CN106558569B - 包含柔性翼互连基板的半导体封装 - Google Patents

包含柔性翼互连基板的半导体封装 Download PDF

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CN106558569B
CN106558569B CN201610134264.5A CN201610134264A CN106558569B CN 106558569 B CN106558569 B CN 106558569B CN 201610134264 A CN201610134264 A CN 201610134264A CN 106558569 B CN106558569 B CN 106558569B
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flex
wing
semiconductor packages
fixed part
package substrate
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CN106558569A (zh
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申熙珉
金美英
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SK Hynix Inc
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Hynix Semiconductor Inc
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Abstract

包含柔性翼互连基板的半导体封装。一种半导体封装包括：第一半导体封装；第二半导体封装，所述第二半导体封装设置在所述第一半导体封装上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一半导体封装和所述第二半导体封装之间。

Description

包含柔性翼互连基板的半导体封装
技术领域
本发明的实施方式涉及半导体封装，并且更具体地，涉及包含柔性翼互连基板的半导体封装。
背景技术
在电子产业中，随着多功能、更大的电容性的和更小的半导体封装的发展，对包含多个半导体封装或多个半导体芯片的单个统一封装的需求不断增加。如果在电子系统中采用单个统一封装，则可以减小电子系统的尺寸。单个统一封装中的每一个可以被实现为具有包含垂直地层叠的多个半导体芯片的多芯片封装结构或者包含垂直地层叠的多个半导体封装的层叠封装(PoP)结构。PoP结构可以被实现为包含具有不同的功能的半导体封装。因此，PoP结构已经被广泛地使用在电子产业领域中。
可以通过将顶部封装附接到底部封装上来制造具有PoP结构的封装。当将顶部封装附接到底部封装上时，顶部封装或底部封装可能翘曲(warp)或弯曲，以导致接头失效(joint failure)。顶部封装和底部封装的接头失效可以导致顶部封装和底部封装之间的电断开。因此，已经集中了很多努力以改进顶部封装和底部封装的接头结构的可靠性。
发明内容
根据一个实施方式，一种半导体封装包括：第一半导体封装；第二半导体封装，所述第二半导体封装设置在所述第一半导体封装上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一半导体封装和所述第二半导体封装之间。所述柔性翼互连基板包括：固定部；第一柔性翼，所述第一柔性翼从所述固定部延伸；以及第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸。所述第一柔性翼的一部分与所述第二半导体封装结合，并且所述第二柔性翼的一部分与所述第一半导体封装结合。
根据一个实施方式，一种半导体封装包括：第一封装基板；第二封装基板，所述第二封装基板设置在所述第一封装基板上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一封装基板和所述第二封装基板之间。所述柔性翼互连基板包括：固定部；第一柔性翼，所述第一柔性翼从所述固定部延伸；以及第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸。所述第一柔性翼的一部分与所述第二封装基板结合，并且所述第二柔性翼的一部分与所述第一封装基板结合。
根据一个实施方式，提供了一种包含半导体封装的存储器卡。该半导体封装包括：第一半导体封装；第二半导体封装，所述第二半导体封装设置在所述第一半导体封装上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一半导体封装和所述第二半导体封装之间。所述柔性翼互连基板包括：固定部；第一柔性翼，所述第一柔性翼从所述固定部延伸；以及第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸。所述第一柔性翼的一部分与所述第二半导体封装结合，并且所述第二柔性翼的一部分与所述第一半导体封装结合。
根据一个实施方式，提供了一种包含半导体封装的存储器卡。该半导体封装包括：第一封装基板；第二封装基板，所述第二封装基板设置在所述第一封装基板上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一封装基板和所述第二封装基板之间。所述柔性翼互连基板包括：固定部；第一柔性翼，所述第一柔性翼从所述固定部延伸；以及第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸。所述第一柔性翼的一部分与所述第二封装基板结合，并且所述第二柔性翼的一部分与所述第一封装基板结合。
