AU2002364274A1 - Insulation trench for an integrated circuit and method for production thereof - Google Patents
Insulation trench for an integrated circuit and method for production thereofInfo
- Publication number
- AU2002364274A1 AU2002364274A1 AU2002364274A AU2002364274A AU2002364274A1 AU 2002364274 A1 AU2002364274 A1 AU 2002364274A1 AU 2002364274 A AU2002364274 A AU 2002364274A AU 2002364274 A AU2002364274 A AU 2002364274A AU 2002364274 A1 AU2002364274 A1 AU 2002364274A1
- Authority
- AU
- Australia
- Prior art keywords
- production
- integrated circuit
- insulation trench
- trench
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001157785 DE10157785A1 (en) | 2001-11-27 | 2001-11-27 | Isolation trench for an integrated circuit and method for its production |
DE10157785.0 | 2001-11-27 | ||
PCT/EP2002/012838 WO2003046977A2 (en) | 2001-11-27 | 2002-11-15 | Insulation trench for an integrated circuit and method for production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2002364274A8 AU2002364274A8 (en) | 2003-06-10 |
AU2002364274A1 true AU2002364274A1 (en) | 2003-06-10 |
Family
ID=7706915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002364274A Abandoned AU2002364274A1 (en) | 2001-11-27 | 2002-11-15 | Insulation trench for an integrated circuit and method for production thereof |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1449246A2 (en) |
AU (1) | AU2002364274A1 (en) |
DE (1) | DE10157785A1 (en) |
WO (1) | WO2003046977A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10345346B4 (en) | 2003-09-19 | 2010-09-16 | Atmel Automotive Gmbh | A method of manufacturing a semiconductor device having active regions separated by isolation structures |
DE10345345A1 (en) | 2003-09-19 | 2005-04-14 | Atmel Germany Gmbh | Method of manufacturing semiconductor devices in a semiconductor substrate |
DE10348021A1 (en) * | 2003-10-15 | 2005-05-25 | Infineon Technologies Ag | A method of manufacturing a semiconductor structure with encapsulation of a filling used to fill trenches |
US7935602B2 (en) | 2005-06-28 | 2011-05-03 | Micron Technology, Inc. | Semiconductor processing methods |
US7422960B2 (en) | 2006-05-17 | 2008-09-09 | Micron Technology, Inc. | Method of forming gate arrays on a partial SOI substrate |
US7537994B2 (en) | 2006-08-28 | 2009-05-26 | Micron Technology, Inc. | Methods of forming semiconductor devices, assemblies and constructions |
US7939403B2 (en) | 2006-11-17 | 2011-05-10 | Micron Technology, Inc. | Methods of forming a field effect transistors, pluralities of field effect transistors, and DRAM circuitry comprising a plurality of individual memory cells |
US9263455B2 (en) | 2013-07-23 | 2016-02-16 | Micron Technology, Inc. | Methods of forming an array of conductive lines and methods of forming an array of recessed access gate lines |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4106050A (en) * | 1976-09-02 | 1978-08-08 | International Business Machines Corporation | Integrated circuit structure with fully enclosed air isolation |
US5098856A (en) * | 1991-06-18 | 1992-03-24 | International Business Machines Corporation | Air-filled isolation trench with chemically vapor deposited silicon dioxide cap |
JPH05299498A (en) * | 1991-06-22 | 1993-11-12 | Takehide Shirato | Semiconductor device |
EP0540262A2 (en) * | 1991-10-31 | 1993-05-05 | STMicroelectronics, Inc. | Trench isolation region |
KR100242466B1 (en) * | 1996-06-27 | 2000-02-01 | 김영환 | Semiconductor and its fabrication |
KR100234408B1 (en) * | 1997-02-17 | 1999-12-15 | 윤종용 | Isolatoin Method for Smiconductor Device |
US5915192A (en) * | 1997-09-12 | 1999-06-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming shallow trench isolation |
US5972758A (en) * | 1997-12-04 | 1999-10-26 | Intel Corporation | Pedestal isolated junction structure and method of manufacture |
KR100244299B1 (en) * | 1997-12-13 | 2000-03-02 | 김영환 | Isolation region of semiconductor device and method forming the same |
KR100252866B1 (en) * | 1997-12-13 | 2000-04-15 | 김영환 | Semiconductor device and its manufacture method |
US6140691A (en) * | 1997-12-19 | 2000-10-31 | Advanced Micro Devices, Inc. | Trench isolation structure having a low K dielectric material isolated from a silicon-based substrate |
US6214696B1 (en) * | 1998-04-22 | 2001-04-10 | Texas Instruments - Acer Incorporated | Method of fabricating deep-shallow trench isolation |
US6251734B1 (en) * | 1998-07-01 | 2001-06-26 | Motorola, Inc. | Method for fabricating trench isolation and trench substrate contact |
US6268637B1 (en) * | 1998-10-22 | 2001-07-31 | Advanced Micro Devices, Inc. | Method of making air gap isolation by making a lateral EPI bridge for low K isolation advanced CMOS fabrication |
EP1043769A1 (en) * | 1999-04-07 | 2000-10-11 | STMicroelectronics S.r.l. | Process for manufacturing a semiconductor material wafer comprising single-crystal regions separated by insulating material regions, in particular for manufacturing intergrated power devices, and wafer thus obtained |
US6144086A (en) * | 1999-04-30 | 2000-11-07 | International Business Machines Corporation | Structure for improved latch-up using dual depth STI with impurity implant |
US6150212A (en) * | 1999-07-22 | 2000-11-21 | International Business Machines Corporation | Shallow trench isolation method utilizing combination of spacer and fill |
US6833079B1 (en) * | 2000-02-17 | 2004-12-21 | Applied Materials Inc. | Method of etching a shaped cavity |
-
2001
- 2001-11-27 DE DE2001157785 patent/DE10157785A1/en not_active Withdrawn
-
2002
- 2002-11-15 EP EP02799043A patent/EP1449246A2/en not_active Withdrawn
- 2002-11-15 AU AU2002364274A patent/AU2002364274A1/en not_active Abandoned
- 2002-11-15 WO PCT/EP2002/012838 patent/WO2003046977A2/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU2002364274A8 (en) | 2003-06-10 |
WO2003046977A3 (en) | 2004-02-12 |
DE10157785A1 (en) | 2003-06-12 |
EP1449246A2 (en) | 2004-08-25 |
WO2003046977A2 (en) | 2003-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |