AU2002330718A1 - Integrated circuit structure and a method of making an integrated circuit structure - Google Patents
Integrated circuit structure and a method of making an integrated circuit structureInfo
- Publication number
- AU2002330718A1 AU2002330718A1 AU2002330718A AU2002330718A AU2002330718A1 AU 2002330718 A1 AU2002330718 A1 AU 2002330718A1 AU 2002330718 A AU2002330718 A AU 2002330718A AU 2002330718 A AU2002330718 A AU 2002330718A AU 2002330718 A1 AU2002330718 A1 AU 2002330718A1
- Authority
- AU
- Australia
- Prior art keywords
- integrated circuit
- circuit structure
- making
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IES010802 | 2001-09-03 | ||
| IE20010802 | 2001-09-03 | ||
| PCT/IE2002/000128 WO2003021679A2 (en) | 2001-09-03 | 2002-08-30 | Integrated circuit structure and a method of making an integrated circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002330718A1 true AU2002330718A1 (en) | 2003-03-18 |
Family
ID=11042836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002330718A Abandoned AU2002330718A1 (en) | 2001-09-03 | 2002-08-30 | Integrated circuit structure and a method of making an integrated circuit structure |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2002330718A1 (en) |
| WO (1) | WO2003021679A2 (en) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2396252A (en) * | 2002-10-01 | 2004-06-16 | Steven Leftly | Textile light system |
| US7357035B2 (en) | 2003-06-06 | 2008-04-15 | The Board Of Trustees Of The University Of Illinois | Sensor chip and apparatus for tactile and/or flow sensing |
| US7644624B2 (en) | 2004-06-04 | 2010-01-12 | The Board Of Trustees Of The University Of Illinois | Artificial lateral line |
| US7413802B2 (en) | 2005-08-16 | 2008-08-19 | Textronics, Inc. | Energy active composite yarn, methods for making the same, and articles incorporating the same |
| ATE471572T1 (en) * | 2006-04-07 | 2010-07-15 | Koninkl Philips Electronics Nv | ELASTIC DEFORMABLE INTEGRATED CIRCUIT |
| US7661319B2 (en) | 2006-06-02 | 2010-02-16 | The Board Of Trustees Of The University Of Illinois | Micromachined artificial haircell |
| EP2029300A4 (en) | 2006-06-02 | 2013-10-30 | Univ Illinois | Soft mems |
| KR20100014920A (en) * | 2007-02-15 | 2010-02-11 | 디 오스트레일리언 내셔널 유니버시티 | A substrate assembly, an assembly process, and an assembly apparatus |
| WO2008139376A1 (en) * | 2007-05-14 | 2008-11-20 | Philips Intellectual Property & Standards Gmbh | Shading device |
| FR2917895B1 (en) * | 2007-06-21 | 2010-04-09 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING AN ASSEMBLY OF MECHANICALLY CONNECTED CHIPS USING A FLEXIBLE CONNECTION |
| TWI370714B (en) | 2008-01-09 | 2012-08-11 | Ind Tech Res Inst | Circuit structure and menufacturing method thereof |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| WO2010056857A2 (en) * | 2008-11-12 | 2010-05-20 | Mc10, Inc. | Extremely stretchable electronics |
| EP2902294B1 (en) * | 2008-11-12 | 2020-03-04 | Mc10, Inc. | Extremely stretchable electronics |
| EP2386117A4 (en) * | 2009-01-12 | 2017-12-27 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| EP2355144A1 (en) | 2010-02-09 | 2011-08-10 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Component placement on flexible and/or stretchable substrates |
| EP2570006A4 (en) * | 2010-05-12 | 2018-02-28 | Monolithe Semiconductor Inc. | Extendable network structure |
| EP2461658A1 (en) | 2010-12-03 | 2012-06-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate |
| EP2712491B1 (en) | 2011-05-27 | 2019-12-04 | Mc10, Inc. | Flexible electronic structure |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| KR20150031324A (en) | 2012-07-05 | 2015-03-23 | 엠씨10, 인크 | Catheter device including flow sensing |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| WO2014058473A1 (en) | 2012-10-09 | 2014-04-17 | Mc10, Inc. | Conformal electronics integrated with apparel |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| JP2016527649A (en) | 2013-08-05 | 2016-09-08 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | Flexible temperature sensor including compatible electronics |
| CN105705093A (en) | 2013-10-07 | 2016-06-22 | Mc10股份有限公司 | Conformal sensor systems for sensing and analysis |
| WO2015077559A1 (en) | 2013-11-22 | 2015-05-28 | Mc10, Inc. | Conformal sensor systems for sensing and analysis of cardiac activity |
| US10153519B2 (en) | 2013-12-27 | 2018-12-11 | Arizona Board Of Regents On Behalf Of Arizona State University | Deformable origami batteries |
| KR102396850B1 (en) | 2014-01-06 | 2022-05-11 | 메디데이타 솔루션즈, 인코포레이티드 | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
| US10485118B2 (en) | 2014-03-04 | 2019-11-19 | Mc10, Inc. | Multi-part flexible encapsulation housing for electronic devices and methods of making the same |
| WO2016049444A1 (en) | 2014-09-26 | 2016-03-31 | Arizona Board Of Regents On Behalf Of Arizona State University | Stretchable batteries |
| US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
| US10297572B2 (en) | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
| USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
| US10306755B2 (en) | 2014-12-08 | 2019-05-28 | Fujikura Ltd. | Stretchable board |
| WO2016109652A1 (en) | 2015-01-02 | 2016-07-07 | Arizona Board Of Regents On Behalf Of Arizona State University | Archimedean spiral design for deformable electronics |
| US10502991B2 (en) | 2015-02-05 | 2019-12-10 | The Arizona Board Of Regents On Behalf Of Arizona State University | Origami displays and methods for their manufacture |
| US10477354B2 (en) | 2015-02-20 | 2019-11-12 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| US10398343B2 (en) | 2015-03-02 | 2019-09-03 | Mc10, Inc. | Perspiration sensor |
| US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
| WO2017031129A1 (en) | 2015-08-19 | 2017-02-23 | Mc10, Inc. | Wearable heat flux devices and methods of use |
| EP4079383A3 (en) | 2015-10-01 | 2023-02-22 | Medidata Solutions, Inc. | Method and system for interacting with a virtual environment |
| EP3359031A4 (en) | 2015-10-05 | 2019-05-22 | Mc10, Inc. | Method and system for neuromodulation and stimulation |
| US10277386B2 (en) | 2016-02-22 | 2019-04-30 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
| CN108781313B (en) | 2016-02-22 | 2022-04-08 | 美谛达解决方案公司 | System, apparatus and method for a coupled hub and sensor node to obtain sensor information on-body |
| EP3445230B1 (en) | 2016-04-19 | 2024-03-13 | Medidata Solutions, Inc. | Method and system for measuring perspiration |
| US10390698B2 (en) | 2016-06-16 | 2019-08-27 | Arizona Board Of Regents On Behalf Of Arizona State University | Conductive and stretchable polymer composite |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000501230A (en) * | 1995-06-15 | 2000-02-02 | ディコネックス パテンテ アーゲー | Connection board |
| JP3359910B2 (en) * | 1998-01-22 | 2002-12-24 | フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン | Microsystem and method of manufacturing microsystem |
| NO311317B1 (en) * | 1999-04-30 | 2001-11-12 | Thin Film Electronics Asa | Apparatus comprising electronic and / or optoelectronic circuits and method of realizing and / or integrating circuits of this kind in the apparatus |
-
2002
- 2002-08-30 WO PCT/IE2002/000128 patent/WO2003021679A2/en not_active Application Discontinuation
- 2002-08-30 AU AU2002330718A patent/AU2002330718A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003021679A2 (en) | 2003-03-13 |
| WO2003021679A3 (en) | 2003-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |