CN106057771B - 具有插座插头互连结构的半导体封装 - Google Patents

具有插座插头互连结构的半导体封装 Download PDF

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CN106057771B
CN106057771B CN201510633171.2A CN201510633171A CN106057771B CN 106057771 B CN106057771 B CN 106057771B CN 201510633171 A CN201510633171 A CN 201510633171A CN 106057771 B CN106057771 B CN 106057771B
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socket
substrate
plug
bump
semiconductor package
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CN106057771A (zh
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崔亨硕
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SK Hynix Inc
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SK Hynix Inc
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Abstract

具有插座插头互连结构的半导体封装。一种半导体封装可以包括第一基板和第二基板。插座凸块可以被设置在第一基板上以在插座凸块内提供插槽。插头凸块可以被设置在第二基板上。插头凸块可以构造为插入到插座凸块的插槽中，并且可以电连接至插座凸块。还可以提供相关的存储卡和电子系统。

Description

具有插座插头互连结构的半导体封装
相关申请的交叉引用
本申请要求于2015年4月6日在韩国知识产权局提交的韩国申请No.10-2015-0048674的优先权，通过引用将该韩国专利申请整体并入本文。
技术领域
各种实施方式可以涉及封装技术，并且更具体地，涉及具有插座插头互连结构的半导体封装。
背景技术
随着诸如移动系统的较小电子系统的发展，越来越需要能够处理大量数据的半导体封装。响应于这种需求，可能必须增加在电子系统中使用的半导体器件的集成密度。而且，随着对便携式电子产品和可穿戴式电子产品的兴趣增加，越来越需要电子系统的柔性特性。需要构成电子系统的电子部件(诸如半导体封装)的柔性。
由于半导体芯片可以具有易于被弯曲的厚度，所以逐渐增加了实现柔性半导体封装的可能性。因此，大量努力集中于即使当半导体器件的芯片或基板弯曲或变形时，也将半导体器件的芯片彼此电连接、将芯片电连接至封装基板或者将基板彼此电连接的互连结构。
发明内容
根据一个实施方式，可以提供一种半导体封装。该半导体封装可以包括第一基板和设置在所述第一基板上并且被构造为提供插槽的插座凸块。该半导体封装可以包括第二基板和设置在所述第二基板上的插头凸块。每个所述插头凸块可以被构造为分别插入到每个所述插槽中，以分别电连接至所述插座凸块。
根据一个实施方式，可以提供一种半导体封装。该半导体封装可以包括第一基板，所述第一基板包括包含在所述第一基板中并且形成在所述第一基板中与所述第一基板的表面相邻的凸块槽。该半导体封装可以包括分别设置在所述凸块槽中的插座凸块。每个所述插座凸块都可以覆盖所述凸块槽的任一个的底部和侧壁部以在所述插座凸块内提供插槽。第二基板可以设置为面向所述第一基板。插头凸块设置在所述第二基板上并且插入到所述插座凸块的所述插槽中。所述插头凸块可以分别电连接至所述插座凸块。所述凸块槽可以是凹形的。
