TW201741675A - Bidirectional conductive pin, bidirectional conductive pattern module, and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method of manufacturing the same. The bidirectional conductive pin includes: an upper contact part formed by spirally winding a conductive thin plate about a vertical axis, and elastically supporting a terminal of a semiconductor device; a lower contact part formed by spirally winding a conductive thin plate about a vertical axis and elastically supporting a terminal of an inspection circuit substrate; and at least one connection part electrically connecting the upper contact part and the lower contact part. Accordingly, the bidirectional conductive pin may be obtained by pattering the conductive thin plate, forming the upper contact part and the lower contact part respectively having the spiral shape by winding the patterned thin plate, and winding the connection part in a circumferential direction to have a twisted form.

Description

Bidirectional conductive contact pin, bidirectional conductive model module and manufacturing method thereof

The invention relates to a bidirectional conductive stylus. More specifically, the present invention relates to a bidirectional conductive stylus, a bidirectional conductive pattern module, and a method of fabricating the same that can utilize a Pogo-pin to compensate for weaknesses of conventional semiconductor test sockets.

The present application claims the priority of Korean Patent Application No. 10-2016-0066293, filed on Jun. 2, 2016, and the Korean Patent Application No. 10-2016-0134778, filed on This is incorporated herein by reference.

After the semiconductor device is fabricated, an inspection process is performed to determine the electrical performance of the semiconductor device. When a semiconductor test socket (or contactor or connector) is inserted between the semiconductor device and the inspection circuit substrate for electrical connection therebetween, the inspection procedure of the semiconductor device is performed. When manufacturing a semiconductor device, in addition to the final electrical performance test of the semiconductor device, the semiconductor test socket is also used for a burn-in test.

With the development of integrated semiconductor technology, the semiconductor device becomes smaller, and therefore the terminal of the semiconductor device becomes smaller, in other words, the size and interval of the wires in the semiconductor device become smaller. Therefore, the spacing between the conductive models of the test socket is also reduced in size.

However, there are limitations to developing semiconductor test sockets that utilize spring pins to develop semiconductor test sockets that can process integrated semiconductor devices. FIG. 1 to FIG. 3 are diagrams showing an example of a conventional semiconductor test socket using a spring pin disclosed in Korean Patent Application Publication No. 10-2011-0065.

Referring to FIG. 1 to FIG. 3, the conventional semiconductor test socket (100) includes a casing (110) in which a through hole (111) is formed in a vertical direction and corresponds to a terminal (131) of the semiconductor device (130). The position of the spring pin (120) is disposed inside the through hole (111) and electrically connects the terminal (131) of the semiconductor device (130) with the contact pad (141) of the test device (130).

The pogo pin (120) is configured to include a barrel (124) having a cylindrical shape and used as a stylus body; a tip portion (123) formed at a lower portion of the barrel (124); a spring (122) ), disposed inside the barrel (124) and connected to the tip portion (123) and capable of stretching and contracting; and a stylus (121) connected to the opposite side of the spring (122), the spring connecting the contact The tip (123) moves vertically when it contacts the terminal (131) of the semiconductor device (130).

Here, the spring (122) absorbs mechanical shock applied to the stylus (121) and the tip portion (123) by contraction and extension, and electrically connects the terminal (131) of the semiconductor device (130) with the test device (140). The contact pads (141) enable electrical testing of the semiconductor device (130).

A conventional semiconductor test socket using the aforementioned spring pin uses a spring to maintain elasticity in the vertical direction. However, the spring is disposed inside the cylinder and the barrel is inserted into the hole. Therefore, the process of manufacturing this test socket becomes complicated, and the complicated process also increases the manufacturing cost.

In addition, there is a precise spacing that limits the physical implementation of the electrical construction that is resilient in the vertical direction. In addition, conventional semiconductor test sockets have been limited to use in recently developed integrated semiconductor devices.

In order to overcome the limitation of the conventional semiconductor test socket using the pogo pin, a semiconductor test socket using a Pressure Sensitive Conductive Rubber (PCR) socket is proposed, wherein a perforation model is formed in the vertical direction in the colloidal gel. The body is made of an elastic material, and the perforated model is filled with a conductive powder to form a conductive model.

However, semiconductor test sockets using PCR sockets are also limited in that the conductive powder filled in the semiconductor test socket using the PCR socket decomposes and reduces product life.

