CN206413261U - Circuit board assemblies and the terminal with it - Google Patents
Circuit board assemblies and the terminal with it Download PDFInfo
- Publication number
- CN206413261U CN206413261U CN201720097736.4U CN201720097736U CN206413261U CN 206413261 U CN206413261 U CN 206413261U CN 201720097736 U CN201720097736 U CN 201720097736U CN 206413261 U CN206413261 U CN 206413261U
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- Prior art keywords
- plate body
- circuit board
- bare crystalline
- board assemblies
- groove
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- 230000000712 assembly Effects 0.000 title claims abstract description 34
- 238000000429 assembly Methods 0.000 title claims abstract description 34
- 238000012360 testing method Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model discloses a kind of circuit board assemblies and the terminal with it, circuit board assemblies include：First plate body, the second plate body and bare crystalline chip.Second plate body is stacked with the first plate body, and the second plate body is electrically connected with the first plate body, and the surface away from the first plate body of the second plate body is provided with groove；Bare crystalline chip is located in groove, and bare crystalline chip is electrically connected with the second plate body.According to circuit board assemblies of the present utility model; by setting the second plate body on the first plate body; and groove is set on the second plate body; so that bare crystalline chip is assembled in groove, thus, it is possible to prevent in maintenance, test other elements or progress SMT pasters on circuit boards; touch bare crystalline chip; so as to effectively protect bare crystalline chip, the service life of bare crystalline chip is extended, the reliability of circuit board assemblies is improved.
Description
Technical field
The utility model is related to technical field of electronic products, more particularly, to a kind of circuit board and the terminal with it.
Background technology
In correlation technique, with the fast development of electronic product, the fuselage of electronic product is intended to thin, light and handyization so that
Space layout inside electronic product is more and more compacter.The ultra-thin and densification trend of electronic product so that the bare crystalline used
Chip is more and more.However, bare crystalline chip is chip source crystalline substance encapsulation, shell do not have Plastic Package, be stressed when hold very much
It is fragile.Bare crystalline chip is typically directly welded on circuit board (i.e. pcb board), and in SMT, (SMT is " Surface Mount
Technology " abbreviation, Chinese is surface mounting technology) paster, test, maintenance when be easy to touch bare crystalline core
Piece, causes bare crystalline wafer damage, shortens the service life of bare crystalline chip, reduces the reliability of circuit board and electronic product.
Utility model content
The utility model is intended at least solve one of technical problem in correlation technique to a certain extent.Therefore, this reality
With a kind of circuit board assemblies of new proposition, the reliability of the circuit board assemblies is high, and service life is long.
Another purpose of the present utility model is to propose a kind of mobile terminal with foregoing circuit board component.
According to the circuit board assemblies of the utility model first aspect, including：First plate body；Second plate body, second plate
Body is stacked with first plate body, and second plate body is electrically connected with first plate body, second plate body it is remote
Surface from first plate body is provided with groove；Bare crystalline chip, the bare crystalline chip is located in the groove, the bare crystalline core
Piece is electrically connected with second plate body.
According to circuit board assemblies of the present utility model, by setting the second plate body on the first plate body, and in the second plate body
Upper setting groove, by the assembling of bare crystalline chip in groove, thus, it is possible to prevent in maintenance, test other elements or in electricity
When carrying out SMT pasters on the plate of road, bare crystalline chip is touched, so as to effectively protect bare crystalline chip, bare crystalline chip is extended
Service life, improve the reliability of circuit board assemblies.
In addition, can also have technical characteristic additional as follows according to circuit board assemblies of the present utility model：
According to some embodiments of the present utility model, the depth of the groove is H, and the height of the bare crystalline chip is h, institute
State H, h satisfaction：H≥h.
Alternatively, the height h of the depth H of the groove and the bare crystalline chip is further met：H-h≥0.1mm.
Alternatively, the groove is square groove.
According to some embodiments of the present utility model, second plate body is provided with multiple first pads and multiple second welderings
Disk, multiple first pads are corresponded with multiple second pads, and each first pad with it is corresponding described in
Second pad is electrically connected, and first plate body is electrically connected with first pad, the pin of the bare crystalline chip and corresponding institute
State the electrical connection of the second pad.
Specifically, second pad is located in the inner bottom wall of the groove.
Alternatively, second plate body is single sided board or multi-layer sheet.
