KR101735418B1 - Manufacturing method of semiconductor package test socket using plural moldpin - Google Patents

Manufacturing method of semiconductor package test socket using plural moldpin Download PDF

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Publication number
KR101735418B1
KR101735418B1 KR1020150098831A KR20150098831A KR101735418B1 KR 101735418 B1 KR101735418 B1 KR 101735418B1 KR 1020150098831 A KR1020150098831 A KR 1020150098831A KR 20150098831 A KR20150098831 A KR 20150098831A KR 101735418 B1 KR101735418 B1 KR 101735418B1
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South Korea
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mold
test socket
mold body
semiconductor
manufacturing
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KR1020150098831A
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Korean (ko)
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KR20170008330A (en
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이은주
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주식회사 이노글로벌
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

In one embodiment of the present invention, a method of manufacturing a semiconductor package test socket using a plurality of mold pins for manufacturing a semiconductor test socket using a mold for a semiconductor test socket comprises the steps of: (S1) a mold for a semiconductor test socket having an upper mold body provided with a plurality of projecting fins and a lower mold body provided with a mold groove, the method comprising the steps of: ; (S2) injecting a second mold material into a mold cavity provided in the lower mold body; (S3) before the second mold material is cured, the upper mold body is engaged with the lower mold body so that a plurality of projecting fins are inserted into the second mold material injected into the mold cavity; (S4) After the second mold material is cured, the upper mold body is separated from the lower mold body, the hardened second mold material is separated from the mold recess of the lower mold body, and a test pad having a plurality of conductive holes is formed step; And (S5) a step of forming a semiconductor test socket while the conductive powder is filled into the plurality of conductive holes of the test pad, wherein (S1) the step of forming a metal mold having a predetermined thickness, Forming a perforation hole; Attaching a mold plate to one surface of the mold plate; Providing an upper mold body having a plurality of projecting fins protruded from the surface of the mold plate after the first mold material is injected into the plurality of holes and cured; And a step of preparing a lower mold body having a mold cavity in which a plurality of projecting pins are seated.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for manufacturing a semiconductor package test socket using a plurality of mold pins,

The present invention relates to a method of manufacturing a socket for testing a semiconductor package using a plurality of mold pins, and more particularly, to a method of manufacturing a socket for testing a semiconductor package using a plurality of mold pins, To a method of manufacturing a socket for testing a semiconductor package using a plurality of mold pins.

The semiconductor device is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. Inspection is carried out with a semiconductor test socket (or a connector or a connector) formed so as to be in electrical contact with a terminal of a semiconductor element inserted between a semiconductor element and an inspection circuit board.

Semiconductor test sockets are used in burn-in testing process of semiconductor devices in addition to final semiconductor testing of semiconductor devices.

The size and spacing of terminals or leads of semiconductor devices are becoming finer in accordance with the development of technology for integrating semiconductor devices and miniaturization trends and there is a demand for a method of finely forming spaces between conductive patterns of test sockets.

Therefore, conventional Pogo-pin type semiconductor test sockets have limitations in manufacturing semiconductor test sockets for testing integrated semiconductor devices.

The proposed technique to be compatible with the integration of such semiconductor devices is to form a perforated pattern in a vertical direction on a silicon body made of a silicone material of elastic material and then to fill the perforated pattern with a conductive powder to form a conductive pattern PCR-type sockets are widely used.

Korean Patent No. 10-0952712 discloses a ball grid array (BGA) semiconductor device in connection with a silicon contactor, and Korean Patent No. 10-0952712 (silicon contactor including plate type conductive particles) And an insulating silicon part serving as an insulating layer between the conductive silicon part and the conductive silicon part in contact with the lead terminal of the device.

Meanwhile, a conventional PCR type semiconductor test socket is manufactured as shown in FIG.

First, as shown in Fig. 1 (a), a silicon pad 10 having a flat plate structure having a predetermined thickness is prepared. Thereafter, as shown in Fig. 1 (b), a laser pierces the silicon pad 10, and a plurality of holes 11 are formed in the silicon pad 10. [ Next, as shown in FIG. 1 (c), the conductive powder is injected into the plurality of holes 11 provided in the test pad to form the PCR-type semiconductor test socket 20.

The semiconductor test socket 20 of the PCR (Pressure Conductive Rubber) type manufactured through the process described above can be used for a plurality of holes 11 due to a mechanical error of the laser, The size of the semiconductor test socket 20 can be miniaturized to easily test the defect of the silicon pad 10 in order to test the very small semiconductor element when the defect such as the gap between the holes 11 occurs, , There may arise a problem of finally producing a defective PCR type semiconductor test socket 20.