根据一个实施方式，提供了一种包含半导体封装的电子系统。该半导体封装包括：第一半导体封装；第二半导体封装，所述第二半导体封装设置在所述第一半导体封装上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一半导体封装和所述第二半导体封装之间。所述柔性翼互连基板包括：固定部；第一柔性翼，所述第一柔性翼从所述固定部延伸；以及第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸。所述第一柔性翼的一部分与所述第二半导体封装结合，并且所述第二柔性翼的一部分与所述第一半导体封装结合。
根据一个实施方式，提供了一种包含半导体封装的电子系统。该半导体封装包括：第一封装基板；第二封装基板，所述第二封装基板设置在所述第一封装基板上；以及柔性翼互连基板，所述柔性翼互连基板设置在所述第一封装基板和所述第二封装基板之间。所述柔性翼互连基板包括：固定部；第一柔性翼，所述第一柔性翼从所述固定部延伸；以及第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸。所述第一柔性翼的一部分与所述第二封装基板结合，并且所述第二柔性翼的一部分与所述第一封装基板结合。
附图说明
图1是例示了根据实施方式的层叠封装(PoP)结构的半导体封装的截面图；
图2、图3、图4和图5例示了在根据实施方式的PoP结构的半导体封装中所包含的柔性翼互连基板的各种形状；
图6是例示了根据实施方式的PoP结构的半导体封装的变换形状的截面图；
图7是例示了一般PoP结构的半导体封装的接头失效的截面图；
图8是例示了根据实施方式的层叠封装(PoP)结构的半导体封装的截面图；
图9是采用包含根据一些实施方式的封装中的至少一种封装的存储器卡的电子系统的框图；以及
图10是例示了包含根据一些实施方式的封装中的至少一种封装的电子系统的框图。
具体实施方式
本文中使用的术语可以对应于在实施方式中考虑它们的功能而选择的词，并且术语的含义可以根据实施方式所属领域的普通技术人员而被解释为不同。如果详细地限定，则术语可以根据限义来解释。除非另外限定，否则本文中使用的术语(包括技术术语和科学术语)具有与实施方式所属技术领域的普通技术人员中的一个通常理解的含义相同的含义。各种实施方式旨在包含柔性翼互连基板的半导体封装、包括该半导体封装的存储器卡、以及包括该存储器卡的电子系统。
将要理解的是，虽然可以在本文中使用术语第一、第二、第三等来描述各个元件，但是这些元件不应该受这些术语限制。这些术语通常仅被用来将一个元件与另一个元件区分开来。因此，在不脱离本发明的教导的情况下，一些实施方式中的第一元件能够在其它实施方式中被称为第二元件。
如例如在图中例示的，诸如“在…下方”、“在…下面”、“下面的”、“在…上面”、“上面的”、“顶部”、“底部”等的空间相对的术语可以被用于描述一个元件和/或特征与另一元件和/或特征的关系。将要理解的是，空间相对的术语意在除了包含附图中描述的方位以外，还包含装置在使用和/或操作中所处的不同的方位。例如，当图中的装置被翻转时，被描述为位于其它元件或特征的下面和/或下方的元件将随后被定向在所述其它元件或特征的上方。所述装置可以被按其它方式定向(旋转90度或者在其它方位)，并相应地解释本文中使用的空间相对的描述。
半导体封装可以包含诸如半导体芯片这样的电子装置。可以通过使用管芯锯切工序将诸如晶圆这样的半导体基板分离成多个块来获得半导体芯片。半导体芯片可以与存储器芯片或逻辑芯片(包括专用集成电路(ASIC)芯片)对应。存储器芯片可以包括在半导体基板上集成的动态随机存取存储器(DRAM)电路、静态随机存取存储器(SRAM)电路、闪存电路、磁随机存取存储器(MRAM)电路、电阻式随机存取存储器(ReRAM)电路、铁电随机存取存储器(FeRAM)电路或相变随机存取存储器(PcRAM)电路。逻辑芯片可以包括在半导体基板上集成的逻辑电路。可以在诸如移动电话这样的通信系统、与生物技术或健康保健关联的电子系统、或者可穿戴电子系统中采用半导体封装。
在整个说明书中，相同的附图标记是指相同的元件。因此，即使没有参照一个图提及或描述一个附图标记，也会参照另一个图来提及或描述该附图标记。此外，即使在一个图中未示出一个附图标记，也会在另一个图中提及或描述该附图标记。
参照图1，描述例示了根据实施方式的半导体封装10的截面图。
在图1中，半导体封装10可以被配置为具有层叠封装(PoP)结构。PoP结构可以包括：第一半导体封装100，其与底部半导体封装对应；以及第二半导体封装200，其与层叠在底部半导体封装上的顶部半导体封装对应。虽然图1例示了半导体封装10包括顺序地层叠的第一半导体封装100和第二半导体封装200的示例，但是本发明不限于此。例如，半导体封装10还可以包括第三半导体封装，该第三半导体封装设置在第二半导体封装200上或者设置在第一半导体封装100下面。虽然多芯片封装包括多个半导体芯片，但是半导体封装10的PoP结构可以包括具有一种封装形式的多个半导体封装。具有PoP结构的半导体封装10还可以包括柔性翼互连基板300，该柔性翼互连基板300设置在第一半导体封装100和第二半导体封装200之间。