根据一个实施方式，可以提供一种半导体封装。该半导体封装可以包括第一基板；以及插座凸块，所述插座凸块被构造为从所述第一基板的表面伸出并且在所述插座凸块内提供插槽。该半导体封装可以包括第二基板，所述第二基板被定位为面向所述第一基板；以及插头凸块，所述插头凸块设置为从所述第二基板的表面朝向所述第一基板伸出并且构造为插入到所述插座凸块的所述插槽中。所述插头凸块构造为在所述插槽中通过往复运动来移动，并且可以分别电连接至所述插座凸块。
根据一个实施方式，可以提供一种包括封装的存储卡。该封装可以包括第一基板和设置在所述第一基板上并且构造为提供插槽的插座凸块。该封装可以包括第二基板和设置在所述第二基板上并且构造为插入到所述插座凸块的所述插槽中的插头凸块。所述插头凸块可以分别电连接至所述插座凸块。
根据一个实施方式，可以提供一种包括封装的存储卡。该封装可以包括第一基板和凸块槽，所述凸块槽包括在所述第一基板中并且形成在所述第一基板中与所述第一基板的表面相邻。该封装可以包括插座凸块，所述插座凸块分别设置在所述凸块槽中。每个所述插座凸块都覆盖所述凸块槽的任一个的底部和侧壁部以在所述插座凸块内提供插槽。该封装可以包括设置为面向所述第一基板的第二基板。插入到所述插座凸块的所述插槽中的插头凸块可以设置在所述第二基板上。所述插头凸块可以分别电连接至所述插座凸块。所述凸块槽可以是凹形的。
根据一个实施方式，可以提供一种包括封装的存储卡。该封装可以包括第一基板，以及构造为从所述第一基板的表面伸出并且在所述插座凸块内提供插槽的插座凸块。该封装可以包括定位为面向所述第一基板的第二基板；以及插头凸块，所述插头凸块设置为从所述第二基板的表面朝向所述第一基板伸出并且构造为插入到所述插座凸块的所述插槽中。所述插头凸块构造为在所述插槽中通过往复运动来移动，并且可以分别电连接至所述插座凸块。
根据一个实施方式，可以提供一种包括封装的电子系统。该封装可以包括第一基板和设置在所述第一基板上并且构造为提供插槽的插座凸块。该封装可以包括第二基板和插头凸块，所述插头凸块设置在所述第二基板上并且构造为插入到所述插座凸块的所述插槽中。所述插头凸块可以分别电连接至所述插座凸块。
根据一个实施方式，可以提供一种包括封装的电子系统。该封装可以包括包含凸块槽的第一基板，所述凸块槽包括在所述第一基板中并且形成在所述第一基板中与所述第一基板的表面相邻。该封装可以包括插座凸块，所述插座凸块分别设置在所述凸块槽中。每个所述插座凸块都可以覆盖所述凸块槽的任一个的底部和侧壁部以在所述插座凸块内提供插槽。第二基板可以设置为面向所述第一基板。插头凸块设置在所述第二基板上并且构造为插入到所述插座凸块的所述插槽中。所述插头凸块可以分别电连接至所述插座凸块。所述凸块槽可以是凹形的。
根据一个实施方式，可以提供一种包括封装的电子系统。该封装可以包括第一基板以及构造为从所述第一基板的表面伸出并且在所述插座凸块内提供插槽的插座凸块。该封装可以包括定位为面向所述第一基板的第二基板；以及插头凸块，所述插头凸块构造为从所述第二基板的表面朝向所述第一基板伸出并且构造为插入到所述插座凸块的所述插槽中。所述插头凸块构造为在所述插槽中通过往复运动来移动，并且可以分别电连接至所述插座凸块。
附记1、一种半导体封装，该半导体封装包括：
第一基板；
插座凸块，所述插座凸块设置在所述第一基板上并且构造为提供插槽；
第二基板；以及
插头凸块，所述插头凸块设置在所述第二基板上，每个所述插头凸块被构造为分别插入到每个所述插槽中，以分别电连接至所述插座凸块。
附记2、根据附记1所述的半导体封装，该半导体封装进一步包括：
伸缩式导电连接构件，所述伸缩式导电连接构件被构造为将所述插座凸块的在所述插槽内的表面电连接至插头凸块的前端。
附记3、根据附记2所述的半导体封装，
其中，所述伸缩式导电连接构件包括导电弹簧；并且
其中，所述导电弹簧的第一端与所述插座凸块的在所述插槽内的表面相结合，并且弹簧构件的另一端与所述插头凸块的前端相结合。
