CN215728605U - Probe apparatus - Google Patents

Abstract

The present invention provides a probing apparatus including a probe card, a prober engaged with the probe card, and a holder. The probe card comprises a substrate, a protruding unit and a plurality of probes. The substrate has a first surface and a second surface opposite to the first surface. The protruding unit is disposed on the first surface of the substrate. The plurality of probes are arranged on the second surface of the substrate and protrude from the second surface of the substrate. The probe device comprises a plate body, a rod piece and an accommodating unit. The plate body includes a through hole, and the rod member spans the through hole. The accommodating unit is arranged on the rod piece and is configured to accommodate the protruding unit so as to enable the probe card and the prober to be mutually jointed. The holder is disposed between the second surface of the probe card and the prober and includes a sensor.

Description

Probe apparatus

Technical Field

The present disclosure relates to a probing apparatus, and more particularly, to a probing apparatus including a probe card.

Background

In the manufacturing process of Integrated Circuits (ICs), the electrical function before packaging must be tested to ensure the functional integrity of the shipped IC products. Testing is performed by Automated Test Equipment (ATE). In an automatic test equipment for wafer inspection, a probe device for controlling and performing on-wafer testing is included. The probing device is positioned above a device under test (i.e., a wafer under test) during testing and is electrically connected to a plurality of dies on the device under test to test the function of each die. The automatic test equipment also comprises a bearing platform which is arranged relative to the detection device and is used for bearing the device to be tested, so that the device to be tested can be smoothly measured by the detection device. The detecting device can be suspended or fixed above the wafer to be detected and the bearing table by matching with a proper mechanism.

Generally, the probing apparatus can contact the wafer to be tested through a probe card (probe card) fixed in the probing apparatus. The probe card includes, for example, a printed circuit board and a probe (pin) array mounted on the printed circuit board. The probe array is designed to align with contact pads on the wafer to be tested to facilitate electrical connection to each other.

SUMMERY OF THE UTILITY MODEL

Embodiments of the present disclosure provide a probing apparatus including a probe card, a prober engaged with the probe card, and a holder disposed between the probe card and the prober. The probe card comprises a substrate, a protruding unit and a plurality of probes. The substrate has a first surface and a second surface opposite to the first surface. The protruding unit is disposed on the first surface of the substrate. The plurality of probes are arranged on the second surface of the substrate and protrude from the second surface of the substrate. The probe device comprises a plate body, a rod piece and an accommodating unit. The plate body includes a through hole, and the rod member spans the through hole. The accommodating unit is arranged on the rod piece and is configured to accommodate the protruding unit so as to enable the probe card and the prober to be mutually jointed. The holder is disposed between the second surface of the probe card and the prober and includes a sensor.

Drawings

Fig. 1 is an exploded view of a detecting device according to a first embodiment of the present invention.

Fig. 2 is a perspective view of a probe card according to an embodiment of the present invention.

Fig. 3 and 4 are schematic diagrams illustrating a probing apparatus used in a dut according to an embodiment of the present disclosure.

FIG. 5 is a diagram illustrating a probing apparatus for a DUT according to a comparative example.

FIG. 6 is a top view of a holder according to an embodiment of the present invention.

Detailed Description

In order to make those skilled in the art understand the present disclosure, the following embodiments are specifically illustrated and described in detail with reference to the accompanying drawings. It should be noted that the drawings are simplified schematic diagrams, and therefore, only the elements and combinations related to the present invention are shown to provide a clearer description of the basic architecture or implementation method of the present invention, and the actual elements and layout may be more complicated. For convenience of description, the components shown in the drawings are not necessarily drawn to scale, and the specific scale may be adjusted according to design requirements.

When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, regions, steps, operations, and/or elements, but do not preclude the presence or addition of one or more other features, regions, steps, operations, elements, and/or groups thereof. When an element such as a layer or region is referred to as being "on" or extending "onto" another element (or variations thereof), it can be directly on or extend directly onto the other element or intervening elements may also be present. On the other hand, when an element is referred to as being "directly" disposed on another element (or variations thereof) or extending "directly" onto another element, there are no intervening elements present between the two. Also, when an element is referred to as being "electrically connected" to another element (or variations thereof), it can be directly connected to the other element or be indirectly connected to the other element through one or more elements.

Before and during testing of a device under test, it is important to adjust the probe card of the probing apparatus so that the tips of the probe array are in a single plane and parallel to the surface of the device under test, so that the probes can contact all of the contact pads of the device under test with uniform force. The device under test is, for example, a wafer under test. The probe card placement must be precisely adjusted and calibrated to be substantially parallel to the dut. However, it is not easy to grasp the setting condition of the fixed probe card at present. In recent years, as the array size of a device to be tested and a probe card is larger, the requirements for a probing device are more stringent. Therefore, there is a need for an improved detection device to ameliorate the above problems.

Referring to fig. 1 and 2, fig. 1 is an exploded view of a probing apparatus according to an embodiment of the present invention, and fig. 2 is a schematic view of a probe card and a holder of the probing apparatus according to an embodiment of the present invention. The probe apparatus 100 includes a probe card 10, a prober 20 bonded to the probe card 10, a tester 30, and a holder 40 disposed between the probe card 10 and the prober 20. The tester 30 is used for interfacing the probe card 10 and the prober 20, accommodating the holder 40, and for generating and providing test signals to a device under test (not shown). The probe card 10 includes a substrate 11, a protruding unit 12, and a plurality of probes (not shown). The substrate 11 has a first surface 111 and a second surface 112, and the second surface 112 is opposite to the first surface 111. The protruding unit 12 is disposed on the first surface 111 of the substrate 11. The probes are disposed on the second surface 112 of the substrate 11. The prober 20 includes a plate 21, a rod 22, and a receiving unit 23. The board body 21 includes a through hole 211, the rod 22 crosses the through hole 211, and the receiving unit 23 is disposed on the rod 22 and configured to receive the protruding unit 12 so as to couple the probe card 10 and the prober 20 to each other. In other words, the probe card 10 is firmly disposed at the lower side of the prober 20 by receiving the protruding units 12 through the receiving units 23.

The holder 40 is disposed between the second surface 112 of the probe card 10 and the prober 20. The position of the holder 40 is adjusted and set as desired, and is not particularly limited. In one embodiment, the purpose of the holder 40 is to conduct the forces experienced by the probes to the prober 20. In one embodiment, the purpose of the holder 40 is to conduct the forces experienced by the probes 15 to the prober 20. In one embodiment, the holder 40 is fixed between the probe card 10 and the prober 20 but is not fixed to be completely immovable, and thus can act as a shock absorber (damper) or damper for the probing apparatus 100.

The positions and the number of the protruding units 12 are adjusted and arranged according to the requirement, and are not particularly limited. The positions and the number of the receiving units 23 are arranged corresponding to the protruding units 12. In one embodiment, a protrusion unit 12 can be disposed at any position on the first surface 111 of the probe card 10, and a receiving unit 23 is disposed on the prober 20 corresponding to the protrusion unit 12.

In an embodiment, the protrusion unit 12 is further provided with an engagement force sensor 13, and the engagement force sensor 13 measures the force of the probe card 10 and the prober 20 engaging with each other, so that the engagement condition of the protrusion unit 12 and the accommodating unit 23 can be known through the result of the engagement force sensor 13 arranged on the protrusion unit 12, and the probe card 10 and the prober 20 are arranged in a more ideal relative position. When the force of the probe card 10 and the prober 20 engaging each other reaches a predetermined value, the engagement of the probe card 10 and the prober 20 can be regarded as reaching an ideal relative engagement position, i.e., the configuration of the probe card 10 with respect to the prober 20 is good.

In one embodiment, the two protruding units 12 can be disposed on the first surface 111 at intervals, such as at any diagonal position. By providing one engagement force sensor 13 for each protruding unit 12 and comparing the measurement results of the two engagement force sensors 13, the arrangement of the probe card 10 relative to the prober 20 can be known. In another embodiment, the probe card 10 is provided with four protruding units 12, and the protruding units 12 can be arranged in a rectangular shape, such as but not limited to a position corresponding to the bar 22. Each protruding unit 12 is provided with an engagement force sensor 13, and the arrangement of the probe card 10 with respect to the prober 20 can be known by comparing the measurement results of the four engagement force sensors 13.

In one embodiment, the protruding element 12 comprises a conductive rigid material, such as a metal or an alloy. In one embodiment, the accommodating unit 23 comprises a conductive rigid material, such as a metal or an alloy. The electrically conductive rigid material for the protruding unit 12 and the electrically conductive rigid material for the receiving unit 23 may be the same or different.

The measurement result of the occlusion force sensor 13 is typically an electrical signal of the order of a few millivolts, which needs to be amplified before analysis and comparison. In one embodiment, each of the bite force sensors 13 is electrically connected to a signal amplifier (signal amplifier), which is further connected to a Data Transfer Module (DTM). In one embodiment, all of the signal amplifiers are connected to the same data conversion module. The signal amplifier and the data conversion module are disposed in a case 14, and the case 14 is fixed on the second surface of the probe card 10. The engagement force sensor 13 collects information of each stage during the engagement between the protruding unit 12 and the accommodating unit 23, and then transmits the information to the signal amplifier and the data conversion module for processing and analysis, so as to obtain the engagement information between the protruding unit 12 and the accommodating unit 23. If the probe card 10 is provided with a plurality of engagement force sensors 13 or a plurality of protrusion units 12, the bonding state of each part of the probe card 10 and the prober 20 is analyzed by comparing information collected by each engagement force sensor 13, so as to further calibrate the probe card 10.