第一半导体封装100可以被配置为具有单独的封装形式。第一半导体封装100可以包括第一封装基板120、安装在第一封装基板120上的第一半导体芯片110、以及设置在第一封装基板120上以覆盖并包封(encapsulate)第一半导体芯片110的第一保护层130。第一保护层130可以包括覆盖第一封装基板120的第一表面121的介电层。第一保护层130可以包含环氧树脂模制化合物(EMC)材料。在不同的实施方式中，第一保护层130可以被设置为完全覆盖第一半导体芯片110。然而，第一保护层130可以被设置为使第一半导体芯片110的一部分(例如，顶表面111)暴露，以高效地辐射从第一半导体芯片110产生的热。第一半导体芯片110可以包括诸如ASIC芯片这样的逻辑芯片。第一封装基板120可以包括将第一半导体芯片110电连接到外部装置或外部系统的电路互连结构。第一封装基板120还可以包括将第二半导体芯片200电连接到外部装置或外部系统的另一电路互连结构。第一封装基板120可以是印刷电路板(PCB)。另选地，第一封装基板120可以是嵌入有第一半导体芯片110的嵌入式基板。
第一封装基板120可以包括第一迹线(trace)图案123，该第一迹线图案123设置在其第一表面121上以将第一封装基板120电连接到第一半导体芯片110的。第一迹线图案123可以是导电图案。第一迹线图案123可以与在第一封装基板120的第一表面121上设置的电路互连结构的一部分对应。第一迹线图案123可以是接合焊盘(landing pad)，该接合焊盘电连接到第一芯片连接器113，以将第一封装基板120电连接到第一半导体芯片110。第一芯片连接器113可以包括导电凸块(bump)。第二迹线图案124可以设置在第一封装基板120的与第一迹线图案123相反的第二表面122上，以将半导体封装10电连接到外部装置或外部系统。第二迹线图案124可以是导电图案。第二迹线图案124可以与用于将第一半导体封装100或半导体封装10电连接到外部装置或外部系统的电路互连结构的一部分对应。第二迹线图案124可以是附接有外部连接器190的接触焊盘。第一内部连接器125可以穿透第一封装基板120以将第一迹线图案123电连接到第二迹线图案124。第一内部连接器125中的每一个可以包含内部迹线图案或导电通孔中的至少一个。
第一封装基板120可以包括第三迹线图案126，该第三迹线图案126设置在第一封装基板120的第一表面121上，并且电连接到第二半导体封装200。第三迹线图案126可以与设置在第一封装基板120的第一表面121上的电路互连结构的一部分对应。第三迹线图案126可以是与电连接到第二半导体封装200的第一封装连接器140结合的接合焊盘。第一封装连接器140中的每一个可以包括基本上穿透第一保护层130的第一封装连接通孔部141、以及设置在第一封装连接通孔部141的顶部上的第一封装连接接触部143。第一封装连接接触部143可以是诸如焊料层这样的导电粘附层。第一封装连接通孔部141可以是穿透第一保护层130的导电柱或导电通孔。第一封装连接器140中的每一个可以是基本上穿透第一保护层130的通孔。例如，第一封装连接器140中的每一个可以是基本上穿透第一保护层130的穿塑孔(through mold via，TMV)。
第三迹线图案126可以电连接到在第一封装基板120的第二表面122上设置的第二迹线图案124中的一些。第二内部连接器127可以基本上穿透第一封装基板120，以将第三迹线图案126电连接到第二迹线图案124中的一些。第二内部连接器127可以包含内部迹线图案和导电通孔。第三内部连接器128可以设置在第一封装基板120中或者设置在第一封装基板120上，以将第三迹线图案126电连接到第一迹线图案123。由于第三迹线图案126通过第三内部连接器128电连接到第一迹线图案123，因此第一半导体封装100的第一半导体芯片110可以电连接到在第二半导体封装200中设置的第二半导体芯片212和第三半导体芯片214。因此，第一半导体芯片110可以使用电信号来与第二半导体芯片212和第三半导体芯片214通信。
设置在第一半导体封装100上的第二半导体封装200可以具有与第一半导体封装100不同的形状和功能。因此，PoP结构的半导体封装10可以是由多个半导体芯片或者具有不同的功能的多个半导体芯片组成的单个统一封装。
第二半导体封装200可以包括第二半导体芯片212。在一个实施方式中，第二半导体封装200可以被配置为包括多个半导体芯片。例如，第二半导体封装200可以包括在第二封装基板220上顺序地层叠的第二半导体芯片212和第三半导体芯片214。第二半导体芯片212可以具有与第三半导体芯片214相同的功能和形状。然而，在不同的实施方式中，第二半导体芯片212可以具有与第三半导体芯片214不同的功能或不同的尺寸。第二半导体芯片212或第三半导体芯片214可以是存储器半导体芯片。
可以将第二半导体芯片212和第三半导体芯片214的层叠结构安装在第二封装基板220上。另外，第二保护层230可以覆盖并包封第二半导体芯片212和第三半导体芯片214，以保护第二半导体芯片212和第三半导体芯片214。第二保护层230可以包括介电层。第二保护层230可以包含环氧树脂模制化合物(EMC)材料。第二封装基板220可以包括将第二半导体芯片212和第三半导体芯片214电连接到第一半导体封装100的电路互连结构。第二封装基板220可以是印刷电路板(PCB)。另选地，第二封装基板220可以是嵌入有第二半导体芯片212和第三半导体芯片214的嵌入式基板。
第二封装基板220可以具有第三表面221，在该第三表面221上面安装有第二半导体芯片212和第三半导体芯片214。此外，第二封装基板220也可以包含第四迹线图案223，该第四迹线图案223设置在第三表面221上以将第二封装基板220电连接到第二半导体芯片212和第三半导体芯片214。第四迹线图案223可以是导电图案。第四迹线图案223可以与设置在第二封装基板220的第三表面221上的电路互连结构的一部分对应。第四迹线图案223可以是接合焊盘，该接合焊盘电连接到第二芯片连接器213和第三芯片连接器215，以将第二封装基板220电连接到第二半导体芯片212和第三半导体芯片214。第二芯片连接器213和第三芯片连接器215可以是接合线。另选地，第二芯片连接器213和第三芯片连接器215可以是导电凸块。第一芯片接触部216可以设置在第二半导体芯片212的表面上，并且可以与第二芯片连接器213结合。第一芯片接触部216可以是接触焊盘。第二芯片接触部217可以设置在第三半导体芯片214的表面上，并且可以与第三芯片连接器215结合。第二芯片接触部217可以是接触焊盘。
第五迹线图案224可以设置在第二封装基板220的与第二半导体芯片212和第三半导体芯片214相反的第四表面222上，以将第二半导体封装200的第二封装基板220电连接到第一半导体封装100的第一封装基板120。第五迹线图案224可以与用于将第二半导体封装200电连接到第一半导体封装100、柔性翼互连基板300或另一装置的电路互连结构的一部分对应。第五迹线图案224可以是与第二封装连接器240结合的接合焊盘。第四内部连接器227可以基本上穿透第二封装基板220，以将第三迹线图案223电连接到第五迹线图案224。第四内部连接器227中的每一个可以包含内部迹线图案或导电通孔中的至少一个。
与第五迹线图案224结合的第二封装连接器240中的每一个可以是焊球、导电柱或导电螺柱。
再次参照图1，柔性翼互连基板300可以用作用于将第一半导体封装100和第二半导体封装200彼此电连接的互连构件。粘接层180可以设置在柔性翼互连基板300与第一半导体封装100之间，以将第一半导体封装100附接到柔性翼互连基板300。柔性翼互连基板300可以包括基板主体330，该基板主体330具有用于将第一半导体封装100和第二半导体封装200彼此电连接的电路互连结构310。基板主体330可以包含介电材料。更具体地，基板主体330可以包含能够由于外力而翘曲或弯曲的柔性材料。在不同的实施方式中，基板主体330可以包含诸如聚酰亚胺材料这样的柔性聚合物材料。
参照图2和图3，描述了例示图1的柔性翼互连基板300的截面图。
在图1和图2中，柔性翼互连基板300可以将第一半导体封装100和第二半导体封装200彼此电连接。柔性翼互连基板300还可以使得第一半导体封装100即使在第一半导体封装100与第二半导体封装200彼此电连接的同时，也能够相对于第二半导体封装200在垂直方向上或者在水平方向上自由地移动。柔性翼互连基板300的基板主体330可以包括固定部350和从固定部350横向延伸的多个柔性翼370。柔性翼370中的每一个的一端可以固定到固定部350，而柔性翼370中的每一个的另一端可以从固定部350向外延伸。
固定部350可以位于基板主体330的中心部处，并且柔性翼370可以从固定部350的两个侧壁横向地延伸。固定部350可以包括第一固定部351、位于第一固定部351下面的第二固定部352、以及设置在第一固定部351和第二固定部352之间的中间连接器353。中间连接器353可以将第一固定部351与第二固定部352结合。在不同的实施方式中，中间连接器353可以使用粘接层来将第一固定部351与第二固定部352结合。另选地，第一固定部351、第二固定部352和中间连接器353可以包含相同的材料以构成单个统一主体，而如图2所例示在它们之间没有任何异质结。
柔性翼370的第一柔性翼371可以从第一固定部351延伸。柔性翼370的第二柔性翼372可以在与第一柔性翼371相反的方向上从第一固定部351延伸。柔性翼370的第三柔性翼373可以在与第一柔性翼371相同的方向上与第一柔性翼371平行地从第二固定部352延伸。柔性翼370的第四柔性翼374可以在与第三柔性翼373相反的方向上与第二柔性翼372平行地从第二固定部352延伸。第一柔性翼371的面对第三柔性翼373的底表面可以与基板主体330的第一内表面375对应。此外，第三柔性翼373的面对第一柔性翼371的顶表面可以与基板主体330的第二内表面376对应。因此，第一内表面375和第二内表面376可以彼此面对，但是彼此不接合。因此，第一柔性翼371和第二柔性翼372可以彼此面对，并且可以彼此分隔开。结果，因为第一柔性翼371和第三柔性翼373中的每一个包含柔性材料，所以第一柔性翼371和第三柔性翼373可以独立地翘曲或弯曲。在第一柔性翼371和第三柔性翼373中的至少一个由于外力而翘曲以使得第一柔性翼371和第三柔性翼373彼此接触的同时，如果第一柔性翼371和第三柔性翼373二者由于外力而附加地向上或向下翘曲，则第一柔性翼371(或第三柔性翼373)的端部可以沿着第三柔性翼373(或第一柔性翼371)的表面移动。如图2所例示的，第一柔性翼371和第三柔性翼373可以彼此分隔开固定部350的中间连接器353的厚度。第一柔性翼371和第三柔性翼373可以由于外力而翘曲。这可能是因为第一柔性翼371和第三柔性翼373没有彼此接合或固定。与以上讨论相同的移动同样可适用于第二柔性翼372和第四柔性翼374。
如图3所例示的，第三柔性翼373可以由于外力而翘曲，以远离第一柔性翼371。类似地，第二柔性翼372可以由于外力而翘曲，以远离第四柔性翼374。如此，第一柔性翼371和第三柔性翼373中的至少一个可以由于外力而翘曲，使得第一柔性翼371和第三柔性翼373彼此远离或靠近。另外，第二柔性翼372和第四柔性翼374中的至少一个也可以由于外力而翘曲，使得第二柔性翼372和第四柔性翼374彼此远离或靠近。
参照图4，描述了例示包含在图1的半导体封装10中的柔性翼互连基板300的电路互连结构310的分解立体图。
在图1、图2和图4中，电路互连结构310可以设置在柔性翼互连基板300的基板主体330上或者设置在柔性翼互连基板300的基板主体330中，以将第一半导体封装(图1的100)电连接到第二半导体封装(图1的200)。基板主体330的第一外表面331可以面对第一半导体封装100，而基板主体330的第二外表面332可以面对第二半导体封装200。