Therefore, there is a need for semiconductor test sockets that are capable of implementing precise spacing and addressing height limitations or conventional test socket problems.

Therefore, the present invention contemplates the aforementioned problems occurring in the related art, and the present invention is to propose a bidirectional conductive stylus, a bidirectional conductive model module, and a manufacturing method thereof, which can utilize a pogo pin and a PCR socket to make up for the conventional knowledge. The weakness of semiconductor test sockets.

In order to achieve the object, in one aspect, the present invention provides a bidirectional conductive stylus comprising: an upper contact member that transmits through a vertical axis when contacting a terminal of a semiconductor device from a top to a bottom direction Surrounding a spirally wound conductive sheet and the terminal for elastically supporting the semiconductor device; a lower contact member that spirally winds a conductive thin plate around the vertical axis when contacting a terminal of the test circuit substrate from the bottom to the top direction And the terminal for elastically supporting the inspection circuit substrate; and at least one connecting member electrically connecting the upper contact member and the lower contact member.

In the present specification, the upper contact member, the lower contact member, and the connecting member are formed by spirally winding a susceptor model around a vertical axis, and the pedestal model is formed by modeling a conductive sheet.

In addition, the bidirectional conductive stylus may further include: a stylus body, which is made of an elastic insulating material and disposed between the upper contact member and the lower contact member, and the connecting portion is disposed in the stylus body unit.

Furthermore, the bidirectional conductive stylus may further comprise: at least one inner support member extending from the upper contact member toward the lower contact member such that a lower end of the inner support member is spaced apart from the lower contact member by a predetermined distance.

Furthermore, the upper contact member is stepped radially outwards, whereby the radially inner portion of the upper contact member projects upwardly relative to its radially outer portion.

Furthermore, the lower contact member is stepped radially outwards, whereby the radially inner portion of the lower contact member projects downwardly relative to its radially outer portion.

Further, the connecting member is formed to have a predetermined width in the horizontal direction and is disposed between the upper contact member and the lower contact member to support the upper contact member and the lower contact member in the vertical direction.

In another aspect, the present invention provides a bidirectional conductive model module, the model module includes: an insulator; a plurality of conductive stylus pins disposed inside the insulator such that the conductive stylus are spaced apart from each other in a horizontal direction, And the upper part and the lower part of the conductive contact pin are respectively exposed on the outer side of the upper surface and the lower surface of the insulator, wherein each of the conductive contact pins comprises: an upper contact part, which contacts from the top to the bottom direction a terminal of a semiconductor device formed by spirally winding a conductive thin plate around a vertical axis and elastically supporting the terminal of the semiconductor device; and a lower contact member that contacts a terminal of the test circuit substrate from the bottom to the top direction, Formed by spirally winding a conductive sheet around the vertical axis and elastically supporting the terminal of the test circuit substrate; and at least one connecting member electrically connecting the upper contact member and the lower contact member.

In the present specification, the upper contact member, the lower contact member, and the connecting member of the conductive contact pin are formed by spirally winding a susceptor model around a vertical axis, and the pedestal model can be modeled through A conductive thin plate is formed.

In addition, the two-way conductive model module may further include: at least one inner support member extending from the upper contact member toward the lower contact member such that a lower end of the inner support member is spaced apart from the lower contact member by a predetermined distance.

Furthermore, the upper contact member is stepped radially outwards, whereby the radially inner portion of the upper contact member projects upwardly relative to its radially outer portion.

Furthermore, the lower contact member is stepped radially outwards, whereby the radially inner portion of the lower contact member projects downwardly relative to its radially outer portion.

Further, the connecting member is formed to have a predetermined width in the horizontal direction and is disposed between the upper contact member and the lower contact portion to support the upper contact member and the lower contact member in the vertical direction.

In another aspect, the present invention provides a method of fabricating a bidirectional conductive model module, the method comprising: (a) forming a pedestal model by modeling a conductive sheet, the pedestal model comprising: a plurality of upper contact models, Separating from each other in a horizontal direction; a plurality of lower contact models spaced apart from each other in a horizontal direction and spaced apart from the plurality of upper contact models in a vertical direction; and at least one connected model connecting each of the upper contact models Corresponding to one of the lower contact models facing each other; (b) electroless plating the susceptor model; (c) winding the electroless plated pedestal model around the vertical axis, so that they are respectively formed into a spiral shape a plurality of upper contact members and a plurality of lower contact members; and a connection member connecting one of the upper contact members and the lower contact members facing each other.

In the present specification, the method may further include: (d) forming an insulator made of an elastic insulating material, wherein the connecting member is disposed inside the insulator such that upper surfaces of the upper contact members and the like The lower surfaces of the lower contact members are exposed upward and downward, respectively.

Moreover, in forming the pedestal model, the joint model can be formed in a diagonal model that diagonally connects each of the upper contact models to one of the lower contact models that face each other.

Further, in winding the susceptor model, each of the upper contact models is wound around the same vertical axis with respect to one of the lower contact models facing each other, so that an upper contact member is in contact with the lower contact The components may be formed at positions facing each other.

In addition, the method may further include: forming at least one inner support model that protrudes from the upper contact model toward the lower contact model when forming the susceptor model by modeling the conductive thin plate; and forming an inner support member When the susceptor model is wound, it is extended from each of the upper contact members to a relevant one of the lower contact members by winding the inner support model.

Furthermore, the upper contact models are stepped in the horizontal direction or in the vertical direction, so that each of the upper contact members can be stepped radially outward, whereby the radially inner portion of the upper contact member is relative to Its radially outer portion projects upward.

Furthermore, the lower contact models are stepped in the horizontal direction or in the vertical direction, so that each of the lower contact members can be stepped radially outward, whereby the radially inner portion of the upper contact member is opposed to Its radially outer portion projects downward.

Further, the connecting member is formed to have a predetermined width in the horizontal direction, and is disposed between each of the upper contact members and the associated one of the lower contact members to support the upper contact member and the lower portion in the vertical direction Contact parts.

In still another aspect, the present invention provides a method of fabricating a bidirectional conductive stylus, the method comprising: fabricating a bidirectional conductive model module according to a method of fabricating the bidirectional conductive model module; and cutting the bidirectional direction in a vertical direction The insulator of the conductive model module is formed to form a plurality of bidirectional conductive contact pins, such that an upper contact member, a lower contact member, and a connecting member of each of the bidirectional conductive contact pins are connected to each other.

According to the invention constructed using the foregoing construction, the bidirectional conductive stylus is obtained by modeling the conductive thin plate; forming the spiral shape by winding the patterned thin plate by a method such as a molding process The upper contact member and the lower contact member; and the connecting member is wound in a circumferential direction to have a curved shape. Therefore, the bidirectional conductive stylus has elasticity in the vertical direction.

Further, when the upper contact member having a spiral shape contacts a terminal of a semiconductor device, for example, a ball which sequentially contacts the upper contact member from the inside of the spiral to the outside thereof. Therefore, stable contact can be obtained, and when the ball is detached from the sphere, the upper contact member is stably restored.

In addition, since the metal thin plate is modeled into a cylindrical shape by using an etching process, a stamping method, a molding process, or the like, the process is simplified, and thus the manufacturing cost thereof is also reduced.

In addition, a semiconductor test socket in which a plurality of conductive models are formed in the horizontal and depth directions by manufacturing and arranging the two-way conductive model modules in the depth direction can be fabricated.

In the following description, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4a through 4c are diagrams illustrating the principle of forming a bidirectional conductive stylus in accordance with an embodiment of the present invention. 4a to 4c, the bidirectional conductive contact pin (10) according to the present invention includes an upper contact member (11), a lower contact member (12), and a connecting member (13). In addition, the bidirectional conductive contact pin (10) may further include a stylus body (14).

The bidirectional conductive contact pin (10) of the present invention as shown in Figure 4a is fabricated using a susceptor model (100a) formed by modeling a conductive sheet (e.g., a sheet of metal). As shown in FIG. 4a, the susceptor model (100a) includes an upper contact model (11a); a lower contact model (12a); and at least one connection model (13a) connecting the upper contact model (11a) to the lower contact. Model (12a).

When the upper contact model (11a) and the lower contact model (12a) of the susceptor model (100a) are wound twice or more around the vertical axis to form a spiral shape as shown in FIG. 4c, respectively, the two-way according to the present invention is formed. The upper contact member (11) and the lower contact member (12) of the conductive contact pin (10).