Referring to fig. 3 and 4, fig. 3 and 4 are schematic views of the probing apparatus shown in fig. 2 along the AA tangent line, and illustrate a state in which the probing apparatus is used for a device under test. In one embodiment, a device under test 50 is placed on the stage 51, and the device under test 50 overlaps the probes 15 in a Z-direction perpendicular to the first surface 111. The stage 51 carries the dut 50, and moves the dut 50 in the Z direction as shown in fig. 3 and moves closer to or away from the probes 15, or brings the dut 50 into contact with the probes 15 as shown in fig. 4. In one embodiment, the width W1 of the probes 15 is the same as the width W2 of the holder 40 in the X direction parallel to the first plane 111. In one embodiment, the width W1 of the probes 15 is greater than the width W2 of the holder 40. In one embodiment, the width W1 of the probes 15 is less than the width W2 of the holder 40.

In one embodiment, when the stage 51 carries the device under test 50, the device under test 50 is moved along the Z direction and contacts the probes 15, the first force S1 is transmitted from the probes 15 to the substrate 11 along the Z direction, and then the first force S1 is transmitted from the substrate 11 to the holder 40, then transmitted from the holder 40 to the prober 20 and dispersed in the prober 20. The second force S2 is transmitted from the probes 15 to the substrate 11 along the Z direction, and then dispersed in the substrate 11, and the second force S2 is transmitted from the probe card 10 to the prober 20 via the protrusion device 12 and the receiving device 23. In one embodiment, the weight of the holder 40 provides a third force S3, the third force S3 being opposite to the Z direction, such that each probe 15 is in uniform contact with the DUT 50.

Referring to fig. 5, fig. 5 shows a state of the probing apparatus of the comparative example applied to a device under test. In a comparative example, there is no holder between the probe card 10 and the prober 20, the second force S2 is transmitted in the Z direction from the probes 15 to the substrate 11, and then the second force S2 is transmitted from the substrate 11 to the prober 20 and dispersed in the prober 20. Since the second force S2 is only minimally absorbed by the prober 20, which may cause the probe card 10 to bend or twist, the probes 15 do not make uniform contact with the device under test 50, and the device under test 50 cannot be accurately measured.

In one embodiment, the holder 40 is smaller in size than the probe card 10. In one embodiment, the holder 40 is smaller in size than the prober 20. In one embodiment, the holder 40 may be, for example, but not limited to, a cube, a cuboid, or various suitable shapes. In one embodiment, the holder 40 overlaps at least one probe 15 in a Z-direction perpendicular to the first surface 111. In one embodiment, the holder 40 overlaps the probes 15 in the Z-direction. In one embodiment, the holder 40 overlaps the bar 22 in the Z-direction. In one embodiment, the holder 40 contacts the probe card 10 and is surrounded by a plurality of protruding units 12.

In one embodiment, the holder 40 is disposed on the first surface 111. In one embodiment, at least a portion of the holder 40 is embedded in the probe card 10. In one embodiment, the holder 40 is disposed between the first surface 111 and the second surface 112 of the probe card 10. In one embodiment, the upper surface of the holder 40 is aligned with the first surface 111 of the probe card 10.

The holder 40 contains a sensor 41. In one embodiment, the sensor 41 is used to sense the force transmitted by the probes 15 to the probe card 10. In one embodiment, the sensor 41 is a shock sensor. In one embodiment, the holder 40 further comprises a box 42, and the sensor 41 is disposed in the box 42.

Referring to FIG. 6, FIG. 6 is a top view of the holder according to an embodiment of the present invention. The position and number of the sensors 41 are adjusted and set according to the requirement, and are not particularly limited. In one embodiment, the holder 40 is provided with four sensors 41, the sensors 41 are arranged in a rectangular shape, for example, and when each sensor 41 measures that the force of the contact between the probes 15 and the device under test 50 reaches a predetermined value, the probes 15 and the device under test 50 can be considered to reach the desired relative contact position, i.e., the probe card 10 can measure the device under test 50 at the proper position. In one embodiment, the sensor 41 of the holder 40 measures that the contact force between the probes 15 and the dut 50 does not reach a predetermined value, and further adjusts and corrects the relative positions of the probe card 10 and the dut 50.

