WO2016122039A1

WO2016122039A1 - Pin block and testing device having same

Info

Publication number: WO2016122039A1
Application number: PCT/KR2015/001158
Authority: WO
Inventors: 김유곤; 김천기
Original assignee: 유니퀘스트 주식회사
Priority date: 2015-01-27
Filing date: 2015-02-04
Publication date: 2016-08-04
Also published as: KR20160092366A

Abstract

The present invention relates to a pin block and a testing device having same. A pin block, according to the present invention, has two pogo pins and enables identical connecting pins on a module substrate to be connected to the two pogo pins. The pin block, according to the present invention, further has auxiliary pogo pins, which are connected to an FPCB connection area, other than the pogo pins being connected to a connecting pin connection area, thereby enabling stable execution of function testing by means of the auxiliary pogo pins even if some of the plurality of pogo pins break or bend. And the pin block has formed thereon a guide block having a guide surface (247a), thereby enabling a connecting pin terminal of the module substrate to be guided so as to be accurately inserted into a proper position.

Description

Pin block and inspection device having same

The present invention relates to a pin block and an inspection apparatus having the same, and more particularly, a pin block for connecting a function of a module substrate having a connection pin terminal connected to a main board of an electronic terminal such as a smart phone, and the same. It relates to an inspection device.

Smartphone manufacturing technology has become popular as an electronic product that can be easily developed by electronic companies around the world. One of the reasons for this universalization is the modularization of components. Conventionally, manufacturing techniques such as the technology of designing circuits and mounting components are necessary for each manufacturer, but now, since most necessary components are modularized and can be supplied from an external specialized company, a board mounted with modular components on the main board Is connected via the inout pin to complete the manufacture. For example, if a camera is needed, a module board equipped with a camera module supplied by an external specialist may be connected to the main board through an inout pin. As described above, a substrate provided with a camera module, a speaker module, a microphone module, etc., each of which is connected to the main board through an inout pin and is provided with an inout connecting pin, will be referred to as a "module board" in the present invention. The module substrate 100 includes a semiconductor chip 150, a smartphone function button module (not shown), an antenna module (not shown), and the like on a flexible printed circuit board (FPCB) 130 on which the lead wire 140 is printed. At least one of the same module is electrically connected through the lead wire 140 and forms a single substrate. The module substrate 100 is connected to a main circuit board mounted on an electric and electronic device (for example, a smartphone) to complete one device.

The module substrate is connected to the main circuit board through a connecting pin terminal connected to the end of the lead wire, and the inspection apparatus of the present invention to determine whether the module board is good before connecting the module board to the main circuit board. Functional test is performed through

1 is a plan view schematically showing an example of a module substrate to be inspected, and FIG. 2 is a cross-sectional view taken along line A-A 'of the connection pin terminal shown in FIG. 1 and 2 will be described a problem of the conventional pin block for inspecting the module substrate and the inspection device having the same.

The inspection apparatus includes a pin block, and a functional test is performed with the connection pin terminal 125 of the module substrate 100 inserted into the pin block. The functional test is a test method that checks the quality of the module board before inserting the module board into the main circuit board. After the specific data is applied to the input pin, the desired data is output to the designated output pin. This is how the test is performed. The connection pin terminals 125 are provided with a plurality of connection pins 110 serving as in / out pins for inputting and outputting electrical signals to and from the module substrate 100.

The connecting pin terminals 125 of the module substrate illustrated in FIG. 1 are provided with connecting

pins

110a and 110b one by one from side to side. As shown in FIG. 2, the connection pin terminal 125 forms a plurality of

protrusions

131a, 131b, and 131c on the FPCB 130, and top, left, and right sides of the

protrusions

131a, 131b, and 131c. The plurality of

connection pins

110a and 110b formed of a conductor over a portion of the upper surface may be provided while maintaining an insulated state. It can be seen that due to this shape, two

trenches

115a and 115b are formed. When the connecting pin terminal 125 is inserted into the main circuit board, a portion electrically connected to the connecting pin provided on the main circuit board is an area indicated by 'A' in FIG. 2 and the other area indicated by 'B'. Is a portion extending from the 'A' region to serve as an extension lead for forming an electrical connection with the

lead wires

140a and 140b provided in the FPCB. For convenience of description, the area 'A' is referred to as a 'normal connection area' and the area 'B' is referred to as an 'FPCB connection area'.