附记4、根据附记3所述的半导体封装，其中，所述导电弹簧包括弹簧圈。
附记5、根据附记2所述的半导体封装，
其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的导电纳米线，以及
其中，所述纳米线是弯曲的或彼此缠结。
附记6、根据附记2所述的半导体封装，其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的弯曲的或缠结的导电碳纳米管。
附记7、根据附记2所述的半导体封装，其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的导电弹性构件。
附记8、根据附记2所述的半导体封装，其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的导电聚合物。
附记9、根据附记1所述的半导体封装，其中，所述第一基板包括半导体芯片，所述半导体芯片包括集成电路。
附记10、根据附记9所述的半导体封装，
其中，所述第二基板包括封装基板，并且
其中，所述半导体芯片安装在所述封装基板上。
附记11、根据附记1所述的半导体封装，
其中，每个所述插座凸块都包括从所述插座凸块的第一底部伸出的圆柱形侧壁部。
附记12、根据附记11所述的半导体封装，
其中，所述插座凸块的所述侧壁部包括彼此分开的至少两个侧壁。
附记13、根据附记1所述的半导体封装，其中，每个所述插座凸块都包括从所述插座凸块的第一底部伸出的侧壁柱，以利用所述侧壁柱基本围绕所述插槽。
附记14、根据附记13所述的半导体封装，其中，每个所述侧壁柱都包括小于所述插头凸块的线宽的线宽。
附记15、根据附记1所述的半导体封装，
其中，每个所述插座凸块都包括分别从所述插座凸块的第一底部伸出的侧壁，并且每个所述侧壁被构造为分别允许每个所述插头凸块保持在所述插座凸块的所述插槽内。
附记16、一种半导体封装，该半导体封装包括：
第一基板；
凸块槽，所述凸块槽包括在所述第一基板中并且形成在所述第一基板中与所述第一基板的表面相邻；
插座凸块，所述插座凸块分别设置在所述凸块槽中，每个所述插座凸块覆盖所述凸块槽中的任一个的底部和侧壁部以在所述插座凸块内提供插槽；以及
第二基板；
插头凸块，所述插头凸块设置在所述第二基板上并且插入到所述插座凸块的所述插槽中，
其中，所述插头凸块分别电连接至所述插座凸块，并且
其中，所述凸块槽是凹形的。
附记17、根据附记16所述的半导体封装，
其中，每个所述插座凸块包括从所述插座凸块的底部伸出的圆柱形侧壁部。
附记18、根据附记17所述的半导体封装，
其中，所述插座凸块的所述侧壁部包括彼此分开的至少两个侧壁。
附记19、根据附记16所述的半导体封装，
其中，每个所述插座凸块分别包括从所述插座凸块的所述底部伸出的侧壁，并且每个所述侧壁被构造为分别允许每个所述插头凸块保持在所述插座凸块的所述插槽内。
附记20、一种半导体封装，该半导体封装包括：
第一基板；
插座凸块，所述插座凸块构造为从所述第一基板的表面伸出并且在所述插座凸块内提供插槽；
第二基板，所述第二基板被定位为面向所述第一基板；以及
插头凸块，所述插头凸块设置为从所述第二基板的表面朝向所述第一基板伸出并且被构造为插入到所述插座凸块的所述插槽中，
其中，所述插头凸块被构造为在所述插槽中通过往复运动来移动，并且分别电连接至所述插座凸块。
附图说明
图1、图2、图3是示出根据实施方式的半导体封装的示例的表示的截面图。
图4是示出根据实施方式的半导体封装的插座插头互连结构的示例的表示的截面图。
图5是示出根据各种实施方式的半导体封装中采用的其它插座插头互连结构的示例的表示的垂直截面图。
图6是示出根据各种实施方式的在半导体封装中采用的其它插座插头互连结构的示例的表示的垂直截面图。
图7和图8是示出根据各种实施方式的半导体封装中采用的其它插座插头互连结构的示例的表示的水平截面图。
图9和图10是示出根据各种实施方式的在半导体封装中采用的其它插座插头互连结构的示例的表示的水平截面图。
图11和图12是示出根据实施方式的半导体封装的示例的表示的截面图。
图13是示出采用包括根据实施方式的封装的存储卡的电子系统的示例的表示的框图。
图14是示出包括根据实施方式的封装的电子系统的示例的表示的框图。
具体实施方式
本文中使用的术语可以对应于考虑到它们在这些实施方式中的功能而选择的词语，并且这些术语的含义可以根据这些实施方式所属的领域中的普通技术人员而被解释为不同。如果进行了详细定义，那么术语可以根据该定义来解释。除非另外定义，否则本文中使用的术语(包括科技术语)具有与实施方式所属的技术领域中的普通技术人员通常所理解的相同含义。
将会理解的是，虽然术语“第一”、“第二”、“第三”等在本文中可被用来描述各种元件，但是这些元件不应该被这些术语限制。这些术语仅用来区别一元件与另一元件。因此，在一些实施方式中的第一元件可以在其它实施方式中被称为第二元件，而不偏离本说明的教导。
半导体封装可以包括诸如半导体芯片的电子部件，并且半导体芯片可以通过使用管芯锯切工艺将诸如晶片的半导体基板分成多个片来获得。
半导体芯片可以对应于存储芯片或逻辑芯片。存储芯片可以包括集成在半导体基板上和/或半导体基板中的动态随机存取存储(DRAM)电路、静态随机存取存储(SRAM)电路、闪存电路、磁性随机存取存储(MRAM)电路、电阻随机存取存储(ReRAM)电路、铁电随机存取存储(FeRAM)电路或相变随机存取存储(PcRAM)电路。逻辑芯片可以包括被集成在半导体基板上和/或半导体基板中的逻辑电路。半导体封装可以被应用于诸如移动通信设备、与生物或卫生保健相关联的电子系统和可穿戴式电子系统的信息终端。
各种实施方式可以针对具有插座插头互连结构的半导体封装、包括该半导体封装的存储卡和包括该半导体封装的电子系统。
图1至图3是示出根据实施方式的半导体封装10的示例的表示的截面图。图4是示出根据实施方式的半导体封装的插座插头互连结构的示例的表示的截面图。
参照图1，半导体封装10可以包括第一基板100和第二基板200。第一基板100和第二基板200可以被堆叠。半导体封装10可以包括作为用于将第一基板100电连接并且信号连接至第二基板200的连接装置的插座插头互连结构300+410。
第一基板100可以是晶片基板、半导体管芯或半导体芯片，在晶片基板、半导体管芯或半导体芯片上通过半导体工艺实现集成电路。第一基板100可以是封装基板，在该封装基板上或在该封装基板中，当通过封装技术封装半导体管芯或半导体芯片以形成半导体封装时，安装或嵌入半导体管芯或半导体芯片。封装基板可以是PCB(印刷电路板)。第二基板200可以晶片基板、半导体管芯或半导体芯片，在晶片基板、半导体管芯或半导体芯片上通过半导体工艺实现集成电路。第二基板200可以是封装基板，在该封装基板上或在该封装基板中，当通过封装技术封装半导体管芯或半导体芯片以形成半导体封装时，安装或嵌入半导体管芯或芯片。封装基板可以是PCB(印刷电路板)。
第一基板100可以是包括半导体芯片的构件，并且第二基板200可以是封装基板，在该封装基板上要安装半导体芯片。半导体芯片可以足够薄以变形或弯曲。例如，半导体芯片可以通过从外部环境施加的力而变形或弯曲。封装基板可以被引入为具有柔性特性的基板，即，封装基板可以变形或弯曲。
参照图1和图4，提供插座插头互连结构300+410的插座凸块300可以设置在第一基板100的面向第二基板200的第一表面101上。插座凸块300可以用作将第一基板100电连接至第二基板200的连接构件。插头凸块410可以设置在第二基板200的面向第一基板100的第二表面201上以分别对应于插座凸块300。插头凸块410可以被插入设置在插座凸块300内的插槽340中。插头凸块410可以被插入插座凸块300的插槽340中以机械地接触插座凸块300。插头凸块410可以被插入插座凸块300中，使得插头凸块410的侧表面(图4的443)可以与侧壁303的提供插座凸块300的插槽340的内侧表面343接触。