In the present specification, as shown in FIG. 4a, in the present invention, the connection model (13a) is formed by adopting a pair of diagonal lines, which diagonally connect the upper contact model (11a) and the lower contact model (12a) facing each other. ). Then, the upper contact model (11a) and the lower contact model (12a) are spirally wound around the vertical axis, and the connection model (13a) also spirally winds the upper contact model (11a) and the lower contact model (12a). Therefore, the connecting member (13a) is formed in a meander shape as shown in Fig. 4b.

When the terminal (for example, a ball) of the semiconductor device contacts the spiral upper contact member (11) from the top to the bottom direction, as shown in FIG. 4c, the spiral portion of the upper contact member (11) will be contacted first (1). ), and the upper contact member (11) moves downward. The spheres are in contact with the spiral portions (2, 3) in order to elastically contact the upper contact members (11). When the ball is disengaged, the upper contact member (11) is restored. In other words, the upper contact member (11) elastically supports the ball when the ball contacts from the top to the bottom.

Also, when the terminal of the test circuit substrate contacts the spiral lower contact member (12) from the bottom to the top direction, the terminal sequentially contacts the lower contact member (12) from the radially inner portion to the radially outer portion. Therefore, when the terminal is contacted from the bottom to the top direction, the lower contact member (12) elastically supports the terminal of the inspection circuit substrate.

Therefore, a conductive line is formed by electrically connecting the upper contact member (11) and the lower contact member (12) through the connecting member (13). Therefore, the bidirectional conductive contact pin (10) can be used to inspect the semiconductor device.

In the present specification, the stylus body (14) is disposed between the upper contact member (11) and the lower contact member (12), and the connecting member (13) is disposed inside the stylus body. The stylus body (14) supports the upper contact member (11) and the lower contact member (12) in the vertical direction. In the present specification, in the present embodiment, the stylus body (14) is made of an elastic insulating material such as silicone.

In the following description, referring to Figures 5a to 5c, 6a and 6b, a method of manufacturing the bidirectional conductive model module (100) and the bidirectional conductive contact pin (10) according to the present invention will be described in detail.

Referring now to Figures 5a through 5c, 6a and 6b, first, a sheet of metal is configured and modeled to form a pedestal model (100a), as shown in Figure 5a. In the present specification, the metal thin plate can be made of a conductive material, but the thin plate can be made conductive by performing a modeling process which will be described later, so that it is not necessary to use a thin plate having a conductive material. In the present specification, the metal thin plate may be made of copper or a copper alloy such as beryllium copper (BeCu). In the present specification, the present invention uses an etching method or a printing method as a method of modeling a metal sheet.

Referring to FIG. 5a, a susceptor model (100a) formed by modeling a thin metal plate includes a plurality of upper contact models (11a); a plurality of lower contact models (12a); and a connection model (13a) connected. Each of the upper contact models (11a) is associated with one of the lower contact models (12a) facing each other. In the present specification, a single group is shown in Fig. 4a, which forms a bidirectional conductive contact pin (10) and is composed of an upper contact model (11a), a lower contact model (12a), and a connection model (13a). The connection model (13a) of the embodiment shown in Fig. 5a has an arc shape curved in the horizontal direction.

A plurality of upper contact models (11a) are formed spaced apart from each other in the horizontal direction. A plurality of lower contact models (12a) are formed spaced apart from each other in the horizontal direction, and a plurality of upper contact models (11a) are spaced apart in the vertical direction.

In the present specification, the pedestal model (100a) may include: an upper support model (121) connecting each of the upper contact model (11a) and the upper connection model (123); and a lower support model (122), It connects each of the lower contact model (12a) and the lower connection model (124) so that a later process using the upper contact model (11a), the lower contact model (12a), and the connected model (13a) can be simultaneously performed.

When the aforementioned susceptor model (100a) is completed, an electroplating process is performed on the susceptor model (100a) to improve conductivity. In the present invention, nickel plating and gold plating are sequentially performed on the susceptor model (100a).

After the electroless plating process is completed, as shown in FIG. 4c, the susceptor model (100a) is wound around the vertical axis such that each of the upper contact models (11a) and each of the lower contact models (12a) One is wound into a spiral. As shown in Fig. 5b, each of the upper contact member (11), the lower contact member (12), and the connecting member (13) is formed. In the present specification, when the contact model (11a) and the lower contact model (12a) are spirally wound, the joint model (13a) is also spirally wound, thereby causing the connecting member (13) to be warped.