3 is a cross-sectional view illustrating a PCB connection terminal form of a main circuit board corresponding to the connection pin terminal of the module substrate shown in FIG. 2.

Protrusions

1131a and 1131b are formed on the PCB substrate 1130 of the main circuit board, and the

conductors

1110a and 1110b are disposed on the top and side surfaces of the

protrusions

1131a and 1131b and some surfaces of the PCT substrate 1130. Is formed. In FIG. 3, two regions designated as 'C' are inserted into the

trenches

115a and 115b of FIG. 2, respectively, so that the module substrate and the main circuit board are electrically connected.

In the industry, the connection pin terminal of the module substrate shown in FIG. 2 is called a container, and the PCB connection terminal of the main circuit board shown in FIG. 3 is called a plug. Of course, the plug shown in FIG. 3 may be formed by the connecting pin terminal of the module substrate, and the container shown in FIG. 2 may be formed by the PCB connection terminal of the mail circuit board. In this case, the 'C' region shown in FIG. 3 corresponds to the 'normal connection region', and the 'D' region corresponds to the 'FPCB connection region'.

In the above description, the shape of the connector of FIG. 3 is described as being provided in the main circuit board. However, when the functional test is performed, it is to be understood that the connection port of FIG.

On the other hand, the inspection device having a pin block is provided with a pin block for inserting the connecting pin terminal, and after the plurality of pogo pins are installed in the pin block, the pogo pin is connected to the connecting pin terminal while pressing the connecting pin terminal 125 from the top. The function test is performed in the state of being electrically connected with. Figure 4 is a shape diagram showing the shape of the pogo pin used in the conventional inspection device. The conventional pogo pin 49 is composed of a housing 43, a lower pin 45 and an upper pin 41, the housing 43 has a structure in which an elastic spring is inserted. When the module board is inserted into the main circuit board (or the pin block of the inspection apparatus), the end of the lower pin 45 is connected to the connecting terminal formed on the main circuit board (or the pin block), and the upper pin 41 is connected to the module. It is connected with the connecting pin of a circuit board.

FIG. 5 is an explanatory diagram illustrating a process of performing inspection while the connection pin of the module substrate shown in FIG. 2 and the pogo pin shown in FIG. 4 are connected by using an inspection apparatus having a conventional pin block. Figure 5 (a) shows a state before the connecting pin terminal of the module substrate is connected to the pogo pin provided in the pin block, Figure 5 (b) is a lower portion while the pressure is applied from the upper portion of the connecting pin terminal of the module substrate It shows the state connected with the pogo pin as going down. In the conventional inspection apparatus, when the connecting pin terminal of the module substrate moves downward by Δt, the upper pin 41 of the pogo pin is inserted into the

trenches

115a and 115b of the connecting pin terminal of the module substrate, thereby making a connection. .

By the way, according to the conventional pogo pin and inspection device that had to insert the upper pin 41 of the pogo pin to the bottom surface of the

trenches

115a and 115b, in the process of inserting the upper pin 41 in the trench or the upper Some probes may be damaged due to an impact applied while the end portion of the pin 41 contacts the bottom surface. Particularly, even if some pogo pins are damaged, a large number of pogo pins are integrally inserted into and fixed to the jig, and thus, the entire cost of the pin blocks must be replaced instead of only the damaged pogo pins.

In addition, an impact is applied in the process of inserting the connecting pin terminal into the pin block, so that the shock is relieved, the pin block is configured to be elastically movable in the vertical direction with respect to the body. Here, looking at the process of connecting the connecting pin terminal to the pin block, in the process of inserting the connecting pin terminal into the pin block, a vertical impact may be applied to the pin block, the connecting pin terminal is the pin position (that is, In the process of finely adjusting the left and right position of the connecting pin terminal to be located in the correct connection with the pogo pin), a horizontal impact may be applied to the pin block.

