WO2017119676A1 - Semiconductor test contactor - Google Patents

Semiconductor test contactor Download PDF

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Publication number
WO2017119676A1
WO2017119676A1 PCT/KR2016/015566 KR2016015566W WO2017119676A1 WO 2017119676 A1 WO2017119676 A1 WO 2017119676A1 KR 2016015566 W KR2016015566 W KR 2016015566W WO 2017119676 A1 WO2017119676 A1 WO 2017119676A1
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WO
WIPO (PCT)
Prior art keywords
probe
end portion
elastic part
semiconductor test
test contactor
Prior art date
Application number
PCT/KR2016/015566
Other languages
French (fr)
Inventor
Young Bae Chung
Original Assignee
Isc Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isc Co., Ltd. filed Critical Isc Co., Ltd.
Publication of WO2017119676A1 publication Critical patent/WO2017119676A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Definitions

  • the present invention relates to a semiconductor test contactor, and more particularly, to a semiconductor test contactor for inspecting a semiconductor having a fine pitch.
  • a test signal may be transmitted from a test device to an inspection target device to check whether the inspection target device is short-circuited.
  • test device and the inspection target device are not directly connected to each other but are indirectly connected to each other through an intermediate device called "a contactor.”
  • a contactor Such contactors may be classified into a sheet type and a pin type.
  • the sheet type may be provided as elastic sheets including conductive powder and silicone rubber.
  • the pin type may be provided as probes such as pogo pins.
  • the pogo pin includes a hollow cylindrical barrel being a main body of the pogo pin, a contact tip provided on an end of the barrel, a spring placed inside the barrel and connected to the contact tip in a retractable and extendable manner, and a plunger connected to a side of the spring opposite the contact tip and movable like a piston.
  • pogo pins of the related art are constituted by many components as described above, and there is a limit to decreasing the diameter of the pogo pins. Thus, it is very difficult to manufacture pogo pins that can be arranged at a fine pitch.
  • Korean Patent Application Laid-open Publication No. 2005-0044775 discloses an electric connecting apparatus.
  • the document discloses a cobra-pin-shaped probe generally known as a buckle beam.
  • penetration holes formed in plate-shaped members for receiving the upper and lower end portions of the probe are also not coaxial. That is, it is inconvenient to couple the plate-shaped members because it is necessary to finely adjust coupling positions of the plate-shaped members according to the shape of the probe.
  • the present invention provides a semiconductor test contactor for inspecting a semiconductor having a fine pitch.
  • an embodiment of the present invention provides a semiconductor test contactor including: a first probe part including one end portion configured to make electric contact with a terminal of an inspection target device; a second probe part including one end portion configured to make electric contact with a pad of an inspection device; and an elastic part formed in one piece with the first and second probe parts and electrically connecting the first and second probe parts to each other, wherein the elastic part is thinner than the first and second probe parts, both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part, the elastic part is curved in a direction toward a first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, and the elastic part is curved in such a manner that a center portion of the elastic part does is not beyond the first imaginary connection line.
  • the elastic part may have the same thickness along an entire length of the elastic part.
  • the elastic part may have a thickness decreasing in directions from the center portion towards both the end portions of the elastic part.
  • the elastic part when the elastic part is compressed, the elastic part may be further curved in the direction in which the elastic part is originally curved.
  • a protrusion may be formed on the center portion of the elastic part in such a manner that the protrusion may protrude in a direction toward a second imaginary connection line connecting the one side of the other end portion of the first probe part to the one side of the other end portion of the second probe part.
  • the first and second probe parts may be coaxial.
  • the elastic part may have at least one curvature.
  • an embodiment of the present invention provides a semiconductor test contactor including: a first probe part including one end portion configured to make electric contact with a terminal of an inspection target device; a second probe part including one end portion configured to make electric contact with a pad of an inspection device; and an elastic part formed in one piece with the first and second probe parts and electrically connecting the first and second probe parts to each other, wherein the elastic part is thinner than the first and second probe parts, both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part, and the elastic part is curved with a predetermined radius of curvature.
  • the elastic part may be located between a first imaginary connection line and a second imaginary connection line, the first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, the second imaginary connection line connecting the one side of the other end portion of the first probe part to the one side of the other end portion of the second probe part.
