KR102007263B1 - Bi-directional electrically conductive module - Google Patents

Abstract

The present invention relates to a bidirectional conductive module and a method of manufacturing the same. The bidirectional conductive module according to the present invention includes an insulating body having a plurality of through holes formed in an insulating material, and having a plurality of through holes penetrated in an up and down direction, and filled in an upper region of each of the through holes, and including conductive powder having conductivity. A conductive filler formed by filling a filler, and a conductive pin accommodated in a lower region of each of the through holes and electrically contacting the conductive filler; Each of the through holes is formed by an upper through hole opened in an upward direction, a lower through hole having an inner diameter smaller than the inner diameter of the upper through hole, and a step due to a difference in the inner diameter between the upper through hole and the lower through hole. Including a stepped portion; Each of the conductive pins may include a pillar portion inserted into the lower through hole and an extension portion extending radially outward from an upper portion of the pillar portion. Accordingly, the electrical characteristics are improved while overcoming the limitations of the fine pitch and the thickness, and the manufacturing is possible by a simple manufacturing method.

Description

Bidirectional conductive module and its manufacturing method {BI-DIRECTIONAL ELECTRICALLY CONDUCTIVE MODULE}

The present invention relates to a bidirectional conductive module and a method for manufacturing the same, and more particularly, to overcome the limitations of the fine pitch and thickness, the electrical characteristics are improved, and a bidirectional conductive module and a method for manufacturing the same can be manufactured by a simple manufacturing method will be.

After the semiconductor device is manufactured, the semiconductor device performs a test to determine whether the electrical performance is poor. The positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board so as to be in electrical contact with a terminal of the semiconductor device. The semiconductor test socket is also used in a burn-in test process during the manufacturing process of the semiconductor device, in addition to the final positive inspection of the semiconductor device.

With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads, are also miniaturized. Accordingly, there is a demand for a method of forming minute spacing between conductive patterns of test sockets.

However, the conventional Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated. 1 to 3 are diagrams showing an example of a conventional Pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.

1 to 3, the conventional semiconductor test socket 1100 includes a housing 1110 having a through hole 1111 formed in a vertical direction at a position corresponding to the terminal 1131 of the semiconductor device 1130, and Pogo-pins 1120 mounted in the through holes 1111 of the housing 1110 to electrically connect the terminals 1131 of the semiconductor device 1130 and the pads 1141 of the test apparatus 1140. Is done.

The configuration of the pogo-pin 1120 is a barrel 1124, which is used as a pogo-pin body and has a hollow cylindrical shape, and is formed below the barrel 1124. A semiconductor device connected to a contact tip 1123, a spring 1122 connected to the contact tip 1123 inside the barrel 1124 and contracting and expanding, and opposite to a spring 1122 connected to the contact tip 1123. It is composed of a contact pin 1121 to perform the vertical movement according to the contact with 1130.

At this time, the spring 1122 contracts and expands, while absorbing the mechanical shock transmitted to the contact pins 1121 and the contact tips 1123, the springs 1122 of the terminals 1131 and the test apparatus 1140 of the semiconductor device 1130. The pad 1141 is electrically connected to check whether there is an electrical failure.

However, the conventional Pogo-pin type semiconductor test socket as described above uses a physical spring to maintain elasticity in the vertical direction, inserts the spring and the pin into the barrel, and Since the process has to be inserted into the through-hole of the housing again, the process is complicated and the manufacturing cost increases due to the complexity of the process.

In addition, the physical configuration itself for the implementation of the electrical contact structure having elasticity in the vertical direction has a limit to implement the fine pitch, and the situation has already reached the limit to apply to the integrated semiconductor device in recent years.

In order to overcome the limitations of the pogo-pin type semiconductor device, the limited technology forms a perforated pattern in a vertical direction on a silicon main body made of an elastic silicon material, and then conductive powder inside the perforated pattern. It is a PCR socket type semiconductor test socket that fills the conductive pattern to form a conductive pattern.