Here, the vertical impact can be mitigated by the above-described elastic operation of the pin block, but the horizontal impact cannot be solved by the elastic operation of the pin block, and when such horizontal impact is accumulated or a threshold value is applied, the pogo is transmitted. This can be a major cause of broken pins. In addition, even if the pogo pin is not broken, if it is slightly bent, the length thereof is shorter than that of other pogo pins, so that the corresponding pogo pin cannot be connected to the connection pin of the connection pin terminal.

The present invention has been made to solve the above problems, the object of the present invention is that the physical impact (especially horizontal impact) is applied when inserting the connecting pin terminal into the pin block, the pogo pin is the top of the connection pin It is to provide a pin block that can be inspected by providing a separate electrical connection even if not connected to the connection area and an inspection apparatus having the same.

In addition, an object of the present invention is to provide a pin block and an inspection apparatus having the same by providing a separate additional connection pin even if the pogo pin connected to the normal connection area by physical impact is broken. do.

Still another object of the present invention is to provide a pin block having a structure capable of minimizing damage when inserting a connection pin terminal of a module substrate into a pin block and an inspection apparatus having the same.

The object of the present invention is to provide a specific function coupled to the main circuit board including a printed circuit board having a plurality of connection terminals (hereinafter referred to as "PCB"), and a flexible printed circuit board coupled to the plurality of connection terminals In the pin block coupled to the connecting pin terminal of the module substrate configured to include a connecting pin terminal consisting of a plurality of connecting pins (hereinafter referred to as 'FPCB'), the second through hole in the center A base cover having a housing portion, a base cover coupled to a lower portion of the housing portion, and having a first through hole at the center thereof, and a plurality of first pogo pins installed in the space between the housing portion and the base cover. And a plurality of second pogo pins, a floating portion having a first through hole at the center, coupled to an upper portion of the housing portion, and a plurality of springs installed between the housing portion and the floating portion, The first pogo pin and the second pogo pin can be achieved by a pin block and an inspection apparatus including the pin block, characterized in that arranged in pairs to be connected to the same connecting pin of the module substrate.

In the conventional pin block and the inspection apparatus having the same, if any one of a plurality of pogo pins electrically connected to the connecting pin connection area should be replaced, the pin block has to be replaced, but the pin block according to the present invention and the inspection apparatus having the same In addition to the pogo pin connected to the connection pin connecting area further comprises a secondary pogo pin connected to the FPCB connection area to function stably by the auxiliary pogo pin even if some of the plurality of pogo pin problems such as broken or bent The test can now be performed.

In addition, the conventional pin block is broken when pogo pin breaks while colliding with the floating part of the pin block when it does not come down from the vertical vertical direction when the connection pin terminal of the module board is inserted, In this case, the guide block is formed in the floating part and the guide surface is lowered in steps in the guide block, thereby inducing the connection pin terminal to be inserted into the pin block in place when the pin block is seated, thereby reducing breakage of the pogo pin. I can do it.

1 is a plan view schematically showing an example of a module substrate to be inspected.

FIG. 2 is a cross-sectional view along the line A-A 'of the connecting pin terminal shown in FIG. 1; FIG.

3 is a cross-sectional view illustrating a PCB connection terminal form of a main circuit board corresponding to a connection pin terminal of the module substrate shown in FIG. 2.

Figure 4 is a diagram showing the shape of the pogo pin used in the conventional inspection device.

5 is an explanatory diagram illustrating a process of performing an inspection while the connection pins of the module substrate shown in FIG. 2 and the pogo pins shown in FIG. 4 are connected by using an inspection apparatus having a conventional pin block.

Figure 6 is a perspective view of the pin block coupling of an embodiment according to the present invention.

Figure 7 is an exploded perspective view of the pin block of one embodiment according to the present invention.

8 is a front view of a pogo pin of an embodiment according to the present invention.

9 is a cross-sectional view of a pin block illustrating a process of inspecting a module substrate using an embodiment according to the present invention.

FIG. 10 is an enlarged view illustrating a portion where an upper pin of a pogo pin is connected to a module substrate in FIG. 9; FIG.

