WO2015099431A1

WO2015099431A1 - Align socket unit of semiconductor device and semiconductor device checking apparatus comprising same

Info

Publication number: WO2015099431A1
Application number: PCT/KR2014/012768
Authority: WO
Inventors: 김기민; 윤용희
Original assignee: 주식회사 아이에스시
Priority date: 2013-12-24
Filing date: 2014-12-23
Publication date: 2015-07-02
Also published as: TW201530166A; TWI578001B; KR101464990B1

Abstract

Disclosed is an align socket unit of a semiconductor device. The align socket unit of the semiconductor device according to one embodiment of the present invention comprises: an insertion body having an opening which receives the semiconductor device so as to test a packaged semiconductor device; a guide sheet which is installed in the lower surface of the insertion body, and which is provided for an alignment of an insertion position of a ball terminal provided in the semiconductor device; a base part to which the lower surface of the insertion body is seated, and which comprises a plurality of probe pins disposed in a position facing the ball terminal; and a guide pad which is in close contact with the lower surface of the guide sheet, and which has guide holes where the upper ends of the probe pins are inserted partially so as to always guide the position of the probe pins to the right position.

Description

Semiconductor device alignment socket unit and semiconductor device inspection apparatus including same

The present invention is for conducting a conductive test for a memory or non-memory semiconductor device, and more particularly, a stable alignment of the probe pin when conducting a conductive test for a semiconductor device having a relatively large number of ball terminals. The present invention relates to a semiconductor device alignment socket unit and a semiconductor device inspection apparatus including the same.

In general, semiconductor devices such as ICs are inspected for defects by inspecting electrical characteristics during the manufacturing process, and the electrical characteristics inspection of the semiconductor devices includes a contact point (bump) and a printed circuit board (PCB) of the semiconductor device. Is performed through a probe pin interposed between the contacts (pads) of the test board.

In addition, the electrical characteristic inspection of the semiconductor device is performed in the state where the semiconductor device is inserted into the inspected carrier. The inspection of the conventional semiconductor device is performed by the electrical contact between the ball terminal of the semiconductor device mounted on the object carrier and the probe pin supported on the socket assembly. At this time, very small ball terminals and probe pins are arranged at a narrow pitch, so highly accurate alignment is required during the test.The alignment of the ball terminals and the probe pins is necessary to align the alignment holes of the specimen carrier and the socket guide. This is achieved through the alignment of the pins.

Since the subject carrier has to repeat the coupling and disconnection with the socket guide during the test, the alignment pins and the alignment holes are increased in margin through repeated coupling and disconnection. As a result, this increase in margin causes a problem of mismatching or offset of the ball terminal and the probe pin.

This problem can cause damage to expensive semiconductor devices due to collisions between semiconductor devices and probe pins when conducting conductivity tests on thousands of semiconductor devices, or the ball terminals of broken semiconductor devices may remain in the equipment. In this case, a problem arises in that replacement or repair should be performed while the conductivity test is stopped.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and more specifically, a semiconductor device alignment socket unit having improved accuracy according to contact by precisely matching the mutual alignment of the ball terminal and the probe pin of the semiconductor device. And a semiconductor device inspection apparatus.

The semiconductor device alignment socket unit of the present invention for achieving the above object, the insertion body having an opening for receiving the semiconductor device for testing the packaged semiconductor device; A guide sheet for aligning the insertion position of the ball terminal provided on the bottom surface of the insertion body and provided in the semiconductor device; A base part including a plurality of probe pins disposed on a lower surface of the insertion body and facing each other with the ball terminal; And a guide pad in close contact with a lower surface of the guide sheet and having a guide hole partially inserted at an upper end of the probe pin to guide the position of the probe pin to a constant position at all times.

In the semiconductor device alignment socket unit, the semiconductor device may have the ball terminal disposed between at least 500 balls and 2000 balls.

In the semiconductor device alignment socket unit, the guide sheet may include a conductive pad including conductive particles in a silicon rubber; A first guide sheet positioned in close contact with an upper surface of the conductive pad and having a first guide hole formed at a position corresponding to the ball terminal; It may include a second guide sheet which is positioned in close contact with the lower surface of the conductive pad and has a second guide hole in which an end portion of the probe pin is partially inserted.

In the semiconductor device alignment socket unit, the conductive pad may be a polyamide film or any one of FR4 or FR5 or XPC.

In the semiconductor device alignment socket unit, the guide pad may have a thickness relatively thicker than the thickness of the guide sheet.

In the semiconductor device alignment socket unit, the guide pad may be an insulating material having electrical insulation.

In the semiconductor device alignment socket unit, the guide pad may be a flexible printed circuit board (FPCB).

In the semiconductor device alignment socket unit, the insertion body includes a coupling protrusion projecting downward toward an upper surface of the base portion, and the base portion is formed with an insertion hole opened at a position corresponding to the coupling protrusion so that the coupling protrusion is formed. The state coupled to the insertion hole may be maintained.

In the semiconductor device alignment socket unit, the base part may include a guide member positioned on an inner side of the semiconductor device to face each other and in contact with an outer side of the insertion body to maintain a fixed position.

In the semiconductor device alignment socket unit, the guide member may be any one of rubber, silicon, and plastic.

In the semiconductor device alignment socket unit, the insertion body may include an insertion groove formed at a position corresponding to the guide member and into which the guide member is inserted.

The semiconductor device inspection apparatus of the present invention for achieving the above object is aligned with the insertion position of the insertion main body having an opening for accommodating the semiconductor device, and the insertion position of the ball terminal provided inside the insertion body and provided in the semiconductor device. A base portion including a guide sheet for mounting, a lower surface of the insertion body and a plurality of probe pins disposed at positions facing the ball terminal, and a top portion of the probe pin in close contact with the lower surface of the guide sheet. An alignment socket unit having a guide pad inserted therein to guide the position of the probe pin to the home position at all times; A loading unit in which a plurality of alignment socket units are installed; A pusher installed at a position facing the upper portion of the alignment socket unit and pressing the plurality of semiconductor devices moved to the upper portion of the alignment socket unit to the inside of the insertion body; And a controller for controlling the presence or absence of abnormalities of the plurality of semiconductor devices during the conduction test on the semiconductor device pressurized by the pusher at a predetermined pressure.

The semiconductor device alignment socket unit according to the present invention can improve workability and work efficiency through a stable conductivity test of a plurality of semiconductor devices, and conduct a conductivity test of a semiconductor device having a relatively large number of ball terminals. There is an advantage that can be easily carried out.

In the semiconductor device alignment socket unit according to the present invention, only a plurality of semiconductor devices are transferred, and the alignment socket unit can perform work in a state where it is located in the loading apparatus, and thus, workability is remarkably improved.

The semiconductor device alignment socket unit according to the present invention has an advantage of conducting a conductive test on a semiconductor device while stably aligning an upper end of a probe pin so as to exactly match the alignment of the plurality of ball terminals.

1 is an exploded perspective view of a semiconductor device alignment socket unit according to an exemplary embodiment of the present inventive concept.

2 is a plan view of a semiconductor device alignment socket unit according to an exemplary embodiment of the present inventive concept.

3 is an exploded cross-sectional perspective view of a semiconductor device alignment socket unit according to an exemplary embodiment of the present inventive concept.

4 is a front view briefly showing a semiconductor device inspection apparatus according to an embodiment of the present invention.

5 to 6 are diagrams illustrating a use state of a semiconductor device alignment socket unit according to an embodiment of the present invention.

A configuration of a semiconductor device alignment socket unit according to an embodiment of the present invention will be described with reference to the drawings.

The alignment socket unit 1 according to an embodiment of the present invention includes an insertion body 100 having an opening 110 in which the semiconductor device 10 is accommodated for testing the packaged semiconductor device 10, and It is installed on the lower surface of the insertion body 100 and the guide sheet 200 for alignment with the insertion position of the ball terminal 12 of the semiconductor device 10, and the lower surface of the insertion body 100 is seated and the ball A base portion 300 including a plurality of probe pins 302 disposed at positions facing the terminal 12; And a guide pad 400 that is in close contact with the bottom surface of the guide sheet 200 and partially inserts an upper end of the probe pin 302 to guide the position of the probe pin 302 at a constant position at all times.

The alignment socket unit 1 according to the present embodiment is for conducting a conductive test on the semiconductor device 10 used in a CPU in which the ball terminals 12 are relatively numbered from 500 balls to 2000 balls. For example, it is used to conduct a conductive test on a relatively large semiconductor device 10 such as a CPU installed in a PC.

The insert body 100 according to the present exemplary embodiment includes an inclined surface 120 in which the opening 110 is opened upward to allow the semiconductor device 10 to be stably inserted, and the inside of the opening 110 is inclined downward. do. The inclined surface 120 is formed to stably insert the semiconductor device 10 toward the opening 110.

The insertion body 100 includes an insertion groove 104 formed at a position corresponding to the guide member 310 to be described later and into which the guide member 310 is inserted, and the guide member 310 and the insertion groove 104. A detailed description thereof will be given below with reference to the base unit 300.

A guide sheet according to an embodiment of the present invention will be described.

The guide sheet 200 includes a conductive pad 210 positioned below the insertion body 100 and first and

second guide sheets

220 and 230.

The conductive pad 210 includes a conductive portion 211 and an insulating portion 212. In this case, the conductive portion 211 is formed in a shape in which a plurality of conductive particles are arranged in the thickness direction in the insulating elastic material, the conductive portion 211 is in contact with the ball terminal 12 to energize the probe pin 302 while the semiconductor The conduction state of the plurality of ball terminals 12 installed in the device 10 can be checked.

At this time, the conductive portion 211 is the conductive particles are positioned at a position corresponding to the first, second guide holes (222, 232) to be described later. Specifically, when the conductive portion 211 is disposed at positions corresponding to the first and

second guide holes

222 and 232, and the ball terminal 12 of the semiconductor device 10 presses the conductive portion to a predetermined pressure, The ball terminal 12 is energized to the probe pin 302 through the conductive portion.

The insulating elastic material constituting the conductive part 211 is preferably made of silicone rubber, but is not limited thereto. Any rubber material having good elasticity may be used.

Meanwhile, the insulating part 212 is integrally coupled with the conductive part 211 around the plurality of conductive parts 211 to insulate while supporting the conductive part 211. Electrical insulation is enabled only in the thickness direction by the insulation part 212. The insulating part 212 may be made of the same material as the insulating elastic material constituting the conductive part 211, but is not limited thereto. Any one of a polyamide film, FR4, FR5, and XPC may be used.

The first guide sheet 220 is positioned in close contact with the upper surface of the conductive pad 210 and the first guide hole 222 is formed at a position corresponding to the ball terminal 12.

The first guide hole 222 is opened in the entire region of the first guide sheet 220, and in the drawing according to the present embodiment, the first guide hole 222 is not shown as a whole, but is partially shown only at the central position. Explain.

For example, the first guide hole 222 is disposed at a distance of 0.4 mm from the center of the neighboring first guide hole, and at least 1000 ball terminals 12 are simultaneously disposed in the first guide hole 222 and the second guide hole. Probe pins 302 positioned at positions corresponding to the ball terminals 12 via 232 are aligned to conduct conductivity tests on the semiconductor device 10.

The second guide sheet 230 is positioned in close contact with the bottom surface of the conductive pad 210, and a second guide hole 232 is formed to partially insert the end of the probe pin 302. The second guide hole 232 is formed to align the plurality of probe pins 302 differently from the first guide hole 222 described above, and the top of the probe pins 302 is partially inserted. maintain.

The first and second guide holes 222 and 232 are opened at the same position, and in this embodiment, a plurality of probe pins 302 are provided by installing a guide pad 400 for more accurate alignment of the probe pins 302. Conduct an alignment on

Since the guide pad 400 is made of a thickness relatively thicker than the thickness of the guide sheet 200 described above, the top of the probe pin 302 is more stably coupled. FPCB is used for the guide pad 400. Since the FPCB is excellent in electrical insulation and strong in heat resistance, bending resistance, and chemical resistance, a predetermined external force is applied by the semiconductor device 10 in the guide sheet 200. Edo stably supported and is maintained in a stable state without being separated even when a plurality of probe pins 302 are coupled.

The guide pad 400 has a portion of the upper end of the probe pin 302 inserted into the guide hole 410. For example, when the number of the ball terminals 12 is 1000 balls or more, when the semiconductor device 10 is momentarily moved toward the probe pins 302 by the pusher, an upper end of the probe pins 302 may be formed in the guide hole 410. As a result, the conductive pins are electrically aligned with the probe pins 302 through the conductive particles aligned without dislocations and distributed on the conductive pads 210. For reference, since the probe pin 302 is a well-known configuration, detailed description thereof will be omitted.

A base unit according to an embodiment of the present invention will be described with reference to the drawings.

Referring to FIG. 1 or FIG. 3, the base part 300 has an insertion hole 301 formed at a position corresponding to the coupling protrusion 130 protruding from the lower side of the insertion body 100 to insert the body 100. Primary coupling is performed, and the guide member 310 is brought into contact with the outside of the insertion body 100 to maintain a fixed position.

The guide member 310 may be any one of rubber, silicon, or plastic is selectively used. In the present embodiment, the guide member 310 is disposed to face each other on the left and right sides of the base part 300 on the basis of the drawing, and is inserted into the insertion groove 104. Is inserted. The insertion groove 104 is formed in a shape corresponding to the shape of the guide member 310 when the insertion body 100 is coupled to the inside of the base portion 300, the guide member 310 is easily inserted groove 104 To be inserted).

The guide member 310 is protruded in the form of a spherical shape toward the outside of the base portion 300, it is noted that it is possible to change to another shape that is coupled to the insertion groove 104 and the male and female form.

The base portion 300 includes a first base portion 320 to which the lower end of the probe pin 302 is coupled, and a second base portion 330 in close contact with the upper portion of the first base portion 320. The first and

second base parts

320 and 330 stably support the lower portion of the probe pin 302.

A semiconductor device inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings. Note that the socket unit 1 is the same as in FIG.

The semiconductor device inspecting apparatus 1a according to an embodiment of the present invention relates to an inspecting apparatus for testing a semiconductor device using the above-described alignment socket unit 1, and the semiconductor device 10 is accommodated. A guide sheet for alignment with an insertion position of the insertion body 100 having an opening 110 formed therein, and an insertion position of the ball terminal 12 provided inside the insertion body 100 and provided in the semiconductor device 10 ( 200 and a base portion 300 including a plurality of probe pins 302 disposed at positions where the lower surface of the insertion body 100 faces the ball terminal 12 and faces each other, and the guide sheet ( The guide hole 410 is closely attached to the lower surface of the 200, and the upper end of the probe pin 302 is partially inserted to guide the position of the probe pin 302 to a constant position when a test is performed on the semiconductor device 10. ) Formed Alignment socket unit 1 having an id pad 400, a loading unit 2 having a plurality of alignment socket units 1 installed thereon, and a position facing the upper portion of the alignment socket unit 1 A pusher (3) installed and pressing the plurality of semiconductor devices (10) moved to the upper portion of the alignment socket unit (1) to the inside of the insertion body (100); And a controller 4 for controlling the presence or absence of abnormalities of the plurality of semiconductor devices 10 during the conducting inspection of the semiconductor device 10 pressed by the pusher 3 at a predetermined pressure.

Since the alignment socket unit 1 has already been described above, a detailed description thereof will be omitted, and the loading unit 2 has 30 to 50 alignment socket units 1 installed therein to conduct conductivity tests of the plurality of semiconductor devices 10. It can be carried out at one time, and in this case, the operator can conduct the conductivity test on the plurality of semiconductor devices 10 more conveniently and quickly, thereby improving workability and having an abnormality for the plurality of semiconductor devices at a faster time. You can check.

The pusher 3 is composed of a hydraulic cylinder and a piston and is installed to simultaneously press all of the semiconductor device 10 at a predetermined pressure toward the inside of the insertion body 100, and the pressing force of the pusher 3 is pneumatically. It is operated so that the operator can easily set it to any pressure.

The controller 4 determines whether a conductive state input through the plurality of semiconductor devices 10 inserted into the plurality of alignment socket units 1 is stable, and outputs a current signal input from the specific alignment socket unit 1. Sensing and classifying the malfunctioning semiconductor device, and controls only the semiconductor device that is operating normally.

A use state of the semiconductor device alignment socket unit according to the exemplary embodiment of the present invention configured as described above will be described with reference to the accompanying drawings.

1 or 5 to 6, the semiconductor device 10 is moved by the pusher 3 to the opening 110 of the insertion body 100, and the 1000 or more ball terminals 12 are removed. 1 is accurately inserted into the first guide hole 222 formed in the guide sheet 220.

When an electrical signal is input to the semiconductor device 10, an electrical signal is simultaneously applied to the plurality of ball terminals 12 and pressed by the pusher toward the lower side of the insertion body 100, thereby conducting the conductive portion of the conductive pad 210. The ball terminal 12 is pressed by the ball terminal 12 so that an electrical signal is conducted to the probe pin 302 located at a position corresponding to each ball terminal 12 to conduct a conductivity test of the semiconductor device 10.

For example, in one alignment socket unit 1, hundreds of semiconductor devices 10 are repeatedly inserted into the insertion body 100 successively with a time difference. In this case, the ball terminal 12 and the probe pin 302 ) Must always be exactly coincident so that no error occurs when conducting a conductivity test on the semiconductor device 10.

The ball terminal 12 of the present invention is stably aligned by the first guide hole 222, and the plurality of probe pins 302 have an upper end accurately by the second guide hole 232 and the guide hole 410. It is located under the ball terminal 12.

Accordingly, the upper end of the probe pin 302 is stably aligned with respect to the ball terminal 12, so that the top of the probe pin 302 may be always aligned in the right position regardless of the movement caused by the falling of the ball terminal 12. Therefore, precise conductivity test can be performed.

As mentioned above, although an embodiment of the present invention has been described, those skilled in the art may add, change, delete, or add components within the scope not departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.

Claims

An insert body having an opening for receiving the semiconductor device for testing a packaged semiconductor device;

A guide sheet for aligning the insertion position of the ball terminal provided on the bottom surface of the insertion body and provided in the semiconductor device;

A base part including a plurality of probe pins disposed on a lower surface of the insertion body and facing each other with the ball terminal; And

And a guide pad in close contact with a lower surface of the guide sheet and having a guide hole formed at an upper end of the probe pin to partially guide the position of the probe pin.
According to claim 1,

The semiconductor device,

And the ball terminal is arranged between at least 500 and 2000 balls.
According to claim 1,

The guide sheet,

Conductive pads containing conductive particles in silicon rubber;

A first guide sheet positioned in close contact with an upper surface of the conductive pad and having a first guide hole formed at a position corresponding to the ball terminal;

And a second guide sheet positioned in close contact with a lower surface of the conductive pad and having a second guide hole partially inserted into an end portion of the probe pin.
The method of claim 3, wherein

The conductive pad,

A semiconductor device alignment socket unit in which either a polyamide film or FR4 or FR5 or XPC is optionally used.
According to claim 1,

The guide pad,

The semiconductor device alignment socket unit, characterized in that made of a thickness relatively thicker than the thickness of the guide sheet.
According to claim 1,

The guide pad,

A semiconductor device alignment socket unit in which an insulating material having electrical insulation is used.
According to claim 1,

The guide pad,

Semiconductor device alignment socket unit using FPCB (Flexible Printed Circuit Board).
According to claim 1,

The insert body,

The semiconductor device includes a coupling protrusion protruding downward toward an upper surface of the base portion, wherein the base portion is formed with an insertion hole opened at a position corresponding to the coupling protrusion to maintain the coupling protrusion coupled to the insertion hole. Socket unit.
According to claim 1,

The base part,

And a guide member positioned on an inner surface of the insert body so as to face each other and in contact with an outer side of the insertion body to maintain a fixed position.
The method of claim 9,

The guide member,

A semiconductor device alignment socket unit in which any one of rubber, silicon and plastic is optionally used.
The method of claim 9,

The insert body,

And a insertion groove formed at a position corresponding to the guide member and into which the guide member is inserted.
An insertion body having an opening for accommodating a semiconductor device, a guide sheet for aligning an insertion position of a ball terminal provided inside the insertion body and provided in the semiconductor device, and a lower surface of the insertion body is seated and the ball A base portion including a plurality of probe pins disposed at positions facing each other of the terminal, and a bottom portion of the guide sheet and partially inserted into an upper end of the probe pin to test the semiconductor device. An alignment socket unit having a guide pad for guiding the position at all times;

A loading unit in which a plurality of alignment socket units are installed;

A pusher installed at a position facing the upper portion of the alignment socket unit and pressing the plurality of semiconductor devices moved to the upper portion of the alignment socket unit to the inside of the insertion body; And

And a control unit for controlling the presence or absence of abnormality of the plurality of semiconductor devices during the conductivity test on the semiconductor device pressed by the pusher at a predetermined pressure.