WO2018038321A1

WO2018038321A1 - Electronic part inspection device

Info

Publication number: WO2018038321A1
Application number: PCT/KR2016/012634
Authority: WO
Inventors: 김영미; 권용찬
Original assignee: 한화테크윈 주식회사
Priority date: 2016-08-25
Filing date: 2016-11-04
Publication date: 2018-03-01
Also published as: KR101828547B1

Abstract

According to one aspect of the present invention, provided is an electronic part inspection device for inspecting an electronic part, comprising: a frame having a single opening part formed on the upper surface thereof; one pair of conductor terminal parts insertedly provided at the opening part and having upper surfaces coming in contact with a lead portion of the electronic part; insulation parts provided on the respective conductor terminal parts so as to face each other, such that the one pair of conductor terminal parts do not come in contact with each other; at least one conductive pin provided at each of the conductor terminal parts; and a socket part supported by the frame and elastically supporting the conductive pin.

Description

Electronic component inspection device

The present invention relates to an electronic component inspection device.

Devices for inspecting the electrical properties of electronic components such as resistors, capacitors, and semiconductor chips are generally used during the post-production test of electronic components or before mounting them on a substrate.

The electronic component inspection apparatus contacts the terminals of the electronic component inspection apparatus with the leads of the electronic component, measures electrical characteristics such as resistance values, voltage values, and current values, and determines whether the electronic components are normal or defective.

Japanese Laid-Open Patent Publication No. 2010-78432 discloses a substrate inspection jig for use in inspecting a substrate.

According to an aspect of the present invention, it is a main problem to implement an electronic component inspection apparatus capable of inspecting electronic components of various sizes.

According to an aspect of the present invention, in the electronic component inspection apparatus for inspecting an electronic component, a frame having a single opening formed on the upper surface; and a pair is fitted to the opening, the pair of the lead portion of the electronic component in contact with the upper surface A conductive terminal of the conductive terminal portion of the conductive terminal portion facing each other so that the pair of conductive terminal portions do not touch each other; and at least one conductive pin provided in the respective conductive terminal portion; It is supported, and provides an electronic component inspection device comprising a socket portion for elastically supporting the conductive pin.

According to the electronic component inspection device according to one aspect of the present invention, a pair of conductor terminal portions are disposed to be fitted into a single opening portion, and an insulation portion is provided to face each other in a pair of conductor terminal portions, thereby contacting the lead portion of the electronic component. The distance between a pair of conductor terminal parts can be made as small as possible. If the gap between the pair of conductor terminals is made as small as possible, the area of the upper surface of the conductor terminals can be increased. Therefore, electronic parts of various sizes such as large electronic parts as well as very small electronic parts can be used universally without additional equipment. It can be easily inspected.

1 is a schematic perspective view showing an electronic component inspection apparatus according to an embodiment of the present invention.

2 is a front view of an electronic component inspection apparatus according to an embodiment of the present invention.

3 is a cross-sectional view taken along line III-III of FIG. 2.

4 is a perspective view illustrating the bottom of an electronic component inspection apparatus according to an exemplary embodiment of the present disclosure.

FIG. 5 is a schematic perspective view illustrating a part of a conductor terminal part, an insulating part, and a conductive pin according to an embodiment of the present invention.

FIG. 6 is a schematic partial perspective view illustrating a state in which a conductor terminal portion and an insulation portion are fitted into a single opening portion according to an embodiment of the present invention.

7 is a schematic perspective view showing a part of a conductor terminal part, an insulating part, and a conductive pin according to another embodiment of the present invention.

8 is a schematic partial perspective view illustrating a state in which a conductor terminal portion and an insulation portion are fitted into a single opening portion according to another embodiment of the present invention.

FIG. 9 is a schematic diagram illustrating an inspection in which a lead part of a microelectronic part contacts a conductor terminal part according to an embodiment of the present invention.

FIG. 10 is a schematic diagram illustrating an inspection in which a lead part of a large electronic component contacts a conductor terminal part according to an embodiment of the present invention.

