JPWO2007072789A1 - 異方導電性コネクター、及びこの異方導電性コネクターを備える検査装置用変換アダプタ及び検査装置、並びにこの異方導電性コネクターの製造方法 - Google Patents
異方導電性コネクター、及びこの異方導電性コネクターを備える検査装置用変換アダプタ及び検査装置、並びにこの異方導電性コネクターの製造方法 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
そして、被検査物136の突出した電極部135が、異方導電性コネクター36の位置決め部材103の開口部107に嵌合することにより、被検査物136の電極部135が正しく異方導電性コネクター36の導電路形成部69の上に位置合わせされて積層される。
12 回路基板
14 電極部
36 異方導電性コネクター
33 電子部品
36 異方導電性コネクター
69 導電路形成部
70 絶縁部
101 電極部
102 異方導電性シート
103 位置決め部材
104 孔
105 有孔金属製部材
106 絶縁層
107 開口部
108 凹部
109 形成型
113 孔
114 マスク
121 検査用回路基板
124 検査電極部
128 ハンダボール電極部
131 検査用基板
133 検査電極部
135 電極部
Claims (7)
- 突出した電極部を有する検査対象の電子部品と、検査電極部を有する検査用回路基板とを電気的に接続して検査するために、前記電子部品の電極部と前記検査用回路基板の検査電極部との間に設けられる異方導電性コネクターであって、
前記電子部品の電極部と前記検査用回路基板の検査電極部とを電気的に接続可能な導電路形成部と、該導電路形成部を相互に絶縁する絶縁部とが形成された異方導電膜を備えた異方導電性シートと、
該異方性導電性シートと前記電子部品との間に設けられ、前記導電路形成部に対応した位置に開口部が形成された位置決め部材とを備えており、
該位置決め部材は、有孔金属製部材の周囲に絶縁層が形成されて構成され、前記位置決め部材の開口部に前記電子部品の電極部を嵌合すると、該電極部が前記導電路形成部に案内されるように構成されていることを特徴とする異方導電性コネクター。 - 前記有孔金属製部材は格子状に形成されており、該有孔金属製部材の少なくとも交差部以外の部分の周囲に絶縁層が形成されている請求項1に記載の異方導電性コネクター。
- 前記位置決め部材は、前記有孔金属製部材の周囲に形成された絶縁層と前記異方導電性シートの絶縁部とを接着することにより該異方導電性シートに一体化して形成されている請求項1又は2に記載の異方導電性コネクター。
- 前記異方導電膜の周辺領域に段差部が形成され、該段差部に前記異方導電膜の周縁部を支持する支持体が設けられている請求項1〜3のいずれか1の請求項に記載の異方導電性コネクター。
- 突出した電極部を有する検査対象の電子部品と、検査電極部を有する検査用回路基板とを電気的に接続し、前記電子部品に対して電気的検査を行う検査装置に設けられる検査装置用変換アダプタであって、
請求項1〜4のいずれか1の請求項に記載の異方導電性コネクターを備えていることを特徴とする検査装置用変換アダプタ。 - 突出した電極部を有する検査対象の電子部品と、検査電極部を有する検査用回路基板とを電気的に接続し、前記電子部品に対して電気的検査を行う検査装置であって、
請求項1〜4のいずれか1の請求項に記載の異方導電性コネクターを備えていることを特徴とする検査装置。 - 突出した電極部を有する検査対象の電子部品と、検査電極部を有する検査用回路基板とを電気的に接続して検査するために、前記電子部品の電極部と前記検査用回路基板の検査電極部との間に設けられる異方導電性コネクターの製造方法であって、
(A)エッチング処理により金属製部材に多数の孔を穿設して有孔金属製部材を製造する工程と、
(B)前記(A)工程において製造された有孔金属製部材を、形成型に形成された凹部に沿って且つ該凹部の上方に位置するように、前記形成型に配置する工程と、
(C)前記形成型の凹部に対応した位置に孔が形成されたマスクを、前記(B)工程において前記形成型に配置された前記有孔金属製部材の上方に配置する工程と、
(D)前記(C)工程において配置されたマスクの孔から前記凹部に対して液状の絶縁材料を流し込み、前記有孔金属製部材の周囲に絶縁層を形成し、開口部を有する位置決め部材を製造する工程と、
(E)前記(D)工程において製造された位置決め部材を、該位置決め部材の開口部が前記導電路形成部に対応する位置に来るように、前記異方導電性シートに配置する工程と、
(F)前記(E)工程において前記位置決め部材が前記異方導電性シートに配置された状態で、該前記異方導電性シート及び前記位置決め部材を加熱し、前記導電路形成部を相互に絶縁する前記異方導電性シートの絶縁部と前記位置決め部材の絶縁層とを接着し、前記異方導電性シートと前記位置決め部材とを一体化する工程と、
を有していることを特徴とする異方導電性コネクターの製造方法。
