCKET scheme test, the test is currently applied to power supply control test or radio frequency performance test of chip pins, but is not suitable for testing the antenna radio frequency performance of the AOP packaged antenna integrated with the antenna; in the existing probe station test scheme and SOCKET scheme test, the subarray AOP packaged antenna needs to be subjected to radio frequency performance test after being welded, the antenna performance test needs to be carried out independently, and the AOP packaged antenna is easy to damage due to reciprocating welding.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problems that in the existing probe station test scheme and SOCKET scheme test, a radio frequency performance test needs to be carried out after a subarray AOP packaged antenna is welded, the antenna performance test needs to be carried out independently, and the AOP packaged antenna is easy to damage due to reciprocating welding.

The utility model is realized by the following technical scheme:

this scheme provides a quick testing arrangement of phased array AOP encapsulation antenna, includes: the device comprises an active fixing assembly, a testing composite circuit board and a plurality of probes, wherein the active fixing assembly is arranged on the testing composite circuit board, an AOP packaging antenna and the probes are detachably arranged in the AOP packaging antenna fixing assembly, BGA solder balls of the AOP packaging antenna are in contact with the probes, and the probes penetrate through the active fixing assembly to be in contact with the testing composite circuit board.

The working principle of the scheme is as follows: in the existing probe station test scheme and SOCKET scheme test, a radio frequency performance test needs to be carried out after a subarray AOP packaging antenna is welded, the antenna performance test needs to be carried out independently, the AOP packaging antenna is easily damaged by reciprocating welding and disassembling, an active fixing component is designed in the scheme, the AOP packaging antenna and a probe are detachably installed in the AOP packaging antenna fixing component, a BGA solder ball of the AOP packaging antenna is contacted with the probe, and the probe passes through the active fixing component and is contacted with a test composite circuit board to realize an antenna test link; and the AOP packaging antenna is actively connected with the testing composite circuit board without welding, so that the damage of the AOP packaging antenna caused by reciprocating welding is well avoided.

In a further preferred embodiment, the active fixation assembly comprises: the device comprises a pressing block, an upper cavity and a lower cavity, wherein the upper cavity is provided with a groove matched with the AOP packaged antenna, the bottom of the groove is provided with a stepped hole for mounting a probe, and the corresponding position of the lower cavity is also provided with the stepped hole of the probe; the pressing block presses the AOP packaged antenna into the groove of the upper cavity, the probe penetrates through the stepped holes of the upper cavity and the lower cavity to be positioned, one end of the probe is in contact with a BGA solder ball of the AOP packaged antenna, the other end of the probe is in contact with the testing composite circuit board to complete an antenna testing link, and power supply control testing and antenna performance testing of the AOP packaged antenna are achieved.

The further optimization scheme is that the upper cavity and the lower cavity are cuboids made of engineering plastics, one surface of the upper cavity with a large area is attached to one surface of the lower cavity with a large area, and a groove capable of being matched with and provided with the AOP packaging antenna is formed in the center of the other surface of the upper cavity with the large area.

A further optimization scheme is that four corners of one side of the upper cavity with the groove are provided with bosses, the pressing block is of a cuboid structure, the vertex angle of the pressing block is a notch matched with the bosses, and the bosses of the upper cavity limit the pressing block.

The upper cavity and the lower cavity are made of engineering plastics, and stepped holes for installing probes are formed in the upper cavity and the lower cavity. And after all the probes are assembled in the stepped holes, the upper cavity and the lower cavity are fixedly connected with each other by screws. The groove design of the upper cavity is beneficial to initial installation and positioning of the AOP packaged antenna.

The probe in the scheme is a probe with a spring inside and certain elasticity, and is used as a channel for supplying power, controlling signals and radio frequency signals in the test process, the top end of the probe is in contact with a BGA solder ball of an AOP packaging antenna in the test process, and the lower end of the probe is interconnected with a bonding pad of a test composite board.

