KR102061669B1 - By-directional electrically conductive module - Google Patents

Abstract

The present invention relates to a bidirectional conductive module capable of connecting upper and lower devices elastically. The bidirectional conductive module includes: an insulating body made of an insulating material and including a plurality of through holes penetrated in a vertical direction; a plurality of conductive pattern parts formed in each of the through holes to form a signal line in a vertical direction to connect the upper and lower devices electrically; an elastic spring having conductivity and formed in the insulating body to be physically separated from the conductive pattern parts while surrounding each of the through holes to provide restoring force in a vertical direction; and a ground terminal part combined with the lower part of the insulating body to enable the conductive pattern parts to be exposed through the bottom and earthing the elastic spring by coming into contact with the elastic spring exposed through the bottom of the insulating body. Therefore, a pogo-pin type semiconductor test socket can be replaced, a high-speed test as well as stable signal delivery can be possible, and the module can be applied to an interposer between a high-speed CPU and a board to electrically connect the CPU and the board.

Description

Bi-directional conductive module {BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE MODULE}

The present invention relates to a bi-directional conductive module, and more particularly, it is possible to replace the pogo-pin type semiconductor test socket and to test at high speed with stable signal transmission, and between the high-speed CPU and the board. The present invention relates to a bidirectional conductive module applicable to an interposer that electrically connects a CPU to a board.

After the semiconductor device is manufactured, the semiconductor device performs a test to determine whether the electrical performance is poor. The positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board to be in electrical contact with a terminal of the semiconductor device. The semiconductor test socket is also used in a burn-in test process during the manufacturing process of the semiconductor device, in addition to the final positive inspection of the semiconductor device.

With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads, are also miniaturized. Accordingly, there is a demand for a method of forming minute spacing between conductive patterns of test sockets.

However, the conventional Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated. 1 to 3 are diagrams showing an example of a conventional Pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.

1 to 3, the conventional semiconductor test socket 1100 includes a housing 1110 having a through hole 1111 formed in a vertical direction at a position corresponding to the terminal 1131 of the semiconductor device 1130, and Pogo-pins 1120 mounted in the through holes 1111 of the housing 1110 to electrically connect the terminals 1131 of the semiconductor device 1130 and the pads 1141 of the test apparatus 1140. Is done.

The configuration of the pogo-pin 1120 is a barrel 1124, which is used as a pogo-pin body and has a hollow cylindrical shape, and is formed below the barrel 1124. A semiconductor device connected to a contact tip 1123, a spring 1122 connected to the contact tip 1123 inside the barrel 1124 and contracting and expanding, and opposite to a spring 1122 connected to the contact tip 1123. It is composed of a contact pin 1121 to perform the vertical movement according to the contact with 1130.

At this time, the spring 1122 contracts and expands, while absorbing the mechanical shock transmitted to the contact pins 1121 and the contact tips 1123, the springs 1122 of the terminals 1131 and the test apparatus 1140 of the semiconductor device 1130. The pad 1141 is electrically connected to check whether there is an electrical failure.

However, the conventional Pogo-pin type semiconductor test socket as described above uses a physical spring to maintain elasticity in the vertical direction, inserts the spring and the pin into the barrel, and Since the process has to be inserted into the through-hole of the housing again, the process is complicated and the manufacturing cost increases due to the complexity of the process.

In addition, the physical configuration itself for the implementation of the electrical contact structure having elasticity in the vertical direction has a limit to implement the fine pitch, and the situation has already reached the limit to apply to the integrated semiconductor device in recent years.

In addition, as shown in FIGS. 1 to 3, the pogo-pin type semiconductor test socket is connected to the connecting tip 1123, the spring 1122, and the connecting pin 1121 in the upper and lower directions. Because of this structure, there is a limit in reducing the length in the vertical direction, which is a limit in testing a high-speed device.

Meanwhile, the pogo-pin semiconductor test socket is used in a structure for electrically connecting two devices in addition to the test of the semiconductor device. As a representative example, a high-speed CPU, for example, an interposer connecting a pin of a CPU and a terminal of a board between a CPU and a board used in a large-capacity server.

In the case of a CPU used in a large-capacity server, the area of the CPU is larger than that of a general PC, and the number of pins is more than 1000, and if a direct contact is made with a terminal of a board, contact failure may occur. A pin-type interposer elastically connects the two devices in the vertical direction.

However, in the case of the Pogo-pin type interposer, as described above, there is a limitation in applying to a CPU in which the pitch interval is narrowed due to the limitation of the pitch, as well as the length in the vertical direction. Limitations raise the difficulty of keeping up with the speed of high-speed CPUs.

