JP2011252766A - 接触子ホルダ - Google Patents
接触子ホルダ Download PDFInfo
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- JP2011252766A JP2011252766A JP2010126062A JP2010126062A JP2011252766A JP 2011252766 A JP2011252766 A JP 2011252766A JP 2010126062 A JP2010126062 A JP 2010126062A JP 2010126062 A JP2010126062 A JP 2010126062A JP 2011252766 A JP2011252766 A JP 2011252766A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
【解決手段】基材21は、その表面212、213上又は該表面の上方であって、信号伝送用接触子3bのプランジャ近傍に、接地用導体層291、292を有する。各接地用導体層は、基材21の表面212、213上において、各接地用接触子に電気的に接続された導体部分241に電気的に接続されており、また信号伝送用接触子とは電気的に接続されないようになっている。
【選択図】図5
Description
Zo = 60/ε1/2・ln(D/d)
2 接触子ホルダ
21 基材
24、25 接触子用孔
291、292 接地用導体層
3a、3b、3c、3d 接触子
31 外殻
32 コイルばね
33 第1プランジャ
34 第2プランジャ
Claims (7)
- 電子デバイスが有する複数の端子のそれぞれを、回路基板の対応する接点に電気的に接続するように構成された接触子ホルダであって、
絶縁性の基材と、
前記基材に形成された複数の孔にそれぞれ挿入され保持された複数の電気伝導性の接触子と、を有し、
前記絶縁性の基材は、該基材の表面上又は該表面の上方に配置された、前記接触子と絶縁されかつ接地される接地用導体層を有し、
前記接地用導体層は、該接地用導体層の面が前記接触子の軸方向に略垂直になるように配置される、接触子ホルダ。 - 前記接触子の軸方向に垂直な方向についての、前記基材の表面から突出する前記接触子の部分と前記接地用導体層との距離は、前記接触子及び前記接地用導体層が容量結合するように設定される、請求項1に記載の接触子ホルダ。
- 前記基材に形成された複数の孔の各々の内表面に導体部分が形成され、
前記複数の電気伝導性の接触子は、前記導体部分と電気的に絶縁されるように、前記複数の孔にそれぞれ挿入され保持され、
前記接触子の各々は、両端のプランジャと、該プランジャを連結する連結部材とを有し、前記プランジャの少なくとも1つは前記基材の厚さ方向に可動に構成される、請求項1又は2に記載の接触子ホルダ。 - 前記接触子の各々は、略円筒状の外殻及び該外殻の両端に設けられたプランジャを有し、前記プランジャの少なくとも1つは前記外殻の軸方向に可動に構成される、請求項3に記載の接触子ホルダ。
- 前記基材内に設けられ、前記導体部分の各々を互いに電気的に接続する接続部をさらに有する、請求項3又は4に記載の接触子ホルダ。
- 前記基材内に配置され、該基材よりも高い誘電率を有する少なくとも1つの層状誘電体と、
前記基材内に配置され、前記層状誘電体の両側に形成された層状導体とを有し、
前記基材内に形成された複数の孔の各々の内表面に形成された導体部分の少なくとも1つは前記層状導体のいずれか1つに電気的に接続されている、請求項3〜5のいずれか1項に記載の接触子ホルダ。 - 前記接触子の外表面と、該接触子が挿入される前記基材の孔の内表面に形成された導体部分との間隙に誘電体が配置される、請求項3〜6のいずれか1項に記載の接触子ホルダ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010126062A JP5960383B2 (ja) | 2010-06-01 | 2010-06-01 | 接触子ホルダ |
CN201180027441.5A CN102934297A (zh) | 2010-06-01 | 2011-05-26 | 触点夹持器 |
EP11790221.3A EP2577814A2 (en) | 2010-06-01 | 2011-05-26 | Contact holder |
US13/697,185 US8911266B2 (en) | 2010-06-01 | 2011-05-26 | Contact holder |
PCT/US2011/038064 WO2011153054A2 (en) | 2010-06-01 | 2011-05-26 | Contact holder |
TW100119096A TW201208213A (en) | 2010-06-01 | 2011-05-31 | Contact holder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010126062A JP5960383B2 (ja) | 2010-06-01 | 2010-06-01 | 接触子ホルダ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011252766A true JP2011252766A (ja) | 2011-12-15 |