In the present specification, one of the upper contact models (11a) and the lower contact model (12a) facing each other is wound around the same vertical axis, thus forming upper contact members (11) facing each other, respectively. With the lower contact part (12).

As described above, when the upper contact member (11), the lower contact member (12), and the connecting member (13) are formed, as shown in Fig. 5c, an insulator (110) is formed on the upper contact member (11) and the lower contact member. (12), such that each of the upper surfaces of the upper contact members (11) and each of the lower surfaces of the lower contact members (12) are exposed upward and downward, respectively. In the example shown in Figure 5c, the insulator (110) forms a connecting member (13) included therein and covers a portion of the lower member of the upper contact member (11) and a portion of the lower contact member (12) component.

In a specific embodiment, the susceptor model (100a) shown in Figure 5b is in a molded configuration and is in a liquid silicone injection molding. The insulator (110) is formed by solidifying liquid silicone. Therefore, the upper surface of the upper contact member (11) and the lower surface of the lower contact member (12) are exposed to the outside of the insulator (110), and the opposite surface of the upper contact member (11) and the lower contact member (12) The connecting member (13) is disposed inside the insulator (110).

When the insulator (110) is obtained by using the foregoing process, the upper connection model (123) and the lower connection model (124) are cut along the boundary line (C1, C2) shown in FIG. 5c by using a laser cutting method. And obtain a bidirectional conductive model module (100), as shown in Figure 6a.

Referring to FIG. 6a, in the bidirectional conductive model module (100), a plurality of bidirectional conductive contact pins (10) are formed inside the insulator (110), wherein the bidirectional conductive contact pins (10) are spaced apart from each other in the horizontal direction. In the present specification, each of the plurality of bidirectional conductive contact pins (10) is formed to include an upper contact member (11), a lower contact member (12), and a connecting member (13). In addition, each of the plurality of bidirectional conductive contact pins (10) forms a bidirectional conductive line in a vertical direction.

Further, when a plurality of bidirectional conductive model modules (100) are arranged in the depth direction, a semiconductor test socket having a plurality of conductive models in the horizontal and depth directions can be constructed.

Further, when the bidirectional conductive model module (100) is cut along the boundary line (C3) shown in Fig. 6a by a laser cutting method, a single bidirectional conductive stylus (10) can be obtained, as shown in Fig. 6b. The insulator (110) remaining between the upper contact member (11) and the lower contact member (12) becomes a stylus body (14). A single bidirectional conductive stylus (10) can be substituted for conventional pogo pins.

Figures 7a, 7b, 8a, 8b, 9, 10a to 10d, 11a and 11b are diagrams showing various examples of a susceptor model (100a) in accordance with the present invention. The scope of the technical concept according to the present invention is as described above, and various examples of the susceptor model shown in FIGS. 7a, 7b, 8a, 8b, 9, 10a to 10d, 11a, and 11b, and other modified examples are in the present invention. Within the spirit. In other words, in addition to the examples shown in the present invention, a skilled person can easily fabricate a susceptor model (100a) in accordance with various modified examples within the spirit of the present invention.

In a specific embodiment, FIGS. 10a to 10d show example shapes of the upper contact member (11) and the lower contact member (12) which are changed according to the shapes of the upper contact model (11a) and the lower contact model (12a). Further, in the example shown in FIG. 11a, when the inner support model (15a) is formed to extend from the upper contact model (11a) to the lower contact model (12a), the inner support member (15) is formed in the insulator (110) or Inside the stylus body (14), as shown in Figure 11b. In the present specification, when forming a susceptor model (100a) in which a conductive sheet is modeled, the inner support model (15a) can be formed by modeling a metal sheet.

In the following description, a bidirectional conductive contact pin (10') according to another embodiment of the present invention will be described with reference to Figs. 12a and 12b.

Referring to Figures 12a and 12b, the bidirectional conductive stylus (10') according to the present invention includes an upper contact member (11'), a lower contact member (12'), and a connecting member (13'). Moreover, as in the previous embodiment, the bidirectional conductive stylus (10') can include an inner support member (15') and a stylus body (14).