Accordingly, the present invention has been made to solve the above problems, it is possible to replace the pogo-pin type semiconductor test socket, but also to test the high-speed with a stable signal transmission, high-speed CPU It is an object of the present invention to provide a bidirectional conductive module that can be applied to an interposer that electrically connects the CPU and the board between the board and the board.

The present invention includes a plurality of conductive pattern portions, a plurality of elastic springs, and a ground terminal portion for grounding the elastic springs in one insulating body, without separately installing a ground terminal in a lower device for inspecting the goodness of the upper device. An object of the present invention is to provide a bidirectional conductive module capable of transmitting a stable signal by minimizing noise and mutual signal interference in each conductive pattern portion when the conductive pattern portion is electrically connected to the upper device and the lower device.

According to the present invention, the bidirectional conductive module for electrically connecting the upper device and the lower device, provided with an insulating material, an insulating body formed with a plurality of through holes penetrated in the vertical direction, and each of the above A plurality of conductive pattern portions formed in the through-holes to form signal lines in an up-down direction, and electrically connecting the upper device and the lower device to each other; An elastic spring which is formed inside the insulating body to be physically separated, and provides a restoring force in the vertical direction, and is coupled to the lower portion of the insulating body to expose the plurality of conductive pattern portions downward, and is exposed to the lower direction of the insulating body. Contacting each said elastic spring to ground said elastic spring It characterized in that it comprises a round terminal portion.

Here, the ground terminal portion includes an insulating plate provided with a plurality of terminal through holes penetrated in an arrangement corresponding to the plurality of through holes, and a ground pattern patterned on one surface of the insulating plate to be electrically connected to the elastic spring. The ground pattern may be in contact with each of the elastic springs to form a ground in the elastic springs.

For example, the ground patterns may be formed by penetrating a plurality of ground pattern holes in a vertical direction through a plating layer provided between the insulating plate and the insulating body, and the plurality of ground pattern holes may be arranged to correspond to the plurality of through holes. It is characterized in that it has a diameter larger than the diameter of the through-hole and smaller than the diameter of the elastic spring.

As another example, the ground terminal part may be provided on a lower conductive pattern patterned on the other surface of the insulating plate and the inner circumferential surface of the terminal through hole so that the plurality of terminal through holes are opened downward, thereby providing the lower conductive pattern and the ground pattern. Further comprising a hole plating layer electrically connected, wherein the inner diameter of the hole plating layer is larger than the diameter of the through hole.

As another example, the ground terminal portion may further include a lower conductive pattern provided on the other surface of the insulating plate and a hole plating layer provided on an inner circumferential surface of the terminal through hole to electrically connect the lower conductive pattern and the ground pattern. The inner diameter of the hole plating layer is larger than the diameter of the through hole.

In this embodiment, the elastic spring is a base spring having a restoring force in the vertical direction; It may include a plating layer plated on the surface of the base spring to provide conductivity.

In addition, the elastic spring may include a coil spring of the form wound along the vertical direction in the insulating body around the through hole.

In addition, each of the conductive pattern parts may be formed by filling each through hole with a filler including conductive particles having conductivity.

In addition, each of the conductive pattern parts may be filled in an upper region of each of the through holes, filled with a filler including conductive particles having conductivity, and received in a lower region of each of the through holes. A conductive pin in electrical contact with the conductive filler; Each of the through holes includes an upper through hole opened in an upper direction and a lower through hole having an inner diameter smaller than an inner diameter of the upper through hole and forming a step between the upper through holes; Each of the conductive pins may include a pillar portion inserted into the lower through hole, and an extension portion extending radially outward from an upper portion of the pillar portion.

According to the present invention, according to the present invention, it is possible to replace the pogo-pin type semiconductor test socket, but also to test at high speed with stable signal transmission, and between the CPU and the board of high-speed CPU and board A bidirectional conductive module is also provided that can be applied to an interposer that electrically connects the board.

The present invention includes a plurality of conductive pattern portions, a plurality of elastic springs, and a ground terminal portion for grounding the elastic springs in one insulating body, without separately installing a ground terminal in a lower device for inspecting the goodness of the upper device. When the conductive pattern portion is electrically connected to the upper device and the lower device, the elastic spring minimizes noise and mutual signal interference in each conductive pattern portion, thereby enabling stable signal transmission.

The present invention is provided such that the ground pattern of the ground terminal portion is in contact only with the elastic spring, thereby preventing the flow of current from the terminal of the conductive pattern portion or the lower device. As a result, the present invention can prevent a short circuit of current in the bidirectional conductive module, which may occur when current flows to the ground terminal portion of the bidirectional conductive module when the upper device and the lower device are electrically connected.

The present invention minimizes signal interference or noise between the plurality of conductive pattern portions through the elastic spring and the ground terminal portion, so that the plurality of conductive pattern portions can stably transmit signals to the upper device and the lower device, thereby connecting the upper device and the lower device. The efficiency can be improved.

When the lower device is a device for inspecting the goodness of the upper device, the present invention minimizes signal interference or noise between the plurality of conductive pattern parts through the elastic spring and the ground terminal, thereby increasing the signal transmission efficiency between the upper device and the lower device. Inspection efficiency can be increased.

The present invention is equipped with a grounding function in the bidirectional conductive module, there is no need to replace the device, such as separately installed the ground terminal in the lower device for checking the good of the upper device, it is economical from the user side.

1 to 3 are diagrams for explaining a conventional Pogo-pin type semiconductor test socket,
4 and 5 are views for explaining a bidirectional conductive module according to a first embodiment of the present invention,
6 is a view for explaining an example of the ground terminal unit;
7 is a diagram for explaining another example of the ground terminal portion;
8 is a view for explaining another example of the ground terminal portion;
9 and 10 are views for explaining a method of manufacturing a bidirectional conductive module according to a first embodiment of the present invention,
11 is a view for explaining a bidirectional conductive module according to a second embodiment of the present invention;
12 to 14 are views for explaining a method of manufacturing a bidirectional conductive module according to a second embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a bidirectional conductive module according to an embodiment according to the present invention.

Referring to FIG. 4, the bidirectional conductive module 100 according to embodiments of the present invention is applied to electrically connect the upper device and the lower device. For example, when applied to the positive inspection of the semiconductor device 20, the upper device may be the semiconductor device 20 to be tested, and the lower device may be the test circuit board 10.

In addition, when the bidirectional conductive module 100 according to the present invention is applied to an interposer, the upper device may be a CPU, and the lower device may be a board. Hereinafter, the bidirectional conductive module 100 according to the present invention will be described as an example that is applied to the positive test of the semiconductor device 20.

4 and 5 are diagrams for describing the bidirectional conductive module 100 according to the first embodiment of the present invention. 4 and 5, the bidirectional conductive module 100 according to the first embodiment of the present invention includes an insulating main body 110, a conductive pattern portion 130, and an elastic spring 120.

The insulating body 110 is made of an insulating material, and has an elasticity such as silicon

It is taken as an example that the material is provided. The insulating body 110 is formed with a plurality of through holes 111 (see FIG. 10) penetrating in the vertical direction.

The conductive pattern portion 130 is formed in each through hole 111 to form a signal line in the vertical direction. The conductive pattern part 130 according to the first embodiment of the present invention is an example in which a filler including conductive particles 131 having conductivity is filled in each through hole 111. For example, the liquid silicon 132 and the conductive particle 131 may be formed by filling and curing a filler mixed therein. Here, the conductive particle 131 may have the form of conductive powder, conductive fiber or conductive wire having conductivity, and plating of a conductive material may be formed on an outer surface to improve conductivity.

As shown in Figure 4 (a) and 4 (b), the elastic spring 120 is formed inside the insulating body 110 to surround the periphery of each through hole 111 to provide a restoring force in the vertical direction do.

In the present invention, as shown in Figures 4 and 5, the elastic spring 120 is formed in the form of a coil spring of the form wound around the inside of the insulating body 110 around the through hole 111 in the vertical direction Yes.

Here, the elastic spring 120 is provided to have conductivity, and may include a base spring having a restoring force in the vertical direction and a plating layer plated on the surface of the base spring to provide conductivity. The base spring may be formed of at least one of carbon steel material, stainless steel material, tungsten material, and plastic material, and the plating layer may be formed on the surface by silver or gold plating, and before the silver or gold plating, depending on the material of the base spring. It may be formed through additional plating such as nickel plating.

In addition, the lower portion of the elastic spring 120 according to the present invention is exposed in the lower direction of the insulating body (110). As shown in FIG. 4A, the lower region of the elastic spring 120 exposed in the lower direction of the insulating body 110 is in contact with the ground terminal 140. 4A is a cross-sectional view of the bidirectional conductive module, FIG. 4B is a plan view of the bidirectional conductive module, and FIG. 4C is a bottom view of the bidirectional conductive module.

The ground terminal 140 may be coupled to the insulator body 110 by an adhesive 190, but is not necessarily limited thereto, and the ground terminal unit 140 may be coupled to the insulator body 110 in various ways within the obvious scope of the person skilled in the art. Can be.

4 and 5, the ground terminal 140 is in contact with the elastic spring 120 and is coupled to the lower portion of the insulating body 110 so that the plurality of conductive pattern portions 130 are exposed downward. The elastic spring 120 is grounded.

As illustrated in FIGS. 6 to 8, the ground terminal unit 140 may include an insulating plate 142 provided with a plurality of terminal through holes 145, and an insulating plate 142 electrically connected to the elastic spring 120. It consists of a ground pattern (140a) patterned on a conductive layer provided on one surface of.