According to some embodiments of the present utility model, second plate body is multiple for what is be spaced apart.
Alternatively, the bare crystalline chip is bga chip.
According to the terminal of the utility model second aspect, including according to the circuit board group of the above-mentioned first aspect of the utility model
Part.
Additional aspect and advantage of the present utility model will be set forth in part in the description, partly by from following description
In become obvious, or by it is of the present utility model practice recognize.
Brief description of the drawings
Of the present utility model above-mentioned and/or additional aspect and advantage will from description of the accompanying drawings below to embodiment is combined
Become substantially and be readily appreciated that, wherein：
Fig. 1 is the structural representation of the circuit board assemblies according to the utility model embodiment.
Reference：
Circuit board assemblies 100,
First plate body 1,
Second plate body 2, the first pad 21,
Bare crystalline chip 3, pin 31,
Signal wire 4.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings.Below by
The embodiment being described with reference to the drawings is exemplary, it is intended to for explaining the utility model, and it is not intended that new to this practicality
The limitation of type.
According to the circuit board assemblies 100 of the utility model first aspect embodiment, including：First plate body 1, the second plate body 2
With bare crystalline chip 3.Second plate body 2 is stacked with the first plate body 1, and the second plate body 2 is electrically connected with the first plate body 1, the second plate
The surface away from the first plate body 1 of body 2 is provided with groove；Bare crystalline chip 3 is located in groove, the electricity of 3 and second plate body of bare crystalline chip 2
Connection.
According to the circuit board assemblies 100 of the utility model embodiment, by setting the second plate body 2 on the first plate body 1, and
Groove is set on the second plate body 2, bare crystalline chip 3 is assembled in groove, thus, it is possible to prevent from repairing, testing other
Element during progress SMT pasters, touches bare crystalline chip 3, so as to effectively protect bare crystalline chip on the first plate body 1
3, the service life of bare crystalline chip 3 is extended, the reliability of circuit board assemblies 100 is improved.
The circuit board assemblies 100 according to the utility model first aspect embodiment are described below with reference to Fig. 1.Wherein, circuit
Board component 100 is applied to terminal, such as mobile terminal.
As described in Figure 1, according to the circuit board assemblies 100 of the utility model embodiment, including：First plate body 1, the second plate body
2 and bare crystalline chip 3.
Wherein, the second plate body 2 is stacked with the first plate body 1.Specifically, reference picture 1, the first plate body 1 and the second plate body 2
It can be formed generally as square.First plate body 1 has the first plate face and the second plate face, for example, the first plate face can be the first plate
The upper surface of body 1, the second plate face can be the lower surface of the first plate body 1.Second plate body 2 can be arranged on the of the first plate body 1
In one plate face, in the second plate face that the first plate body 1 can also be arranged on, the first plate of the first plate body 1 can also be arranged on simultaneously
On face and the second plate face.For convenience of describing, in the description below the application, the upper of the first plate body 1 is arranged on the second plate body 2
Illustrated exemplified by surface.
Alternatively, the second plate body 2 is single sided board or multi-layer sheet.
Second plate body 2 can be one or more.For example, in the example of fig. 1, the second plate body 2 is one.And for example,
According to some embodiments of the present utility model, the second plate body 2 is multiple (not shown) spaced apart.Here, it is necessary to explanation
It is that " multiple " in the application refer to two or more.
Second plate body 2 is electrically connected with the first plate body 1, and the surface away from the first plate body 1 of the second plate body 2 is provided with groove.
Bare crystalline chip 3 is located in groove, and bare crystalline chip 3 is electrically connected with the second plate body 2.Wherein, bare crystalline chip 3 can the side of generally forming
Shape.Groove can be formed by the part on surface of second plate body 2 away from first plate body 1 towards the first plate body 1 is recessed.Example
Such as, in the example of fig. 1, the second plate body 2 is arranged on the upper surface of the first plate body 1, the middle part court of the upper surface of the second plate body 2
To the recessed formation groove of the first plate body 1.
Alternatively, groove can be square groove, but not limited to this.The cross-sectional area of groove can be slightly larger than bare crystalline chip 3
Cross-sectional area, in order to which bare crystalline chip 3 is assembled in groove.