第六迹线图案311可以设置在基板主体330的第一外表面331上，并且可以电连接到第一半导体封装100。第六迹线图案311也可以被称为基板主体330的第一迹线图案。第六迹线图案311可以用作与第一封装连接器(图1的140)结合的接合焊盘或接触焊盘。由于第一封装连接器140与第六迹线图案311结合，因此第一半导体封装100可以电连接到柔性翼互连基板300。
第七迹线图案312可以设置在基板主体330的第二外表面332上，并且可以电连接到第二半导体封装200。第七迹线图案312也可以被称为基板主体330的第二迹线图案。第七迹线图案312可以用作与第二封装连接器(图1的240)结合的接合焊盘或接触焊盘。由于第二封装连接器240与第七迹线图案312结合，因此第二半导体封装200可以电连接到柔性翼互连基板300。
通孔313可以设置在基板主体330的固定部350中，以基本上穿透固定部350。第八迹线图案315可以设置在基板主体330的第一外表面331上，以将通孔313电连接到第六迹线图案311。第八迹线图案315也可以被称为基板主体330的第三迹线图案。第八迹线图案315可以平行地设置以分别将第六迹线图案311连接到通孔313。
第九迹线图案314可以设置在基板主体330的第二外表面332上，以将通孔313电连接到第七迹线图案312。第九迹线图案314也可以被称为基板主体330的第四迹线图案。第九迹线图案314也可以平行地设置以分别将第七迹线图案312连接到通孔313。第六迹线图案311、第七迹线图案312、第八迹线图案315、第九迹线图案314和通孔313可以构成电路互连结构310。另外，电路互连结构310可以提供将与第二半导体封装200结合的第二封装连接器240电连接到与第一半导体封装100结合的第一封装连接器140的电路径。
参照图5，描述了例示能够替换图2、图3和图4中示出的柔性翼互连基板300的另一柔性翼互连基板301的截面图。在图5中，与图2中所使用的附图标记相同的附图标记指示相同的元件。
在图2和图5中，柔性翼互连基板301的基板主体330可以包括从固定部350横向延伸的多个柔性翼370。如图2中所例示的，固定部350可以是包括第一固定部351、第二固定部352和中间连接器353的单个统一主体。然而，如图5中所例示的，固定部350可以被配置为包括第一固定部351、第二固定部352、以及由与第一固定部351和第二固定部352不同的材料构成的中间连接器353A。中间连接器353A可以包括粘接层，以将第一固定部351与第二固定部352结合。在这种情况下，第一固定部351、第一柔性翼371和第二柔性翼372可以构成与单个统一柔性基板对应的第一柔性基板。另外，第二固定部352、第三柔性翼373和第四柔性翼374可以构成与单个统一柔性基板对应的第二柔性基板。因此，第一柔性基板和第二柔性基板可以通过中间连接器353A的粘接层彼此结合，以构成柔性翼互连基板301。第一柔性基板和第二柔性基板的仅中心部可以通过中间连接器353A彼此结合，使得所述多个柔性翼370彼此进一步地分隔开。
再次参照图1和图2，半导体封装10可以包括第一封装100和层叠在第一封装100上的第二封装200，并且柔性翼互连基板300可以设置在第一封装100和第二封装200之间。从柔性翼互连基板300的固定部350延伸的第一柔性翼371的一部分可以与第二封装基板220结合。另外，从柔性翼互连基板300的固定部350延伸的第三柔性翼373的一部分可以与第一封装基板120结合。类似地，从柔性翼互连基板300的固定部350延伸的第二柔性翼372的一部分可以与第二封装基板220结合。此外，从柔性翼互连基板300的固定部350延伸的第四柔性翼374的一部分可以与第一封装基板120结合。
参照图6，描述了例示包含在图1所示出的PoP结构的半导体封装10中的第一半导体封装100的变换形状的截面图。此外，参照图7，描述了一般PoP结构的半导体封装200的接头失效的截面图。
在图6中，半导体封装10的仅第一半导体封装100可以在第二半导体封装200保持其原始形状而没有任何翘曲的同时翘曲。最近的半导体封装的厚度倾向于减小。因此，第一半导体封装100或第二半导体封装200的厚度也可以减小，以实现紧凑的半导体封装。如果第一半导体封装100或第二半导体封装200的厚度减小，则第一半导体封装100或第二半导体封装200可以容易地翘曲或弯曲。
如图6中所例示的，第一半导体封装100可以翘曲以具有哭形状。第一半导体封装100可以翘曲以使得第一半导体封装100的两端位于比第一半导体封装100的中心部低的水平处。当第一半导体封装100翘曲时，柔性翼互连基板300的第三柔性翼373和第四柔性翼374也可以按照翘曲的第一半导体封装100的形状而翘曲。因此，即使第一半导体封装100翘曲，设置在第三柔性翼373和第四柔性翼374上的第六迹线图案311也仍然可以电连接到第一封装连接器140。
第一封装连接器140的位置可以在第一半导体封装100翘曲时改变。当第一半导体封装100翘曲时，第三柔性翼373和第四柔性翼374也可以翘曲，以改变设置在第三柔性翼373和第四柔性翼374上的第六迹线图案311的位置。第一封装连接器140可以在第一半导体封装100翘曲时移动。此外，当第一半导体封装100翘曲时，第三柔性翼373和第四柔性翼374也可以翘曲。因此，当第一半导体封装100翘曲时，第六迹线图案311和第一封装连接器140可以同时一起移动。随着第一半导体封装100的翘曲而施加到第六迹线图案311和第一封装连接器140的接头部的应力可以通过第三柔性翼373和第四柔性翼374的翘曲来减轻或消除。因此，当第一半导体封装100翘曲时，可以通过减轻施加到第六迹线图案311和第一封装连接器140的接头部的应力来抑制或防止第六迹线图案311和第一封装连接器140之间的接触失效。即使第一半导体封装100翘曲，第六迹线图案311也仍然可以电连接到第一封装连接器140。
