WO2022186679A1 - Contacteur et son procédé de fabrication - Google Patents

Contacteur et son procédé de fabrication Download PDF

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Publication number
WO2022186679A1
WO2022186679A1 PCT/KR2022/003888 KR2022003888W WO2022186679A1 WO 2022186679 A1 WO2022186679 A1 WO 2022186679A1 KR 2022003888 W KR2022003888 W KR 2022003888W WO 2022186679 A1 WO2022186679 A1 WO 2022186679A1
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WO
WIPO (PCT)
Prior art keywords
contactor
buffer
conductive
mold
pad
Prior art date
Application number
PCT/KR2022/003888
Other languages
English (en)
Korean (ko)
Inventor
구황섭
박종군
윤기상
김경호
Original Assignee
(주)위드멤스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)위드멤스 filed Critical (주)위드멤스
Publication of WO2022186679A1 publication Critical patent/WO2022186679A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Definitions

  • the present invention relates to a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other.
  • an interconnection structure electrically connecting a terminal of a pad under test and a terminal of a pad of a test device is used.
  • the interconnection structure mounted on the test device sends electricity while in contact with the pad of the test object, and the defective pad of the test object is selected according to the signal returned at that time.
  • the interconnection structure may electrically transmit an inspection signal while ensuring contact with the terminal of the pad under test by elastic force.
  • a conventional interconnect structure uses a pogo pin, and the pogo pin includes a hollow pipe, a spring positioned in the pipe, and at least one terminal movable while supported by the spring and the pipe. With this configuration, the pogo pin can electrically transmit the inspection signal while ensuring the contact with the terminal of the subject pad by the elastic force.
  • the present invention is to solve the problems of the prior art described above, a contactor with a simple manufacturing process and low manufacturing cost, which can replace a contact pin such as a conventional pogo pin manufactured by processing and assembling a spring part. would like to provide
  • an embodiment of the present invention is a method of manufacturing a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other, preparing a mold having a receiving part to do; inserting a conductive part into the receiving part; filling a liquid buffer containing conductive particles into the receiving part into which the conductive part is inserted; aligning a magnetic force concentrating member having a magnetic pad formed thereon at a position corresponding to the receiving portion to the mold; curing the buffer unit under preset pressure and temperature conditions; and separating the contactor in which the conductive part and the buffer part are integrally formed from the mold.
  • Another embodiment of the present invention provides a contactor for electrically connecting a pad of an object to be inspected and a pad of an inspection apparatus to each other, the contactor comprising: a conductive part having an insertion part; and a buffer portion containing conductive particles and formed to receive the insertion portion, wherein the buffer portion is cured to a shape accommodating the insertion portion by a phase change and is integrally coupled with the conductive portion. ter can be provided.
  • any one of the means for solving the problems of the present invention described above it is possible to provide a contactor that has a simple structure and is easy to manufacture compared to a conventional pogo pin configuration.
  • the contactor according to the present invention is integrally configured, defects due to processing and assembly tolerances can be improved, and contact resistance can be prevented from being increased due to pinching or damage between components during use.
  • the contactor according to the present invention includes a soft contact configuration, damage applied to an object to be inspected can be minimized, and it is advantageous in miniaturization and high-speed measurement.
  • the conductive part providing electrical connection and rigidity and the buffer part providing elasticity can be firmly coupled integrally.
  • the phase change of the buffer part while aligning the conductive particles can be manufactured to be completely integrated with the conductive part, so that the disadvantage of complicated processes and the risk of breakage or separation during use can be eliminated in the case of assembling.
  • the bonding area is enlarged and a strong coupling can be made.
  • the length of the contactor can be increased by filling and stacking buffer portions in each of the plurality of plates. Accordingly, it is possible to effectively manufacture a contactor having a long shape while maintaining a minute cross-sectional area.
  • FIG. 1 and 2 are views showing embodiments of a contactor according to the present invention.
  • FIG. 3 is a view showing a method of manufacturing a contactor according to the present invention.
  • FIG. 4 to 10 are views illustrating each step of the method for manufacturing the contactor shown in FIG. 3 .
  • FIG. 11 is a cross-sectional view illustrating another embodiment of a contactor according to the present invention.
  • the contactor according to the present invention is a structure for electrically connecting a pad of an inspection apparatus and a pad of an object to be inspected to each other, and may include a probe pin.
  • the contactor 100 may include a conductive part 110 and a buffer part 120 .
  • the contactor 100 according to the present invention has a simple structure and easy assembly compared to the conventional pogo pin configuration. Since the contactor 100 is integrally formed, defects due to processing and assembly tolerances may be improved, and contact resistance may be prevented from increasing due to pinching or damage between components during use.
  • the contactor 100 since the contactor 100 according to the present invention includes a soft contact configuration, damage applied to an object to be inspected during inspection can be minimized.
  • the contactor 100 has the advantage of being more compact than the conventional pogo pin and capable of responding to high-speed measurement.
  • FIG. 3 is a view showing a method for manufacturing a contactor according to the present invention
  • FIGS. 4 to 10 are views showing each step of the method for manufacturing a contactor shown in FIG. 3 . 3 and 4
  • the mold 210 including the receiving part 211 may be prepared in step S110 .
  • the contactor 100 according to the present invention can respond to the miniaturization trend by manufacturing the buffer part 120 connected to the conductive part 110 using the mold 210 without going through an assembly process.
  • the mold 210 is a manufacturing frame made of a metal or resin material for manufacturing the contactor 100 .
  • the mold 210 may be made of a non-magnetic metal or resin. As an example, it may include aluminum (Al) and Torlon.
  • the mold 210 may include a plurality of accommodating parts 211 as shown in FIG. 4 .
  • the mold 210 may form a plurality of accommodating parts 211 based on a predetermined interval.
  • the accommodating part 211 may be formed by laminating a plurality of plates 212 as one mold for manufacturing the contactor 100 . Thereafter, when the contactor 100 is manufactured and the contactor 100 is separated from the mold 210 , the plurality of stacked plates 212 can be removed one by one, so that the mold 210 and the contactor 100 are removed. (100) can be separated more easily, and can be separated without damage to the molded contactor (100).
  • the accommodating part 211 may include a first through-hole 211a and a second through-hole 211b.
  • the second through-hole 211b may have a smaller diameter than the first through-hole 211a.
  • the receiving portion 211 formed on one side of the mold 210 may have a first through hole 211a
  • the receiving portion 211 formed on the other side of the mold 210 may have a second through hole.
  • a hole 211b may be provided.
  • the first through-hole 211a may accommodate the conductive part 110 of the contactor 100 to be described later
  • the second through-hole 211b is used to form a buffer part 120 of the contactor 100 to be described later. can
  • the conductive part 110 may be inserted into the receiving part 211 in step S120 .
  • the conductive part 110 may be inserted in one direction.
  • the conductive part 110 may be formed of a metal material and may include an insertion part 111 .
  • the conductive part 110 may further include a head part 112 connected to the insertion part 111 and having a diameter larger than that of the insertion part 111 and the buffer part 120 .
  • the conductive part 110 may include an insertion part 111 accommodated in the buffer part 120 , and a head part 112 separated from the insertion part 111 .
  • the conductive part 110 may be formed of a material including a ferromagnetic metal, for example, iron, nickel, and/or cobalt.
  • the insertion part 111 and the buffer part 120 of the conductive part 110 have a concentric cylindrical shape, and the diameter of the insertion part 111 is smaller than the diameter of the buffer part 120 .
  • the conductive part 110 and the buffer part 120 may be integrally coupled and formed through the insertion part 111 .
  • the conductive part 110 may be inserted into the receiving part 211 so that the head portion 112 of the conductive part 110 is exposed. That is, the insertion part 111 of the conductive part 110 may be inserted into the receiving part 211 .
  • a part of the conductive part 110 is disposed to be supported on the inner surface of the first through hole 211a, and the other part of the conductive part 110 is disposed at a central portion spaced apart from the inner surface of the second through hole 211b.
  • the head portion 112 of the conductive part 110 is disposed to be supported on the inner surface of the first through hole 211a, and the insertion part 111 of the conductive part 110 is disposed on the inner surface of the second through hole 211b. It may be disposed in a central portion spaced apart from the.
