AU2001296373A1 - A method and an apparatus for testing electronic devices - Google Patents

A method and an apparatus for testing electronic devices

Info

Publication number
AU2001296373A1
AU2001296373A1 AU2001296373A AU9637301A AU2001296373A1 AU 2001296373 A1 AU2001296373 A1 AU 2001296373A1 AU 2001296373 A AU2001296373 A AU 2001296373A AU 9637301 A AU9637301 A AU 9637301A AU 2001296373 A1 AU2001296373 A1 AU 2001296373A1
Authority
AU
Australia
Prior art keywords
electronic devices
testing electronic
testing
devices
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296373A
Inventor
Kok Hong Chan
Tark Wooi Fong
Chu Aun Lim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001296373A1 publication Critical patent/AU2001296373A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
AU2001296373A 2000-09-29 2001-09-26 A method and an apparatus for testing electronic devices Abandoned AU2001296373A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US67580200A 2000-09-29 2000-09-29
US09/675,802 2000-09-29
PCT/US2001/030364 WO2002027335A2 (en) 2000-09-29 2001-09-26 A method and an apparatus for testing electronic devices

Publications (1)

Publication Number Publication Date
AU2001296373A1 true AU2001296373A1 (en) 2002-04-08

Family

ID=24712034

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001296373A Abandoned AU2001296373A1 (en) 2000-09-29 2001-09-26 A method and an apparatus for testing electronic devices

Country Status (2)

Country Link
AU (1) AU2001296373A1 (en)
WO (1) WO2002027335A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011075313A (en) * 2009-09-29 2011-04-14 Three M Innovative Properties Co Ic device testing socket
JP5960383B2 (en) 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー Contact holder

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866374A (en) * 1984-10-12 1989-09-12 Daymarc Corporation Contactor assembly for testing integrated circuits
US5207584A (en) * 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5923176A (en) * 1991-08-19 1999-07-13 Ncr Corporation High speed test fixture
US5205742A (en) * 1991-08-22 1993-04-27 Augat Inc. High density grid array test socket
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
US5307012A (en) * 1991-12-03 1994-04-26 Intel Corporation Test substation for testing semi-conductor packages
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device

Also Published As

Publication number Publication date
WO2002027335A2 (en) 2002-04-04
WO2002027335A3 (en) 2002-11-07

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