However, the PCR-type semiconductor test socket also has a problem due to structural limitations of the PCR-type semiconductor test socket, such as a problem of shortening of life due to separation of conductive powder filled therein.

In addition, the PCR-type semiconductor test socket is subject to the constraint of the thickness in the vertical direction, there is a disadvantage in that the resistance does not come out to produce a thickness of about 0.8mm ~ 1.2mm or more does not function as a conductive pattern.

Therefore, there is a demand for the development of a semiconductor test socket capable of realizing fine pitch while overcoming the thickness constraints in the vertical direction.

On the other hand, the pogo-pin type semiconductor test socket is used in a structure for electrically connecting two devices in addition to the test of the semiconductor device. As a representative example, a high-speed CPU, for example, an interposer connecting a pin of a CPU and a terminal of a board between a CPU and a board used in a large-capacity server.

In the case of a CPU used in a large-capacity server, the area of the CPU is larger than that of a general PC, and the number of pins is more than 1000, and if a direct contact is made with a terminal of a board, contact failure may occur. A pin-type interposer elastically connects the two devices in the vertical direction.

However, in the case of the Pogo-pin type interposer, as described above, there is a limitation in applying to a CPU in which the pitch interval is narrowed due to the limitation of the pitch, as well as the length in the vertical direction. Limitations raise the difficulty of keeping up with the speed of high-speed CPUs.

Accordingly, the present invention has been made to solve the above problems, to overcome the limitations of the fine pitch and thickness, while improving the electrical characteristics, to provide a bidirectional conductive module and a method for manufacturing the same by a simple manufacturing method The purpose is.

According to the present invention, in the bidirectional conductive module, the object is provided with an insulating material, filled with an insulating body having a plurality of through holes penetrated in the vertical direction, and filled in the upper region of each of the through holes. A conductive filler formed by filling a filler including a conductive powder, and a conductive pin accommodated in a lower region of each of the through holes and electrically contacting the conductive filler; Each of the through holes is formed by an upper through hole opened in an upward direction, a lower through hole having an inner diameter smaller than the inner diameter of the upper through hole, and a step due to a difference in the inner diameter between the upper through hole and the lower through hole. Including a stepped portion; Each of the conductive pins is achieved by a bidirectional conductive module comprising a pillar portion inserted into the lower through hole and an extension portion extending radially outward from the top of the pillar portion.

Herein, the extension part may be moved downward in a downward direction when the extension part is spaced apart from the step part by a predetermined interval in the upper direction and pressed in the upper direction.

In addition, an elastic spring may be installed in the spaced space between the extension part and the step part to provide a restoring force in the vertical direction.

In addition, at least one region may be formed inside the insulating body to surround the upper through hole, and may further include an elastic spring that provides a restoring force in the vertical direction.

In addition, at least one region may be formed inside the insulating body to surround the lower through hole, and may further include an elastic spring that provides a restoring force in the vertical direction.

On the other hand, the above object is, according to another embodiment of the present invention, in the manufacturing method of the bidirectional conductive module, (a) providing a base mold with a plurality of mold pins projecting upwards-each said mold pin is the base A first pin portion protruding from the bottom surface of the mold, and a second pin portion extending from the first pin portion and smaller in diameter than the first pin portion; (b) injecting a liquid of an insulating material into the base mold and curing the liquid to form an insulating body; (c) detaching the insulating body from the base mold, and a plurality of through holes penetrated vertically through the insulating body by respective mold pins, wherein each of the through holes is formed in the second fin part. An upper through hole formed by the lower through hole and the first pin part and having an inner diameter wider than the lower through hole is formed; (d) providing a conductive pin including a pillar portion having a diameter corresponding to the inner diameter of the lower through hole, and an extension portion extending radially outward from an upper portion of the pillar portion; (e) inserting the conductive pin through the upper through hole to insert the pillar portion into the lower through hole; (f) is also achieved by a method of manufacturing a bidirectional conductive module, comprising the step of filling and curing the filler including conductive powder having conductivity in the upper through hole to form a conductive filler.

In the step (e), the pillar part is inserted into the lower through hole from the upper through hole and protrudes downward from the insulating body through the lower through hole; (F) step (f1) filling the upper through hole with the filler; (f2) the upper plate mold is in contact with the upper surface of the insulating body to block the upper portion of each upper through hole; (f3) curing the filler in a state in which the lower plate mold contacts the lower surface of the insulating body and the pillar portion protruding downward through the lower through hole is moved upwards; By the step (f3), the extension part may be formed to be spaced apart from the step part formed by the step due to the difference in the inner diameter of the upper through hole and the lower through hole at a predetermined interval in the upper direction.

And, in the step (e) before the insertion of the conductive pin is inserted into the elastic spring to be caught in the step portion formed by the step by the difference in the inner diameter of the upper through hole and the lower through hole; The elastic spring may be located between the extension part of the conductive pin and the stepped part.

And further comprising fitting an elastic spring to each of the first pin portions to surround each of the first pin portions before performing step (b); In the step (c), at least one region may be formed inside the insulating body so that the elastic spring surrounds the periphery of the upper through hole.

And fitting an elastic spring to each of the second fin portions to surround each of the second fin portions before performing step (b); In the step (c), at least one region may be formed inside the insulating body so that the elastic spring surrounds the periphery of the lower through hole.

In addition, the elastic spring may be provided with at least one of carbon steel material, stainless steel material, tungsten material, plastic material.

The elastic spring may include a coil spring wound in an up and down direction in the insulating body.

The conductive pin may be formed by plating a conductive material on the surface of the base body.

And, the base body is provided of a fiber material or BeCu material; Plating of the conductive material may be formed through sequential plating of nickel and gold.

According to the present invention according to the configuration as described above, the electrical properties are improved while overcoming the limitations of the fine pitch and thickness, and provided in a bidirectional conductive module and a method for manufacturing the same by a simple manufacturing method.

1 to 3 are diagrams for explaining a conventional Pogo-pin type semiconductor test socket,
4 is a cross-sectional view of a bidirectional conductive module according to a first embodiment of the present invention;
5A to 5F are views for explaining a method of manufacturing a bidirectional conductive module according to a first embodiment of the present invention;
6 is a cross-sectional view of a bidirectional conductive module according to a second embodiment of the present invention;
7A to 7F are views for explaining a method of manufacturing a bidirectional conductive module according to a second embodiment of the present invention.
8 is a cross-sectional view of a bidirectional conductive module according to a third embodiment of the present invention;
9A and 9B are diagrams for describing an operating process of the bidirectional conductive module according to the second embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; Bi-directional conductive module 100 according to the embodiments of the present invention is used for the positive inspection of the semiconductor device 1, PCB, wafer, like the conventional pogo-pin type semiconductor test socket or PCR type semiconductor test socket, It can also be applied to CPU interposers used in large servers.

4 is a cross-sectional view of the bidirectional conductive module 100 according to the first embodiment of the present invention. Referring to FIG. 4, the bidirectional conductive module 100 according to the first embodiment of the present invention includes an insulating body 110, a plurality of conductive fillers 130, and a plurality of conductive pins 120. .

The insulating body 110 is provided with an insulating material, for example, is provided with a material having elasticity such as silicon. Here, the plurality of through holes 111 and 112 penetrated in the vertical direction are formed in the insulating body 110.

Here, each through hole 111 and 112 of the insulating body 110 according to the first embodiment of the present invention, as shown in the enlarged region of FIG. 4 and FIG. 5C, the upper through hole 111 and the lower through hole, respectively. (112).

The upper through hole 111 is open in the upper direction and communicates with the lower through hole 112 in the lower direction. The lower through hole 112 is opened in the lower direction and communicates with the upper through hole 111 in the upper direction. Here, the inner diameter of the lower through hole 112 is provided smaller than the inner diameter of the upper through hole 111. In addition, the stepped portion 113 is formed by the step due to the difference in the inner diameter between the upper through-hole 111 and the lower through-hole 112.

The conductive filler 130 is filled in the upper region of each of the through holes 111 and 112. Here, the conductive filler 130 is formed by filling with a filler including conductive powder having conductivity, and can be applied to a conventional PCR-type semiconductor test socket, a variety of forms having conductivity, For example, forms of conductive fibers, conductive wires, and the like may be applied.

Each of the conductive pins 120 is accommodated in the lower regions of the through holes 111 and 112 and maintains electrical contact with the conductive filling unit 130. As a result, the conductive filling unit 130 and the conductive pin 120 form one conductive pattern in the vertical direction.

Here, the conductive pin 120 includes a pillar portion 121 inserted into the lower through hole 112 and an extension portion 122 extending radially outward from an upper portion of the pillar portion 121. As a result, even when the conductive pin 120 is moved from the upper portion of the extension portion 122 to the lower portion in the state where the pillar portion 121 is inserted into the lower through hole 112, the stepped portion 113 of the through holes 111 and 112 is moved. It becomes the shape caught on and prevents the departure to the downward direction.

In the present invention, for example, the conductive pin 120 is formed by the plating of the conductive material on the surface of the base body in the form of the conductive pin 120, the base body is provided with a fiber material or BeCu material, nickel material and gold material For example, it is formed through the sequential plating of.

In forming one conductive pattern according to the above configuration, by using the conductive filling unit 130 and the conductive pin 120, the conductive filling unit 130 is a package ball of the semiconductor device 1 (Package ball) (1a, see FIG. 9) to eliminate scratches that may occur in the package ball (1a), the thickness of the conductive pattern in the vertical direction to the length of the conductive pin 120 in the vertical direction By solving the above problem, the limitation of the micro pitch implementation, which is a problem of the conventional pogo-pin type semiconductor test socket, is solved, and the problem of the thickness limitation in the vertical direction, which is the problem of the PCR test semiconductor test socket, can be solved. .

Here, in the bidirectional conductive module 100 according to the first embodiment of the present invention, at least one region is formed inside the insulating body 110 to surround the periphery of the lower through hole 112, as shown in FIG. 4. It may include an elastic spring to provide a restoring force in the vertical direction. Hereinafter, the elastic spring according to the first embodiment will be described as 'lower elastic spring 140' in order to distinguish it from other embodiments.

4 illustrates that the entirety of the lower elastic spring 140 is formed to surround the periphery of the lower through hole 112 in a state formed inside the insulating body 110, but a part of the lower elastic spring 140 is formed in the through hole 111 and 112. Of course, it can be provided in a state exposed to the side.

Here, the lower elastic spring 140 is formed to provide a restoring force in the vertical direction, as shown in FIG. 4, wound along the vertical direction in the insulating main body 110 around the lower through hole 112. Take the example of being configured in the form of a coil spring.

According to the configuration as described above, when the extension 122 of the conductive pin 120 is pressed from the top in contact with the internal step portion 113 of the through holes 111 and 112 in the test process to be described later, the insulating body ( The lower elastic spring 140 along with 110 elastically supports it, thereby preventing deformation of the insulating body 110.

In addition, since the insulating body 110 of silicon material loses the restoring force and the problem of deformation during the continuous inspection process, the life of the product can be improved.

Here, the lower elastic spring 140 according to the present invention is an example that is provided with at least one of carbon steel material, stainless steel material, tungsten material, plastic material, to be provided with another material that can be elastically supported in the vertical direction Of course it can.

Hereinafter, a method of manufacturing the bidirectional conductive module 100 according to the first embodiment of the present invention will be described with reference to FIGS. 5A to 5F.

First, as shown in FIG. 5A, a base mold 300 having a plurality of mold pins 310 protruding upward is provided. Here, the plurality of mold pins 310 formed in the base mold 300 are provided to correspond to the shape of the through holes 111 and 112 of the bidirectional conductive module 100. In more detail, each of the mold pins 310 extends from the first pin portion 312 and the first pin portion 312 protruding from the bottom surface of the base mold 300, but has a diameter greater than that of the first pin portion 312. This small second pin part 311 is comprised. Here, the first pin part 312 corresponds to the upper through hole 111 of the through holes 111 and 112, and the second pin part 311 corresponds to the lower through hole 112 of the through holes 111 and 112.

Then, the lower elastic spring 140 is inserted into each mold pin 310 to surround the second fin portion 311 of each mold pin 310. In addition, as shown in FIG. 5B, in the state where the lower elastic spring 140 is inserted into the second pin part 311 of each mold pin 310, a liquid of an insulating material, for example, liquid silicone, is formed in the base mold 300. ), And then cured at a high temperature to form an insulating body 110. In the present invention, for example, curing at high temperature for more than 15 minutes at a temperature of 150 ℃.

When curing is completed, when the insulating main body 110 is separated from the base mold 300, as shown in FIG. 5C, an insulating main body 110 having a plurality of through holes 111 and 112 is formed. Here, each of the through holes 111 and 112 includes a lower through hole 112 formed by the second pin part 311 and an upper through hole 111 formed by the first pin part 312. The inner diameter of the through hole 112 is smaller than the inner diameter of the upper through hole 111. In addition, the lower elastic spring 140 surrounds the periphery of the lower through hole 112 and is formed in the insulating body 110.

Then, as shown in Figure 5d, the conductive pin 120 is inserted through the upper through hole 111 so that the pillar portion 121 is inserted into the lower through hole 112. At this time, the extension portion 122 of the conductive pin 120 is in the form of being caught by the inner stepped portion 113 of the through holes 111 and 112 can be prevented from being separated below the through holes 111 and 112 in the manufacturing process. .

After the conductive pin 120 is inserted, as shown in FIG. 5E, a filler including conductive powder, for example, a filler in which liquid silicon and conductive powder are mixed into each upper through hole 111. When filled and then cured, the conductive filler 130 may be formed. Here, the filler is an example of curing at a high temperature, for example, 160 ℃ or higher.

Here, in the present invention, as shown in Figure 5f, in the curing process of the filler, after filling the filler, the upper plate mold is in contact with the upper surface of the insulating body 110, the upper portion of each upper through hole 111 Is blocked, and the curing process of the filler is performed in a state in which the lower plate die contacts the lower surface of the insulating body 110 and the pillar portion 121 protruding downward through the lower through hole 112 moves upward. You can proceed.

Therefore, the pillar portion 121 is pushed upward by the lower flat metal mold, and the hardening of the conductive filler 130 proceeds in a state where a space is formed between the extension portion 122 and the step portion 113. It becomes possible. Accordingly, as shown in the enlarged region of FIG. 4, the extension part 122 of the conductive pin 120 is spaced apart from the inner step portion 113 of the through holes 111 and 112 by a predetermined interval in an upward direction. Detailed description thereof will be described later.

Hereinafter, the bidirectional conductive module 100a according to the second embodiment of the present invention will be described in detail with reference to FIG. 6. Here, in describing the second embodiment, a detailed description of the configuration corresponding to the first embodiment may be omitted.

As shown in FIG. 6, the bidirectional conductive module 100a according to the second embodiment of the present invention includes an insulating body 110a, a plurality of conductive filling parts 130a, and a plurality of conductive pins 120a. do. Here, the insulating main body 110a, the plurality of conductive filling parts 130a, and the plurality of conductive pins 120a according to the second embodiment correspond to the above-described first embodiment, and a detailed description thereof will be omitted.

In the bidirectional conductive module 100a according to the second embodiment of the present invention, as shown in FIG. 6, at least one region is formed inside the insulating main body 110a so as to surround the upper through hole 111a. It may include an elastic spring (hereinafter referred to as 'upper elastic spring 140a') to provide a restoring force in the direction.

In FIG. 6, the entire upper elastic spring 140a is formed to cover the periphery of the upper through hole 111a in a state formed inside the insulating body 110a, but a part of the upper elastic spring 140a is formed in the upper through hole ( Of course, it can be provided in a state exposed to the 111a) side.