  • a center portion of the elastic part may be closer to the first imaginary connection line than to the second imaginary connection line.
  • both end portions of the elastic part may be respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part.
  • the elastic part may be curved in a direction toward a first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, and a center portion of the elastic part may not be beyond the first imaginary connection line. Owing to this structure, even when external force is not applied to the elastic part, the elastic part may maintain its curved shape, and when the semiconductor test contactor undergoes compression deformation, the elastic part may be elastically deformed in the direction in which the elastic part is originally curved.
  • the semiconductor test contactors when a plurality of semiconductor test contactors are deformed by compression, elastic parts of the semiconductor test contactors may be elastically deformed in the same direction, and thus the semiconductor test contactors may not interfere with each other.
  • the semiconductor test contactors when the semiconductor test contactors are provided in a test socket, the semiconductor test contactors may be easily inserted into the test socket, and thus assembly characteristics of the semiconductor test contactors may be improved.
  • FIG. 1 is a perspective view illustrating a semiconductor test contactor according to a first embodiment of the present invention.
  • FIG. 2 is a front view illustrating the semiconductor test contactor according to the first embodiment of the present invention.
  • FIG. 3 is a view illustrating an example in which semiconductor test contactors are coupled to a test socket according to the first embodiment of the present invention.
  • FIG. 4 is an example view illustrating how semiconductor test contactors operate according to the first embodiment of the present invention.
  • FIG. 5 is a graph illustrating pressure applied by the semiconductor test contactor of the first embodiment of the present invention during compression deformation of the semiconductor test contactor.
  • FIG. 6 is a front view illustrating a semiconductor test contactor according to a second embodiment of the present invention.
  • FIG. 7 is a front view illustrating a semiconductor test contactor according to a third embodiment of the present invention.
  • FIG. 1 is a perspective view illustrating a semiconductor test contactor according to a first embodiment of the present invention
  • FIG. 2 is a front view illustrating the semiconductor test contactor according to the first embodiment of the present invention
  • FIG. 3 is a view illustrating an example in which semiconductor test contactors are coupled to a test socket according to the first embodiment of the present invention
  • FIG. 4 is an example view illustrating how semiconductor test contactors operate according to the first embodiment of the present invention
  • FIG. 5 is a graph illustrating pressure applied by the semiconductor test contactor of the first embodiment of the present invention during compression deformation of the semiconductor test contactor.
  • a semiconductor test contactor 100 of the first embodiment of the present invention may include a first probe part 110, a second probe part 120, and an elastic part 130.
  • One end portion of the first probe part 110 may be brought into electric contact with a terminal of an inspection target device 10.
  • one end portion of the second probe part 120 may be brought into electric contact with a pad of an inspection device 20.
  • the elastic part 130 may be formed in one piece with the first probe part 110 and the second probe part 120 and may electrically connect the first probe part 110 and the second probe part 120 to each other.
  • the elastic part 130 may have a thickness that is less than those of the first probe part 110 and the second probe part 120, and both end portions of the elastic part 130 may be respectively connected to one side 113 of the other end portion 112 of the first probe part 110 and one side 123 of the other end portion 122 of the second probe part 120.
  • the elastic part 130 may be curved in a direction toward a first imaginary connection line L1 connecting the other side 114 of the other end portion 112 of the first probe part 110 to the other side 124 of the other end portion 122 of the second probe part 120, and a center portion 131 of the elastic part 130 may not be beyond the first imaginary connection line L1.
  • the elastic part 130 may maintain its curved shape even though external force is not applied to the elastic part 130, and when the semiconductor test contactor 100 undergoes compression deformation, the elastic part 130 may be elastically deformed in the direction in which the elastic part 130 is originally curved. Therefore, when a plurality of semiconductor test contactors 100 are deformed by compression, elastic parts 130 of the semiconductor test contactors 100 may be elastically deformed in the same direction, and thus the semiconductor test contactors 100 may not interfere with each other. In addition, the semiconductor test contactors 100 may be easily inserted into a test socket, and thus assembly characteristics of the semiconductor test contactors 100 may be improved.
  • semiconductor test contactors 100 of the present invention may be arranged on a test socket provided between an inspection target device 10 and an inspection device 20 so as to electrically connect terminals 11 of the inspection target device 10 to pads 21 of the inspection device 20.
  • Each of the semiconductor test contactors 100 may include a first probe part 110, a second probe part 120, and an elastic part 130.
  • One end portion 111 of the first probe part 110 may be brought into contact with a terminal 11 of the inspection target device 10 for electric connection therebetween.
  • the one end portion 111 of the first probe part 110 may have a flat shape.
  • the one end portion 111 of the first probe part 110 is not limited thereto.
  • the one end portion 111 of the first probe part 110 may have a curved shape for stable contact with a terminal 11 of the inspection target device 10, and an additional tip (not shown) may be formed on the one end portion 111 of the first probe part 110.
  • one end portion 121 of the second probe part 120 may be brought into contact with a pad 21 of the inspection device 20 for electric connection therebetween.
  • the one end portion 121 of the second probe part 120 may have a flat shape.
  • the one end portion 121 of the second probe part 120 is not limited thereto.
  • the one end portion 121 of the second probe part 120 may have a curved shape for stable contact with a pad 21 of the inspection device 20, and an additional tip (not shown) may be formed on the one end portion 121 of the second probe part 120.
  • first probe part 110 and the second probe part 120 may have the same shape and thickness.
  • first probe part 110 and the second probe part 120 may be coaxial.
  • the elastic part 130 may be provided between the first probe part 110 and the second probe part 120 and may electrically connect the first probe part 110 and the second probe part 120 to each other.
  • the elastic part 130 may be formed in one piece with the first probe part 110 and the second probe part 120.
  • the elastic part 130 may have a thickness D3 that is less than a thickness D1 of the first probe part 110 and a thickness D2 of the second probe part 120.
  • the thickness D3 of the elastic part 130 may be constant along the entire length of the elastic part 130. In this case, the thickness D3 of the elastic part 130 may be 25 ⁇ m.
  • both end portions of the elastic part 130 may be respectively connected to one side 113 of the other end portion 112 of the first probe part 110 and one side 123 of the other end portion 122 of the second probe part 120.
  • the elastic part 130 may be curved in a direction toward a first imaginary connection line L1 connecting the other side 114 of the other end portion 112 of the first probe part 110 to the other side 124 of the other end portion 122 of the second probe part 120.
  • the elastic part 130 may be curved in such a manner that a center portion 131 of the elastic part 130 may not be beyond the first imaginary connection line L1.
  • the center portion 131 of the elastic part 130 may be on the first imaginary connection line L1.
  • the elastic part 130 of the semiconductor test contactor 100 may have the above-described curved shape even when compressive force is not applied to the semiconductor test contactor 100.
  • both end portions of the elastic part 130 may be on a second imaginary connection line L2 connecting the one side 113 of the other end portion 112 of the first probe part 110 to the one side 123 of the other end portion 122 of the second probe part 120. Therefore, when the semiconductor test contactor 100 is viewed as a whole, the semiconductor test contactor 100 may be located inside the first imaginary connection line L1 and the second imaginary connection line L2.
  • the semiconductor test contactor 100 may be easily inserted into the first coupling hole 31 and the second coupling hole 41 (refer to FIG. 3).
  • the semiconductor test contactors 100 even when a plurality of semiconductor test contactors 100 are compressed in a state in which the semiconductor test contactors 100 are coupled to a test socket, the semiconductor test contactors 100 may not interfere with each other.
  • the elastic parts 130 of the semiconductor test contactors 100 of the present invention are curved in one direction, and thus when compressive force is applied to the semiconductor test contactors 100, the elastic parts 130 of the semiconductor test contactors 100 may be further curved in the direction in which the elastic parts 130 are originally curved.
  • FIG. 5 illustrates force applied by a semiconductor test contactor 100 with respect to the amount of compression of the semiconductor test contactor 100 when the semiconductor test contactor 100 is compressed.
  • a semiconductor test contactor of the present invention was used in an inventive example, and a cobra pin was used as a contactor in a comparative example.