In the present specification, in the specific embodiment shown in Figs. 12a and 12b, as shown in Fig. 12a, the upper contact model (11a') is stepped in the horizontal direction. Therefore, when the upper contact mold (11a') is spirally wound around the vertical shaft to form the upper contact member (11'), the radially inner portion of the upper contact member (11') projects upward with respect to its radially outer portion, such as Figure 12b shows. In other words, the upper contact member (11') is stepped radially outward.

Therefore, when the terminal of a semiconductor device contacts the upper surface of the upper contact member (11'), the terminal first contacts the radially inner portion of the upper contact member (11'), whereby the upper contact member (11') moves downward. . The terminal is capable of elastically and stably contacting the upper contact member (11') by additionally contacting the radially outer portion of the upper contact member (11').

In the particular embodiment illustrated in Figures 12a and 12b, the upper contact model (11a') is stepped in the horizontal direction. However, in the specific embodiment shown in Figures 10b, 10c and 10d, the upper contact model (11a') is stepped in the vertical direction and can form an upper contact member (11'), wherein a radially inner portion is opposite to A radially outer portion projects upward.

Similarly, as shown in Fig. 12a, the lower contact model (12a') is stepped in the horizontal direction. Therefore, when the lower contact member (12') is formed by spirally winding the lower contact mold in the vertical direction to form the lower contact member (12'), the lower contact member (12') is formed, wherein the lower contact member (12') The radially inner portion projects downward with respect to its radially outer portion. In other words, as shown in Fig. 12b, the lower contact member (12') is stepped radially outward.

Therefore, when the terminal of the inspection circuit substrate contacts the lower surface of the lower contact member (12'), the terminal first contacts the radially inner portion of the lower contact member (12'), and the lower contact member (12') moves upward. The terminal is capable of elastically and stably contacting the lower contact member (12') by additionally contacting the radially outer portion of the lower contact member (12').

In the particular embodiment illustrated in Figures 12a and 12b, the lower contact model (12a') is stepped in the horizontal direction. However, in the specific embodiment shown in Figures 10b, 10c and 10d, the lower contact model (12a') is stepped in the vertical direction and the lower contact member (12'), wherein the diameter of the lower contact member (12') The inside is extended downward with respect to its radially outer portion.

In the following description, a bidirectional conductive contact pin (10A) according to another embodiment of the present invention will be described with reference to Figs. 13a and 13b.

Referring to Figures 13a and 13b, the bidirectional conductive contact pin (10A) according to the present invention comprises an upper contact member (11¢¢), a lower contact member (12¢¢), and a connecting member (13¢¢). . The embodiment shown in Figures 13a and 13b does not include an inner support member (15').

Moreover, in the particular embodiment illustrated in Figures 13a and 13b, the bidirectional conductive stylus (10A) does not include a stylus body (14). A connecting member (13¢¢) is disposed between the upper contact member (11¢¢) and the lower contact member (12) to support the upper contact member (11¢¢) and the lower contact member (12¢¢). In the embodiment shown in Figures 13a and 13b, a connection model (13a) is formed in the horizontal direction to have a predetermined width, as shown in Figure 13a, and when an upper contact model (11a) is in contact with When the model (12a¢¢) is spirally wound around the vertical axis, the connection model (13a') is also wound. In the present specification, the connecting member (13¢¢) is formed in a cylindrical shape by the connection model (13a¢¢) as shown in FIG. 13b, and supports the upper contact member (11¢¢) and the lower contact member in the vertical direction ( 12¢¢).

In the present specification, the horizontal width of the connection model (13a¢¢) may be a width capable of forming a cylindrical shape or forming a part of a cylindrical shape.

Although the preferred embodiment of the present invention has been described for the purpose of illustration, it is understood that the various modifications, additions and substitutions may be made without departing from the scope and spirit of the invention. . Accordingly, the exemplary embodiments are merely illustrative and not limiting. The scope of the present invention is as described in the following "the scope of the patent application", and is not described in the "detailed description", and all changes or modifications of the meaning, scope and equivalent patents of the scope of the patent application should be included in Within the scope of the invention.