Here, the upper elastic spring 140a is formed to provide a restoring force in the vertical direction. As shown in FIG. 6, the upper elastic spring 140a is wound along the vertical direction in the insulating main body 110a around the upper through hole 111a. Take the example of being configured in the form of a coil spring.

According to the configuration as described above, when the ball 1a of the semiconductor device 1 presses the upper portion of the conductive filling portion 130a in a test process to be described later, the upper elastic spring 140a together with the insulating body 110a is burnt. By supporting it sexually, it prevents the deformation of the insulating body (110a).

In addition, since the insulating body 110a of the silicon material loses the restoring force and the problem of deformation during the continuous inspection process, the life of the product can be improved.

Here, the upper elastic spring 140a according to the present invention is provided with at least one of carbon steel material, stainless steel material, tungsten material, and plastic material, and may be provided with another material that can be elastically supported in the vertical direction. Of course it can.

Hereinafter, a method of manufacturing the bidirectional conductive module 100a according to the second embodiment of the present invention will be described with reference to FIGS. 7A to 7F.

First, as shown in FIG. 7A, a base mold 300a having a plurality of mold pins 310a protruding upward is provided. Here, the plurality of mold pins 310a formed in the base mold 300a are composed of the first fin portion 312a and the second fin portion 311a as in the first embodiment.

Then, the upper elastic spring 140a is inserted into each mold pin 310a to surround the first fin part 312a of each mold pin 310a. In the state where the upper elastic spring 140a is fitted to the first pin part 312a of each of the mold pins 310a, as shown in FIG. 7B, the base mold 300a is formed of an insulating material, for example, liquid silicone. ), And then cured at a high temperature to form an insulating body (110a). In the present invention, for example, curing at high temperature for more than 15 minutes at a temperature of 150 ℃.

When curing is completed, when the insulating main body 110a is separated from the base mold 300a, as shown in FIG. 7C, an insulating main body 110a having a plurality of through holes 111a and 112a is formed. Here, as in the first embodiment, each of the through holes 111a and 112a has a lower through hole 112a formed by the second fin part 311a and an upper through hole formed by the first fin part 312a. The hole 111a is included, and the inner diameter of the lower through hole 112a is smaller than the inner diameter of the upper through hole 111a. In addition, the upper elastic spring 140a surrounds the upper through hole 111a and is formed inside the insulating body 110a.

Then, as shown in Figure 7d, the conductive pin (120a) is inserted through the upper through hole (111a) so that the pillar portion 121a is inserted into the lower through hole (112a). At this time, the extension portion 122a of the conductive pin 120a is formed to be caught by the internal stepped portion 113a of the through holes 111a and 112a, thereby preventing separation from the lower portion of the through holes 111a and 112a during the manufacturing process. You can do it.

Then, after the conductive pin 120a is inserted, as shown in FIG. 7E, a filler including conductive powder, for example, a filler in which liquid silicon and conductive powder are mixed in each upper through hole 111a. When filled and then cured, the conductive filler 130a can be formed. Here, the filler is an example of curing at a high temperature, for example, 160 ℃ or higher.

Here, as in the first embodiment, as shown in FIG. 7F, in the curing process of the filler, after filling of the filler, the upper flat metal mold contacts the upper surface of the insulating body 110a to form respective upper through holes ( The filler of the pillar 121a protruding downward through the lower through-hole 112a by moving the upper flat portion of the 111a) in contact with the lower surface of the insulating body 110a is moved upward. The curing process can be carried out.

Accordingly, the pillar portion 121a is pushed upward by the lower flat metal mold, and curing of the conductive filler 130a proceeds in a state where a space is formed between the extension portion 122a and the step portion 113a. It becomes possible. Accordingly, as shown in the enlarged region of FIG. 6, the extension part 122a of the conductive pin 120a is spaced apart from the inner stepped part 113a of the through holes 111a and 112a by a predetermined interval in the upward direction. This will be described later.