插座凸块300可以包括接触第一基板100的第一表面101的第一底部301和从底部301延伸以与第一表面101垂直或基本垂直的侧壁部303。属于侧壁303的部分可以具有圆柱形特征或者基本圆柱形的特征以在侧壁303内提供插槽340。插座凸块300的第一底部301可以是连接至设置在第一基板100上的其它电路布线线路(未示出)的构件，可以是对应于电路布线线路的一部分的导电线路图案，或者可以是电连接至嵌入或安装在第一基板100中或第一基板100上的其它器件(未示出)的构件。插座凸块300可以包括导电材料。在实施方式中，插座凸块300可以包括诸如(例如，但不限于)Cu或Sn的导电金属。
插头凸块410可以被设置为与接触第二基板100的第二表面201的第二底部403垂直或基本垂直。插头凸块410可以具有从第二表面201朝向第一基板100伸出的形状或者朝向第一基板100直立的柱状的形状。插头凸块410可以插入到插槽340中以沿着插座凸块300的侧壁303的内侧表面343的表面滑动和上下运动。允许插头凸块300的滑动动作的导电界面层可以被引入在插头凸块410的侧表面443的一部分与插座凸块300的内侧的内侧表面343之间，以在插座凸块300与插头凸块410之间进行电连接。但是，可以不包括用于将插头凸块410的侧表面443的部分与插座凸块300的内侧的内侧表面343相结合的结合层的引入，以允许平滑的滑动和上下操作。
用于将插座凸块300电连接至插头凸块410的伸缩式导电连接构件500可以被引入在插座凸块300的第一底部301与插头凸块410的前端405之间。伸缩式导电连接构件500可以能够被拉入。伸缩式导电连接构件500可以是可拉伸的或弹性的。伸缩式导电连接构件500可以被引入，作为当插头凸块410向上运动以接近第一底部301时被按压并且当插头凸块410向下运动并离开第一底部301时延伸的构件。参照图4，伸缩式导电连接构件500的第一端501可以接触插座凸块300的第一底部301。伸缩式导电连接构件500的第二端504可以接触插头凸块410的前端405，使得伸缩式导电连接构件500可以进一步补充插座凸块300与插头凸块410之间的电连接。虽然伸缩式导电连接构件500并不与插座凸块300的第一底部301或插头凸块410的前端405相结合，但是如果插头凸块410被插入到插座凸块300的插槽340中并被按压，则伸缩式导电连接构件500的两个端501和504可以分别与插座凸块300的第一底部301和插头凸块410的前端405接触。另选地，伸缩式导电连接构件500的第一端501可以与插座凸块300的第一底部301的表面341接触和结合。另选地，伸缩式导电连接构件500的第二端504可以与插头凸块410的前端405接触和结合。
伸缩式导电连接构件500可以包括弹性构件，诸如导电弹簧。弹性构件可以随着插头凸块410上下运动而被弹性按压或拉伸，使得弹性构件可以提供弹性恢复力。导电弹簧可以具有从插座凸块300的第一底部301延伸至插头凸块410的前端405的线形弹簧形状。导电弹簧可以具有螺旋形缠绕的弹簧圈的形状以从插座凸块300的第一底部301延伸至插头凸块410的前端405。
参照图1和图2，每个插头凸块410可以被插入到插座凸块300的任一插槽340中以部分地填充该插槽340，例如，仅填充插槽340的一半而不全部填充插槽340，使得第一基板100的第一表面101和第二基板200的第二表面201彼此分开对应于初始距离的第一距离D1。因此，插头凸块410的前端405可以位于距第一表面101第一高度H1的位置处。插头凸块410的前端405可以被引入以与插座凸块300的第一底部301分开预定距离。伸缩式导电连接构件500可以被引入到插座凸块300的第一底部301与插头凸块410的前端405之间的空间中。
