WO2002027335A3 - A method and an apparatus for testing electronic devices - Google Patents

A method and an apparatus for testing electronic devices Download PDF

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Publication number
WO2002027335A3
WO2002027335A3 PCT/US2001/030364 US0130364W WO0227335A3 WO 2002027335 A3 WO2002027335 A3 WO 2002027335A3 US 0130364 W US0130364 W US 0130364W WO 0227335 A3 WO0227335 A3 WO 0227335A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic devices
contact elements
testing electronic
signal line
plane
Prior art date
Application number
PCT/US2001/030364
Other languages
French (fr)
Other versions
WO2002027335A2 (en
Inventor
Tark Wooi Fong
Chu Aun Lim
Kok Hong Chan
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to AU2001296373A priority Critical patent/AU2001296373A1/en
Publication of WO2002027335A2 publication Critical patent/WO2002027335A2/en
Publication of WO2002027335A3 publication Critical patent/WO2002027335A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Abstract

An apparatus comprising a body having a first signal line through a first plane of the body and a second signal line through a second plane of the body. A first set of contact elements extend through the body and are coupled to the first signal line. A second set of contact elements extend through the body and are coupled to the second signal lines. The first set of contact elements and the second set of contact elements correspond to a portion of external contact points of an integrated circuit.
PCT/US2001/030364 2000-09-29 2001-09-26 A method and an apparatus for testing electronic devices WO2002027335A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001296373A AU2001296373A1 (en) 2000-09-29 2001-09-26 A method and an apparatus for testing electronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67580200A 2000-09-29 2000-09-29
US09/675,802 2000-09-29

Publications (2)

Publication Number Publication Date
WO2002027335A2 WO2002027335A2 (en) 2002-04-04
WO2002027335A3 true WO2002027335A3 (en) 2002-11-07

Family

ID=24712034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/030364 WO2002027335A2 (en) 2000-09-29 2001-09-26 A method and an apparatus for testing electronic devices

Country Status (2)

Country Link
AU (1) AU2001296373A1 (en)
WO (1) WO2002027335A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011075313A (en) * 2009-09-29 2011-04-14 Three M Innovative Properties Co Ic device testing socket
JP5960383B2 (en) 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー Contact holder

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3716240A1 (en) * 1986-05-16 1987-12-17 Daymarc Corp Test adaptor, especially for an integrated circuit
EP0498530A2 (en) * 1991-01-09 1992-08-12 David A. Johnson Electrical interconnect contact system
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
US5290193A (en) * 1991-08-22 1994-03-01 Augat Inc. High density grid array test socket
US5307012A (en) * 1991-12-03 1994-04-26 Intel Corporation Test substation for testing semi-conductor packages
US5923176A (en) * 1991-08-19 1999-07-13 Ncr Corporation High speed test fixture
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3716240A1 (en) * 1986-05-16 1987-12-17 Daymarc Corp Test adaptor, especially for an integrated circuit
EP0498530A2 (en) * 1991-01-09 1992-08-12 David A. Johnson Electrical interconnect contact system
US5923176A (en) * 1991-08-19 1999-07-13 Ncr Corporation High speed test fixture
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
US5290193A (en) * 1991-08-22 1994-03-01 Augat Inc. High density grid array test socket
US5307012A (en) * 1991-12-03 1994-04-26 Intel Corporation Test substation for testing semi-conductor packages
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device

Also Published As

Publication number Publication date
WO2002027335A2 (en) 2002-04-04
AU2001296373A1 (en) 2002-04-08

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