8 is a cross-sectional view of the bidirectional conductive module 100b according to the third embodiment of the present invention. The third embodiment shown in FIG. 8 is a modification of the second embodiment and corresponds to the configuration of the bidirectional conductive module 100b according to the second embodiment. That is, the bidirectional conductive module 100b according to the third embodiment of the present invention includes an insulating body 110b, a conductive filling unit 130b, and a conductive pin 120b. In addition, the bidirectional conductive module 100b according to the third embodiment of the present invention has an upper portion formed inside the insulating main body 110b to surround the upper through hole (not shown) of the through hole (not shown). It may include an elastic spring (140b).

Here, the bidirectional conductive module 100b according to the third embodiment of the present invention may include a stepped portion (not shown) inside an extension part (not shown) of the conductive pin 120 and a through hole (not shown). It may further include an inner elastic spring (150b) disposed in the space between the space to provide a restoring force in the vertical direction.

Accordingly, the conductive pin 120b is elastically supported when the conductive pin 120b is pressed from the upper direction to the lower direction during the test process of the semiconductor device 1, and provides a restoring force, thereby enabling more stable electrical contact. Rather, as the resilience increases, the service life of the product can be improved. Here, the inner elastic spring 150b may be inserted into the upper through hole (not shown) before inserting the conductive pin 120b shown in FIG. 7.

Meanwhile, FIGS. 9A and 9B illustrate effects according to a separation space between the extension portion 122a of the conductive pin 120a and the internal step portion 113a of the through holes 111a and 112a in the embodiments of the present invention. It is a figure for following. 9A and 9B show an example of the bidirectional conductive module 100a in the second embodiment of the present invention.

As described in the second embodiment of the present invention, the lower end of the pillar portion 121a of the conductive pin 120a protrudes out of the lower through hole 112a for contact with the test circuit board 3. It is desirable to be. However, as shown in the region A of FIG. 9A during the manufacturing process, such as a defect or error during the manufacturing process, when a part is located inside the lower through hole 112a, an error occurs due to a poor contact.

However, as shown in FIG. 9B, the extension 122a of the conductive pin 120a and the internal stepped portions of the through holes 111a and 112a are pressed by the ball 1a of the semiconductor device 1 from above. Since the conductive pins 120a are movable to the spaces between 113a, the lower ends of the pillar portions 121a of the conductive pins 120a can be stably contacted with the test circuit board 3.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

100,100a, 100b: Bidirectional conductive module
110,110a, 110b: insulating body 111,111a: upper through hole
112,112a: Lower through hole 113,113a: Stepped portion
120,120a, 120b: Conductive pin 121,121a: Column part
122, 122a: Extension 130, 130a, 130b: Conductive Filling
140: lower elastic spring 140a, 140b: upper elastic spring
150b: internal elastic spring 300,300a: base mold
310,310a: Mold pin 311,311a: Second pin part
312,312a: first pin part

Claims (18)