参照图2，当第二基板200的两个边缘通过外力向下弯曲，使得第二基板200表现出向内或朝向第一基板100的第一表面101弯曲的哭状(crying shape)或凸状时，第一基板100的中心部分和第二基板200的中心部分可以彼此分开第二距离D2，且第二距离D2可以不同于第一距离D1。例如，当第二基板200表现出朝向第一表面101的凸状时，第二距离D2可以小于第一距离D1。在这种示例中，第一基板100的边缘可以与第二基板200的边缘分开第三距离D3，且第三距离D3可以不同于第一距离D1。例如，当第二基板200表现出朝向第一表面101的凸状时，第三距离D3可以大于第一距离D1。插头凸块410可以根据外力在插槽340中上下运动，并且插头凸块410的每个前端405可以位于距第一基板100的第一表面101的第二高度H2或第三高度H3处。但是，因为插头凸块410的侧部(即，图4的443)与内侧(即，图4的343)仍可以彼此接触，所以可以保持第一基板100与第二基板200之间的电连接。类似地，即使当第一基板100弯曲时，也可以保持第一基板100与第二基板200之间的电连接。
参照图3，当第二基板200的两个边缘通过外力向上弯曲，使得第二基板200表现出向外或离开第一基板100的第一表面101弯曲的笑状(smile shape)或凹状时，第一基板100的中心部分与第二基板200的中心部分可以彼此分开不同于第一距离D1的特定距离，并且第一基板100的边缘与第二基板200的边缘之间的距离也可以改变。但是，因为插头凸块410的侧部(即，图4的443)与插座凸块300的内侧表面343仍可彼此接触，所以可以保持第一基板100与第二基板200之间的电连接。即使当第一基板100弯曲时，也可以保持第一基板100与第二基板200之间的电连接。
图5示出了在根据各种实施方式的半导体封装中采用的其它插座插头互连结构的示例的表示。
参照图5，导电纳米线可以被引入构成插座插头连接结构300+410的插座凸块300的第一底部301与插头凸块410的前端405之间，作为用于将插座凸块300电连接至插头凸块410的伸缩式导电连接构件510。构成伸缩式导电连接构件510的导电纳米线可以从插座凸块300的第一底部301的表面341生长。导电纳米线可以具有弯曲或曲线的形状或者基本垂直直立的形状，并且可以以彼此缠结的结构被引入。导电纳米线可以使用例如但不限于纳米线形成技术从第一底部301生长。
伸缩式导电连接构件510可以包括例如但不限于碳纳米管。该碳纳米管可以使用例如但不限于碳纳米管形成技术从插座凸块300的第一底部301生长。碳纳米管可以从第一底部301生长和排列以基本垂直于第一底部301的表面341。碳纳米管可以具有不连续的弯曲或曲线的形状，并且可以以彼此缠结的结构被引入。
图6示出了在根据各种实施方式的半导体封装中采用的其它插座插头互连结构的示例的表示。
参照图6，将插座凸块300电连接至插头凸块410的伸缩式导电连接构件530可以被引入在插座凸块300的第一底部301的表面341与插头凸块410的前端405之间。伸缩式导电连接构件530可以包括导电弹性材料。该导电弹性材料可以是包括导电颗粒的聚合物材料或导电聚合物材料。
图7和图8示出了在根据各种实施方式的半导体封装中采用的其它插座插头互连结构的示例的表示。
参照图7和图8，插座凸块(即，参见图1-图6)可以包括从插座凸块的底部伸出的侧壁柱1300以提供由该侧壁柱1300环绕或基本环绕的插槽1340。构成每个插座插头互连结构的侧壁柱1300的数量可以是至少两个，使得插槽1340设置在用作例如图4的侧壁部303的侧壁柱1300之间。插头凸块1400可以插入到由侧壁柱1300提供的插槽1340中，并且侧壁柱1300可以用作防止该插头凸块1400从插槽1340分开的限制条。每个侧壁柱1300可以具有比插头凸块1400的线宽更小的线宽。
图9和图10示出了在根据各种实施方式的半导体封装中采用的其它插座插头互连结构的示例的表示。