6 to 8, the ground pattern 140a may be variously patterned. In the present embodiment, even if the patterns of the ground pattern 140a of the ground terminal unit 140 are different, the same reference numerals are used for components that perform the same function.

4 to 8, the plurality of terminal through holes 145 are provided in the insulating plate 142 such that the conductive pattern portion 120 is exposed to the lower portion of the insulating body 110. The plurality of terminal through holes 145 penetrate in the vertical direction of the insulating plate 142. The plurality of terminal through holes 145 are arranged to correspond to the plurality of through holes 111.

The plurality of terminal through holes 145 are portions into which the terminals 11 of the lower device are inserted. The terminals 11 of the lower device are respectively inserted into the plurality of terminal through holes 145, and are in contact with the plurality of conductive pattern parts 130 to be electrically connected to the terminals 21 of the upper device.

In the present embodiment, the ground pattern 140a is provided on one surface of the insulating plate 142 to be in contact with each elastic spring 120 exposed in the lower direction of the insulating body 110. The elastic spring 120 is in contact with the ground pattern 140a and grounded.

For example, as shown in FIG. 6, the ground pattern 140a is formed by patterning the conductive layer such that a plurality of ground pattern holes 146 are provided in the conductive layer.

The ground pattern hole 146 is a hole in the conductive layer that is arranged to correspond to the plurality of through holes 111 and exposes the insulating plate 142 to a diameter larger than the diameter of the through hole and smaller than the diameter of the elastic spring 120. As shown in FIG. 6B, the ground pattern hole 146 is formed to penetrate in the vertical direction of the conductive layer. The ground pattern hole 146 is provided to be stepped with respect to the terminal through hole 145.

As shown in FIG. 6A, in the ground pattern 140a according to an example, the remaining regions except the plurality of ground pattern holes 146 are formed of a conductive layer. Each elastic spring 120 is in contact with an area of the ground pattern 140a around the plurality of ground pattern holes 146 to be grounded.

According to the present invention, the plurality of elastic springs 120 can be grounded at a time by one ground terminal unit 140 integrally coupled to the insulating body 110 without individually grounding the plurality of elastic springs 120. Even when the micro bidirectional conductive module 100 is smaller than the nail area, the signal is stable by minimizing noise and mutual signal interference in each conductive pattern part when it is electrically connected to the upper device 20 and the lower device 10. Can be delivered.

In addition, the present invention is provided so that the ground pattern 140a is in contact with the elastic spring 120 by the ground pattern hole 46, but not in contact with the conductive pattern portion 130, the upper device, bi-directional conductive module during the inspection of the device Even when the alignment between the lower device and the lower device is not precisely aligned and the alignment is finely aligned, the current flowing through the conductive pattern unit 130 is prevented from flowing to the ground pattern 140a, so that the conductive pattern unit 130 is grounded. It is possible to prevent a short circuit of a current that may occur while energizing the 140a.

As another example, as shown in FIG. 7, the ground terminal unit 140 further includes a lower conductive pattern 140b and a hole plating layer 140c. As shown in FIG. 7A, the ground pattern 140a is formed of a conductive layer except for the plurality of terminal through holes 145. The plurality of terminal through holes 145 are provided in an arrangement corresponding to the plurality of through holes 111.

As shown in FIG. 7B, the lower conductive pattern 140b is provided on the other surface of the insulating plate 142. The hole plating layer 140c is provided on the inner circumferential surface of the terminal through hole 145 to electrically connect the lower conductive pattern 140b and the ground pattern 140a.

The inner diameter of the hole plating layer 140c is larger than the diameter of the through hole 111 so as not to contact the terminal 11 of the lower device when the terminal 11 of the lower device is inserted. desirable. This is because, when the upper device 20 and the lower device 10 are electrically connected, the terminal 11 of the lower device is in contact with the hole plating layer 140a and is energized with the hole plating layer 140a. This is to prevent short circuit of current.

As another example, as shown in FIG. 8, the ground pattern 140a has an area larger than that of the elastic spring 120 around each terminal through-hole 145, but may be electrically connected on the same plane. It is formed on the conductive layer by patterning. The ground pattern 140a may have a circular track shape surrounding the periphery of the plurality of terminal through holes 145 as shown in FIG. 8, but is not limited thereto, and any portion of the lower portion of the elastic spring 120 may be used. Of course, even if exposed, the shape can be changed in various ways so that contact is possible.

When the bidirectional conductive module 100 according to the present invention is applied to the positive inspection of the semiconductor device 20, as shown in FIG. 5A, the bidirectional conductive module 100 is inspected with the semiconductor device 20. Disposed between the circuit boards 10. As shown in FIG. 5B, each conductive pattern portion 130 of the bidirectional conductive module 100 is in contact with the terminal 11 of the lower device 10. The terminal 11 of the lower device penetrates through the terminal through hole 145 to be in contact with the conductive pattern 130.

