AU2001270467A1 - Electronic chip component comprising an integrated circuit and a method for producing the same - Google Patents
Electronic chip component comprising an integrated circuit and a method for producing the sameInfo
- Publication number
- AU2001270467A1 AU2001270467A1 AU2001270467A AU7046701A AU2001270467A1 AU 2001270467 A1 AU2001270467 A1 AU 2001270467A1 AU 2001270467 A AU2001270467 A AU 2001270467A AU 7046701 A AU7046701 A AU 7046701A AU 2001270467 A1 AU2001270467 A1 AU 2001270467A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- integrated circuit
- same
- chip component
- electronic chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H01L2224/0554—External layer
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- H01L2224/05573—Single external layer
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- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
- H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10046296 | 2000-07-17 | ||
DE10046296A DE10046296C2 (en) | 2000-07-17 | 2000-07-17 | Electronic chip component with an integrated circuit and method for its production |
PCT/DE2001/002098 WO2002007209A1 (en) | 2000-07-17 | 2001-06-07 | Electronic chip component comprising an integrated circuit and a method for producing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001270467A1 true AU2001270467A1 (en) | 2002-01-30 |
Family
ID=7656759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001270467A Abandoned AU2001270467A1 (en) | 2000-07-17 | 2001-06-07 | Electronic chip component comprising an integrated circuit and a method for producing the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US6969917B2 (en) |
EP (1) | EP1301942A1 (en) |
JP (1) | JP2004504723A (en) |
CN (1) | CN1254858C (en) |
AU (1) | AU2001270467A1 (en) |
DE (2) | DE10046296C2 (en) |
TW (1) | TW507338B (en) |
WO (1) | WO2002007209A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10046296C2 (en) | 2000-07-17 | 2002-10-10 | Infineon Technologies Ag | Electronic chip component with an integrated circuit and method for its production |
DE10145826C1 (en) * | 2001-09-13 | 2003-01-23 | Siemens Ag | Method, for connecting component to substrate, involves applying underfill material by immersing at least part of component into tank of underfill material before placing component onto substrate |
DE10353676B4 (en) * | 2003-11-17 | 2007-11-29 | Siemens Ag | Method of making an ultrathin module with rough contacts |
DE102006028692B4 (en) | 2006-05-19 | 2021-09-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Electrically conductive connection with an insulating connection medium |
KR20090039411A (en) * | 2007-10-18 | 2009-04-22 | 삼성전자주식회사 | Semiconductor package, module, system having a solder ball being coupled to a chip pad and manufacturing method thereof |
DE102007054692A1 (en) * | 2007-11-12 | 2009-05-20 | Mühlbauer Ag | Method for producing a transponder on a substrate |
DE102008027771A1 (en) * | 2008-06-11 | 2009-12-17 | Giesecke & Devrient Gmbh | Method for installing a chip module in a chip card body |
US8823186B2 (en) | 2010-12-27 | 2014-09-02 | Shin-Etsu Chemical Co., Ltd. | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus |
US8872358B2 (en) | 2012-02-07 | 2014-10-28 | Shin-Etsu Chemical Co., Ltd. | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus |
JP5934078B2 (en) | 2012-11-19 | 2016-06-15 | 信越化学工業株式会社 | Fiber-containing resin substrate and method for manufacturing semiconductor device |
JP5977717B2 (en) * | 2013-07-29 | 2016-08-24 | 信越化学工業株式会社 | Semiconductor encapsulating substrate encapsulating material, semiconductor encapsulating substrate encapsulating material manufacturing method, and semiconductor device manufacturing method |
CN110006282B (en) * | 2018-01-05 | 2020-12-15 | 开文热工科技公司 | Thermal ground plane |
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JPS61124145A (en) * | 1984-11-20 | 1986-06-11 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH0638436B2 (en) * | 1985-02-22 | 1994-05-18 | カシオ計算機株式会社 | Method of joining semiconductor pellet and substrate |