参照图9和图10，插座凸块(即，参照图1-图6)可以包括从插座凸块的底部伸出的侧壁部2300，并且所述侧壁部2300彼此分开以在侧壁部2300之间提供插槽2340。侧壁部2300的数量可以是至少两个，使得插槽2340被设置在侧壁部2300之间用作图4的侧壁303的一部分。侧壁部2300的数量可以是两个，如图9和图10所示。但是，侧壁部2300的数量不限于两个。例如，在一些实施方式中，侧壁部2300的数量可以是三个或更多，以提供对该插槽2340的环绕。插头凸块2400可以插入到被分开的侧壁部2300环绕或基本环绕的插槽2340中，并且侧壁部2300可以用作防止插头凸块2400从插槽2340分开的限制构件。
图11和图12是示出根据一个实施方式的半导体封装的示例的表示的截面图。
参照图11和图12，半导体封装20可以包括堆叠的第一基板3100和第二基板3200，并且可以进一步包括多个插座插头连接结构3300+3410作为用于将第一基板3100电连接和信号连接至第二基板3200的连接装置。多个插座凸块3300可以分别设置在凸块槽3130中，所述凸块槽3130形成在第一基板3100中，与第一基板3100的第一表面3101相邻。插座凸块3300的第一底部3301可以被定位为覆盖凸块槽3130的底表面，且插座凸块3300的侧壁部3303可以被定位为覆盖凸块槽3130的侧壁部。多个插头凸块3410可以设置在第二基板3200的第二表面3201上。插头凸块3410可以插入在设置在插座凸块3300中的插槽3340中。插头凸块3410可以插入到插槽3340中以提供与插座凸块3300的电连接和机械连接。
伸缩式导电连接构件3500可以被引入以将插座凸块3300电连接至插头凸块3410，并且可以分别设置在插座凸块3300的第一底部3301与插头凸块3410的前端3405之间。伸缩式导电连接构件3500可以被引入，作为当插头凸块3410向上运动以接近第一底部3301时被按压并且当插头凸块3410向下运动离开第一底部3301时延伸的构件。插头凸块3410可以设置为垂直或基本垂直于接触第二基板3200的第二表面3201的第二底部3403。
图13是示出包括含根据实施方式的至少一个半导体封装的存储卡7800的电子系统的示例的表示的框图。
存储卡7800包括诸如非易失性存储装置的存储器7810和存储器控制器7820。存储器7810和存储器控制器7820可以存储数据或读取所存储的数据。存储器7810和/或存储器控制器7820包括设置在根据实施方式(即，参见图1-图11及相关文字)的嵌入式封装中的一个或更多个半导体芯片。存储器7810可以包括应用本公开的实施方式的技术的非易失性存储装置。存储器控制器7820可以控制存储器7810，使得响应于来自主机7830的读请求读出数据/响应于来自主机7830的写请求存储数据。
图14是示出包括根据实施方式(即，参见图1-图13及相关文字)的至少一个封装的电子系统8710的示例的表示的框图。电子系统8710可以包括控制器8711、输入/输出单元8712和存储器8713。控制器8711、输入/输出单元8712和存储器8713可以通过提供数据移动所通过的路径的总线8715彼此联接。
在一个实施方式中，控制器8711可以包括一个或更多个微处理器、数字信号处理器、微控制器和/或能够执行和这些部件所执行的功能相同的功能的逻辑装置。控制器8711或存储器8713可以包括根据本公开实施方式(即，参见图1-图13及相关文字)的一个或更多个半导体封装。输入/输出单元8712可以包括选自小键盘、键盘、显示装置、触摸屏等中的至少一种。存储器8713是用于存储数据的装置。存储器8713可以存储由控制器8711等执行的数据和/或命令。
存储器8713可以包括诸如DRAM的易失性存储装置和/或诸如闪存的非易失性存储装置。例如，闪存可以被安装至诸如移动终端或台式计算机的信息处理系统。闪存可以构成固态磁盘(SSD)。在这种情况下，电子系统8710可以在闪存系统中稳定地存储大量数据。