  • the semiconductor test contactor of the present invention and the cobra pin were compressed by the same amount.
  • the elastic part 130 may have at least one curvature.
  • the curvatures of the elastic part 130 may be in the same direction or different directions.
  • FIG. 6 is a front view illustrating a semiconductor test contactor according to a second embodiment of the present invention.
  • the semiconductor test contactor of the current embodiment may have the same structure as the semiconductor test contactor of the first embodiment except for an elastic part having a different thickness, and thus a description of the same structure will be omitted.
  • a semiconductor test contactor 300 of the current embodiment may include an elastic part 330 having a thicknessdecreasingindirections from a center portion 331 toward both end portions of the elastic part 330.
  • the center portion 331 of the elastic part 330 may have a thickness D4 of 30 ⁇ m, and both end portions of the elastic part 330 may have a thickness D5 of 25 ⁇ m. As described above, since the center portion 331 has a relatively large thickness, the center portion 331 may not be broken even though bending stress concentrates on the center portion 331.
  • FIG. 7 is a front view illustrating a semiconductor test contactor according to a third embodiment of the present invention.
  • the semiconductor test contactor of the current embodiment may have the same structure as the semiconductor test contactor of the first embodiment except for the shape of an elastic part, and thus a description of the same structure will be omitted.
  • a protrusion 440 may be formed on a center portion 431 of an elastic part 430 of a semiconductor test contactor 400.
  • the protrusion 440 may protrude in a direction toward a second imaginary connection line L2 connecting a first probe part 410 and a second probe part 420.
  • the protrusion 440 may have a round shape to effectively distribute stress concentrating thereon, and the outermost side of the protrusion 440 may not be beyond the second imaginary connection line L2.

Abstract

The present invention relates to a semiconductor test contactor for inspecting a semiconductor having a fine pitch. According to an embodiment of the present invention, the semiconductor test contactor includes a first probe part, a second probe part, and an elastic part. One end portion of the first probe part is brought into electric contact with a terminal of an inspection target device. One end portion of the second probe part is brought into electric contact with a pad of an inspection device. The elastic part is formed in one piece with the first and second probe parts and electrically connects the first and second probe parts to each other. The elastic part is thinner than the first and second probe parts, and both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part. The elastic part is curved in a direction toward a first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, in such a manner that a center portion of the elastic part is not beyond the first imaginary connection line.

Description

SEMICONDUCTOR TEST CONTACTOR
The present invention relates to a semiconductor test contactor, and more particularly, to a semiconductor test contactor for inspecting a semiconductor having a fine pitch.
In general, after devices such as semiconductor devices are manufactured, electric tests are performed on the devices to check whether the devices are defective. In detail, a test signal may be transmitted from a test device to an inspection target device to check whether the inspection target device is short-circuited.
In this case, the test device and the inspection target device are not directly connected to each other but are indirectly connected to each other through an intermediate device called "a contactor." Such contactors may be classified into a sheet type and a pin type.
The sheet type may be provided as elastic sheets including conductive powder and silicone rubber. The pin type may be provided as probes such as pogo pins.
Korean Patent Application Laid-open Publication No. 2005-0017759 (Feb 23, 2005) discloses a pogo pin of a semiconductor device inspection device. According to the disclosure, the pogo pin includes a hollow cylindrical barrel being a main body of the pogo pin, a contact tip provided on an end of the barrel, a spring placed inside the barrel and connected to the contact tip in a retractable and extendable manner, and a plunger connected to a side of the spring opposite the contact tip and movable like a piston.
Terminals of many recent inspection target devices have been arranged at a fine pitch, and thus it is necessary to arrange contactors at a fine pitch. However, pogo pins of the related art are constituted by many components as described above, and there is a limit to decreasing the diameter of the pogo pins. Thus, it is very difficult to manufacture pogo pins that can be arranged at a fine pitch.
Korean Patent Application Laid-open Publication No. 2005-0044775 (May 12, 2005) discloses an electric connecting apparatus. The document discloses a cobra-pin-shaped probe generally known as a buckle beam. However, since upper and lower end portions of the disclosed probe are not coaxial, penetration holes formed in plate-shaped members for receiving the upper and lower end portions of the probe are also not coaxial. That is, it is inconvenient to couple the plate-shaped members because it is necessary to finely adjust coupling positions of the plate-shaped members according to the shape of the probe.