如图7中所例示的，构成一般半导体封装20的第一半导体封装21和第二半导体封装22可以通过诸如焊球这样的刚性连接器23彼此结合。在这种情况下，当第一半导体封装21翘曲时，不能够消除或减轻施加到连接器23的应力。因此，当第一半导体封装21翘曲时，会发生连接器23与第一半导体封装21之间的接触失效。然而，即使第一半导体封装100翘曲，图1至图6中所例示的半导体封装10也可以防止或抑制第一半导体封装100与柔性翼互连基板300之间的接触失效。
参照图8，描述了例示根据实施方式的PoP结构的半导体封装30的截面图。
在图8中，半导体封装30可以被配置为包括第一半导体封装2100、层叠在第一半导体封装2100上的第二半导体封装2200、以及设置在第一半导体封装2100和第二半导体封装2200之间以使第一半导体封装2100和第二半导体封装2200彼此电连接的柔性翼互连基板2300。柔性翼互连基板2300和第一半导体封装2100可以通过第一封装连接器2140彼此结合，并且第一封装连接器2140可以是不具有穿塑孔(TMV)形状的焊球。第一半导体封装2100的第一封装基板2120可以通过诸如焊球这样的第一封装连接器2140与柔性翼互连基板2300结合。因此，第一封装基板2120可以电连接到柔性翼互连基板2300。第一封装连接器2140中的每一个可以由单个焊球组成。然而，在不同的实施方式中，第一封装连接器2140中的每一个可以包含多个层叠的焊球，以增加其高度。另选地，第一封装连接器2140中的每一个可以包含金属螺柱或导电柱。
第一半导体封装2100可以包括第一封装基板2120、安装在第一封装基板2120上的第一半导体芯片2110、以及设置在第一封装基板2120上以覆盖并包封第一半导体芯片2110的第一保护层2130。第一保护层2130可以不覆盖第一封装基板2120的一部分，以使第一封装连接器2140暴露。第一保护层2130可以包括例如环氧树脂模制化合物(EMC)材料的介电层。在不同的实施方式中，第一保护层2130可以被设置为完全地覆盖第一半导体芯片2110。另选地，第一保护层2130可以被设置为使第一半导体芯片2110的一部分(例如，顶表面2111)暴露，以用于高效地辐射从第一半导体芯片2110产生的热。
第一封装基板2120可以包含电路互连结构。更具体地，第一迹线图案2123可以设置在第一封装基板2120的第一表面2121上，并且可以电连接到第一半导体芯片2110。第一迹线图案2123可以是导电图案。第一迹线图案2123可以是连接到第一芯片连接器2113的接合焊盘，以将第一封装基板2120电连接到第一半导体芯片2110。第二迹线图案2124可以设置在第一封装基板2120的与第一迹线图案2123相反的第二表面2122上。外部连接器2190可以附接到第二迹线图案2124。第一内部连接器2125可以设置在第一封装基板2120中，以将第一迹线图案2123电连接到第二迹线图案2124。
第一封装基板2120可以包含设置在其第一表面2121上的第三迹线图案2126。第一封装连接器140可以电连接到第三迹线图案2126。第三迹线图案2126可以电连接到第二迹线图案2124中的一些。第二内部连接器2127可以基本上穿透第一封装基板2120，以将第三迹线图案2126电连接到第二迹线图案2124中的一些。第三内部连接器2128可以设置在第一封装基板2120中或者设置在第一封装基板2120上，以将第三迹线图案2126电连接到第一迹线图案2123。
第二半导体封装2200可以包括第二半导体芯片2212。第二半导体封装2200还可以包括层叠在第二半导体芯片2212上的第三半导体芯片2214。第二半导体芯片2212和第三半导体芯片2214的层叠结构可以安装在第二封装基板2220上。另外，第二保护层2230可以覆盖并包封第二半导体芯片2212和第三半导体芯片2214，以保护第二半导体芯片2212和第三半导体芯片2214。第二封装基板2220可以包含电路互连结构。更具体地，第二封装基板2220可以具有第三表面2221，在该第三表面2221上安装有第二半导体芯片2212和第三半导体芯片2214。此外，第四迹线图案2223可以设置在第三表面2221上，以将第二封装基板2220电连接到第二半导体芯片2212和第三半导体芯片2214。第四迹线图案2223中的一些可以电连接到第二芯片连接器2213，而其它的第四迹线图案2223可以电连接到第三芯片连接器2215。第二芯片连接器2213可以延伸以电连接到设置在第二半导体芯片2212的表面上的第一芯片接触部2216。第三芯片连接器2215可以延伸以电连接到设置在第三半导体芯片2214的表面上的第二芯片接触部2217。第二芯片连接器2213和第三芯片连接器2215可以是接合线。
第五迹线图案2224可以设置在第二封装基板2220的与第二半导体芯片2212和第三半导体芯片2214相反的第四表面2222上。第五迹线图案2224可以与第二封装连接器2240结合。第四内部连接器2227可以基本上穿透第二封装基板2220以将第四迹线图案2223电连接到第五迹线图案2224。