The frame may include an upper frame portion having the opening formed therein and a lower frame portion supporting the upper frame portion.

Here, the installation terminal may be formed in a portion facing the conductor terminal, the insulating portion may be disposed in the installation groove.

Here, the depth of the installation groove may be smaller than the thickness of the insulating portion.

Here, the socket portion may be formed with a pin receiving portion for receiving at least a portion of the conductive pin, at least one elastic member may be disposed in the pin receiving portion.

Here, the upper surface of the conductor terminal portion may be flat.

Here, the pair of conductor terminals may be guided up and down by the opening.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in this specification and drawing, duplication description is abbreviate | omitted by using the same code | symbol about the component which has substantially the same structure.

1 is a schematic perspective view showing an electronic component inspection apparatus according to an embodiment of the present invention, Figure 2 is a front view of the electronic component inspection apparatus according to an embodiment of the present invention, Figure 3 is III- of FIG. It is sectional drawing cut along the III line. 4 is a perspective view showing the bottom of the electronic component inspection device according to an embodiment of the present invention, Figure 5 is a portion of the conductive terminal portion, the insulating portion, the conductive pins for an embodiment of the present invention 6 is a schematic perspective view, and FIG. 6 is a schematic perspective view illustrating a state in which a conductor terminal portion and an insulation portion are fitted into a single opening in accordance with an embodiment of the present invention.

The electronic component inspection apparatus 100 according to the present embodiment is an apparatus for inspecting electrical characteristics such as resistance values, voltage values, and current values of electronic components.

The electronic component inspection apparatus 100 according to the present embodiment includes a frame 110, a conductor terminal portion 120, an insulation portion 130, a conductive pin 140, and a socket portion 150.

The frame 110 guides the movement of the conductor terminal part 120 and supports the socket part 150.

The frame 110 includes an upper frame portion 111 and a lower frame portion 112 that supports the upper frame portion 111.

The upper frame portion 111 has a plate shape, and a single opening 111a is formed on the upper surface.

The material of the upper frame part 111 is not particularly limited, but is preferably made of an electrically insulating material in preparation for the possibility of contact with the conductor terminal part 120.

The upper frame portion 111 is installed to be fixed to the lower frame portion 112, the manner in which the upper frame portion 111 is installed on the lower frame portion 112 is not particularly limited. For example, the upper frame part 111 may be installed to the lower frame part 112 in various ways such as screwing, soldering, welding, adhesive, or the like.

On the other hand, the conductor terminal portion 120 is composed of a pair, the pair of conductor terminal portion 120 is fitted into a single opening 111a to face each other, by the conductive pin 140 and the socket portion 150 It is elastically supported.

The conductor terminal portion 120 is made of a conductive material such as metal, conductive plastic, and the like. Each of the conductor terminal portions 120 has a shape of “ㅗ” as a whole.

The upper surface 120a of the conductor terminal portion 120 has a flat structure, and the lead portion of the electronic component contacts the upper surface 120a during the inspection.

The installation grooves 121 are formed at portions of the side surfaces of the conductor terminal portion 120 that face each other, and the insulation portion 130 is disposed in the installation grooves 121. The pair of conductor terminal parts 120 may move downward by pressure when contacted with the lead part of the electronic component. In this process, the pair of conductor terminal parts 120 may be in contact with each other to conduct electricity. Insulating part 130 is disposed to. Incidentally, since the pair of conductor terminals 120 are elastically supported, the pair of conductor terminals 120 may move downward by pressure when contacting the lead portion of the electronic component, and move upward by elastic force when the contact with the lead portion of the electronic component is released. It is provided so that it can be guided up and down by the single opening part 111a.

Although the conductor terminal part 120 which concerns on a present Example has the shape of "'" as a whole, this invention is not limited to this. That is, the conductor terminal portion according to the present invention only needs to be able to perform inspection by contacting the lead portion of the electronic component on its upper surface, and there is no particular limitation on the specific shape of the conductor terminal portion. For example, the conductor terminal part according to the present invention may have a rectangular pillar shape as a whole.

Meanwhile, two conductive pins 140 are installed to each of the conductive terminal parts 120, and the conductive pins 140 extend downward and are electrically connected to the conductive terminal parts 120. As shown in FIG. 3, the conductive pin 140 is mounted to the connection portion 122 of the conductor terminal portion 120, and the mounting method is not particularly limited. For example, it can be mounted by screwing, soldering, conductive adhesive or the like.

On the other hand, the insulating unit 130 is installed so as to face each other in the conductor terminal portion 120 so that the pair of conductor terminal portion 120 does not touch each other. That is, the insulator 130 is disposed between the pair of conductor terminals 120, and the pair of conductor terminals 120 do not touch each other due to the presence of the insulator 130.

In the present embodiment, as shown in FIG. 5, an installation groove 121 having a depth d is formed in the conductor terminal portion 120, and an insulation portion 130 having a thickness t1 is disposed in the installation groove 121. do. Here, since the depth d of the installation groove 121 is smaller than the thickness t1 of the insulation portion 130, when the pair of conductor terminal portions 120 are fitted to the opening 111a, the insulation portion 130 exists. As a result, the pair of conductor terminals 120 do not touch each other. In the present embodiment, the distance G1 between the pair of conductor terminal parts 120 is about 0.2 mm, which is merely an example, and the size of the gap may naturally vary according to design.

The material of the insulation unit 130 may be applied without limitation as long as the material can insulate electricity. For example, as the material of the insulating unit 130, an electrically insulating synthetic resin such as polyester (PET), polypropylene (PP), polystyrene (PS), an electrically insulating natural resin, or the like may be applied. 130) An electrically insulating resin impregnated with lubricating oil may be used to reduce friction upon contact.

In addition, in the present embodiment, first, the shape of the insulation portion 130 is made, and then the insulation portion 130 having the final shape is installed in the conductor terminal portion 120. However, the present invention is not particularly limited in the method of installing the insulation portion. none. That is, according to the present invention, the insulating portion 130 may be formed by applying an insulating substance in the form of liquid or paste to the conductor terminal portion 120 and hardening the same.

On the other hand, in the present embodiment, the installation groove 121 is provided in the conductor terminal portion 120, and since the depth d of the installation groove 121 is smaller than the thickness t1 of the insulating portion 130, a pair of conductor terminal portions 120 ) Do not touch each other, but the present invention is not limited thereto. That is, according to the present invention, the installation groove may not be installed in the conductor terminal portion. As an example, a conductor terminal part and an insulating part according to another embodiment of the present invention are shown in FIGS. 7 and 8, which will be described below.

FIG. 7 is a schematic perspective view of a part of a conductor terminal part 220, an insulating part 230, and a conductive pin 240 according to another embodiment of the present invention, and FIG. 8 is a conductor of another embodiment of the present invention. The terminal part 220 and the insulating part 230 are partial schematic perspective views showing a state in which the terminal part 220 and the insulating part 230 are fitted into the single opening 211a of the upper frame part 211.

The conductor terminal portion 220 is made of a conductive material such as a metal or a conductive plastic, and as shown in FIG. The upper surface 220a of the conductor terminal portion 220 has a flat structure, and the lead portion of the electronic component contacts the upper surface 220a during the inspection. Here, the conductor terminal portion 220 is composed of a pair, the pair of conductor terminal portion 220 is fitted to the opening 211a to face each other. The conductor terminal part 220 is provided with an insulating part 230 at a portion facing each other.

The insulation unit 230 may have a plate shape, and may be applied without limitation as long as the material may insulate electricity, similar to the material of the insulation unit 130 of the present embodiment.

The insulating part 230 has a predetermined thickness t2, and is installed to face each other so that the pair of conductor terminal parts 220 do not touch each other. That is, the insulator 230 is disposed between the pair of conductor terminals 220, and the pair of conductor terminals 220 do not touch each other due to the presence of the insulator 230. That is, in another embodiment of the present invention, the thickness t2 of the insulating portion 230 is about 0.07mm, and the distance G2 between the pair of conductor terminal portions 220 is about 0.2mm, which is one example. The size of the gap may of course vary depending on the design.

In addition, in another embodiment of the present invention, first, the insulating portion 230 is formed in a plate shape, and then the plate-shaped insulating portion 230 is installed in the conductor terminal portion 220, but the present invention is a special method for installing the insulating portion. no limits. That is, according to the present invention, the insulating portion 230 may be formed by applying an insulating substance in the form of liquid or paste to the conductor terminal portion 220 and hardening the same.

Other configurations than those described above in the configuration of another embodiment of the present invention are similar to those of the embodiment of the present invention, and thus detailed description thereof will be omitted.

On the other hand, two conductive pins 140 are provided in each of the conductor terminal portion 120, and four of them are installed in total.

The conductive pin 140 is formed of a conductive material such as metal, and is electrically connected to the conductor terminal part 120. As described above, the conductive pin 140 is mounted to the connection portion 122 of the conductor terminal portion 120.

Two conductive pins 140 according to the present embodiment are provided in each of the conductor terminal portions 120, but the present invention is not limited thereto. That is, at least one conductive pin according to the present invention may be provided at each conductor terminal portion 120, and there is no particular limitation.

A portion of the conductive pin 140 is disposed in the pin receiving portion 151 of the socket 150, and is elastically supported by the elastic member 152 disposed in the pin receiving portion 151.

On the other hand, the socket 150 is composed of two, each is installed to be supported on the frame 110.

As shown in FIG. 3, each of the socket parts 150 includes two pin receiving parts 151. At least a portion of the conductive pins 140 are accommodated in the pin receiving part 151.

At least one elastic member 152 is disposed in the pin receiving portion 151 to elastically support the conductive pin 140. That is, when the conductor terminal portion 120 is pressed down and moves downward, the conductive pin 140 fixed to the conductor terminal portion 120 also moves downward. In this case, the conductive terminal portion 120 and the conductive pin are moved due to the presence of the elastic member 152. 140 is elastically supported.

The elastic member 152 may be a conductive coil spring, and is configured to be electrically connected to the conductive pin 140 while elastically supporting the conductive pin 140. The elastic member 152 is electrically connected to the lower terminal portion 153 installed under the socket portion 150, so that the conductive pin 140, the elastic member 152, and the lower terminal portion 153 are electrically connected to each other. .

The lower terminal portion 153 is connected to a wire W, which is electrically connected to an inspection circuit device (not shown) that detects electrical characteristics, and the inspection circuit device (not shown) is connected to various electrical components of the electronic component. Examine the properties.

According to the present embodiment, the elastic member 152 performs a function of electrically connecting the conductive pin 140 and the lower terminal portion 153, but the present invention is not limited thereto. That is, according to the present invention, the elastic member may be made of an electrically insulating material, and may electrically connect the conductive pin 140 and the lower terminal portion 153 with separate wires. In this case, it is preferable that the wire is made of a material that is sufficiently long or deformable so that the conductive pin 140 does not become disconnected even when the conductive pin 140 moves.

Hereinafter, a process of inspecting electrical characteristics of an electronic component using the electronic component inspecting apparatus 100 according to an exemplary embodiment of the present invention will be described with reference to FIGS. 9 and 10.

FIG. 9 is a schematic view illustrating an inspection in which the lead portion R1 of the microelectronic component C1 contacts the conductor terminal portion 120 according to an embodiment of the present invention, and FIG. The lead R2 of the large electronic component C2 contacts the conductor terminal 120 according to the exemplary embodiment of the present invention.

In order to examine the electrical characteristics of the microelectronic component C1, as shown in FIG. 9, the microelectronic component C1 is sucked by the nozzle N, and then the nozzle N is moved to move the microelectronic component C1. The lead portion R1 of is in contact with the upper surface 120a of the conductor terminal portion 120. At this time, since the conductive pin 140 is elastically supported by the elastic member 152 together with the conductor terminal part 120, the lead part R1 may be in stable contact with the conductor terminal part 120.

Here, the space | interval L1 between the lead parts R1 of the example microelectronic component C1 is very small, about 0.5 mm. However, in the present embodiment, a pair of conductor terminal portions 120 are sandwiched by a single opening 111a, and a pair of conductor terminal portions 120 are insulated from each other so as to face each other. Since the gap between the conductor terminal portions 120 can be made as small as possible, the lead portion R1 of the microelectronic component C1 can stably contact the upper surface 120a of the conductor terminal portion 120, so that the inspection can be easily performed. have.

Meanwhile, in order to inspect the electrical characteristics of the large electronic component C2, as shown in FIG. 10, the large electronic component C2 is sucked by the nozzle N, and then the nozzle N is moved to move the large electronic component. The lead portion R2 of (C2) is in contact with the upper surface 120a of the conductor terminal portion 120. At this time, since the conductive pin 140 is elastically supported by the elastic member 152 together with the conductor terminal part 120, the lead part R2 may be in stable contact with the conductor terminal part 120.

Here, the distance L2 between the lead portions R2 of the large electronic component C2 is larger than the above-mentioned L1 and is about 10 mm. However, in the present embodiment, as described above, since the area size of the upper surface 120a of the pair of conductor terminal portions 120 is sufficiently large, the lead portion R2 of the large electronic component C2 is stably conductors. The test may be easily performed by contacting the upper surface 120a of the terminal unit 120.

As described above, according to the electronic component inspection apparatus 100 according to the present embodiment, a pair of conductor terminal portions 120 are sandwiched by a single opening 111a and arranged in each of the pair of conductor terminal portions 120. By providing the insulating part 130 so as to face each other, the distance between the pair of conductor terminal parts 120 in contact with the lead part of the electronic component can be minimized. If the distance between the pair of conductor terminals 120 is made as small as possible, the area of the upper surface 120a of the conductor terminal portion 120 can be increased accordingly. Therefore, the electronic component inspection apparatus according to the embodiment of the present invention is not required without additional equipment. 100 alone enables universal inspection of electronic components of various sizes, such as microelectronic components as well as large electronic components. Therefore, when the electronic component inspection apparatus 100 according to the present embodiment is used, the inspection equipment may be minimized to reduce the inspection cost, and the inspection process may be easily performed to increase the convenience of the inspection.

While aspects of the present invention have been described with reference to the embodiments shown in the accompanying drawings, this is merely exemplary, and various modifications and equivalent other embodiments are possible from those skilled in the art. You will understand the point. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

According to one aspect of the invention, it can be applied to the industry of manufacturing or using the electronic component inspection apparatus.

Claims

In the electronic component inspection device for inspecting electronic components,

A frame having a single opening formed on an upper surface thereof;

A pair of conductor terminal portions inserted into the openings and contacting lead portions of the electronic components to an upper surface thereof;

An insulation part installed to face each other of the conductor terminal parts so that the pair of conductor terminal parts do not touch each other;

At least one conductive pin provided in each of the conductor terminal portions; And

And a socket part supported by the frame and elastically supporting the conductive pin.
The method of claim 1,

The frame includes an upper frame portion having the opening and a lower frame portion supporting the upper frame portion.
The method of claim 1,

And an installation groove is formed in a portion of the conductor terminal portion facing each other, and the insulation portion is disposed in the installation groove.
The method of claim 3,

And a depth of the installation groove is smaller than a thickness of the insulation part.
The method of claim 1,

The socket portion is provided with a pin receiving portion for receiving at least a portion of the conductive pin,

At least one elastic member is disposed on the pin receiving portion.
The method of claim 1,

And an upper surface of the conductor terminal portion is flat.
The method of claim 1,

And the pair of conductor terminal portions are vertically guided by the openings.