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JP2007551079A JP5050856B2 (ja) | 2005-12-21 | 2006-12-19 | 異方導電性コネクターの製造方法 |
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JP2005367578 | 2005-12-21 | ||
JP2005367578 | 2005-12-21 | ||
PCT/JP2006/325216 WO2007072789A1 (ja) | 2005-12-21 | 2006-12-19 | 異方導電性コネクター、及びこの異方導電性コネクターを備える検査装置用変換アダプタ及び検査装置、並びにこの異方導電性コネクターの製造方法 |
JP2007551079A JP5050856B2 (ja) | 2005-12-21 | 2006-12-19 | 異方導電性コネクターの製造方法 |
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JPWO2007072789A1 true JPWO2007072789A1 (ja) | 2009-05-28 |
JP5050856B2 JP5050856B2 (ja) | 2012-10-17 |
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US (1) | US7618266B2 (ja) |
EP (1) | EP1970719B1 (ja) |
JP (1) | JP5050856B2 (ja) |
KR (1) | KR20080082652A (ja) |
CN (1) | CN101341415B (ja) |
TW (1) | TWI403723B (ja) |
WO (1) | WO2007072789A1 (ja) |
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CN102436874B (zh) * | 2011-09-17 | 2013-01-02 | 山西金开源实业有限公司 | 各向异性导电薄膜生产设备 |
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JP7281620B2 (ja) * | 2018-10-15 | 2023-05-26 | パナソニックIpマネジメント株式会社 | 特性計測装置、部品実装装置、特性計測方法および部品実装方法 |
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-
2006
- 2006-12-14 TW TW095146915A patent/TWI403723B/zh not_active IP Right Cessation
- 2006-12-19 US US12/097,769 patent/US7618266B2/en not_active Expired - Fee Related
- 2006-12-19 KR KR1020087015044A patent/KR20080082652A/ko not_active Application Discontinuation
- 2006-12-19 CN CN200680048327XA patent/CN101341415B/zh not_active Expired - Fee Related
- 2006-12-19 WO PCT/JP2006/325216 patent/WO2007072789A1/ja active Application Filing
- 2006-12-19 EP EP06834926A patent/EP1970719B1/en not_active Not-in-force
- 2006-12-19 JP JP2007551079A patent/JP5050856B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1970719B1 (en) | 2013-03-13 |
EP1970719A4 (en) | 2012-03-07 |
WO2007072789A1 (ja) | 2007-06-28 |
CN101341415A (zh) | 2009-01-07 |
TW200804815A (en) | 2008-01-16 |
CN101341415B (zh) | 2011-03-16 |
EP1970719A1 (en) | 2008-09-17 |
US7618266B2 (en) | 2009-11-17 |
US20080311769A1 (en) | 2008-12-18 |
JP5050856B2 (ja) | 2012-10-17 |
TWI403723B (zh) | 2013-08-01 |
KR20080082652A (ko) | 2008-09-11 |
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