柔性翼互连基板2300可以被提供以用作用于使第一半导体封装2100和第二半导体封装2200彼此电连接的互连构件。粘接层2180可以设置在柔性翼互连基板2300和第一半导体封装2100之间，以使第一半导体封装2100附接到柔性翼互连基板2300。柔性翼互连基板2300可以包括具有电路互连结构2310的基板主体2330。柔性翼互连基板2300的基板主体2330可以包括固定部2350和从固定部2350横向延伸的多个柔性翼2370。固定部2350可以包括第一固定部2351、位于第一固定部2351下面的第二固定部2352、以及设置在第一固定部2351和第二固定部2352之间的中间连接器2353。基板主体2330可以具有面对第一半导体封装2100的第一外表面2331和面对第二半导体封装2200的第二外表面2332。第六迹线图案2311可以设置在基板主体2330的第一外表面2331上，并且可以经由第一封装连接器2140电连接到第一半导体封装2100。第七迹线图案2312可以设置在基板主体2330的第二外表面2332上，并且可以经由第二封装连接器2240电连接到第二半导体封装2200。通孔2313可以设置在基板主体2330的固定部2350中，以基本上穿透固定部2350。第八迹线图案2315可以设置在基板主体2330的第一外表面2331上，以使通孔2313电连接到第六迹线图案2311。第九迹线图案2314可以设置在基板主体2330的第二外表面2332上，以使通孔2313电连接到第七迹线图案2312。第六迹线图案2311、第七迹线图案2312、第八迹线图案2315、第九迹线图案2314和通孔2313可以构成电路互连结构2310。
参照图9，描述了例示包括具有根据实施方式的至少一个半导体封装的存储器卡7800的电子系统的框图。存储器卡7800包括存储器控制器7820和诸如非易失性存储器件这样的存储器7810。存储器7810和存储器控制器7820可以存储数据或者读取所存储的数据。存储器7810和/或存储器控制器7820包括设置在根据实施方式的嵌入式封装中的一个或更多个半导体芯片。
存储器7810可以包括应用了本发明的实施方式的技术的非易失性存储器件。存储器控制器7820可以控制存储器7810以使得响应于来自主机7830的读取/写入请求来读出所存储的数据或者存储数据。
参照图10，描述了例示包括根据实施方式的至少一个封装的电子系统8710的框图。电子系统8710可以包括控制器8711、输入/输出装置8712、以及存储器8713。控制器8711、输入/输出装置8712和存储器8713可以经由提供用于数据移动的路径的总线8715而彼此电连接。
在一个实施方式中，控制器8711可以包括一个或更多个微处理器、数字信号处理器、微控制器、和/或能够执行与这些组件相同的功能的逻辑器件。控制器8711或存储器8713可以包括根据本发明的实施方式的半导体封装中的一种或更多种。输入/输出装置8712可以包括在小键盘、键盘、显示装置、触摸屏等当中选择的至少一种。存储器8713是用于存储数据的器件。存储器8713可以存储要由控制器8711执行的数据和/或命令等。
存储器8713可以包括诸如DRAM这样的易失性存储器件和/或诸如闪速存储器这样的非易失性存储器件。例如，闪速存储器可以被安装到诸如移动终端或台式计算机这样的信息处理系统。闪速存储器可以构成固态硬盘(SSD)。在这种情况下，电子系统8710可以将大量数据稳定地存储在闪速存储器系统中。
电子系统8710还可以包括接口8714，该接口8714被配置为向通信网络发送数据和从通信网络接收数据。接口8714可以是有线类型或无线类型。例如，接口8714可以包括天线或者有线或无线收发器。
电子系统8710可以被实现为移动系统、个人计算机、工业用计算机或者执行各种功能的逻辑系统。例如，移动系统可以是下面的项中的任何一个：个人数字助理(PDA)、便携式计算机、平板计算机、移动电话、智能电话、无线电话、膝上型计算机、存储器卡、数字音乐系统、以及信息发送/接收系统。
如果电子系统8710是能够执行无线通信的设备，则电子系统8710可以在诸如码分多址(CDMA)、全球移动通信(GSM)、北美数字移动蜂窝(NADC)、增强型时分多址(E-TDMA)、宽带码分多址(WCDAM)、CDMA2000、长期演进(LTE)和无线宽带互联网(Wibro)这样的通信系统中使用。
出于例示的目的，已公开了本公开的实施方式。本领域技术人员将要领会的是，能够在不脱离本公开和所附的权利要求的范围和精神的情况下进行各种修改、添加和替换。
相关申请的交叉引用
本申请要求于2015年9月21日在韩国知识产权局提交的韩国专利申请No.10-2015-0132792的优先权，该韩国专利申请通过引用的方式全部被并入到本文中，如同其全部在本文中阐述一样。

Claims (26)

1.一种半导体封装，该半导体封装包括：
第一半导体封装和第二半导体封装，所述第二半导体封装设置在所述第一半导体封装上方；以及
柔性翼互连基板，所述柔性翼互连基板设置在所述第一半导体封装和所述第二半导体封装之间，
其中，所述柔性翼互连基板包括：
固定部；
第一柔性翼，所述第一柔性翼从所述固定部延伸，所述第一柔性翼的一部分与所述第二半导体封装结合；以及
第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸，所述第二柔性翼的一部分与所述第一半导体封装结合。
2.根据权利要求1所述的半导体封装，其中，所述柔性翼互连基板还包括：
通孔，所述通孔穿透所述固定部，并且包含导电材料；
第一迹线图案，所述第一迹线图案设置在所述第一柔性翼上，并且电连接到所述第二半导体封装；
第二迹线图案，所述第二迹线图案设置在所述第二柔性翼上，并且电连接到所述第一半导体封装；
第三迹线图案，所述第三迹线图案将所述第一迹线图案电连接到所述通孔；以及
第四迹线图案，所述第四迹线图案将所述第二迹线图案电连接到所述通孔。
3.根据权利要求1所述的半导体封装，
其中，所述柔性翼互连基板的所述固定部包括：
第一固定部，所述第一柔性翼从所述第一固定部延伸；
第二固定部，所述第二柔性翼从所述第二固定部延伸；以及
中间连接器，所述中间连接器位于所述第一固定部和所述第二固定部之间，并且
其中，所述第一固定部、所述第二固定部和所述中间连接器包含相同的材料，以构成单个统一主体。
4.根据权利要求1所述的半导体封装，其中，所述柔性翼互连基板的所述固定部包括：
第一固定部，所述第一柔性翼从所述第一固定部延伸；