 According to the above configuration, when the ball 21 of the semiconductor device 20 in contact with the upper portion of the conductive pattern portion 130 on the upper portion of the bi-directional conductive module 100, the conductive pattern portion 130 correspond to each other The ball 21 of the semiconductor device 20 and the signal terminal 11 of the test circuit board 10 are connected to each other to enable a positive test of the semiconductor device 20.

At this time, the elastic spring 120 located in the periphery of each conductive pattern portion 130 is in contact with the ground terminal portion 140 to form a ground, thereby preventing noise and mutual signal interference in each conductive pattern portion 130. By minimizing this, stable signal transmission is possible, and high-speed implementation is also possible.

In addition, the elastic spring 120 that performs the grounding function provides a restoring force in the vertical direction, so that when the ball 21 of the semiconductor device 20 presses the conductive pattern portion 130 in the lower direction in the upper direction, the insulating spring 120 is insulative. The elastic spring 120 together with the main body 110 elastically supports it, thereby preventing deformation of the insulating main body 110. Through this, it is possible to prevent the deterioration of the electrical characteristics due to deformation as well as to improve the life of the product.

Hereinafter, a method of manufacturing the bidirectional conductive module 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 9 and 10.

First, as shown in FIG. 9A, a base mold 1 having a plurality of mold pins 3 protruding upward is provided. Here, the plurality of mold pins 3 formed in the base mold 1 are provided at sizes and intervals corresponding to the through holes 111 of the bidirectional conductive module 100. Then, the elastic spring 120 is fitted to each mold pin 3 so as to surround each mold pin 3.

In the state where the elastic spring 120 is fitted to each mold pin 3, as shown in FIG. 9B, a liquid, for example, liquid silicone 132 of an insulating material is applied to the base mold 1. After injection, the resin is cured at a high temperature to form an insulating body 110. In the present invention, for example, curing at high temperature for more than 15 minutes at a temperature of 150 ℃. At this time, when injecting the liquid silicon 132 into the base mold 1, as shown in Figure 9 (b), the amount of the upper portion of the elastic spring 120 can be exposed to the outside When the insulating body 110 is formed and used upside down, as shown in FIGS. 4 and 5, the lower portion of the elastic spring 120 is exposed to the lower surface of the insulating body 110. It becomes possible to form.

When the formation of the insulating main body 110 is completed as described above, when the insulating main body 110 is separated from the base mold 1, as shown in FIG. 10, the insulating main body 110 having the plurality of through holes 111 is formed. ) Production is completed. 10 illustrates a state in which the upper and lower sides of the insulating body 110 are not reversed. Here, the plurality of through holes penetrated in the vertical direction in the insulating main body 110 by the respective mold pins 3, and the insulating main body 110 in a form in which the elastic spring 120 wraps around the respective through holes. It is formed inside.

When the filler including the conductive particles 131, for example, the filler filled with the liquid silicon 132 and the conductive particles 131 are mixed in each through hole 111 and then cured, the conductive particles 131 may be electrically conductive. The pattern portion 130 is formed, and flips it up and down. Here, the filler is an example of curing at a high temperature, for example, 160 ℃ or higher.

Thereafter, the ground terminal portion 140 is in contact with the portion where the elastic spring 120 protrudes, and the conductive pattern portion 130 is exposed to the outside by the plurality of terminal through holes 145. Is coupled to. Thus, as shown in FIGS. 4 and 5, the manufacturing of the bidirectional conductive module 100 in which the ground terminal unit 140 is integrally coupled to the insulator body 110 is completed.

Hereinafter, the bidirectional conductive module 300 according to the second embodiment of the present invention will be described in detail with reference to FIG. 11.

In the bidirectional conductive module 300 according to the second embodiment of the present invention, as shown in FIG. 11, the bidirectional conductive module 300 includes an insulating body 310, an elastic spring 320, and a conductive pattern portion 330. And a ground terminal unit 340.

Like the first embodiment, the insulating body 310 is made of an insulating material, for example, is provided with a material having elasticity such as silicon. The insulating body 310 has a plurality of through holes 311 and 312 penetrating in the vertical direction.

Here, each of the through holes 311 and 312 of the insulating main body 310 according to the second embodiment of the present invention, as shown in the enlarged region of FIG. 11 and FIG. 13, the upper through hole 311 and the lower through hole. 312.

The upper through hole 311 is opened in the upper direction and communicates with the lower through hole 312 in the lower direction. The lower through hole 312 is opened in the lower direction and communicates with the upper through hole 311 in the upper direction. Here, the inner diameter of the lower through hole 312 is provided to be smaller than the inner diameter of the upper through hole 311, the step 313 is formed between the upper through hole 311 and the lower through hole 312.