电子系统8710还可以包括被设置为向通信网络发送数据和从通信网络接收数据的接口8714。接口8714可以是有线型或无线型。例如，接口8714可以包括天线、或有线收发器或无线收发器。
电子系统8710可以被实现为移动系统、个人计算机、工业用计算机、或是执行各种功能的逻辑系统。例如，移动系统可以是个人数字助理(PDA)、便携式计算机、平板计算机、移动电话、智能电话、无线电话、膝上型计算机、存储卡、数字音乐系统、以及信息发送/接收系统中的任一种。
如果电子系统8710是能够执行无线通信的设备，那么电子系统8710可以用于通信系统中，诸如CDMA(code division multiple access，码分多址接入)系统、GSM(globalsystem for mobile communications，全球移动通信)系统、NADC(north Americandigital cellular，北美数字移动蜂窝)系统、E-TDMA(enhanced-time division multipleaccess，增强的时分多址接入)系统、WCDMA(wideband code division multiple access，宽带码分多址接入)系统、CDMA2000、LTE(long term evolution，长期演进)系统以及Wibro(wireless broadband internet，无线宽带网络)系统。
已经出于例示的目的公开了本公开的实施方式。本领域技术人员将理解，在不偏离本公开和随附权利要求的范围和精神的情况下，各种修改、增加和替代是可能的。

Claims (8)

1.一种半导体封装，该半导体封装包括：
第一基板；
插座凸块，所述插座凸块设置在所述第一基板上并且构造为提供插槽；
第二基板；
插头凸块，所述插头凸块设置在所述第二基板上，每个所述插头凸块被构造为分别插入到每个所述插槽中，以分别电连接至所述插座凸块；和
伸缩式导电连接构件，所述伸缩式导电连接构件包括第一端和第二端，所述第一端被构造为电连接在所述插座凸块的在所述插槽内的底表面上，并且所述第二端电连接至所插入的插头凸块的前端。
2.根据权利要求1所述的半导体封装，
其中，所述伸缩式导电连接构件包括导电弹簧；并且
其中，所述导电弹簧的第一端与所述插座凸块的在所述插槽内的表面相结合，并且弹簧构件的另一端与所述插头凸块的前端相结合。
3.根据权利要求2所述的半导体封装，其中，所述导电弹簧包括弹簧圈。
4.根据权利要求1所述的半导体封装，
其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的导电纳米线，并且
其中，所述纳米线是弯曲的或彼此缠结。
5.根据权利要求1所述的半导体封装，其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的弯曲的或缠结的导电碳纳米管。
6.根据权利要求1所述的半导体封装，其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的导电弹性构件。
7.根据权利要求1所述的半导体封装，其中，所述伸缩式导电连接构件包括在所述插座凸块的在所述插槽内的表面与所述插头凸块的前端之间的导电聚合物。
8.一种半导体封装，该半导体封装包括：
第一基板；
插座凸块，所述插座凸块构造为从所述第一基板的表面伸出并且在所述插座凸块内提供插槽；
第二基板，所述第二基板被定位为面向所述第一基板；
插头凸块，所述插头凸块设置为从所述第二基板的表面朝向所述第一基板伸出并且被构造为插入到所述插座凸块的所述插槽中，以及
伸缩式导电连接构件，所述伸缩式导电连接构件包括第一端和第二端，所述第一端被构造为电连接在所述插座凸块的在所述插槽内的底表面上，并且所述第二端电连接至所插入的插头凸块的前端，
其中，所述插头凸块被构造为在所述插槽中通过往复运动来移动，并且分别电连接至所述插座凸块。
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