CN101487874B - High-speed test device - Google Patents
High-speed test device Download PDFInfo
- Publication number
- CN101487874B CN101487874B CN2008100031729A CN200810003172A CN101487874B CN 101487874 B CN101487874 B CN 101487874B CN 2008100031729 A CN2008100031729 A CN 2008100031729A CN 200810003172 A CN200810003172 A CN 200810003172A CN 101487874 B CN101487874 B CN 101487874B
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- probe
- support portion
- card extender
- speed test
- test device
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a high-speed test device, which is used for transmitting a test signal sent out by a test machine to electrically test an integrated circuit chip. A circuit layer and a probe set are arranged on and below a support frame respectively. When a lower pressure point of the test machine is contacted with the circuit layer and a corresponding point of the probe set is contacted with an electronic component on the chip, the support frame bears stress on upside and underside.
Description
Technical field
The present invention relates to proving installation, be meant a kind of high-speed test device that is used for testing integrated circuit chip especially.
Background technology
In the IC chip test, probe circuit board in order to transmitted test signal is to supply the measuring head point of tester table to touch, with the test signal of acceptance test board and be sent on the probe of the nearly intensive setting in place, center in circuit board below, behind the chip electronic package acceptance test signal that each probe corresponding point is touched, then by probe return pairing electrical specification to tester table for analysis, so in entire chip level test process, the circuit transmission design of probe circuit board occupies very significant effects to the test result of electronic package, especially along with electronics technology tend towards superiority more speed running, test process need operate in the working at high speed condition of actual correspondence, so the making of transmission line more need meet the operating conditions of high speed signal.
With " low current measures the semiconductor probe card of usefulness " that Figure 1 shows that United States Patent (USP) is provided for No. 5808475, this probe 1 structural area is divided into the contact plate 10 of top, the probe card 12 of below and several middle interval materials 14, wherein, contact circuit plate 10 is provided with the test contacts 11 as coaxial transmission line structure, can avoid contact circuit plate 10 dead resistances that media environment produced own to cause leakage problem, yet because contact plate 10 touches for directly supplying the measuring head point of tester table 1 ', probe card 12 is for being provided with being provided with probe 13, if contact plate 10 or probe card 12 itself do not have enough support strengths and certain rigid body thickness, when tester table 1 ' presses down and imposes stress and desires in whole probe card 1 structure, contact plate 10 then makes contact plate 10 or probe card 12 produce the problem of deformation with the plane of constraint of probe card 12 easily because of local pressure is unequal, moreover when 13 of each probes touch the chip plane, probe card 12 front ends then need constantly bear the reacting force that produces from the chip plane separately, under the stress, probe card 12 front ends also are easy to generate deformation in order to the planar structure that probe 13 is set so for a long time.
Even if can be illustrated in figure 2 as another probe 2 structures commonly used, its signals transmission for via the circuit of being laid on the multilayer board 20 21 from outside to inside and extension from top to bottom wear stacking circuit board 20, send by probe 22 then, so the overall construction intensity plane of constraint single with it of circuit board 20 can on average disperse this acting force when meeting with stresses, and the problem of the unequal deformation that produces of unlikely generation local pressure; Yet multilayer board 20 is to form with compound glass fiber material or the pressing of ceramic material institute, be laid with metal wire rod on each layer structure to form lead 21 structures, so not only need expend suitable cost and man-hour on making, and when transmission line 21 is laid in circuit board inside, the as easy as rolling off a log main cause that causes leakage current of circuit board 20 materials between adjacent lines 21 is laid, add the energy dissipation that interface reflection takes place when the via circuit 210 that is worn because of circuit board 10 each layer structure easily makes signal vertically transmit, so all have a strong impact on the transport property of high-frequency signal, and can't meet the high speed test demand of electric circuitry packages.
Summary of the invention
Therefore, fundamental purpose of the present invention is to be to provide a kind of high-speed test device, has high-level efficiency and low-cost manufacturing process, and can make high-frequency test keep the high quality transmission characteristic.