11 is a view showing various embodiments of the tapered portion of the first pogo pin upper pin according to the present invention.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

In addition, in the present specification, "on or above" means to be located above or below the target portion, and does not necessarily mean to be located above the gravity direction. Also, when a portion such as an area, a plate, etc. is said "on or on top" of another part, it is not only when the other part is connected or spaced "on or on top of" another part but also another part in between. It also includes cases where there is.

In addition, in the present specification, when one component is referred to as "connected" or "connected" with another component, the one component may be directly connected or directly connected to the other component, but in particular It is to be understood that, unless there is an opposite substrate, it may be connected or connected via another component in the middle.

Also, in this specification, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment, advantages and features of the present invention.

Prior to the detailed description of the present invention, a brief description will be given of a module substrate to be inspected through the inspection apparatus of the present invention.

Figure 6 is a perspective view of the pin block coupling of an embodiment according to the present invention, Figure 7 is an exploded perspective view of the pin block of one embodiment according to the present invention shown in Figure 6 (b).

6 (a) is a perspective view illustrating a pin block coupling of an embodiment without a guide block 247, and FIG. 6 (b) shows a perspective view of a pin block coupling of an embodiment having a guide block 247. Guide block 247 is formed as extending the outer edge of the floating portion 240 as shown in the figure, the guide surface 247a is formed stepped (or inclined) to the center inside the guide block 247 Formed. In the case of adopting the guide block 247, when the connecting pin terminal of the module board is placed on the pin block, a function of inducing the insertion into the correct position along the guide surface 247a even if the initial horizontal position is slightly away from the home position. Do it. That is, since the connection pin terminals of the module substrate may be guided along the guide surface 247a formed inside the guide block 247, the pogo pins may be broken.

Pin block according to the present invention is composed of a base cover 210, the housing portion 230 and the floating portion 240. The base cover 210 is a member that is placed on the upper connection terminal of the PCB provided in the inspection device not shown in the drawings, and is fastened by using the bolt 211 to the lower portion of the housing portion 230 disposed above, The portion is provided with a plurality of first through holes 217. The lower pins of the pogo pins 149 and 159 are exposed downward through the first through hole 217 to be connected to the connection terminals of the PCB provided in the inspection apparatus. A plurality of pogo pins 149 and 159 are accommodated in the accommodation space formed between the base cover 210 and the housing 230. In addition, the base cover 210 is provided with a coupling pin 213, it is configured to be coupled to the correct position when the housing portion 230 is coupled using the alignment pin 215.

It can be seen that a plurality of second through-holes 233 through which the upper pins of the pogo pins 149 and 159 are exposed is provided at the center of the housing portion 230. Looking at the second through-hole 233 provided in the housing portion 230, it can be seen that it consists of a total of four rows, the second pogo pin 159 is located in the first row (253a), the second The first pogo pin 149 is located in row 253b, the first pogo pin 149 is located in third row 253c, and the second pogo pin 159 is located in fourth row 253d. do. In this case, the second pogo pins 159 of the first row 253a and the first pogo pins 149 of the second row 253b are connected to the same connector 110a of the module substrate in pairs. The first pogo pin 149 of the third row 253c and the second pogo pin 159 of the fourth row 253d positioned in the same column may be connected to the same connector 110b of the module substrate in pairs. The spring 231 and the floating part 240 are placed in the upper part of the housing part 230, and the floating part 240 is coupled to the upper part of the housing part 230 by using the washer 241 and the bolt 243. . A plurality of third through holes 245 are provided in the center of the floating part 240 to expose the upper pins of the pogo pins 149 and 159. The first through hole 217, the second through hole 233, and the third through hole 245 provided in the base cover 210, the housing part 230, and the floating part 240 are all located at the same vertical position. The hole is formed so that the upper pin and the lower pin of the pogo pins 149 and 159 can be connected to the connection pin and the PCB connection terminal of the module substrate, respectively.

