AU2000265772A1 - Method for making an integrated circuit capable of being surface-mounted and resulting circuit - Google Patents
Method for making an integrated circuit capable of being surface-mounted and resulting circuitInfo
- Publication number
- AU2000265772A1 AU2000265772A1 AU2000265772A AU6577200A AU2000265772A1 AU 2000265772 A1 AU2000265772 A1 AU 2000265772A1 AU 2000265772 A AU2000265772 A AU 2000265772A AU 6577200 A AU6577200 A AU 6577200A AU 2000265772 A1 AU2000265772 A1 AU 2000265772A1
- Authority
- AU
- Australia
- Prior art keywords
- making
- integrated circuit
- resulting
- circuit capable
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H01L2224/05573—Single external layer
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/FR2000/002063 WO2002007208A1 (en) | 2000-07-18 | 2000-07-18 | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000265772A1 true AU2000265772A1 (en) | 2002-01-30 |
Family
ID=8847160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000265772A Abandoned AU2000265772A1 (en) | 2000-07-18 | 2000-07-18 | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
Country Status (8)
Country | Link |
---|---|
US (1) | US6989591B1 (en) |
EP (1) | EP1314196A1 (en) |
JP (1) | JP2004504722A (en) |
KR (1) | KR20030059078A (en) |
AU (1) | AU2000265772A1 (en) |
CA (1) | CA2416502A1 (en) |
IL (1) | IL154002A0 (en) |
WO (1) | WO2002007208A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002007208A1 (en) * | 2000-07-18 | 2002-01-24 | Atmel Grenoble S.A. | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
JP4744689B2 (en) * | 2000-12-11 | 2011-08-10 | パナソニック株式会社 | Viscous fluid transfer device and electronic component mounting device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4396140A (en) | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
US4722470A (en) * | 1986-12-01 | 1988-02-02 | International Business Machines Corporation | Method and transfer plate for applying solder to component leads |
US4759491A (en) | 1987-05-18 | 1988-07-26 | American Telephone And Telegraph Company | Method and apparatus for applying bonding material to component leads |
JPH01270391A (en) * | 1988-04-22 | 1989-10-27 | Nec Corp | Pre-soldering method |
JPH01278967A (en) * | 1988-05-06 | 1989-11-09 | Senju Metal Ind Co Ltd | Presoldering method for lead of electronic parts |
JP2810101B2 (en) * | 1989-04-17 | 1998-10-15 | 日本エー・エム・ピー株式会社 | Electric pin and method of manufacturing the same |
JPH06132439A (en) * | 1992-10-21 | 1994-05-13 | Ngk Insulators Ltd | Plating method for ceramic package |
JPH08167772A (en) * | 1994-12-14 | 1996-06-25 | Hitachi Ltd | Preliminary soldering method of surface mount electronic parts |
US6007348A (en) | 1996-05-07 | 1999-12-28 | Advanced Intercommunications Corporation | Solder ball terminal |
US5847458A (en) * | 1996-05-21 | 1998-12-08 | Shinko Electric Industries Co., Ltd. | Semiconductor package and device having heads coupled with insulating material |
US5839191A (en) * | 1997-01-24 | 1998-11-24 | Unisys Corporation | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
US6002172A (en) * | 1997-03-12 | 1999-12-14 | International Business Machines Corporation | Substrate structure and method for improving attachment reliability of semiconductor chips and modules |
DE19807279C2 (en) * | 1998-02-23 | 2000-02-17 | Dieter Friedrich | Method for manufacturing an electronic component |
FR2789225B1 (en) * | 1999-02-02 | 2004-09-03 | Thomson Csf | SURFACE MOUNTED INTEGRATED CIRCUIT |
WO2002007208A1 (en) * | 2000-07-18 | 2002-01-24 | Atmel Grenoble S.A. | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
-
2000
- 2000-07-18 WO PCT/FR2000/002063 patent/WO2002007208A1/en active Application Filing
- 2000-07-18 EP EP00953253A patent/EP1314196A1/en not_active Withdrawn
- 2000-07-18 CA CA002416502A patent/CA2416502A1/en not_active Abandoned
- 2000-07-18 AU AU2000265772A patent/AU2000265772A1/en not_active Abandoned
- 2000-07-18 US US10/333,252 patent/US6989591B1/en not_active Expired - Fee Related
- 2000-07-18 KR KR10-2003-7000827A patent/KR20030059078A/en not_active Application Discontinuation
- 2000-07-18 JP JP2002513012A patent/JP2004504722A/en active Pending
- 2000-07-18 IL IL15400200A patent/IL154002A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
IL154002A0 (en) | 2003-07-31 |
KR20030059078A (en) | 2003-07-07 |
EP1314196A1 (en) | 2003-05-28 |
WO2002007208A1 (en) | 2002-01-24 |
JP2004504722A (en) | 2004-02-12 |
CA2416502A1 (en) | 2002-01-24 |
US6989591B1 (en) | 2006-01-24 |
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