  • the liquid buffer 120 containing conductive particles may be filled in the receiving part 211 in which the conductive part 110 is inserted.
  • the liquid buffer part 120 may be filled in another direction.
  • the liquid buffer unit 120 may be filled in the receiving unit 211 in the other direction by inverting the mold 210 into which the conductive unit 110 is inserted in one direction.
  • the mold 210 in which the head part 112 of the conductive part 110 is inserted into the first through hole 211a is reversely turned over to fill the liquid buffer 120 through the second through hole 211b.
  • the buffer unit 120 may have a shape that contains the conductive particles 121 and accommodates at least a portion of the conductive unit 110 .
  • the buffer part 120 may be formed to accommodate the insertion part 111 .
  • the buffer unit 120 may be accommodated to surround the outer circumferential surface of the insertion portion 111 of the conducting unit 110 and coupled to one surface of the head portion 112 of the conducting unit 110 .
  • the conductive particles 121 contained in the buffer part 120 may be arranged in the longitudinal direction of the buffer part 120 .
  • the conductive particles 121 are in contact with each other to impart conductivity to the buffer unit 120 in the longitudinal direction.
  • the buffer unit 120 is compressed by applying pressure in the longitudinal direction for the inspection of the object, which is an electrical element, the conductive particles 121 become closer to each other and the longitudinal electrical conductivity of the buffer unit 120 may be higher.
  • the conductive particles 121 may be made of a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, etc. or an alloy material of two or more of these metal materials, which are ferromagnetic.
  • the conductive particles 121 may be manufactured by coating the surface of the core metal with a metal having excellent conductivity, such as gold, silver, rhodium, palladium, platinum, or silver and gold, yin and rhodium, silver and palladium. have.
  • the conductive particles 121 are, in order to improve conductivity, a MEMS tip (tip). It may further include flakes, wire rods, carbon nanotubes (CNTs), graphene (graphene), and the like.
  • the step of filling the buffer unit 120 may be alternately performed with sequentially stacking a plurality of plates 212 .
  • the head portion 112 of the conductive unit 110 may be inserted into the first plate 212 , and the second plate 212 may be stacked on the first plate 212 accommodating the conductive unit 110 , , the liquid buffer unit 120 may be filled in the receiving unit 211 of the stacked second plate 212 .
  • the third plate 212 may be stacked, and the buffer part 120 may be formed by filling the buffer part 120 in liquid into the receiving part 211 of the stacked third plate 212 .
  • the plates (the second plate and the third plate) filled with the buffer unit 120 may be sequentially stacked on the plate (the first plate) into which the conductive unit 110 is inserted.
  • the magnetic force concentrating member 220 in which the magnetic pad 221 made of a ferromagnetic material is formed at a position corresponding to the receiving part 211 may be aligned with the mold 210 .
  • the magnetic force concentrating member 220 may include a plurality of magnetic pads 221 spaced apart from each other.
  • the magnetic pad 221 may be made of, for example, a magnetic metal such as nickel (Ni), a nickel-cobalt alloy (NiCo), and iron (Fe).
  • the magnetic force concentrating member 220 may be formed of a weak magnetic material to induce the magnetic force to be concentrated on the magnetic pad 221 .
  • the magnetic force concentrating member 220 is installed in the mold 210 so that the receiving portion 211 is closed by the magnetic pad 221 . ) can be adhered to.
  • the magnetic force concentrating member 220 may be in close contact with the upper end and lower end of the mold 210 in which the liquid buffer unit 120 is filled in the receiving unit 211 .
  • the magnetic pad 221 of the first magnetic force concentrating member 220 may be in close contact with the first through-hole 211a of the mold 210
  • the magnetic pad 221 of the second magnetic force concentrating member 220 may be in close contact with the second through hole 211b of the mold 210 .
  • the magnetic pad 221 is for concentrating the magnetic force of the contactor 100 .
  • the buffer unit 120 may be cured under preset pressure and temperature conditions. Referring to FIG. 8 , in step S150 of curing the buffer unit 120 , at least one of heat and pressure may be applied to the conductive unit 110 and the buffer unit 120 by the magnetic force concentrating member 220 .
  • the buffer unit 120 may be cured to a shape accommodating the insertion portion 111 by a phase change from a liquid phase to a solid phase, and may be integrally coupled with the conductive unit 110 .
  • the buffer part 120 When the buffer part 120 is filled in the accommodating part 211, at least a portion may be in a liquid phase, and the shape may be fixed while being in contact with the accommodating part 211 and the conductive part 110 in the accommodating part 211 . Thereafter, the buffer unit 120 may undergo a phase change to a solid phase, increase in viscosity, and may be cured.
  • the buffer unit 120 may form a structure directly bonded to the conductive unit 110 integrally.
  • the buffer part 120 and the conductive part 110 may be integrally formed by forming a bonding surface with each other, and the contactor 100 may be integrally formed without a bonding medium including an adhesive material or a fastening part. can be formed with
  • the buffer unit 120 may be cured to a shape that accommodates the insertion portion 111 of the conductive unit 110 by external pressure, and the buffer unit 120 is a conductive unit ( It may be cured into a shape to accommodate the insertion portion 111 of the 110 , and may be integrally coupled with the conductive unit 110 . However, even if no additional heat or pressure is applied, the buffer unit 120 may be cured while maintaining the shape and contact state within a preset temperature and pressure range.
  • the liquid buffer unit 120 may be cured by applying heat while applying pressure to the magnetic force concentrating member 220 in close contact with the mold 210 .
  • the buffer unit 120 may be formed of various types of polymer materials.
  • the buffer unit 120 may be implemented with a diene rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and the like and their hydrogen compounds.
  • the buffer unit 120 may be implemented as a block copolymer such as a styrene butadiene block copolymer, a styrene isoprene block copolymer, and their hydrogen compounds.
  • the buffer unit 120 may be implemented with chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylenepropylenediene copolymer, and the like.
  • the buffer unit 120 may be obtained by curing a liquid resin.
  • step S160 the contactor 100 in which the conductive part 110 and the buffer part 120 are integrally formed may be separated from the mold 210 .
  • the magnetic force concentrating member 220 in close contact with the mold 210 may be separated from the mold 210 .
  • the plate 212 accommodating the buffer unit 120 is separated, and then the plate accommodating the conductive unit 110 . (212) can be separated.
  • the second and third plates 212 containing the buffer unit 120 are separated from the contactor 100
  • the first plate 212 containing the conductive unit 110 is separated from the contactor 100 . can be separated from
  • the buffer unit 120 according to the present invention has a cylindrical shape, and the conductive particles 121 are distributed only in the area less than a predetermined radius in the buffer unit 120.
  • the buffer unit 120 has a rod shape extending in one direction, and the conductive particles 121 are distributed only in the central region in the cross section of any figure shape perpendicular to the one direction.
  • the buffer unit 120 may insert the conductive unit 110 on one side, and may include a protruding surface on the other side.
  • the conductive particles 121 may be distributed in the longitudinal direction in the central region of the buffer unit 120 so as to extend from the conductive unit 110 .
  • the buffer part 120 may insert the conductive part 110 on one side, and the conductive particles 121 are located in the central region of the buffer part 120 so as to extend with the conductive part 110 . It can be distributed in the longitudinal direction.
  • the buffer part 120 may insert the conductive parts 110 on both sides, and the conductive particles 121 extend with the conductive parts 110 inserted on both sides. may be distributed in the longitudinal direction in the central region of Referring to (d) of FIG. 11 , the buffer part 120 may include protruding surfaces on both sides, and may include the conductive part 110 in the central region. The conductive particles 121 may be distributed in the longitudinal direction on both sides of the buffer part 120 so as to extend from the conductive part 110 .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un contacteur qui connecte électriquement un support d'un sujet et un support d'un dispositif d'inspection l'un à l'autre, le procédé comprenant les étapes consistant : à préparer un moule équipé d'une unité de réception ; à insérer une unité conductrice dans l'unité de réception ; à remplir l'unité de réception, en y insérant l'unité conductrice, d'une unité tampon de liquide contenant des particules conductrices ; à aligner sur le moule un élément de concentration de force magnétique sur lequel est formé un support magnétique positionné de manière à correspondre à l'unité de réception ; à durcir l'unité tampon dans des conditions de pression et de température prédéterminées ; et à séparer du moule un contacteur ayant l'unité conductrice et l'unité tampon formées d'un seul tenant.
PCT/KR2022/003888 2021-03-05 2022-03-21 Contacteur et son procédé de fabrication WO2022186679A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210029375A KR102301835B1 (ko) 2021-03-05 2021-03-05 컨택터 및 그 제조 방법
KR10-2021-0029375 2021-03-05