7 and a plurality of pogo pins 149 and 159 arranged in a total of four rows are shown in the pin block of one embodiment according to the present invention, and the pogo pins 159 shown in rows 1 and 4, and 2 It can be seen that the pogo pins 149 shown in rows and 3 use different kinds of pogo pins 149 and 159 with different lengths. This will be described in detail with reference to FIG. 8. The pogo pin shown in FIG. 8A (149, hereinafter referred to as 'first pogo pin') is used to connect to the 'normal connection area' of the connection pin of the module substrate, and the conventional pogo pin shown in FIG. Compared with (49) it can be seen that the overall shape is the same, but the thickness of the upper pin 141 is formed thicker. The upper pin 141 of the first pogo pin 149 is composed of a body portion 141a and a tapered portion 141b. The pogo pin 159 (hereinafter, referred to as 'second pogo pin') shown in FIG. 8B is used to connect to the 'FPCB connection area' of the connection pin of the module substrate.

9 is a cross-sectional view of a pin block for explaining a process of inspecting a module substrate using an embodiment according to the present invention. For convenience of description, only one of the plurality of first pogo pins and the plurality of second pogo pins is shown. FIG. 9A illustrates a state in which pressure is not applied to the upper portion of the module substrate. The first pogo pin 149 and the second pogo pin 159 are not yet connected to the connection pin terminals of the module substrate. Indicates the state. Subsequently, when pressure is applied to the upper portion of the module substrate, as shown in FIG. 9B, the spring 231 interposed between the housing part 230 and the floating part 240 is compressed and the floating part 240 is pressed. Downwards, a portion of the upper pins of the first pogo pin 149 and the second pogo pin 159 through the through hole formed in the center of the floating portion 240 is projected through the connection pin 110a of the module substrate Electrical connection with the

FIG. 10 is an enlarged view illustrating a portion where the upper pin of the pogo pin is connected to the module substrate in FIG. 9. FIG. 10A illustrates a state in which pressure is not applied to the upper portion of the module substrate. The first pogo pin 149 and the second pogo pin 159 are not yet connected to the connection pin terminals of the module substrate. Indicate the state, the arrow shows the direction in which the module substrate is lowered by the pressure applied on the module substrate. 10 (b) shows a portion of the upper pins of the first pogo pin 149 and the second pogo pin 159 through the through hole formed in the center of the floating part 240 as the floating part descends downward. The state connected electrically with the connection pin 110b of a module board | substrate is shown. That is, it can be seen that the upper pin 151 of the second pogo pin is connected to the FPCB connection region of the connecting pin 110a, and the tapered portion 141b of the upper pin 141 of the first pogo pin 149 is the connecting pin. The first pogo pin according to the present invention is connected to the bottom surface while the pogo pin is fully inserted into the trench 115b of the connection pin 110b while the first pogo pin according to the present invention is connected to the normal connection area of the 110b. It can be seen that a predetermined region of the tapered portion 141b is connected to the connection pin 110b formed at the inlet side of the trench 115b by inserting a portion of the predetermined region into the trench 115b of the connection pin 110b.

Here, looking at the insertion structure for the connection of the first pogo pin in detail, the conventional pogo pin is connected to the bottom surface of the trench 115b should be connected to the connection of the pogo pin, but the first pogo pin according to the present invention Even if the attachment of the pin 141 (that is, the tapered portion 141b of the present invention) is not inserted to the bottom surface of the trench 115b, the pin 141 can be connected to the connection pin 110b.

This, when the upper pin 141 of the first pogo pin 149 of the present invention is inserted into the trench 115b, the second diameter (D1) of the tapered portion (141b) as shown in Figure 10 (b) The outer circumferential edge corresponding to the same diameter as the trench width W1 of the connection pin 110 is caught by the trench 115b.

In addition, the tapered portion corresponding to the first diameter D1 is not inserted into the trench 115b and positioned at an upper portion thereof, and the tapered portion corresponding to the third diameter D3 is spaced apart from the bottom surface of the trench 115b. You can see that it is located at.

When the insertion state as described above is completed, the outer circumferential portion corresponding to the second diameter D2 of the tapered portion 141b is connected to the conductive portion formed on the inner wall of the trench 115b.

As a result, according to the first pogo pin according to the present invention, the electrical connection can be realized even if the upper pin 141 is not inserted to the bottom of the connection pin 110b, thereby accurately connecting the first pogo pin. It can be carried out stably while also minimizing the problem of probe damage due to the conventional wrong connection operation.