The ball plunger passes through the through hole and then contacts with the pressing block, and a conical hole is formed in the position where the pressing block contacts with the ball plunger to place the ball portion of the ball plunger.

The further optimization scheme is that the ball head part of the ball head plunger is made of a telescopic material.

The further optimization scheme is that the center of the pressing block is provided with four holes to form a cross hollow structure.

The briquetting adopts engineering plastics for in impressing AOP encapsulation antenna to the recess of last cavity 2, make the BGA solder ball of AOP encapsulation antenna bottom contact with the probe top, it has 4 bell mouths simultaneously all around, and its bulb portion of bulb plunger has certain elasticity, installs in the mounting hole of four bosss of last cavity, is used for quick fixed briquetting. The cross hollow structure designed according to the radio frequency simulation result in the middle of the pressing block can not only realize the pressing of the AOP packaging antenna, but also reduce the radio frequency loss of the pressing block to the antenna radiation end.

In this scheme activity fixed subassembly, make AOP encapsulation antenna and probe contact test composite circuit board with briquetting, last cavity and lower cavity and special structure thereof, avoid conventional other metal material mountings through structural design, reduce testing arrangement to the influence of test, and the briquetting adopts the bulb plunger to come to carry out the structural style of fixing to it, not only can increase of service life, simple structure, the production of being convenient for.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

1. the utility model provides a fast testing device for a phased array AOP packaged antenna, which is characterized in that an active fixing component is designed, an AOP packaged antenna and a probe are detachably arranged in the AOP packaged antenna fixing component, BGA solder balls of the AOP packaged antenna are contacted with the probe, and the probe penetrates through the active fixing component to be contacted with a testing composite circuit board to realize an antenna testing link; the AOP packaging antenna is actively connected with the testing composite circuit board, welding is not needed, and damage of the AOP packaging antenna caused by reciprocating welding is well avoided;

2. according to the rapid test device for the phased array AOP packaged antenna, the press block, the upper cavity, the lower cavity and the special structure of the press block are used for enabling the AOP packaged antenna and the probe to be in contact with the test composite circuit board, the influence of the test device on the test is reduced by avoiding conventional fixing parts made of other metal materials through the structural design, and the press block is fixed by the ball plunger, so that the service life is prolonged, the structure is simple, and the production is convenient.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the utility model and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the utility model and together with the description serve to explain the principles of the utility model. In the drawings:

FIG. 1 is a schematic diagram of a phased array antenna configuration;

FIG. 2 is a schematic diagram of a front side of a single AOP packaged antenna structure;

FIG. 3 is a schematic diagram of a reverse side of a single AOP packaged antenna structure;

FIG. 4 is a schematic structural diagram of a fast testing apparatus for a phased array AOP packaged antenna according to the present invention;

FIG. 5 is a schematic structural diagram of an antenna rapid test apparatus for phased array AOP package according to embodiment 1;

FIG. 6 is a schematic structural diagram of an AOP packaged antenna rapid test device completed in the embodiment 2;

FIG. 7 is a schematic top view of an AOP packaged antenna mounted in a recessed structure;

FIG. 8 is a schematic top view of a compact configuration;

fig. 9 is a schematic cross-sectional view of an AOP packaged antenna mounted on an active mounting assembly.

Reference numbers and corresponding part names in the drawings:

1-pressing block, 11-cross wall, 2-upper cavity, 21-groove, 22-boss, 220-through hole, 3-ball plunger, 4-lower cavity, 5-probe, 6-AOP packaging antenna, 61-chip, 62-BGA solder ball, 7-active fixing component, 8-testing composite circuit board and 9-stepped hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.

As shown in fig. 1-3, the phased array Antenna uses Antenna-on-Package (AOP) antennas as a sub-array set, and then a plurality of AOP packaged antennas are integrated on a PCB according to a certain array arrangement order, so as to form a phased array Antenna with a certain aperture size.