For reaching aforementioned purpose, technical solution of the present invention provides a kind of high-speed test device and has a bracing frame, a circuit layer, a probe groups and a plurality of signal wire, this bracing frame is the rigid body with suitable intensity, be that first support portion with its outer ring is provided with this circuit layer, second support portion with its inner ring is provided with this probe groups, and by this signal wire respectively with this circuit layer with and the probe of probe groups electrically connect.
Therefore, the invention has the advantages that: when tester table when pressure point touches this circuit layer under this high-speed test device upside, promptly bear the stress that pressure point touches under this by this first support portion, and when the probe corresponding point of downside are touched electronic package on chip, promptly bear reacting force from chip by this second support portion, can reduce as the numerous and diverse manufacture craft of multilayer board commonly used, more can be applied to fix circuit layer and probe groups structure that all can equivalence transmit signal with the single structure of a large amount of these bracing frames of making, effectively shorten the making duration of whole testing device.
Description of drawings
Fig. 1 is the structural representation of No. 5808475 probe that provides of United States Patent (USP);
Fig. 2 is the structural representation of a cantalever type probe card commonly used;
Fig. 3 is the exploded perspective synoptic diagram of first preferred embodiment provided by the present invention;
Fig. 4 is the elevated bottom perspective synoptic diagram of above-mentioned first preferred embodiment;
Fig. 5 is the structural representation of above-mentioned first preferred embodiment;
Fig. 6 is the elevated bottom perspective synoptic diagram of above-mentioned first this bracing frame that preferred embodiment provides;
Fig. 7 is the combination top view of above-mentioned first part-structure that preferred embodiment provides, for be provided with the unitized construction synoptic diagram of circuit layer, signal wire and probe groups in this bracing frame;
Fig. 8 is the backplan for unitized construction shown in Figure 7;
Fig. 9 is the exploded perspective synoptic diagram of second preferred embodiment provided by the present invention;
Figure 10 is the structural representation of above-mentioned second preferred embodiment;
Figure 11 is the exploded perspective synoptic diagram of the 3rd preferred embodiment provided by the present invention;
Figure 12 is the elevated bottom perspective synoptic diagram of above-mentioned the 3rd preferred embodiment;
Figure 13 is the structural representation of above-mentioned the 3rd preferred embodiment.
The primary clustering symbol description
" first embodiment "
3 high-speed test devices
301 loam cakes, 302 lower covers
30 bracing frames, 31 first support portions
312 perforation of 311 inside casings
32 second support portions, 321 housings
322 ribs, 33 spaces
40 circuit layers, 41 test contacts
50 cantalever type probe groups, 51 card extenders
510 solder joints, 511 electronic packages
52 probe bases, 53 set collars
54 cantalever type probes, 60 signal wires
" second embodiment "
4 high-speed test devices
70 long-pending body probe groups 71 card extenders
710 leads, 72 mems probe devices
720 probe bases, 721 perforations
722 cantalever type probes
" the 3rd embodiment "
5 high-speed test devices
501 loam cakes, 502 lower covers
45 circuit layers, 65 signal wires
80 bracing frames, 81 first support portions
82 second support portions, 90 vertical probe groups
92 times guide plates of guide plate on 91
93 positioning seats, 94 vertical probes
Embodiment
Below, cooperate diagram to enumerate some preferred embodiments now, in order to structure of the present invention and effect are elaborated, wherein used illustrated brief description is as follows:
Fig. 3 is the exploded perspective synoptic diagram of first preferred embodiment provided by the present invention;
Fig. 4 is the elevated bottom perspective synoptic diagram of above-mentioned first preferred embodiment;
Fig. 5 is the structural representation of above-mentioned first preferred embodiment;
Fig. 6 is the elevated bottom perspective synoptic diagram of above-mentioned first this bracing frame that preferred embodiment provides;
Fig. 7 is the combination top view of above-mentioned first part-structure that preferred embodiment provides, for be provided with the unitized construction synoptic diagram of circuit layer, signal wire and probe groups in this bracing frame;
Fig. 8 is the backplan for unitized construction shown in Figure 7;
Fig. 9 is the exploded perspective synoptic diagram of second preferred embodiment provided by the present invention;
Figure 10 is the structural representation of above-mentioned second preferred embodiment;
Figure 11 is the exploded perspective synoptic diagram of the 3rd preferred embodiment provided by the present invention;
Figure 12 is the elevated bottom perspective synoptic diagram of above-mentioned the 3rd preferred embodiment;
Figure 13 is the structural representation of above-mentioned the 3rd preferred embodiment.