Furthermore, by bringing two pogo pins connected with one connection pin 110b formed on the module substrate to two, even if the first pogo pin is broken while being inserted into or connected to the trench 115b, the corresponding connection pin is caused by the second pogo pin. It can be seen that the inspection can be performed by stably maintaining the connection with 110b.

Figure 11 (a) to (c) is a view showing various embodiments of the tapered portion of the upper pin of the first pogo pin according to the present invention. Referring to Figure 11, the tapered portion of the first pogo pin in the present invention is composed of a semi-elliptic spherical shape (141a) as shown in Figure 11 (a), or conical shape (141c) as shown in Figure 11 (b), or It can be configured as a semi-spherical shape (141d) as shown in Fig. 11 (c), preferably a semi-elliptic shape as shown in Fig. 11 (a).

In addition to the above preferred embodiment, the same purpose can be achieved even if the tapered portion of the first pogo pin is composed of a semi-elliptic spherical shape, a truncated cone shape, or a pyramidal shape made of a polyhedron.

Of course, the pin block according to the present invention is further provided with a second pogo pin additionally, unlike shown in Figure 8, the shape of the upper pin 141 of the first pogo pin 149 conventional pogo pin (49) It can be implemented to be implemented in the same shape as the upper pin of, and to be connected to the bottom surface of the trench of the connecting pin formed on the module substrate.

While the preferred embodiments of the present invention have been described and illustrated using specific terms, such terms are only for clarity of the present invention, and the embodiments and the described terms of the present invention are defined and the technical spirit and scope of the following claims. It is obvious that various changes and changes can be made without departing from the scope.

* Such modified embodiments should not be understood individually from the spirit and scope of the present invention, but should fall within the claims of the present invention.

Claims

Flexible printed circuit board (hereinafter referred to as 'FPCB') coupled with the main circuit board including a printed circuit board having a plurality of connection terminals (hereinafter referred to as 'PCB') to provide a specific function and coupled to the plurality of connection terminals. In the pin block coupled to the connecting pin terminal of the module substrate configured to include a connecting pin terminal consisting of a plurality of connecting pins formed on the

A housing portion 230 having a second through hole 233 in the center thereof;

A base cover 210 coupled to the lower portion of the housing part with a space therebetween and having a first through hole 217 at the center thereof;

A plurality of first pogo pins 149 and a plurality of second pogo pins 159 installed in the space between the housing part 230 and the base cover 210;

A floating portion 240 having a first through hole 245 in the center thereof and coupled to an upper portion of the housing portion;

It includes a plurality of springs 231 installed between the housing portion 230 and the floating portion 240,

The first pogo pin (149) and the second pogo pin (159) pin block, characterized in that arranged in order to be connected to the same connection pin of the module substrate.
The method of claim 1,

When the connection pin forming the connection pin terminal of the module substrate is divided into a normal connection region coupled with a connection terminal of the main circuit board and an FPCB connection region coupled with a lead wire provided in the FPCB, the first pogo pin ( 149 is connected in the normal connection area, and the second pogo pin (159) is connected in the FPCB connection area.
The method of claim 2,

The second pogo pin (159) is a pin block, characterized in that longer than the second pogo pin (149).
The method of claim 2,

The connection pin is provided with a trench 115a having a predetermined width (W) in the normal connection region,

The first pogo pin 149 includes an upper pin 141 and a housing 143 for accommodating a portion of the upper pin 141.

The upper pin 141,

One end is accommodated in the housing, and includes a body 141a protruding out of the housing and a tapered portion 141b formed at an end of the body,

The tapered portion 141b,

And a first diameter D1 larger than the width of the trench, a second diameter D2 equal to the width of the trench, and a third diameter D3 smaller than the width of the trench. Pinblock.
The method of claim 4, wherein

The tapered portion (141b) is a pin block, characterized in that formed in a semi-elliptic, conical, or hemispherical.
The method of claim 4, wherein

One end is accommodated in the housing, the other end pin block further comprises an upper pin protruding out of the housing.
The method of claim 1,

The floating part 240 further includes a guide block 247 having a portion of an outer edge extending upward, and an inner surface of the guide block 247 includes a guide surface 247a which is formed to be stepped toward the center. Pin block characterized in that.
An inspection apparatus comprising a pin block of any one of claims 1 to 7.