According to some embodiments of the present utility model, the depth of groove is H, and the height of bare crystalline chip 3 is h, and H, h are met：H
≥h.For example, the depth H of groove and the height h of bare crystalline chip 3 are further met：H-h≥0.1mm.Thus, it is possible to so that bare crystalline
Chip 3 is embedded in groove, so as to effectively prevent in maintenance, test other elements or carry out SMT patches on circuit boards
During piece, bare crystalline chip 3 is touched, and then can more efficiently protect bare crystalline chip 3, extends the service life of bare crystalline chip 3,
Improve the reliability of circuit board assemblies 100.
According to some embodiments of the present utility model, the second plate body 2 is provided with multiple first pads 21 and multiple second welderings
Disk (not shown), multiple first pads 21 and multiple second pads are corresponded, and each first pad 21 and corresponding the
Two pads are electrically connected, and the first plate body 1 is electrically connected with the first pad 21, the pin 31 of bare crystalline chip 3 and corresponding second pad electricity
Connection.
Specifically, the first pad 21 can be electrically connected with the second pad by signal wire 4, and bare crystalline chip 3 can be welded on
On second pad, to cause the pin 31 of bare crystalline chip 3 to be electrically connected with corresponding second pad.Thus, it is possible to so that bare crystalline core
The pin 31 of piece 3 is realized with corresponding first pad 21 and electrically connected.
The quantity of the pin 31 of bare crystalline chip 3 is equal with the quantity of the first pad 21 and the second pad.For example, working as bare crystalline
When the pin 31 of chip 3 can be 36, the quantity of the first pad 21 and the second pad is also 36.Thus, it may be such that
The signal of one pad 21 and the second pad is corresponding with bare crystalline chip 3, so as to realize on the plate body 1 of bare crystalline chip 3 and first
Other circuits formation connection, complete signal interconnection.
Specifically, multiple first pads 21 can be located on the surface of neighbouring first plate body 1 of the second plate body 2.For example,
In Fig. 1 example, the second plate body 2 is arranged on the upper surface of the first plate body 1, and multiple first pads 21 set the second plate body 2
On lower surface, and multiple first pads 21 being provided at circumferentially spaced along the second plate body 2.Alternatively, the first pad 21 can be formed
For rectangle, but not limited to this.Thus, it is easy to the second plate body 2 being welded on the first plate body 1, and realizes the second plate body 2 and
The electrical connection of one plate body 1.
Second pad can be located in the inner bottom wall of groove, in order to which bare crystalline chip 3 is welded in groove, and is realized naked
The electrical connection of the brilliant plate body 2 of chip 3 and second, so that the pin 31 of bare crystalline chip 3 and the corresponding electricity of first pad 21
Connection, and then can realize that bare crystalline chip 3 is connected with other circuits formation on the first plate body 1, complete the interconnection of signal.
For example, in assembling, first bare crystalline chip 3 can be welded on the second pad in the inner bottom wall of groove so that
The pad of pin 31 and second of bare crystalline chip 3 realizes interconnection, and second plate body 2 then is welded on into the first plate by the first pad 21
On body 1 so that the pad 21 of pin 31 and first of bare crystalline chip 3 realizes interconnection, so as to realize the plate of bare crystalline chip 3 and first
The interconnection of other circuits on body 1.
Alternatively, bare crystalline chip 3 is bga chip, but not limited to this.
According to the circuit board assemblies 100 of the utility model embodiment, by setting the second plate body 2 on the first plate body 1, and
Groove is set on the second plate body 2, bare crystalline chip 3 is embedded in groove, thus, it is possible to prevent from repairing, testing other
Element carries out touching bare crystalline chip 3 during SMT pasters on circuit boards, simultaneously because the structural strength of the second plate body 2 is big
In the structural strength of bare crystalline chip 3, in maintenance, test other elements or when carrying out SMT pasters on circuit boards, the is touched
Also the second plate body 2 will not be damaged during two plate bodys 2, so as to effectively protect bare crystalline chip 3, making for bare crystalline chip 3 is extended
With the life-span, the reliability of circuit board assemblies 100 is improved.
Implement according to the terminal of the utility model second aspect embodiment, including according to the above-mentioned first aspect of the utility model
The circuit board assemblies 100 of example.Wherein, terminal can be mobile terminal, for example, mobile phone, tablet personal computer etc., but not limited to this.