As the size of the semiconductor device is miniaturized with the development of electronic technology, the size of the PCR type semiconductor test socket 20 for testing the semiconductor device is also miniaturized, and the PCR type semiconductor test socket 20 is miniaturized. There is a problem that it is difficult to easily select the defective product.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor package test method using a plurality of mold pins capable of puncturing a conductive hole filled with a conductive powder in a semiconductor test socket, And it is an object of the present invention to provide a method of manufacturing a socket for a socket.

The present invention also provides a method of manufacturing a semiconductor package test socket using a plurality of mold pins capable of continuously producing test pads of the same size due to the production of one mold, And to provide the above objects.

In addition, the mold for a semiconductor test socket according to the present invention provides a method of manufacturing a socket for testing a semiconductor package using a plurality of mold pins capable of performing simultaneous puncturing of a plurality of conductive holes together with molding of a test pad used in a semiconductor test socket The purpose.

The present invention relates to a method of manufacturing a test pad having a bidirectional conductive portion having a predetermined size by forming a plurality of conductive holes in a test pad by a plurality of protruding fins formed in a predetermined standard using a semiconductor test socket mold, It is another object of the present invention to provide a method of manufacturing a socket for testing semiconductor packages using pins.

The present invention also provides a method of manufacturing a socket for testing a semiconductor package using a plurality of mold pins for manufacturing a semiconductor test socket capable of more stably forming an electrical contact between a semiconductor device and an inspection circuit board, The purpose is to provide.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor package test socket using a plurality of mold pins for manufacturing a semiconductor test socket using a mold for a semiconductor test socket, the method comprising the steps of: (S1) Preparing a mold for a semiconductor test socket having a main body and a lower mold body provided with a mold groove; (S2) injecting a second mold material into a mold cavity provided in the lower mold body; (S3) before the second mold material is cured, the upper mold body is engaged with the lower mold body so that a plurality of projecting fins are inserted into the second mold material injected into the mold cavity; (S4) After the second mold material is cured, the upper mold body is separated from the lower mold body, the hardened second mold material is separated from the mold recess of the lower mold body, and a test pad having a plurality of conductive holes is formed step; And (S5) a step of forming a semiconductor test socket while the conductive powder is filled into the plurality of conductive holes of the test pad, wherein (S1) the step of forming a metal mold having a predetermined thickness, Forming a perforation hole; Attaching a mold plate to one surface of the mold plate; Providing an upper mold body having a plurality of projecting fins protruded from the surface of the mold plate after the first mold material is injected into the plurality of holes and cured; And a step of preparing a lower mold body having a mold cavity in which a plurality of projecting pins are seated.

delete

In one embodiment of the present invention, it is preferable that the mold plate is made of FR4 or aluminum material capable of withstanding a high temperature of 100 DEG C or more.

In one embodiment of the present invention, it is preferable that the mold plate has a thickness such that when the upper mold body and the lower mold body are coupled, a plurality of protruding fins can abut the bottom surface of the mold cavity.

In one embodiment of the present invention, in the step (S5), the conductive powder is a gold-plated powder of nickel powder, and the conductive powder is injected into the plurality of conductive holes in a state mixed with the third template material, It is preferable that the template material is cured and bonded to the plurality of conductive holes.

In one embodiment of the present invention, the second template material is preferably liquid silicone.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor package test socket using a plurality of mold pins for manufacturing a semiconductor test socket using a mold for a semiconductor test socket, the method comprising the steps of: (S1) Preparing a mold for a semiconductor test socket having a main body and a lower mold body provided with a mold groove; (S2) injecting a second mold material into a mold cavity provided in the lower mold body; (S3) before the second mold material is cured, the upper mold body is engaged with the lower mold body so that a plurality of projecting fins are inserted into the second mold material injected into the mold cavity; (S4) After the second mold material is cured, the upper mold body is separated from the lower mold body, the hardened second mold material is separated from the mold recess of the lower mold body, and a test pad having a plurality of conductive holes is formed step; And (S5) a step of preparing a semiconductor test socket while the conductive powder is filled into the plurality of conductive holes of the test pad. In the step (S5), the conductive powder is a gold-plated powder of nickel powder, It is preferable that the third template material is cured and bonded to the plurality of conductive holes after being injected into the plurality of conductive holes in a mixed state with the template material.

The present invention is characterized in that a mold for a semiconductor test socket is used to divide a space of a mold cavity by a plurality of projecting fins of an upper mold body after a second mold material is poured into a mold cavity of a lower mold body, The test pads are manufactured in such a manner that a plurality of conductive holes are provided in the portions where the plurality of protruding fins are disposed. As described in the background art, when a test pad is conventionally formed by using a laser, It is possible to prevent the defective product due to the position error of the test pad or the like.

Further, according to the present invention, test pads having the same size can be successively formed by one-time production of a mold, thereby increasing production efficiency of the semiconductor test socket.

In addition, the present invention can simultaneously form a hole of a plurality of conductive holes together with molding of a test pad used in a semiconductor test socket by using a mold for a semiconductor test socket.

In addition, since a plurality of conductive holes are formed in a test pad by a plurality of protruding fins formed in a predetermined standard, a test pad having a predetermined standard can be manufactured, and a semiconductor test The defective product of the socket can be minimized.

The present invention also provides a method of manufacturing a semiconductor test socket for testing a very small semiconductor device, comprising the steps of: forming a plurality of electrically conductive holes having a very small diameter and a plurality of electrically conductive holes Thus, it is possible to efficiently test a semiconductor device having a very small size.

1 schematically illustrates a semiconductor test socket manufacturing process according to the prior art.
FIG. 2 illustrates a mold manufacturing process for a semiconductor test socket according to an embodiment of the present invention. Referring to FIG.
FIG. 3 illustrates a manufacturing process of a semiconductor test socket according to an embodiment of the present invention.
4 schematically shows a perspective view of a semiconductor test socket according to an embodiment of the present invention.

Hereinafter, a method of manufacturing a semiconductor package test socket using a plurality of mold pins according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

Referring to FIG. 2, a process for manufacturing a semiconductor test socket mold used in a method for manufacturing a semiconductor package test socket using a plurality of mold pins according to an embodiment of the present invention will be described.

As shown in Fig. 2 (a), a mold plate 110 having a predetermined thickness is prepared. The mold plate 110 is preferably made of FR-4 or aluminum which can withstand a high temperature of 100 ° C or more. Here, FR-4 (Frame Retardent-4) is a glass epoxy laminate.

As shown in FIG. 2 (b), a plurality of perforation holes 111 are formed in the mold plate 110. The plurality of perforation holes 111 are formed by perforating the mold plate 110 by a perforation machine (not shown). Here, the perforation machine (not shown) may be a laser machine that emits a laser, but it is not limited thereto, and various products may be used within a range obvious to those skilled in the art.

The size of the mold plate 110 and the size and number of the plurality of perforation holes 111 may vary within a range that is obvious from the viewpoint of those skilled in the art depending on the size of the semiconductor test socket 140 and the size and number of the conductive holes 142 Lt; / RTI >

The diameter of the perforation hole 111 is preferably equal to the diameter of the conductive hole 142 formed in the test pad 141 of the semiconductor test socket 140 manufactured by the mold 100 for semiconductor test socket .

When the upper mold body 120 is coupled to the lower mold body 130, the plurality of projecting pins 125b of the upper mold body 120 are inserted into the mold cavity 132 of the lower mold body 130 And a bottom surface of the base plate.

As shown in FIG. 2 (b), the mold plate 121 is attached to one surface of the mold plate 110. Here, the mold plate 121 preferably has a flat plate-like structure abutting one surface of the mold plate 110.

The first mold material 125a is injected into the plurality of perforation holes 111 of the mold plate 110, as shown in FIG. 2 (c). The first mold material 125a is preferably made of a material that can be easily adhered to the mold plate 121 during curing. The first mold material 125a is preferably made of a material having predetermined strength so as to be vertically protruded from one surface of the mold plate 121 after being cured.

In this embodiment, it is preferable that the first mold material 125a is made of a material which is the same as or similar to the mold plate 121 and has a melting point higher than that of the second mold material 135, which will be described later.

The first mold material 125a is injected into the plurality of perforation holes 111 while the mold plate 110 and the mold plate 121 are in contact with each other, After the mold is cured, the mold plate 110 is separated from the mold plate 121 to form the upper mold body 120 as shown in FIG. 2 (d).

The upper mold body 120 includes a mold plate 121 and a plurality of protruding pins 125b. The plurality of projecting pins 125b are formed so as to protrude from the surface of the mold plate 121 while being hardened after the first mold material 125a is injected into the plurality of perforation holes 111. [

If there is a burr generated in the process of curing the foreign matter or the first template material 125a in the upper mold body 120, the foreign material and / or the burr may be transferred to the upper mold body (120). ≪ / RTI >

Meanwhile, a lower mold body 130 to be coupled with the upper mold body 120 is prepared to mold the test pads 141 of the semiconductor test socket 140 to be described later. The semiconductor test socket mold 100 according to the present embodiment has a guide jaw 133 formed on the lower mold body 130 in order to maintain a constant engagement position between the upper mold body 120 and the lower mold body 130 .

As shown in FIG. 2 (e), the lower mold body 130 has a mold cavity 132 in which the second mold material 135 is injected and a plurality of projecting pins 125b are seated. It should be noted that the size of the mold groove 132 may be variously varied within a range obvious to those skilled in the art depending on the size of the test pad 141.

The mold 100 for a semiconductor test socket manufactured by the method for manufacturing a semiconductor package test socket using a plurality of mold pins according to an embodiment of the present invention can be manufactured by forming the second mold material 135 in the mold A plurality of protruding pins 125b of the upper mold body 120 divide the space of the mold cavity 132 after the cavity 132 is filled and the second mold material 135 is hardened, The test pad 141 is manufactured in such a manner that a plurality of conductive holes 142 are provided in a portion where the test pads 141a and 142b are located and the test pads 141 are formed using a laser as described in the background art Defective production due to a mechanical error of the laser or a positional error of the test pad 141 can be prevented.

In addition, the present invention can continuously print test pads 141 having the same size due to the production of a single mold, thereby increasing the production efficiency of the semiconductor test socket 140.

In addition, the mold 100 for a semiconductor test socket according to the present invention can simultaneously perform the puncturing of the plurality of conductive holes 142 together with the molding of the test pads 141 used in the semiconductor test socket 140.

In addition, according to the present invention, since the plurality of conductive holes 142 are formed in the test pad 141 by the plurality of projecting pins 125b formed in a predetermined standard, the test pad 141 having a certain standard can be manufactured , It is possible to minimize the defective product of the semiconductor test socket (140) due to the defect of the conductive hole (142) having a minute size.

Hereinafter, a method of manufacturing a semiconductor package test socket using a plurality of mold pins for manufacturing a semiconductor test socket 140 using the mold 100 for a semiconductor test socket will be described with reference to FIG.

3 (a), an upper mold body 120 provided with a plurality of protruding pins 125b and a lower mold body 130 provided with a mold cavity 132 are provided for a semiconductor test socket The mold 100 is prepared (step S1). The manufacturing process of the semiconductor test socket mold 100 is as described above.

The second mold material 135 is injected into the mold cavity 132 provided in the lower mold body 130 in step S2. At this time, the second mold material 135 is in a liquid state. As the second mold material 135, liquid silicone which is hardened at a predetermined temperature and is not adhered to the upper mold body 120 and the lower mold body 130 may be used. The curing temperature of the silicon varies depending on the type of the silicon. In this embodiment, the curing temperature of the silicon is not particularly limited, and may be varied in various ways depending on the type of silicon used.

3 (b), the upper mold body 120 is engaged with the lower mold body 130 before the second mold material 135 is cured. At this time, the position of the upper mold body 120 where the plurality of projecting pins 125b are inserted into the mold cavity 132 is constantly positioned by the guide jaws 133 provided on the lower mold body 130.

After the second mold material 135 is cured, the upper mold body 120 is separated from the lower mold body 130 and the cured second mold material is removed from the mold cavity 130 of the lower mold body 130 132, it is preferable that a test pad 141 having a plurality of conductive holes 142 as shown in FIG. 3 (c) is provided.

3 (d), in step S5, the conductive powder is filled with the plurality of perforation holes 111 of the test pad 141, and a plurality of conductive parts 145 having bidirectional conductivity are provided. (140). It is preferable that the conductive powder is injected into the plurality of perforation holes 111 while being mixed with the third template material (not shown) and the primer, and then the third template material is cured and bonded to the plurality of perforation holes 111 Do. Here, as the conductive powder, a gold-plated powder may be used for the nickel powder. As the third mold material, a material easy to be bonded to the test pad 141 may be used. For example, liquid silicone having the same material as the second mold material may be used.

The semiconductor test socket 140 manufactured by the above process has a plate structure having a predetermined thickness. The semiconductor test socket 140 is provided with a conductive portion 145 formed by filling a plurality of conductive holes 142 with conductive powder.

The conductive portion 145 is a portion in electrical contact with the terminals of the semiconductor element and the terminals of the inspection circuit board. The terminal of the semiconductor element (not shown) and the terminal of the inspection circuit board (not shown) are electrically connected to each other by the conductive portion 145.

A method for manufacturing a semiconductor package test socket using a plurality of mold pins according to the present invention is to manufacture a semiconductor test socket 140 using a semiconductor test socket mold 100, The test holes 141 of the test holes 141 can be simultaneously formed with the molding of the test pads 141 used in the test socket 140.