Like the first embodiment, the conductive pattern portion 330 is formed in each of the through holes 311 and 312 to form signal lines in the vertical direction. Each conductive pattern part 330 according to the second exemplary embodiment of the present invention may include a conductive filling part 331 and conductive pins 332 and 333, as shown in FIG. 11.

The conductive filler 331 is filled in the upper region of each of the through holes 311 and 312, that is, the upper through hole 311. Here, the conductive filler 331 is formed by filling a filler including conductive powder having conductivity as in the first embodiment.

The conductive pins 332 and 333 are accommodated in the lower regions of the through holes 311 and 312, that is, the lower through holes 312, and remain in electrical contact with the conductive filler 331. Accordingly, the conductive filler 331 and the conductive pins 332 and 333 form one conductive pattern in the vertical direction.

Here, the conductive pins 332 and 333 include a pillar portion 332 inserted into the lower through hole 312 and an extension portion 333 extending radially outward from the top of the pillar portion 332. As a result, even when the conductive pins 332 and 333 move from the upper portion of the extension portion 333 to the lower portion in the state where the pillar portion 332 is inserted into the lower through hole 312, the stepped portions 313 of the through holes 311 and 312 are moved. It becomes a catching form, and the departure to the downward direction is prevented.

In the present invention, for example, the conductive pins 332 and 333 are formed on the surface of the base body in the form of conductive pins 332 and 333 by plating with a conductive material. The base body is made of a fiber material or a BeCu material, and a nickel material and a gold material. For example, it is formed through the sequential plating of.

In the formation of one conductive pattern according to the above configuration, by using the conductive filling portion 331 and the conductive pins 332 and 333, the conductive filling portion 331 is a ball (21, 5) of the semiconductor device 20 By removing the scratches that may occur in the ball 21 and solving the thickness of the conductive pattern in the vertical direction by the length of the conductive pins 332 and 333 in the vertical direction. It is possible to solve the problem of fine pitch, which is a problem of the pin type semiconductor test socket, and at the same time, to solve the problem of thickness constraint in the vertical direction, which is the problem of the PCR test semiconductor test socket.

The elastic spring 320 is formed inside the insulating body 310 to surround the periphery of each of the through holes 311 and 312 to provide a restoring force in the vertical direction. Here, the configuration of the elastic spring 320 according to the second embodiment of the present invention corresponds to the first embodiment, a detailed description thereof will be omitted.

The ground terminal portion 340 is in contact with the elastic spring 320 and is coupled to the lower portion of the insulating body 310 so that the plurality of conductive pattern portions 330 are exposed downward. The ground terminal portion 340 may be coupled to the insulator body 310 by an adhesive 390, but is not necessarily limited thereto. The ground terminal portion 340 according to the second embodiment of the present invention has a variable size of the ground pattern and the terminal through hole 345 in accordance with the shape change of the T-type conductive pattern portion 330. The ground terminal part 340 is provided with a plurality of terminal through holes 345 to correspond to the lower through holes 312 provided in the insulating body 310. The configuration of the ground terminal unit 340 according to the second embodiment of the present invention corresponds to the first embodiment, and a detailed description thereof will be omitted.

According to the above configuration, in the second embodiment of the present invention, as in the first embodiment, the conductive pattern portion of the bidirectional conductive module 300 in the state in which the elastic spring 320 is in contact with the ground terminal portion 340 Each of the 330 contacts the signal terminal 11 of the test circuit board 10, and the ball 21 of the semiconductor device 20 is positioned on the conductive pattern portion 330 on the bidirectional conductive module 300. When contacted, the ball 21 of the semiconductor device 20 and the signal terminal 11 of the test circuit board 10 corresponding to each other are connected to each other by the conductive pattern part 330, so that the positive test of the semiconductor device 20 is performed. It becomes possible.

At this time, the elastic spring 320 located in the periphery of each conductive pattern portion 330 is in contact with the ground terminal portion 340 to form a ground, thereby preventing noise and mutual signal interference in each conductive pattern portion 330. By minimizing this, stable signal transmission is possible, and high-speed implementation is also possible.

In addition, the elastic spring 320 to perform the grounding function to provide a restoring force in the vertical direction, it is insulating when the ball 21 of the semiconductor device 20 presses the conductive pattern portion 330 in the lower direction in the upper direction The elastic spring 320 is elastically supported together with the main body 310 to prevent deformation of the insulating main body 310. Through this, it is possible to prevent the deterioration of the electrical characteristics due to deformation as well as to improve the life of the product.

Hereinafter, a method of manufacturing the bidirectional conductive module 300 according to the second embodiment of the present invention will be described with reference to FIGS. 12 to 14.