According to the terminal of the utility model second aspect embodiment, by setting according to the above-mentioned first aspect of the utility model
The circuit board assemblies 100 of embodiment, extend the service life of terminal, improve the reliability of terminal.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " axle
To ", " radial direction ", the orientation of the instruction such as " circumference " or position relationship be based on orientation shown in the drawings or position relationship, be only for
It is easy to description the utility model and simplifies describe, rather than to indicate or imply that signified device or element must have specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two
It is individual, three etc., unless otherwise specifically defined.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be
Mechanically connect or electrically connect or can communicate each other；Can be joined directly together, the indirect phase of intermediary can also be passed through
Even, can be two element internals connection or two elements interaction relationship, unless otherwise clear and definite restriction.For this
For the those of ordinary skill in field, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature is "above" or "below" second feature
Can be that the first and second features are directly contacted, or the first and second features pass through intermediary mediate contact.Moreover, first is special
Levy second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only
Represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be with
Be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means to combine specific features, structure, material or the spy that the embodiment or example are described
Point is contained at least one embodiment of the present utility model or example.In this manual, to the schematic table of above-mentioned term
State and be necessarily directed to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be with
Combined in an appropriate manner in any one or more embodiments or example.In addition, in the case of not conflicting, this area
Technical staff the not be the same as Example or the feature of example and non-be the same as Example or example described in this specification can be entered
Row is combined and combined.
Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is
Exemplary, it is impossible to it is interpreted as to limitation of the present utility model, one of ordinary skill in the art is in scope of the present utility model
It is interior above-described embodiment to be changed, changed, replaced and modification.
Claims (10)
1. a kind of circuit board assemblies, it is characterised in that including：
First plate body；
Second plate body, second plate body is stacked with first plate body, and second plate body and first plate body
Electrical connection, the surface of remote first plate body of second plate body is provided with groove；
Bare crystalline chip, the bare crystalline chip is located in the groove, and the bare crystalline chip is electrically connected with second plate body.
2. circuit board assemblies according to claim 1, it is characterised in that the depth of the groove is H, the bare crystalline chip
Height be h, described H, h are met：H≥h.
3. circuit board assemblies according to claim 2, it is characterised in that the depth H of the groove and the bare crystalline chip
Height h further meet：H-h≥0.1mm.
4. circuit board assemblies according to claim 1, it is characterised in that the groove is square groove.
5. circuit board assemblies according to claim 1, it is characterised in that second plate body is provided with multiple first pads
With multiple second pads, multiple first pads are corresponded with multiple second pads, and each first pad
Electrically connected with corresponding second pad, first plate body is electrically connected with first pad, the bare crystalline chip draws
Pin is electrically connected with corresponding second pad.
6. circuit board assemblies according to claim 5, it is characterised in that second pad is located at the interior bottom of the groove
On wall.
7. circuit board assemblies according to claim 1, it is characterised in that second plate body is single sided board or multi-layer sheet.
8. circuit board assemblies according to claim 1, it is characterised in that second plate body is multiple for what is be spaced apart.
9. circuit board assemblies according to claim 1, it is characterised in that the bare crystalline chip is bga chip.
10. a kind of terminal, it is characterised in that including the circuit board assemblies according to any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720097736.4U CN206413261U (en) | 2017-01-25 | 2017-01-25 | Circuit board assemblies and the terminal with it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720097736.4U CN206413261U (en) | 2017-01-25 | 2017-01-25 | Circuit board assemblies and the terminal with it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206413261U true CN206413261U (en) | 2017-08-15 |
Family
ID=59557791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720097736.4U Expired - Fee Related CN206413261U (en) | 2017-01-25 | 2017-01-25 | Circuit board assemblies and the terminal with it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206413261U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889355A (en) * | 2017-11-10 | 2018-04-06 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and electronic equipment |
| CN112312678A (en) * | 2019-09-29 | 2021-02-02 | 成都华微电子科技有限公司 | Structure and method of non-packaged chip direct-buried printed circuit board and chip packaging structure |
-
2017
- 2017-01-25 CN CN201720097736.4U patent/CN206413261U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889355A (en) * | 2017-11-10 | 2018-04-06 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and electronic equipment |
| CN112312678A (en) * | 2019-09-29 | 2021-02-02 | 成都华微电子科技有限公司 | Structure and method of non-packaged chip direct-buried printed circuit board and chip packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 |