The semiconductor test socket 140 manufactured by the semiconductor test socket mold 100 has a plurality of conductive holes 142 formed in the test pad 141 by a plurality of protruding pins 125b formed in a predetermined standard Accordingly, the test pad 141 having a predetermined standard can be manufactured, and the defective product due to the defective conductive hole 142 having a small size can be minimized.

The present invention also provides a method of manufacturing a semiconductor test socket 140 for testing a very small semiconductor device using a semiconductor test socket mold 100 to form a plurality of conductive holes 142 having a very small diameter, The spacing between the holes 142 can be set to a certain standard, thereby enabling efficient testing of semiconductor elements having an ultra-small size.

Although several embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various modifications may be made without departing from the principles and spirit of the invention . The scope of the invention will be determined by the appended claims and their equivalents.

100: Mold for semiconductor test socket
110: mold plate 120: upper mold body
121: mold plate 125a: first mold material
125b: projecting pin 130: lower mold body
132: mold groove 133: guide chin
135: second mold material 140: semiconductor test socket
141: test pad 142: conductive hole
145:

Claims (7)

A method of manufacturing a semiconductor package test socket using a plurality of mold pins for manufacturing a semiconductor test socket using a mold for semiconductor test socket,
(S1) preparing a mold for a semiconductor test socket having an upper mold body provided with a plurality of projecting pins and a lower mold body provided with a mold groove;
(S2) injecting a second mold material into a mold cavity provided in the lower mold body;
(S3) before the second mold material is cured, the upper mold body is engaged with the lower mold body, and the plurality of projecting pins are inserted into the second mold material injected into the mold cavity;
(S4) After the second mold material is cured, the upper mold body is separated from the lower mold body, the cured second mold material is separated from the mold cavity of the lower mold body, Forming a test pad; And
(S5) a step of preparing the semiconductor test socket while filling the conductive holes in the plurality of conductive holes of the test pad,
The step (S1)
Forming a plurality of perforated holes in the mold plate by drilling a mold plate having a predetermined thickness;
Attaching a mold plate to one surface of the mold plate;
Providing the upper mold body having the plurality of projecting fins protruded from the surface of the mold plate after the first mold material is injected into the plurality of holes and cured; And
And a step of preparing a lower mold main body having the mold recess on which the plurality of protruding fins are mounted.
delete The method according to claim 1,
Wherein the mold plate is made of FR4 or aluminum material capable of withstanding a high temperature of 100 DEG C or more.
The method according to claim 1,
Wherein the mold plate has a thickness such that when the upper mold body and the lower mold body are coupled to each other, the plurality of projecting pins can abut the bottom surface of the mold cavity. Method of manufacturing socket for.
The method of claim 1, wherein, in the step (S5)
The conductive powder is a gold-plated powder of nickel powder,
Wherein the conductive powder is injected into the plurality of conductive holes in a state mixed with the third mold material and is then bonded to the plurality of conductive holes while the third mold material is cured. A method of manufacturing a socket for testing semiconductor packages.
The method according to claim 1,
Wherein the second mold material is liquid silicon. ≪ RTI ID = 0.0 > 11. < / RTI >
A method of manufacturing a semiconductor package test socket using a plurality of mold pins for manufacturing a semiconductor test socket using a mold for semiconductor test socket,
(S1) preparing a mold for a semiconductor test socket having an upper mold body provided with a plurality of projecting pins and a lower mold body provided with a mold groove;
(S2) injecting a second mold material into a mold cavity provided in the lower mold body;
(S3) before the second mold material is cured, the upper mold body is engaged with the lower mold body, and the plurality of projecting pins are inserted into the second mold material injected into the mold cavity;
(S4) After the second mold material is cured, the upper mold body is separated from the lower mold body, the cured second mold material is separated from the mold cavity of the lower mold body, Forming a test pad; And
(S5) a step of preparing the semiconductor test socket while filling the conductive holes in the plurality of conductive holes of the test pad,
In the step (S5)
The conductive powder is a gold-plated powder of nickel powder,
Wherein the conductive powder is injected into the plurality of conductive holes in a state mixed with the third mold material and is then bonded to the plurality of conductive holes while the third mold material is cured. A method of manufacturing a socket for testing semiconductor packages.
KR1020150098831A 2015-07-13 2015-07-13 Manufacturing method of semiconductor package test socket using plural moldpin KR101735418B1 (en)

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* Cited by examiner, † Cited by third party
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KR102030280B1 (en) 2018-07-04 2019-10-08 주식회사 새한마이크로텍 Manufacturing method of anisotropic conductive sheet
KR20200017686A (en) 2018-08-09 2020-02-19 주식회사 새한마이크로텍 Manufacturing method of anisotropic conductive sheet

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