JP6060253B2 - 位置整列が容易なテスト用ソケット - Google Patents
位置整列が容易なテスト用ソケット Download PDFInfo
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Description
まず、テストボードから伝達された電気的な信号は、インターフェース基板、弾性導電シートを介して、半導体パッケージに伝達されるが、それにより、図1ないし図3に開示された従来技術に比べ、全体的なcurrent passが長くなり、それにより、電気的な信号伝逹特性が低下してしまうという問題点が生じる。
前記テスト用ソケットにおいて、前記整列部材は、検査装置でパッドが配置される検査領域の断面積と対応する大きさを有することができる。
まず、前述の実施形態では、テスト用ソケットが、整列部材及び弾性導電シートから構成されるものを例示したが、それに限定されるものではなく、弾性導電シートの代わりに、従来のポゴピンが利用されもする。
Claims (9)
- 被検査デバイスと検査装置との間に配置され、被検査デバイスの端子と検査装置のパッドとを電気的に連結させるためのテスト用ソケットであって、
前記被検査デバイスの端子または検査装置のパッドと対応する位置ごとに、多数の貫通孔が形成されており、検査装置のパッドにそれぞれの貫通孔が位置するように、前記検査装置に付着される整列部材と、
前記被検査デバイスの端子と対応する位置ごとに配置されるが、絶縁性弾性物質内に、多数の導電性粒子が分布される導電部と、それぞれの導電部を支持しながら、互いに隣接した導電部との電気的接続を断絶させる絶縁性支持部と、前記導電部から下側に突出し、前記整列部材の貫通孔内に挿入される突出導電部と、を含む弾性導電シートと、から構成されるが、
前記突出導電部が、前記整列部材の貫通孔内に挿入されたとき、前記弾性導電シートが位置整列されることを特徴とする位置整列が容易なテスト用ソケット。 - 前記突出導電部の高さは、前記貫通孔の高さより高いことを特徴とする請求項1に記載の位置整列が容易なテスト用ソケット。
- 前記絶縁性支持部は、前記整列部材と離隔されて配置されることを特徴とする請求項2に記載の位置整列が容易なテスト用ソケット。
- 前記整列部材は、前記検査装置の表面に接着剤によって接着されることを特徴とする請求項1に記載の位置整列が容易なテスト用ソケット。
- 前記接着剤は、熱溶融型樹脂からなることを特徴とする請求項4に記載の位置整列が容易なテスト用ソケット。
- 前記整列部材は、検査装置でパッドが配置される検査領域の断面積と対応する大きさを有することを特徴とする請求項1に記載の位置整列が容易なテスト用ソケット。
- 前記突出導電部は、弾性物質内に、多数の導電性粒子が分布されるように構成されたことを特徴とする請求項1に記載の位置整列が容易なテスト用ソケット。
- 前記整列部材は、樹脂材料またはファイバ補強型樹脂材料からなるシートであることを特徴とする請求項1に記載の位置整列が容易なテスト用ソケット。
- 前記弾性導電シートの上端には、前記被検査デバイスの端子と対応する位置ごとに、案内孔が形成されるガイドシートが設けられていることを特徴とする請求項1に記載の位置整列が容易なテスト用ソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0044683 | 2012-04-27 | ||
KR1020120044683A KR101284212B1 (ko) | 2012-04-27 | 2012-04-27 | 위치정렬이 용이한 테스트용 소켓 |
PCT/KR2013/003671 WO2013162343A1 (ko) | 2012-04-27 | 2013-04-29 | 위치정렬이 용이한 테스트용 소켓 |
Publications (2)
Publication Number | Publication Date |
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JP2015518255A JP2015518255A (ja) | 2015-06-25 |
JP6060253B2 true JP6060253B2 (ja) | 2017-01-11 |
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JP2015508874A Active JP6060253B2 (ja) | 2012-04-27 | 2013-04-29 | 位置整列が容易なテスト用ソケット |
Country Status (5)
Country | Link |
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US (1) | US9696344B2 (ja) |
JP (1) | JP6060253B2 (ja) |
KR (1) | KR101284212B1 (ja) |
CN (1) | CN104285151B (ja) |
WO (1) | WO2013162343A1 (ja) |
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KR101439342B1 (ko) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
KR101439343B1 (ko) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
KR101464990B1 (ko) * | 2013-12-24 | 2014-11-26 | 주식회사 아이에스시 | 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치 |
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US9696344B2 (en) | 2017-07-04 |
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