Therefore, semiconductor test contactors applicable to an inspection target device having terminals arranged at a fine pitch are required
To solve the above-described demerits, the present invention provides a semiconductor test contactor for inspecting a semiconductor having a fine pitch.
To solve the above-mentioned technical problem, an embodiment of the present invention provides a semiconductor test contactor including: a first probe part including one end portion configured to make electric contact with a terminal of an inspection target device; a second probe part including one end portion configured to make electric contact with a pad of an inspection device; and an elastic part formed in one piece with the first and second probe parts and electrically connecting the first and second probe parts to each other, wherein the elastic part is thinner than the first and second probe parts, both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part, the elastic part is curved in a direction toward a first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, and the elastic part is curved in such a manner that a center portion of the elastic part does is not beyond the first imaginary connection line.
In an embodiment of the present invention, the elastic part may have the same thickness along an entire length of the elastic part.
In an embodiment of the present invention, the elastic part may have a thickness decreasing in directions from the center portion towards both the end portions of the elastic part.
In an embodiment of the present invention, when the elastic part is compressed, the elastic part may be further curved in the direction in which the elastic part is originally curved.
In an embodiment of the present invention, a protrusion may be formed on the center portion of the elastic part in such a manner that the protrusion may protrude in a direction toward a second imaginary connection line connecting the one side of the other end portion of the first probe part to the one side of the other end portion of the second probe part.
In an embodiment of the present invention, the first and second probe parts may be coaxial.
In an embodiment of the present invention, the elastic part may have at least one curvature.
To solve the above-mentioned technical problem, an embodiment of the present invention provides a semiconductor test contactor including: a first probe part including one end portion configured to make electric contact with a terminal of an inspection target device; a second probe part including one end portion configured to make electric contact with a pad of an inspection device; and an elastic part formed in one piece with the first and second probe parts and electrically connecting the first and second probe parts to each other, wherein the elastic part is thinner than the first and second probe parts, both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part, and the elastic part is curved with a predetermined radius of curvature.
In an embodiment of the present invention, the elastic part may be located between a first imaginary connection line and a second imaginary connection line, the first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, the second imaginary connection line connecting the one side of the other end portion of the first probe part to the one side of the other end portion of the second probe part.
In an embodiment of the present invention, a center portion of the elastic part may be closer to the first imaginary connection line than to the second imaginary connection line.
According to an embodiment of the present invention, both end portions of the elastic part may be respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part. In addition, the elastic part may be curved in a direction toward a first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, and a center portion of the elastic part may not be beyond the first imaginary connection line. Owing to this structure, even when external force is not applied to the elastic part, the elastic part may maintain its curved shape, and when the semiconductor test contactor undergoes compression deformation, the elastic part may be elastically deformed in the direction in which the elastic part is originally curved. Therefore, when a plurality of semiconductor test contactors are deformed by compression, elastic parts of the semiconductor test contactors may be elastically deformed in the same direction, and thus the semiconductor test contactors may not interfere with each other. In addition, when the semiconductor test contactors are provided in a test socket, the semiconductor test contactors may be easily inserted into the test socket, and thus assembly characteristics of the semiconductor test contactors may be improved.
In addition, according to an embodiment of the present invention, owing to the shape of the elastic part, even though the amount of compression of the semiconductor test contactor increases, force applied by the semiconductor test contactor may increase slightly. Therefore, although the semiconductor test contactor is compressed as an inspection target device is lowered or an inspection device is lifted, force applied by the semiconductor test contactor to a terminal of the inspection target device and a pad of the inspection device may be constantly maintained without a significant increase. Thus, contact resistance with the terminal or the pad may be uniformly maintained without being significantly influenced by the amount of compression of the semiconductor test contactor, and thus current capability may be guaranteed. In addition, since force applied to the terminal of the inspection target device and the pad of the inspection device is barely increased even though the amount of compression of the semiconductor test contactor is increased, the possibility of breakage of the terminal and the pad may be reduced, compared to the case of using a conventional semiconductor test contactor. In addition, the durability of the semiconductor test contactor may increase, and thus the lifespan of the semiconductor test contactor may increase.