See also as Fig. 3 to shown in Figure 5, a high-speed test device 3 that is provided for the present invention's first preferred embodiment, can divide into upper and lower relative two side 3a, 3b, upside 3a is in order to connect with tester table, touch for tester table pressure point under the top, downside 3b is in order to contact with the circuit under test assembly of integrated circuit (IC) chip, the test signal that tester table is sent is passed to integrated circuit (IC) chip from top to bottom to do testing electrical property, this high-speed test device 3 includes a bracing frame 30, a circuit layer 40, a cantalever type probe group 50 and a plurality of signal wire 60, wherein:
Please cooperate Fig. 3 and Fig. 6 reference, this bracing frame 30 is for being equivalent to general semiconductor chip size specification, the rigid structure that has suitable intensity with stainless steel or metal material etc. is made, it on the thickness structure that is equivalent to multilayer board commonly used, can bear this high-speed test device 3 suffered stress in test operating procedure, and can not change its rigid body flatness so unlikely generation deformation, present embodiment provides in this bracing frame 30 is divided into, the two-piece type rigid structure of outer ring, be respectively one first support portion 31 of outer ring and one second support portion 32 of inner ring, this first support portion 31 is a ring texture, lateral cross section sizableness with this circuit layer 40, be provided with being provided with this circuit layer 40 and support the stress that this circuit layer 40 is born, this first support portion 31 has an inside casing 311, and be equipped with several perforation 312 and wear for those signal wires 60, this second support portion 32 is the ring-type framework, have a housing 321 and a plurality ofly be radially-arranged rib 322, the inside casing 311 of this housing 321 and this first support portion 31 interlocking is mutually established and is protruding with suitable height than the bottom of this first support portion 31, make between this first support portion 31 and second support portion 32 and be formed with a plurality of spaces 33, extend through those spaces 33 from these bracing frame 30 outer rings so that these bracing frame 30 inner rings for those signal wires 60, those ribs 322 are and these housing 321 conplane radially extensions, can provide more high-intensity support so that this probe groups 50 to be set, on average bear the suffered stress of this probe groups 50, then can pass between those ribs 322, those signal wires 60 are connected with this probe groups 50 for those signal wires 60.
Please cooperate Fig. 3, Fig. 5 and Fig. 7 reference, the simple layer printed circuit board arrangement of this circuit layer 40 for having the good insulation characteristic, be located at the upside 3a that these 31 tops, first support portion are positioned at this high-speed test device 3, this circuit layer 40 is provided with a plurality of test contacts 41, touch with the acceptance test signal for above-mentioned tester table point, vertically conducting to these circuit layer 40 belows are provided with electrically connecting respectively this signal wire 60, therefore transmit test signal to those signal wires 60.
Please cooperate Fig. 3, Fig. 5 and Fig. 8 reference, this probe groups 50 has a card extender 51, one probe base, 52 1 set collars 53 and a plurality of cantalever type probe 54, the single-layer printed circuit board structure of this card extender 51 for having the good insulation characteristic, be located at the downside 3b that these 32 belows, second support portion are positioned at this high-speed test device 3, on this card extender 51, following both sides are provided with a plurality of solder joints 510, and upside is provided with several electronic packages 511 and electrically connects this solder joint 510, those solder joints 510 are on card extender 51, following both sides are provided with welding this signal wire 60 and probe 54 respectively and can make mutually and vertically electrically conduct, maybe can the test signal of this signal wire 60 be handled the back by this electronic package 511 supplies to electrically connect with corresponding probe 54, this probe base 52 is located at the nearly centre of this card extender 51, for the material with good insulation and antiknock quality made, this set collar 53 is located at this probe base 52, for the insulation material with good tackness made, the body portion of those probes 54 is fixedly arranged on this probe base 52 by this set collar 53, makes the needle point position of those probes 54 be convexly set in this set collar 53 belows.