JPS62279643A (en) * | 1986-05-27 | 1987-12-04 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS63119552A (en) * | 1986-11-07 | 1988-05-24 | Sharp Corp | Lsi chip |
JP2647886B2 (en) * | 1988-02-03 | 1997-08-27 | カシオ計算機株式会社 | External electrode forming method for wafer |
US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
JPH07114253B2 (en) | 1989-04-10 | 1995-12-06 | 松下電器産業株式会社 | Method for manufacturing semiconductor device |
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WO1996013066A1 (en) * | 1994-10-20 | 1996-05-02 | National Semiconductor Corporation | Method of attaching integrated circuit dies by rolling adhesives onto semiconductor wafers |
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JP3376203B2 (en) * | 1996-02-28 | 2003-02-10 | 株式会社東芝 | Semiconductor device, method of manufacturing the same, mounting structure using the semiconductor device, and method of manufacturing the same |
JPH09330932A (en) * | 1996-06-10 | 1997-12-22 | Matsushita Electric Ind Co Ltd | Bump formation body and formation of bump |
JP3470789B2 (en) * | 1996-11-15 | 2003-11-25 | 日本特殊陶業株式会社 | Wiring board and method of manufacturing the same |
JP2001510944A (en) * | 1997-07-21 | 2001-08-07 | アギラ テクノロジーズ インコーポレイテッド | Semiconductor flip chip package and method of manufacturing the same |
US6063647A (en) * | 1997-12-08 | 2000-05-16 | 3M Innovative Properties Company | Method for making circuit elements for a z-axis interconnect |
US5888884A (en) * | 1998-01-02 | 1999-03-30 | General Electric Company | Electronic device pad relocation, precision placement, and packaging in arrays |
JP3326382B2 (en) * | 1998-03-26 | 2002-09-24 | 松下電器産業株式会社 | Method for manufacturing semiconductor device |
US6265776B1 (en) * | 1998-04-27 | 2001-07-24 | Fry's Metals, Inc. | Flip chip with integrated flux and underfill |
KR100514559B1 (en) * | 1998-07-01 | 2005-09-13 | 세이코 엡슨 가부시키가이샤 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
JP3710292B2 (en) * | 1998-07-13 | 2005-10-26 | キヤノン株式会社 | Face-down mounting structure |
JP2000150705A (en) * | 1998-11-10 | 2000-05-30 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JP2000164639A (en) * | 1998-11-30 | 2000-06-16 | Nec Kansai Ltd | Semiconductor device and its manufacture |
US8178435B2 (en) * | 1998-12-21 | 2012-05-15 | Megica Corporation | High performance system-on-chip inductor using post passivation process |
US6710454B1 (en) * | 2000-02-16 | 2004-03-23 | Micron Technology, Inc. | Adhesive layer for an electronic apparatus having multiple semiconductor devices |
DE10046296C2 (en) | 2000-07-17 | 2002-10-10 | Infineon Technologies Ag | Electronic chip component with an integrated circuit and method for its production |
-
2000
- 2000-07-17 DE DE10046296A patent/DE10046296C2/en not_active Expired - Fee Related
-
2001
- 2001-06-07 AU AU2001270467A patent/AU2001270467A1/en not_active Abandoned
- 2001-06-07 CN CNB018130070A patent/CN1254858C/en not_active Expired - Fee Related
- 2001-06-07 WO PCT/DE2001/002098 patent/WO2002007209A1/en not_active Application Discontinuation
- 2001-06-07 EP EP01949241A patent/EP1301942A1/en not_active Withdrawn
- 2001-06-07 DE DE10192774T patent/DE10192774D2/en not_active Expired - Fee Related
- 2001-06-07 JP JP2002513013A patent/JP2004504723A/en active Pending
- 2001-07-10 TW TW090116849A patent/TW507338B/en not_active IP Right Cessation
-
2003
- 2003-01-17 US US10/347,324 patent/US6969917B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20030127750A1 (en) | 2003-07-10 |
DE10046296A1 (en) | 2002-02-07 |
DE10046296C2 (en) | 2002-10-10 |
CN1443365A (en) | 2003-09-17 |
US6969917B2 (en) | 2005-11-29 |
CN1254858C (en) | 2006-05-03 |
JP2004504723A (en) | 2004-02-12 |
TW507338B (en) | 2002-10-21 |
DE10192774D2 (en) | 2003-10-09 |
WO2002007209A1 (en) | 2002-01-24 |
EP1301942A1 (en) | 2003-04-16 |
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