Example 1

As shown in fig. 4-5, this embodiment 1 provides a fast testing apparatus for phased array AOP packaged antenna

A phased array AOP encapsulates quick testing arrangement of antenna, includes: the fixed subassembly 7 of activity, test composite circuit board 8 and a plurality of probe 5, the fixed subassembly 7 of activity is installed on test composite circuit board 8, and AOP encapsulation antenna and probe 5 demountable installation are in the fixed subassembly 7 of activity, AOP encapsulation antenna 6's BGA solder ball 62 and probe 5 contact, and probe 5 passes the fixed subassembly 7 of activity and contacts with test composite circuit board 8.

The active fixation assembly comprises: the antenna comprises a pressing block 1, an upper cavity 2 and a lower cavity 4, wherein the upper cavity 2 is provided with a groove 21 matched with the AOP packaged antenna, the bottom of the groove 21 is provided with a stepped hole 9 for installing a probe, and the position corresponding to the lower cavity 4 is also provided with a stepped hole of the probe; the pressing block 1 presses the AOP packaging antenna into the groove 21 of the upper cavity 2, the probe 5 penetrates through stepped holes of the upper cavity 2 and the lower cavity 4 to be positioned, one end of the probe 5 is in contact with a BGA solder ball of the AOP packaging antenna, and the other end of the probe 5 is in contact with the testing composite circuit board. As shown in fig. 9, the stepped hole 9 has a diameter that increases from top to bottom when it is in the upper chamber 2, and has a diameter that decreases from top to bottom when it is in the lower chamber 4, and the contact positions of the upper chamber 2 and the lower chamber 4 have the same diameter, and the configuration of the stepped hole 9 is designed according to the configuration of the probe 5, and when the configuration of the probe 5 is changed, the configuration of the stepped hole 9 is changed accordingly.

As shown in fig. 7, the upper cavity 2 is provided with a groove 21 matched with the AOP packaged antenna, and four corners of the groove 21 are provided with small semicircular grooves to prevent the mounting interference of the AOP packaged antenna 6. After the AOP packaging antenna 6 is installed in the groove 21, the gap between the AOP packaging antenna 6 and the periphery of the groove 21 is 0.1 mm.

And a lower chamber 4

Go up cavity 2 and cavity 4 and be the cuboid that engineering plastics made, go up the one side laminating of cavity 2 and cavity 4 great area down, go up cavity 2 great area another side center of cavity and offer the recess 21 that can match and install AOP encapsulation antenna.

Go up four angles departments of one side that cavity 2 has the recess and all set up boss 22, briquetting 1 is the cuboid structure, and the apex angle of briquetting 1 sets up to the breach that matches with boss 22, goes up cavity 2's boss 22 and carries on spacingly to briquetting 1.

The ball plunger 3 is further included, a through hole is formed in the boss 22, the ball plunger 3 contacts the pressing block 1 after penetrating through the through hole, and the conical hole 11 is formed in the position, contacting with the ball plunger 3, of the pressing block 1 so as to place the ball part of the ball plunger 3.

The bulb part of the bulb plunger 3 is made of a telescopic material.

As shown in fig. 8, the center of the pressing block 1 is provided with four holes to form a cross hollow structure, so that the radio frequency loss of the pressing block to the antenna radiation end is reduced; the size of the AOP packaged antenna 6 in this embodiment is: 10mm, the cross-shaped hollow structure is designed according to the radio frequency simulation result, the thickness of the cross-shaped wall 11 is 0.5mm, and the height is 4 mm; the tool size of the whole AOP packaged antenna rapid testing device is as follows: 25mm 20mm 10.8 mm.