1‧‧‧Spiral part 2‧‧‧ helical part 3‧‧‧ helical part
10‧‧‧Two-way conductive stylus
10¢‧‧‧Two-way conductive stylus
10¢¢‧‧‧Two-way conductive stylus
11‧‧‧Upper contact parts
11¢‧‧‧Upper contact parts
11¢¢‧‧‧Upper contact parts
11a‧‧‧Contact model
11a¢‧‧‧Contact Model
11a¢¢‧‧‧Contact Model
12‧‧‧ Lower contact parts
12¢‧‧‧Contact parts
12¢¢‧‧‧Contact parts
12a‧‧‧ contact model
12a¢‧‧‧ contact model
12a¢¢‧‧‧ contact model
13‧‧‧Connecting parts
13¢‧‧‧Connecting parts
13¢¢‧‧‧Connecting parts
13a‧‧‧Connection model
13a¢‧‧‧connection model
13a¢¢‧‧‧connection model
14‧‧‧ stylus body
15‧‧‧ Inner support parts
15¢‧‧‧ Inner support parts
15a‧‧‧ internal support model
100‧‧‧Two-way conductive model module
100a‧‧‧Base model
110‧‧‧Insulator
111‧‧‧through hole
120‧‧ ‧ spring needle
121‧‧‧Upper support model
122‧‧‧lower support model
123‧‧‧Uplink model
124‧‧‧Connected model
130‧‧‧Semiconductor device
131‧‧‧terminal
140‧‧‧Testing device
141‧‧‧Touch pads
C1‧‧ ‧ boundary line
C2‧‧‧ boundary line
C3‧‧ ‧ boundary line

The above and other objects, features, and other advantages of the present invention will become more apparent from 4a, 4b, and 4c are diagrams illustrating the principle of forming a bidirectional conductive stylus in accordance with an embodiment of the present invention; Figures 5a through 5c, 6a and 6b illustrate the fabrication of a bidirectional conductive stylus and a bidirectional conductive model in accordance with the present invention. A diagram of the method of the module. Figures 7a, 7b, 8a, 8b, 9, 10a to 10d, 11a and 11b are diagrams showing various examples of a susceptor model in accordance with the present invention; and Figures 12a, 12b, 13a and 13b are diagrams showing another embodiment in accordance with the present invention. A diagram of an example of a bidirectional conductive stylus of a particular embodiment.

1‧‧‧Spiral part

2‧‧‧Spiral part

3‧‧‧ spiral part

10‧‧‧Two-way conductive stylus

11‧‧‧Upper contact parts

11a‧‧‧Contact model

12‧‧‧ Lower contact parts

12a‧‧‧ contact model

13‧‧‧Connecting parts

13a‧‧‧Connection model

14‧‧‧ stylus body

100a‧‧‧Base model

Claims (22)