Please cooperate Fig. 3 to Fig. 5 reference, after this bracing frame 30 is assembled with this circuit layer 40 and probe groups 50, then lock respectively and establish a upper and lower cover 301,302 in both sides, these loam cake 301 frames are established the inside casing 311 of this first support portion 31, these lower cover 302 rings are established this card extender 51, therefore those signal wires 60 are sealed in this high-speed test device 3 inside, have attractive in appearance and prevent that foreign matter from forming the function of polluting in inside, can guarantee the structure packing quality of this high-speed test device 3.
Therefore, this high-speed test device 3 provided by the present invention is the rigid structures that utilize this bracing frame 30, support this circuit layer 40 and this second support portion 32 these probe groups 50 of support by this first support portion 31, so when tester table when pressure point touches the test contacts 41 of this circuit layer 40 under the upside 3a of this high-speed test device 3, promptly bear the stress that pressure point touches under this by this first support portion 31, and when those probe 54 corresponding point of downside 3b are touched electronic package on chip, promptly bear reacting force from chip by this second support portion 32, not only reduced as the numerous and diverse manufacture craft of multilayer board commonly used, more, effectively shortened the making duration of whole testing device because of being applied to fix circuit layer and the probe groups structure that all can equivalence transmit signal with the single structure of this bracing frame 30 of a large amount of making; Moreover, because this circuit layer 40 and card extender 51 are all the good insulation material-structure of single bed thickness, so only be extremely short path when signal runs through this circuit layer 40 with card extender 51, efficiently solve test signal leakage current effects between the adjacent transmission signals when in dielectric material, transmitting, and vertically run through on the path and need not pass through inter-level dielectric, therefore unlikely generation as the through-hole construction face of multilayer board commonly used in the energy dissipation problem of inter-level dielectric, make this high-speed test device 3 keep the good signal impedance matching property, have low-loss in order to the high-frequency test process, mate good high-frequency signal transmission quality.
What deserves to be mentioned is, high-speed test device provided by the present invention except as the applied cantalever type probe structure of above-mentioned embodiment, also can and Figure 10 shows that a high-speed test device 4 of second preferred embodiment provided by the present invention as Fig. 9, be to have this bracing frame 30, circuit layer 40, those signal wires 60 and a long-pending body probe groups 70, should amass 32 belows, second support portion that body probe groups 70 is located at this bracing frame 30 equally, be a little to touch the structure of probe for manufacturing of chip electronic package with above-mentioned first preferred embodiment supplier's of institute difference with microcomputer electrodeposition body technology, wherein:
Should long-pending body probe groups 70 be the long-pending body assembling structure of a card extender 71 and a mems probe device 72, this card extender 71 is to have the circuit space translation function, for with organic (the Multi-Layered Organic of the general multilayer of tool good insulation characteristic, MLO) structure or multi-layer ceramics (Multi-Layered Ceramic, MLC) the made space convertor of structure, in the middle of be laid with plurality of wires 710, those leads 710 are for phasing down the structure that is provided with of its adjacent spacing from top to bottom, therefore can distinguish corresponding respectively this signal wire 60 that electrically connects in last, with the mems probe device 72 of those signal wire 60 vertical conductings to the below; This mems probe device 72 is that the structure dress mode of therefore being somebody's turn to do long-pending body probe groups 70 is each lead 710 that those perforations 721 is electrically connected this card extender 71 respectively with a plurality of perforations 721 of long-pending body technology tool electric conductivity on the formed probe base 720 of insulated substrate and a corresponding respectively cantalever type probe 722.
So after the test signal that these circuit layer 40 acceptance test boards are transmitted, those signal wires 60 promptly transmit test signal to the lead 710 of this card extender 71 so that the probe 722 of this mems probe device 72, therefore this high-speed test device 4 more can be applied to measure the more chip electronic package of fine pitch except having being equal to the effect of the foregoing description by the fine pitch of this mems probe device 72.
Certainly, high-speed test device provided by the present invention is except as the applied cantalever type probe structure of the various embodiments described above, also can be as Figure 11 to a high-speed test device 5 that Figure 13 shows that the 3rd preferred embodiment provided by the present invention, application for the vertical probe structure, include a circuit layer 45, one bracing frame 80, a plurality of signal wires 65, on one, lower cover 501,502 and one vertical probe group 90, this bracing frame 80 that similar the foregoing description provided is for having one first support portion 81 of outer ring and one second support portion 82 of inner ring, be provided with being provided with this circuit layer 45 and this probe groups 90 respectively, be with the supplier's of the foregoing description institute difference:
The probe base that this vertical probe group 90 is made up of a upper and lower guide plate 91,92 and a positioning seat 93 is with fixing a plurality of vertical probes 94, should go up 82 belows, second support portion that guide plate 91 is fixed in this bracing frame 80, make that those vertical probes 94 can this signal wire 65 be affixed respectively with respectively, it is made that this upper and lower guide plate 91,92 and positioning seat 93 are all the material with good insulation and antiknock quality, vertically wear an end that makes probe 94 for this probe 94 respectively and electrically connect this signal wire 65, other end needle point position is suspended at this time guide plate 92 belows.
So this high-speed test device 5 provided by the present invention is similarly the rigid structure that utilizes this bracing frame 80, support this circuit layer 45 in the top, in this probe groups 90 of supported underneath, effectively bear 94 stress source that directly receive of this circuit layer 45 and those probes, and because this vertical probe group 90 is direct and the mode of those signal wires 65 electric connections, after the test signal that these circuit layer 45 acceptance test boards are transmitted, promptly directly be passed to respectively this probe 94, the setting that can save additional circuit exchanging structure between signal wire 65 and the probe 94 by those signal wires 65.
The above only is a preferable possible embodiments of the present invention, changes so use the equivalent structure that instructions of the present invention and claim do such as, ought to be included in the protection domain of claim of the present invention.
Claims (12)
1. high-speed test device, distinguishing has upper and lower relative both sides, and upside is in order to electrically connect tester table, downside is in order to electrically connect integrated circuit (IC) chip, with the test signal that the transmission tester table is sent integrated circuit (IC) chip is done testing electrical property, it is characterized in that, include:
One bracing frame for having the rigid body of suitable intensity, and has one first and one second support portion, this second support portion be this first support portion institute around;
One circuit layer is located at this first support portion and is positioned at this bracing frame upside, and this circuit layer has a plurality of test contacts, electrically connects for above-mentioned tester table;
One probe groups, be located at this second support portion and be positioned at this bracing frame downside, have a probe base and a plurality of probe, this probe base is made by the material that the good insulation characteristic is arranged, those probe stationary are on this probe base, and respectively the needle point of this probe is provided with a little touching the said integrated circuit chip for being suspended at this probe base downside;
A plurality of signal wires, respectively the two ends of this signal wire electrically connect the probe of test contacts and this probe groups of this circuit layer respectively; And,
This first support portion has an inside casing, this second support portion has a housing and a plurality ofly is radially-arranged rib, the inside casing of the housing of this second support portion and this first support portion interlocking is mutually established and is protruded than the bottom of this first support portion, make between this first support portion and this second support portion to be formed with a plurality of spaces, extend through described a plurality of space from this bracing frame outer ring so that this bracing frame inner ring for described a plurality of signal wires.
2. according to the described high-speed test device of claim 1, it is characterized in that described first support portion is a ring texture.
3. according to the described high-speed test device of claim 2, it is characterized in that described first support portion is equipped with a plurality of perforation, the test contacts that those signal wires pass those perforation and this circuit layer electrically connects.
4. according to the described high-speed test device of claim 1, it is characterized in that the corresponding test contacts with this circuit layer in this circuit layer downside of described a plurality of signal wires electrically connects.
5. according to the described high-speed test device of claim 4, it is characterized in that described circuit layer is the simple layer printed circuit board arrangement with good insulation characteristic.
6. according to the described high-speed test device of claim 1, it is characterized in that described probe groups also has a card extender, be located at the second support portion downside of this bracing frame, this probe base is fixed in this card extender, and those probes are corresponding on this card extender to be electrically connected with those signal wires.
7. according to the described high-speed test device of claim 6, it is characterized in that, described card extender is the single-layer printed circuit board structure with good insulation characteristic, those signal wires are welded in this card extender upside, those probes are welded in this card extender downside, the respectively probe of this signal wire and corresponding electric connection vertically conducting in this card extender.
8. according to the described high-speed test device of claim 6, it is characterized in that described card extender is provided with at least one electronic package, electrically connect this signal wire and probe.
9. according to the described high-speed test device of claim 6, it is characterized in that, described card extender is that to have the material of good insulation characteristic made, in the middle of be laid with plurality of wires, extend to the downside of this card extender from the upside of this card extender, and phase down its adjacent spacing from top to bottom, those signal wires electrically connect respectively this lead respectively in this card extender upside, and those probes electrically connect respectively this lead respectively in this card extender downside.
10. according to the described high-speed test device of claim 9, it is characterized in that it is one made that described card extender is that multilayer organic structure or multilayer ceramic structure are selected.
11. according to claim 1 or 9 described high-speed test devices, it is characterized in that, described a plurality of probe is for being formed on the cantalever type probe on this probe base with microcomputer electrodeposition body technology, this probe base provides the perforation of a plurality of tool electric conductivity, respectively corresponding respectively this signal wire and the probe of electrically connecting in the upper and lower both sides of this perforation.
12., it is characterized in that described respectively this probe wears this probe base from top to bottom according to claim 1,6 or 9 described high-speed test devices, two ends electrically connect this signal wire respectively and are suspended at this probe base downside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100031729A CN101487874B (en) | 2008-01-15 | 2008-01-15 | High-speed test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100031729A CN101487874B (en) | 2008-01-15 | 2008-01-15 | High-speed test device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101487874A CN101487874A (en) | 2009-07-22 |
| CN101487874B true CN101487874B (en) | 2011-07-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100031729A Expired - Fee Related CN101487874B (en) | 2008-01-15 | 2008-01-15 | High-speed test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101487874B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011043377A (en) * | 2009-08-20 | 2011-03-03 | Tokyo Electron Ltd | Contact structure for inspection |
| TW201623976A (en) * | 2014-12-24 | 2016-07-01 | Mpi Corp | Vertical probe device with positioning plates |
| IT201700046645A1 (en) * | 2017-04-28 | 2018-10-28 | Technoprobe Spa | Measurement board for a test device of electronic devices |
| JP2020009978A (en) * | 2018-07-12 | 2020-01-16 | 東京エレクトロン株式会社 | Circuit device, tester, inspection device, and method for adjusting warpage of circuit board |
| CN109521386B (en) * | 2018-12-10 | 2021-01-29 | 中国海洋石油集团有限公司 | Insulating panel and low-resistance signal generating device |
| CN111721979B (en) * | 2019-03-18 | 2023-05-23 | 台湾中华精测科技股份有限公司 | Probe card testing device and signal switching module thereof |
| CN115825835B (en) * | 2023-02-09 | 2023-05-23 | 苏州联讯仪器股份有限公司 | Low leakage current calibration system |
-
2008
- 2008-01-15 CN CN2008100031729A patent/CN101487874B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN101487874A (en) | 2009-07-22 |
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