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WO2022186679A1 true WO2022186679A1 (fr) 2022-09-09

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PCT/KR2022/003888 WO2022186679A1 (fr) 2021-03-05 2022-03-21 Contacteur et son procédé de fabrication

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WO (1) WO2022186679A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102301835B1 (ko) * 2021-03-05 2021-09-14 (주)위드멤스 컨택터 및 그 제조 방법
KR102616073B1 (ko) * 2021-05-24 2023-12-20 주식회사 나노시스 금속 핀과 탄성 핀을 포함하는 전도성 연결부재 및 그 제조방법

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JP2000322938A (ja) * 1999-05-13 2000-11-24 Jsr Corp 異方導電性シートおよびその製造方法並びに回路装置の電気的検査装置および電気的検査方法
KR20130094100A (ko) * 2012-02-15 2013-08-23 리노공업주식회사 반도체 디바이스를 검사하기 위한 프로브 및 그를 사용하는 테스트 소켓
KR20140143516A (ko) * 2013-06-07 2014-12-17 주식회사 에이엠에스티 프로브의 제조방법 및 이 제조방법에 의해 제조된 단일체형 프로브
KR20200024462A (ko) * 2018-08-28 2020-03-09 주식회사 이노글로벌 양방향 도전성 모듈 및 이의 제조방법
KR102153221B1 (ko) * 2019-05-21 2020-09-07 주식회사 새한마이크로텍 이방 전도성 시트
KR102301835B1 (ko) * 2021-03-05 2021-09-14 (주)위드멤스 컨택터 및 그 제조 방법

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Publication number Priority date Publication date Assignee Title
KR100448254B1 (ko) 2001-12-24 2004-09-10 삼성전기주식회사 슬림형 키보드

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000322938A (ja) * 1999-05-13 2000-11-24 Jsr Corp 異方導電性シートおよびその製造方法並びに回路装置の電気的検査装置および電気的検査方法
KR20130094100A (ko) * 2012-02-15 2013-08-23 리노공업주식회사 반도체 디바이스를 검사하기 위한 프로브 및 그를 사용하는 테스트 소켓
KR20140143516A (ko) * 2013-06-07 2014-12-17 주식회사 에이엠에스티 프로브의 제조방법 및 이 제조방법에 의해 제조된 단일체형 프로브
KR20200024462A (ko) * 2018-08-28 2020-03-09 주식회사 이노글로벌 양방향 도전성 모듈 및 이의 제조방법
KR102153221B1 (ko) * 2019-05-21 2020-09-07 주식회사 새한마이크로텍 이방 전도성 시트
KR102301835B1 (ko) * 2021-03-05 2021-09-14 (주)위드멤스 컨택터 및 그 제조 방법

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