A bidirectional conductive contact pin comprising: an upper contact member formed by spirally winding a conductive thin plate around a vertical axis, and elastically supporting the terminal of the semiconductor device when contacting a terminal of a semiconductor device from a top to bottom direction a contact member formed by spirally winding a conductive thin plate around a vertical axis, and elastically supporting the terminal of the test circuit substrate when contacting a terminal of the test circuit substrate from the bottom to the top direction; and at least one connecting member It electrically connects the upper contact member and the lower contact member. The bidirectional conductive stylus according to claim 1, wherein the upper contact member, the lower contact member, and the connecting portion are formed by spirally winding a susceptor model on a vertical axis, and the pedestal model is a transmission model A conductive sheet is formed. The bidirectional conductive stylus according to claim 1, further comprising: a stylus body made of an elastic insulating material and disposed between the upper contact member and the lower contact member, and the connection The component is disposed inside the stylus body. The bidirectional conductive contact pin of claim 1, further comprising: at least one inner support member extending from the upper contact member toward the lower contact member such that a lower end of the inner support member is spaced apart from the lower contact member Scheduled distance. The bidirectional conductive stylus of claim 1 wherein the upper contact member is stepped radially outwardly such that the radially inner portion of the upper contact member projects upwardly relative to a radially outer portion thereof. The bidirectional conductive stylus of claim 1, wherein the lower contact member is stepped radially outwardly such that the radially inner portion of the lower contact member projects downwardly relative to a radially outer portion thereof. A bidirectional conductive contact pin according to claim 1, wherein the connecting member is formed to have a predetermined width in a horizontal direction and is disposed between the upper contact member and the lower contact member to support the upper contact member in a vertical direction. With the lower contact member. A bidirectional conductive model module comprising: an insulator; a plurality of conductive contact pins disposed inside the insulator such that the conductive contacts are spaced apart from each other in a horizontal direction, and upper and lower members of the conductive contact pins Exposed to the outer side of the upper surface and the lower surface of the insulator, respectively, wherein each of the conductive contact pins comprises: an upper contact member formed by spirally winding a conductive sheet around the vertical axis, and from the top to When the bottom direction contacts the terminal of a semiconductor device, the terminal of the semiconductor device is elastically supported; the lower contact member is formed by spirally winding a conductive thin plate around the vertical axis, and contacts a test circuit substrate from the bottom to the top direction. The terminal elastically supports the terminal of the inspection circuit substrate; and at least one connecting member electrically connecting the upper contact member and the lower contact member. The bidirectional conductive model module of claim 8, wherein the upper contact part of the conductive contact pin, the lower contact part, and the connecting part are formed by spirally winding a susceptor model around a vertical axis, and the The pedestal model is formed by modeling a conductive sheet. The bidirectional conductive model module of claim 8, further comprising: at least one inner support member extending from the upper contact member to the lower contact member such that a lower end of the inner support member is spaced apart from the lower contact member a predetermined distance. The bidirectional conductive model module of claim 8 wherein the upper contact member is stepped radially outwardly such that the radially inner portion of the upper contact member projects upwardly relative to a radially outer portion thereof. The bidirectional conductive model module of claim 8 wherein the lower contact member is stepped radially outwardly such that the radially inner portion of the lower contact member projects downwardly relative to a radially outer portion thereof. The bidirectional conductive model module of claim 8, wherein the connecting member is formed to have a predetermined width in a horizontal direction and is disposed between the upper contact member and the lower contact member to support the upper contact in a vertical direction. The component and the lower contact component. A method of manufacturing a bidirectional conductive model module, the method comprising: (a) forming a pedestal model by modeling a conductive sheet, the pedestal model comprising: a plurality of upper contact models spaced apart from each other in a horizontal direction; Lower contact models that are spaced apart from each other in a horizontal direction and are spaced apart from the plurality of upper contact models in a vertical direction; and at least one connected model that connects each of the upper contact models to face each other (b) electroless plating the susceptor model; (c) winding the electroless plating pedestal model around the vertical axis, whereby a plurality of upper contact members having a spiral shape are respectively formed a plurality of lower contact members; and a connecting member for connecting one of the upper contact members to the one of the lower contact members facing each other. The method of claim 14, further comprising: (d) forming an insulator made of an elastic insulating material, wherein the connecting member is disposed inside the insulator such that upper surfaces of the upper contact members are The lower surfaces of the lower contact members are exposed upward and downward, respectively. The method of claim 14, wherein in forming the pedestal model, the connection model is formed by a diagonal model that diagonally connects each of the upper contact models to each other facing each other Contact one of the models. The method of claim 14, wherein in winding the susceptor model, each of the upper contact models is wound around a same vertical axis with respect to one of the lower contact models facing each other, Therefore, an upper contact member and a lower contact member are formed at positions facing each other. The method of claim 14, further comprising: forming at least one inner support model extending from the upper contact model to the lower contact model when the susceptor model is formed by modeling the conductive sheet; and When the susceptor model is wound, the inner support mold is wound to form an inner support member that extends from each of the upper contact members to a relevant one of the lower contact members. The method of claim 14, wherein the upper contact models are stepped in a horizontal direction or in a vertical direction, such that each of the upper contact members is stepped radially outward, such that the upper contact The radially inner portion of the component projects upwardly relative to its radially outer portion. The method of claim 14, wherein the lower contact models are stepped in a horizontal direction or in a vertical direction, such that each of the lower contact members is stepped radially outward, such that the upper contact The radially inner portion of the component projects downwardly relative to its radially outer portion. The method of claim 14, wherein the connecting member is formed to have a predetermined width in a horizontal direction and is disposed between each of the upper contact members and the associated one of the lower contact members to be in a vertical direction. The upper contact member and the lower contact member are supported. A method of manufacturing a bidirectional conductive stylus, the method comprising: manufacturing a bidirectional conductive model module according to the method of any one of claims 14 to 21; and severing the insulator of the bidirectional conductive model module in a vertical direction A plurality of bidirectional conductive contacts are formed by connecting an upper contact member, a lower contact member, and a connecting member of each of the bidirectional conductive contacts.