In the bidirectional conductive module,
An insulating body provided with an insulating material and having a plurality of through holes penetrated in the vertical direction;
A conductive filler filled in an upper region of each of the through holes and filled with a filler including conductive powder having conductivity;
A conductive pin received in a lower region of each of the through holes, the conductive pin being in electrical contact with the conductive filling portion;
Each of the through holes
An upper through hole opened in an upward direction,
A lower through hole having an inner diameter smaller than that of the upper through hole;
A stepped portion formed by a step due to a difference in inner diameter between the upper through hole and the lower through hole;
Each conductive pin is
A pillar portion inserted into the lower through hole;
And an extension extending radially outward from an upper portion of the pillar portion. The method of claim 1,
The extension part is a bidirectional conductive module, characterized in that the movement in the lower direction when the pressure is pressed in the upper direction spaced apart from the step portion in the upper direction. The method of claim 2,
A bidirectional conductive module, characterized in that an elastic spring is provided in the spaced space between the extension and the step portion to provide a restoring force in the vertical direction. The method of claim 1,
And a resilient spring formed inside the insulating body to surround the upper through hole to provide a restoring force in the vertical direction. The method of claim 1,
And an elastic spring formed inside the insulating body to surround the lower through hole and providing a restoring force in an up and down direction. The method according to claim 4 or 5,
The elastic spring is a bidirectional conductive module, characterized in that provided with at least one of carbon steel material, stainless steel material, tungsten material, plastic material. The method according to claim 4 or 5,
The elastic spring is a bi-directional conductive module, characterized in that it comprises a coil spring of the form wound along the vertical direction inside the insulating body. The method of claim 1,
The conductive pin is a bidirectional conductive module, characterized in that formed on the surface of the base body by plating of a conductive material. The method of claim 8,
The base body is made of a fiber material or a BeCu material;
Plating of the conductive material is a bidirectional conductive module, characterized in that formed through the sequential plating of nickel and gold. In the manufacturing method of the bidirectional conductive module,
(a) providing a base mold from which a plurality of mold pins protrude upwards, each of the mold pins extending from a first pin portion protruding from a bottom surface of the base mold, the first pin portion being extended from the first pin portion; A second pin portion having a smaller diameter;
(b) injecting a liquid of an insulating material into the base mold and curing the liquid to form an insulating body;
(c) detaching the insulating body from the base mold, and a plurality of through holes penetrated vertically through the insulating body by respective mold pins, wherein each of the through holes is formed in the second fin part. An upper through hole formed by the lower through hole and the first pin part and having an inner diameter wider than the lower through hole is formed;
(d) providing a conductive pin including a pillar portion having a diameter corresponding to the inner diameter of the lower through hole, and an extension portion extending radially outward from an upper portion of the pillar portion;
(e) inserting the conductive pin through the upper through hole to insert the pillar portion into the lower through hole;
(F) a method of manufacturing a bi-directional conductive module comprising the step of filling and curing the filler comprising a conductive powder having conductivity in the upper through hole to form a conductive filler. The method of claim 10,
In the step (e), the pillar portion is inserted into the lower through hole from the upper through hole and protrudes to the lower portion of the insulating body through the lower through hole;
Step (f)
(f1) filling the upper through hole with the filler;
(f2) the upper plate mold contacts the upper surface of the insulated body so that an upper portion of each of the upper through holes is blocked;
(f3) curing the filler in a state in which the lower plate mold contacts the lower surface of the insulating body and moves the upper portion of the pillar portion projecting downward through the lower through hole;
The method of manufacturing the bi-directional conductive module, characterized in that by the step (f3) is extended from the step portion formed by the step difference due to the step difference due to the difference in the inner diameter of the upper through hole and the lower through hole spaced apart in the upper direction. . The method of claim 10,
Inserting an elastic spring to engage the stepped portion formed by the step due to the difference in inner diameter of the upper through hole and the lower through hole before inserting the conductive pin in step (e);
And the elastic spring is positioned between the extension part of the conductive pin and the stepped part. The method of claim 10,
Fitting an elastic spring to each said first fin portion to surround each said first fin portion before performing step (b);
In the step (c), at least one region is formed inside the insulating body so that the elastic spring surrounds the periphery of the upper through hole. The method of claim 10,
Fitting an elastic spring to each said second fin portion to surround each said second fin portion before performing step (b);
In the step (c), at least one region is formed inside the insulating body so that the elastic spring surrounds the periphery of the lower through hole. The method according to claim 13 or 14,
The elastic spring is a method of manufacturing a bi-directional conductive module, characterized in that provided with at least one of carbon steel material, stainless steel material, tungsten material, plastic material. The method according to claim 13 or 41,
The elastic spring is a method of manufacturing a bidirectional conductive module, characterized in that it comprises a coil spring of the form wound along the vertical direction inside the insulating body. The method of claim 10,
The conductive pin is a method of manufacturing a bidirectional conductive module, characterized in that formed on the surface of the base body by plating of a conductive material. The method of claim 17,
The base body is made of a fiber material or a BeCu material;
Plating of the conductive material is a method of manufacturing a bidirectional conductive module, characterized in that formed through sequential plating of nickel and gold.

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