First, as shown in FIG. 12A, first, as shown in FIG. 5A, a base mold 3 having a plurality of mold pins 3 protruding upward is provided. Here, the plurality of mold pins 3 formed in the base mold 3 are provided to correspond to the shape of the through holes 311 and 312 of the bidirectional conductive module 300. In more detail, each mold pin 3 has a first pin portion 512 protruding from the bottom surface of the base mold 3, and extends from the first pin portion 512 and has a diameter greater than that of the first pin portion 512. This small second pin part 511 is comprised. Here, the first fin part 512 corresponds to the upper through hole 311 of the through holes 311 and 312, and the second fin part 511 corresponds to the lower through hole 312 of the through holes 311 and 312.

Then, the elastic spring 320 is fitted to each mold pin 3 so as to surround each mold pin 3. Here, the inner diameter of the elastic spring 320 is formed larger than the diameter of the first pin. Then, in the state in which the elastic spring 320 is fitted to each of the mold pins 3, as shown in (b) of FIG. 12, the base mold (3) is a liquid of insulating material, for example, liquid silicone (332) After injecting into the resin, it is cured at a high temperature to form an insulating body 310. In the present invention, for example, curing at high temperature for more than 15 minutes at a temperature of 150 ℃. At this time, as in the first embodiment, the liquid silicon 332 is injected to the extent that the upper portion of the elastic spring 320 is exposed.

Then, when curing of the liquid silicone 332 is completed, when the insulating main body 310 is removed from the base mold 3, as shown in (a) of FIG. 13, a plurality of through holes (311, 312) The formed insulating body 310 is produced. Here, each of the through holes 311 and 312 includes a lower through hole 312 formed by the second pin part 511 and an upper through hole 311 formed by the first pin part 512. The inner diameter of the through hole 312 is formed smaller than the inner diameter of the upper through hole 311. In addition, the elastic spring 320 surrounds the periphery of the through holes 311 and 312, and is formed in the insulating body 310.

Then, as illustrated in FIG. 13B, the conductive pins 332 and 333 are inserted through the upper through hole 311 so that the pillar part 332 is inserted into the lower through hole 312. In this case, the extension portions 333 of the conductive pins 332 and 333 may be caught by the internal step 313 of the through holes 311 and 312, thereby preventing them from being separated below the through holes 311 and 312 during the manufacturing process.

After the conductive pins 332 and 333 are inserted, the filler including the conductive powder, for example, the liquid silicone 332 and the filler mixed with the conductive powder, as shown in FIG. When the filler is filled in the through hole 311 and cured, the conductive filler 331 can be formed. Here, the filler is an example of curing at a high temperature, for example, 160 ℃ or higher.

Thereafter, the ground terminal portion 340 is coupled to the lower portion of the insulator body 310 so that the conductive pattern portion 330 is exposed to the outside and the elastic spring 320 is in contact with the protruding portion. The ground terminal portion 340 may be coupled to the insulator body 310 by an adhesive 390, but is not necessarily limited thereto, and may be coupled to the insulator body 310 in various ways within a range obvious to those skilled in the art. Can be.

In the present invention, as shown in Figure 14 (b), in the curing process of the filler, after filling the filler, the upper plate mold 610 is in contact with the upper surface of the insulating body 310, each upper through hole The upper portion of the 311 is blocked, and the lower plate mold 620 contacts the lower surface of the insulating body 310 so that the pillar portion 332 protruding downward through the lower through hole 312 moves upward. In one state, the filling process may be performed.

Accordingly, the pillar portion 332 is pushed upward by the lower plate mold, and the conductive filling portion 331 is cured in a state where a space S is formed between the extension portion 333 and the step 313. Becomes possible. Accordingly, the extension parts 333 of the conductive pins 332 and 333 are spaced apart from each other in the upper direction from the inner step 313 of the through holes 311 and 312 as shown in the enlarged area of FIG. 11.

Through this, the lower ends of the pillars 332 of the conductive pins 332 and 333 protrude to the outside of the lower through hole 312 for contact with the test circuit board 10. If a part is located inside the lower through hole 312 during the transfer process, a poor contact occurs.

However, at the top, the balls 21 of the semiconductor device 20 conduct to the spaced space S between the extension portions 333 of the conductive pins 332 and 333 and the internal step 313 of the through holes 311 and 312 by pressing. As the pins 332 and 333 are movable, the lower portion of the pillar portion 332 of the conductive pins 332 and 333 can stably contact the test circuit board 10.

In the above-described embodiment, the upper and lower regions of the elastic spring 320 are formed entirely from the upper region to the lower region, but the lower portion of the elastic spring 320 is exposed from the lower surface of the insulating body 310. Of course, it can be formed only in some areas.

According to the present invention, according to the present invention, it is possible to replace the pogo-pin type semiconductor test socket, but also to test at high speed with stable signal transmission, and between the CPU and the board of high-speed CPU and board A bidirectional conductive module is also provided that can be applied to an interposer that electrically connects the board.