第二固定部，所述第二柔性翼从所述第二固定部延伸；以及
粘接层，所述粘接层将所述第一固定部接合到所述第二固定部。
5.根据权利要求1所述的半导体封装，其中，所述第一柔性翼与所述第二柔性翼分隔开，以能够移动。
6.根据权利要求1所述的半导体封装，其中，所述第一柔性翼与所述第二柔性翼的表面接触，并且能够沿着所述第二柔性翼的所述表面移动。
7.根据权利要求1所述的半导体封装，其中，所述第一柔性翼和所述第二柔性翼中的每一个包含能够翘曲或弯曲的柔性材料。
8.根据权利要求1所述的半导体封装，其中，所述柔性翼互连基板的所述固定部支承所述第一柔性翼和所述第二柔性翼。
9.根据权利要求1所述的半导体封装，其中，所述柔性翼互连基板还包括：
第三柔性翼，所述第三柔性翼在与所述第一柔性翼相反的方向上从所述固定部延伸；以及
第四柔性翼，所述第四柔性翼在与所述第二柔性翼相反的方向上与所述第三柔性翼平行地从所述固定部延伸。
10.根据权利要求1所述的半导体封装，其中，所述第一半导体封装包括：
封装基板；
半导体芯片，所述半导体芯片安装在所述封装基板上；
保护层，所述保护层设置在所述封装基板上，以包封所述半导体芯片；以及
封装连接器，所述封装连接器穿透所述保护层，以将所述封装基板电连接到所述第一柔性翼。
11.根据权利要求10所述的半导体封装，其中，所述封装连接器是穿塑孔TMV。
12.根据权利要求1所述的半导体封装，其中，所述第一半导体封装包括：
封装基板；
半导体芯片，所述半导体芯片安装在所述封装基板上；
保护层，所述保护层覆盖所述半导体芯片，并且使所述封装基板的表面的一部分暴露；以及
封装连接器，所述封装连接器与所述封装基板的暴露的表面结合，以将所述封装基板电连接到所述第一柔性翼。
13.根据权利要求12所述的半导体封装，其中，所述封装连接器包含焊球。
14.一种半导体封装，所述半导体封装包括：
第一封装基板和第二封装基板，所述第二封装基板设置在所述第一封装基板上；以及
柔性翼互连基板，所述柔性翼互连基板设置在所述第一封装基板和所述第二封装基板之间，
其中，所述柔性翼互连基板包括：
固定部；
第一柔性翼，所述第一柔性翼从所述固定部延伸，所述第一柔性翼的一部分与所述第二封装基板结合；以及
第二柔性翼，所述第二柔性翼与所述第一柔性翼平行地从所述固定部延伸，所述第二柔性翼的一部分与所述第一封装基板结合。
15.根据权利要求14所述的半导体封装，其中，所述柔性翼互连基板还包括：
通孔，所述通孔穿透所述固定部，并且包含导电材料；
第一迹线图案，所述第一迹线图案设置在所述第一柔性翼上，并且电连接到所述第二封装基板；
第二迹线图案，所述第二迹线图案设置在所述第二柔性翼上，并且电连接到所述第一封装基板；
第三迹线图案，所述第三迹线图案将所述第一迹线图案电连接到所述通孔；以及
第四迹线图案，所述第四迹线图案将所述第二迹线图案电连接到所述通孔。
16.根据权利要求15所述的半导体封装，该半导体封装还包括：
第一封装连接器，所述第一封装连接器将所述第二迹线图案电连接到所述第一封装基板。
17.根据权利要求16所述的半导体封装，该半导体封装还包括：
第一半导体芯片，所述第一半导体芯片安装在所述第一封装基板上；以及
保护层，所述保护层设置在所述第一封装基板上，以包封所述第一半导体芯片，
其中，所述第一封装连接器包含穿透所述保护层的穿塑孔TMV。
18.根据权利要求16所述的半导体封装，该半导体封装还包括：
第二封装连接器，所述第二封装连接器将所述第一迹线图案电连接到所述第二封装基板。
19.根据权利要求18所述的半导体封装，其中，所述第二封装连接器包含焊球。
20.根据权利要求17所述的半导体封装，该半导体封装还包括：
第二半导体芯片，所述第二半导体芯片安装在所述第二封装基板上；以及
接合线，所述接合线将所述第二半导体芯片电连接到所述第二封装基板。
21.根据权利要求14所述的半导体封装，
其中，所述柔性翼互连基板的所述固定部包括：
第一固定部，所述第一柔性翼从所述第一固定部延伸；
第二固定部，所述第二柔性翼从所述第二固定部延伸；以及
中间连接器，所述中间连接器位于所述第一固定部和所述第二固定部之间，并且
其中，所述第一固定部、所述第二固定部和所述中间连接器包含相同的材料，以构成单个统一主体。
22.根据权利要求14所述的半导体封装，其中，所述柔性翼互连基板的所述固定部包括：
第一固定部，所述第一柔性翼从所述第一固定部延伸；
第二固定部，所述第二柔性翼从所述第二固定部延伸；以及
粘接层，所述粘接层将所述第一固定部接合到所述第二固定部。
23.根据权利要求14所述的半导体封装，其中，所述第一柔性翼与所述第二柔性翼分隔开，以能够移动。
24.根据权利要求14所述的半导体封装，其中，所述第一柔性翼与所述第二柔性翼的表面接触，并且能够沿着所述第二柔性翼的所述表面移动。
25.根据权利要求14所述的半导体封装，其中，所述第一柔性翼和所述第二柔性翼中的每一个包含能够翘曲或弯曲的柔性材料。
26.根据权利要求14所述的半导体封装，其中，所述柔性翼互连基板还包括：
第三柔性翼，所述第三柔性翼在与所述第一柔性翼相反的方向上从所述固定部延伸；以及
第四柔性翼，所述第四柔性翼在与所述第二柔性翼相反的方向上与所述第三柔性翼平行地从所述固定部延伸。
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CN106558569A (zh) 2017-04-05
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KR20170034957A (ko) 2017-03-30
TW201712822A (zh) 2017-04-01

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