In another embodiment, two sensors 41 may be disposed in the box 42, such as but not limited to, at intervals, such as at any diagonal position. By comparing the measurement results of the two sensors 41, the stress condition of the holder 40 can be known. In another embodiment, the holder 40 has a sensor 41 disposed at the center of the case 42 for sensing the vibration applied to the holder 40.

In one embodiment, the holder 40 further comprises a data transmission module 42 for transmitting the result measured by the sensor 41 to a data conversion module. In one embodiment, the measurement of the sensor 41 is typically an electrical signal on the order of a few millivolts that needs to be amplified prior to analysis and comparison. In one embodiment, each of the sensors 41 is electrically connected to a signal amplifier, which is further connected to the data conversion module. In one embodiment, all of the signal amplifiers are connected to the same data conversion module. In one embodiment, the results of the bite force sensor 13 and the sensor 41 are transmitted to the same data conversion module.

In one embodiment, the signal amplifier and the data conversion module are disposed in a case 14, and the case 14 is fixed to the second surface of the probe card 10. In one embodiment, the holder 40 is disposed on the cartridge 14. The occlusion force sensor 13 collects information of each stage of stress caused by the contact of the probes 15 and the device 50 to be tested, and then transmits the information to the signal amplifier and the data conversion module for processing and analysis, so as to obtain the information of the contact of the probes 15 and the device 50 to be tested. If the sensor 41 is used for sensing a force, the force condition of the probes 15 contacting the dut 50 is analyzed through the information collected by the sensor 41. If the holder 40 is provided with a plurality of sensors 41, the stress conditions of the probes 15 and the dut 50 are analyzed by comparing the information collected by the sensors 41, so as to further correct the position of the probe card 10 or correct the position of the stage 51. For example, when the measurement results of the sensor 41 are analyzed to find that the probes 15 of the probe card 10 are not properly or uniformly bonded to the dut 50, the contact force between each probe 15 and the corresponding portion of the dut 50 is properly adjusted and corrected according to the measured quantitative information, or the relative positions of the stage 51 and the probes 15 are adjusted to make the probes 15 uniformly contact the dut 50. Moreover, after the detection device 100 is used each time, the measured quantitative information can be traced, a stable setting process can be established, the setting time is reduced to improve the setting efficiency of the detection device 100, and the setting automation can be achieved beneficially. In one embodiment, the sensor 41 may measure a force of 200kg or more. In one embodiment, the sensor 41 may measure 300kg or more of force.

In summary, the probing device of the present invention directly sets the sensor in the holder, the sensor can sense the stress condition of the probes and the device under test or the vibration received by the holder, and the sensing result of the sensor is utilized to perform an appropriate adjustment, so that the probes and the device under test can maintain an appropriate relative position when they are engaged with each other. The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Description of the symbols:

10 probe card

11: substrate

12 projecting unit

13 occlusal force sensor

14 case body

15 probe

20: probe device

21: plate body

22 rod member

23 accommodating unit

30: tester

40: holder

41: sensor

42 case body

50 device under test

51 bearing table

100 probe device

111 first surface

112 second surface

211, through hole

Z is the direction

X is the direction.

Claims (10)

1. A probe apparatus, comprising:

a probe card, comprising:

a substrate having a first surface and a second surface opposite the first surface;

a protruding unit disposed on the first surface of the substrate; and

a plurality of probes arranged on the second surface and protruding from the second surface of the substrate;

a prober, comprising:

a plate body including a through hole;

a rod member crossing the through hole; and

an accommodating unit disposed on the rod and configured to accommodate the protruding unit so that the probe card and the prober are bonded to each other;

the holder is arranged between the second surface of the probe card and the prober and comprises a sensor.

2. The probing apparatus of claim 1, wherein the sensor is configured to sense a force transmitted by the plurality of probes to the probe card.

3. The apparatus of claim 1, wherein the holder further comprises a data transmission module.

4. The detecting device according to claim 1, wherein the holder further includes a case in which the sensor is disposed.

5. The probing apparatus of claim 1, wherein the holder is disposed between the first surface and the second surface of the probe card.

6. The probing apparatus of claim 1, wherein the upper surface of the holder is aligned with the first surface of the probe card.

7. A probe apparatus according to claim 1, wherein the holder overlaps at least one of the plurality of probes in a direction perpendicular to the first surface.

8. A probe according to claim 1 wherein the holder overlaps the rod in a direction perpendicular to the first surface.

9. The probe of claim 1 wherein the sensor comprises a force sensor, a vibration sensor, or a combination thereof.

10. The probing apparatus of claim 1, wherein said probe card further comprises a bite force sensor disposed on said protruding unit.

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