According to the present invention, the ground terminal part is integrally formed in the bidirectional conductive module, and the elastic spring surrounding each conductive pattern part contacts the ground terminal part to form ground, thereby minimizing noise and mutual signal interference in each conductive pattern part, thereby ensuring stable signal. It is possible to deliver, and high-speed implementation is also possible.

In addition, the present invention is formed so that the ground terminal portion is in contact with the elastic spring, but not in contact with the conductive pattern portion and the terminal of the lower device, to block the flow of current to the ground terminal portion when the upper device and the lower device is electrically connected bidirectionally This can prevent short circuit of current in the module.

According to the present invention, the elastic spring provided in the bidirectional conductive module is grounded to the ground terminal portion, and the bidirectional conductive module is electrically connected to the terminals of the upper device and the terminals of the lower device, respectively, and the positive test is performed, so that the upper device or It is possible to improve the inspection efficiency of the lower device.

According to the present invention, the upper device and the lower device can be electrically connected by using the bidirectional conductive module in which the ground terminal part is integrally formed to perform a positive test of the upper device, so that the ground device is replaced with the upper device or the lower device. It can improve the user satisfaction in terms of the company that inspects the device.

Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

100,300: bidirectional conductive module 110,310: insulating body
111: through hole 311: upper through hole
312 lower through hole 313 step
120,320: elastic spring 130,330: conductive pattern portion
131: conductive particle 132: silicon
331: conductive filling portion 332: pillar portion
333: extensions 140, 340: ground terminal
1,500: base mold 3: mold pin
511: second pin portion 512: first pin portion
10: inspection circuit board 11: signal terminal
20 semiconductor device 21 ball

Claims (9)

In the bidirectional conductive module for electrically connecting the upper device and the lower device,
An insulating body provided with an insulating material and having a plurality of through holes penetrated in the vertical direction;
A plurality of conductive pattern portions formed in each of the through holes and electrically connecting the upper device and the lower device by forming signal lines in the vertical direction;
An elastic spring having conductivity and formed in the insulating body so as to surround a periphery of each of the through holes and to be physically separated from the conductive pattern portion, and to provide a restoring force in the vertical direction;
And a ground terminal portion coupled to a lower portion of the insulating body so that the plurality of conductive pattern portions are exposed downward, and contacting each of the elastic springs exposed in the lower direction of the insulating body to ground the elastic spring. Bidirectional conductive module. The method of claim 1, wherein the ground terminal portion,
An insulation plate provided with a plurality of terminal through holes penetrated in an array corresponding to the plurality of through holes;
A ground pattern patterned on one surface of the insulating plate to be electrically connected to the elastic spring,
And the ground pattern is in contact with each of the elastic springs to form a ground in the elastic springs. The method of claim 2,
The ground pattern is formed by passing a plurality of ground pattern holes in a vertical direction in a plating layer provided between the insulating plate and the insulating body,
The plurality of ground pattern holes may be arranged to correspond to the plurality of through holes, and have a diameter larger than the diameter of the through hole and smaller than the diameter of the elastic spring. The method of claim 2,
And the ground pattern is patterned on one surface of the insulating plate to surround one region of each of the terminal through-holes and to be electrically connected to each other. The method of claim 2, wherein the ground terminal portion,
A lower conductive pattern patterned on the other surface of the insulating plate such that the plurality of terminal through holes are opened downward;
A hole plating layer provided on an inner circumferential surface of the terminal through hole and electrically connecting the lower conductive pattern to the ground pattern;
The inner diameter of the hole plating layer is bidirectional conductive module, characterized in that larger than the diameter of the through hole. The method of claim 1,
The elastic spring is
A base spring having a restoring force in the vertical direction;
And a plated layer plated on a surface of the base spring to provide conductivity. The method of claim 1,
The elastic spring is a bi-directional conductive module, characterized in that it comprises a coil spring of the form wound around the inside of the insulating body around the through hole in the vertical direction. The method of claim 1,
Each conductive pattern portion
A bidirectional conductive module, characterized in that the filler comprising conductive particles having conductivity is filled in each of the through holes. The method of claim 1,
Each conductive pattern portion
A conductive filler filled in an upper region of each of the through holes and filled with a filler including conductive particles having conductivity;
A conductive pin received in a lower region of each of the through holes, the conductive pin being in electrical contact with the conductive filling portion;
Each of the through holes,
An upper through hole opened in an upward direction,
A lower through hole having an inner diameter smaller than an inner diameter of the upper through hole and forming a step between the upper through hole;
Each of the conductive pins,
A pillar portion inserted into the lower through hole;
And an extension extending radially outward from an upper portion of the pillar portion.

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