JP5960383B2 JP5960383B2 (ja) | 2016-08-02 |
Family
ID=45067237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010126062A Expired - Fee Related JP5960383B2 (ja) | 2010-06-01 | 2010-06-01 | 接触子ホルダ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8911266B2 (ja) |
EP (1) | EP2577814A2 (ja) |
JP (1) | JP5960383B2 (ja) |
CN (1) | CN102934297A (ja) |
TW (1) | TW201208213A (ja) |
WO (1) | WO2011153054A2 (ja) |
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JP2016090419A (ja) * | 2014-11-06 | 2016-05-23 | シャープ株式会社 | 半導体トランジスタのテスト方法、及び、テストソケット |
JP2016191553A (ja) * | 2015-03-30 | 2016-11-10 | 日本発條株式会社 | プローブユニット |
JP2018529951A (ja) * | 2015-09-10 | 2018-10-11 | リーノ インダストリアル インコーポレイテッド | プローブソケット |
WO2019013289A1 (ja) * | 2017-07-13 | 2019-01-17 | 日本発條株式会社 | プローブユニット |
JP2019178947A (ja) * | 2018-03-30 | 2019-10-17 | 山一電機株式会社 | 検査用ソケット |
KR102133675B1 (ko) * | 2019-07-03 | 2020-07-13 | 주식회사 새한마이크로텍 | 테스트용 소켓 |
JP2021517974A (ja) * | 2018-05-25 | 2021-07-29 | リーノ インダストリアル インコーポレイテッド | 検査装置 |
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JP2016090419A (ja) * | 2014-11-06 | 2016-05-23 | シャープ株式会社 | 半導体トランジスタのテスト方法、及び、テストソケット |
JP2016191553A (ja) * | 2015-03-30 | 2016-11-10 | 日本発條株式会社 | プローブユニット |
JP2018529951A (ja) * | 2015-09-10 | 2018-10-11 | リーノ インダストリアル インコーポレイテッド | プローブソケット |
US11320461B2 (en) | 2017-07-13 | 2022-05-03 | Nhk Spring Co., Ltd. | Probe unit |
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JP7372194B2 (ja) | 2020-04-06 | 2023-10-31 | 株式会社日本マイクロニクス | プローブおよび電気的接続装置 |
WO2021261288A1 (ja) * | 2020-06-22 | 2021-12-30 | 株式会社ヨコオ | 検査装置 |
JP2022550400A (ja) * | 2020-06-30 | 2022-12-01 | リーノ インダストリアル インコーポレイテッド | 検査ソケット及びその製造方法 |
JP7333869B2 (ja) | 2020-06-30 | 2023-08-25 | リーノ インダストリアル インコーポレイテッド | 検査ソケット及びその製造方法 |
KR20220043866A (ko) * | 2020-09-29 | 2022-04-05 | (주)티에스이 | 테스트 소켓 |
KR102599969B1 (ko) | 2020-09-29 | 2023-11-08 | 주식회사 티에스이 | 테스트 소켓 |
Also Published As
Publication number | Publication date |
---|---|
CN102934297A (zh) | 2013-02-13 |
US8911266B2 (en) | 2014-12-16 |
EP2577814A2 (en) | 2013-04-10 |
WO2011153054A2 (en) | 2011-12-08 |
WO2011153054A3 (en) | 2012-01-19 |
TW201208213A (en) | 2012-02-16 |
JP5960383B2 (ja) | 2016-08-02 |
US20130065455A1 (en) | 2013-03-14 |
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