Example 2

The phased array AOP packaging antenna rapid testing device based on the previous embodiment carries out the following testing steps:

step 1: and assembling the upper cavity 2, the ball plunger 3, the probe 5 and the lower cavity 4 together to obtain an active fixing component 7, and fixing the active fixing component 7 on the testing composite circuit board 8, so that the lower end of the probe 5 is in contact with a pad on the testing composite circuit board 8.

Step 2: the AOP package antenna 6 is placed into the recess 21 of the upper cavity 2 from the upper end.

And step 3: the pressing block 1 is placed between the bosses 22 of the upper cavity 2 from top to bottom, so that the top-telescopic ball head part is retracted inwards after the ball plunger 3 is pressed, and when the tapered hole 11 of the pressing block 1 moves downwards to be in contact with the ball plunger 3, the ball head of the ball plunger 3 rebounds, so that the pressing block 1 is pressed to prevent the pressing block from loosening, as shown in fig. 6.

At the moment, in the antenna test link, the power supply control test and the antenna performance test of the AOP packaged antenna can be realized.

When the next AOP packaged antenna needs to be tested, the two ends of the pressing block 1 are clamped and lifted upwards, and the pressing block 1 can be detached. Taking out the AOP packaged antenna; and (5) repeating the step (2) and the step (3).

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A quick testing arrangement of phased array AOP encapsulation antenna which characterized in that includes: the device comprises an active fixing assembly (7), a testing composite circuit board (8) and a plurality of probes (5), wherein the active fixing assembly (7) is arranged on the testing composite circuit board (8), an AOP packaging antenna (6) and the probes (5) are detachably arranged in the active fixing assembly (7), BGA solder balls of the AOP packaging antenna (6) are contacted with the probes (5), and the probes (5) penetrate through the active fixing assembly (7) to be contacted with the testing composite circuit board (8).

2. A phased array AOP package antenna fast test device according to claim 1, characterized in that the active fixture assembly (7) comprises: the device comprises a pressing block (1), an upper cavity (2) and a lower cavity (4), wherein the upper cavity (2) is provided with a groove (21) matched with an AOP packaging antenna (6), the bottom of the groove (21) is provided with a stepped hole for installing a probe, and the lower cavity (4) is also provided with a stepped hole for the probe at a corresponding position; briquetting (1) compresses tightly AOP encapsulation antenna (6) in recess (21) of last cavity (2), and probe (5) are passed the shoulder hole of last cavity (2) and lower cavity (4) and are positioned, and probe (5) one end contacts with the BGA solder ball of AOP encapsulation antenna (6), and probe (5) other end contacts with test composite circuit board (8).

3. The device for rapidly testing the phased array AOP packaged antenna according to claim 2, wherein the upper cavity (2) and the lower cavity (4) are cuboids made of engineering plastics, one surface of the upper cavity (2) with a larger area is attached to one surface of the lower cavity (4) with a larger area, and a groove (21) capable of being matched with and provided with the AOP packaged antenna (6) is formed in the center of the other surface of the upper cavity (2) with a larger area.

4. The phased array AOP packaged antenna rapid testing device according to claim 3, wherein bosses (22) are arranged at four corners of one surface of the upper cavity (2) with the groove, the pressing block (1) is of a cuboid structure, the vertex angle of the pressing block (1) is a notch matched with the bosses (22), and the bosses (22) of the upper cavity (2) limit the pressing block (1).

5. The phased array AOP packaged antenna rapid testing device according to claim 4, further comprising a ball plunger (3), wherein a through hole (220) is formed in the boss (22), the ball plunger (3) contacts the pressing block (1) after passing through the through hole (220), and a taper hole (11) is formed in the position where the pressing block (1) contacts the ball plunger (3) to place the ball part of the ball plunger (3).

6. The phased array AOP packaged antenna rapid test device according to claim 5, wherein the ball head part of the ball plunger (3) is made of a flexible material.

7. The phased array AOP packaged antenna rapid test device according to claim 4, wherein four holes are formed in the center of the pressing block (1) to form a cross-shaped hollow structure.