Effects of the present invention are not limited to the above-described effects but include all effects that may be inferred from the detailed description of the present invention or the constitution of the present invention defined by the claims.
FIG. 1 is a perspective view illustrating a semiconductor test contactor according to a first embodiment of the present invention.
FIG. 2 is a front view illustrating the semiconductor test contactor according to the first embodiment of the present invention.
FIG. 3 is a view illustrating an example in which semiconductor test contactors are coupled to a test socket according to the first embodiment of the present invention.
FIG. 4 is an example view illustrating how semiconductor test contactors operate according to the first embodiment of the present invention.
FIG. 5 is a graph illustrating pressure applied by the semiconductor test contactor of the first embodiment of the present invention during compression deformation of the semiconductor test contactor.
FIG. 6 is a front view illustrating a semiconductor test contactor according to a second embodiment of the present invention.
FIG. 7 is a front view illustrating a semiconductor test contactor according to a third embodiment of the present invention.
The present invention will now be described with reference to the accompanying drawings. However, the present invention may be variously implemented. Thus, the present invention should not be considered as being limited to embodiments described below. In the drawings, parts not relevant to the present invention may be omitted for clarity of illustration, and like reference numerals refer to like elements throughout.
In the present specification, when a part is referred to as being "connected to" or "coupled to" another part, it may be directly connected or coupled to the other part or intervening parts may be present. In addition, it will be further understood that the terms "comprises" and/or "comprising" used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements unless the context clearly indicates otherwise.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view illustrating a semiconductor test contactor according to a first embodiment of the present invention, FIG. 2 is a front view illustrating the semiconductor test contactor according to the first embodiment of the present invention, FIG. 3 is a view illustrating an example in which semiconductor test contactors are coupled to a test socket according to the first embodiment of the present invention, FIG. 4 is an example view illustrating how semiconductor test contactors operate according to the first embodiment of the present invention, and FIG. 5 is a graph illustrating pressure applied by the semiconductor test contactor of the first embodiment of the present invention during compression deformation of the semiconductor test contactor.
Referring to FIGS. 1 to 5, a semiconductor test contactor 100 of the first embodiment of the present invention may include a first probe part 110, a second probe part 120, and an elastic part 130.
One end portion of the first probe part 110 may be brought into electric contact with a terminal of an inspection target device 10. In addition, one end portion of the second probe part 120 may be brought into electric contact with a pad of an inspection device 20.
The elastic part 130 may be formed in one piece with the first probe part 110 and the second probe part 120 and may electrically connect the first probe part 110 and the second probe part 120 to each other. In addition, the elastic part 130 may have a thickness that is less than those of the first probe part 110 and the second probe part 120, and both end portions of the elastic part 130 may be respectively connected to one side 113 of the other end portion 112 of the first probe part 110 and one side 123 of the other end portion 122 of the second probe part 120.
The elastic part 130 may be curved in a direction toward a first imaginary connection line L1 connecting the other side 114 of the other end portion 112 of the first probe part 110 to the other side 124 of the other end portion 122 of the second probe part 120, and a center portion 131 of the elastic part 130 may not be beyond the first imaginary connection line L1.
Owing to this structure, the elastic part 130 may maintain its curved shape even though external force is not applied to the elastic part 130, and when the semiconductor test contactor 100 undergoes compression deformation, the elastic part 130 may be elastically deformed in the direction in which the elastic part 130 is originally curved. Therefore, when a plurality of semiconductor test contactors 100 are deformed by compression, elastic parts 130 of the semiconductor test contactors 100 may be elastically deformed in the same direction, and thus the semiconductor test contactors 100 may not interfere with each other. In addition, the semiconductor test contactors 100 may be easily inserted into a test socket, and thus assembly characteristics of the semiconductor test contactors 100 may be improved.
In detail, semiconductor test contactors 100 of the present invention may be arranged on a test socket provided between an inspection target device 10 and an inspection device 20 so as to electrically connect terminals 11 of the inspection target device 10 to pads 21 of the inspection device 20.
Each of the semiconductor test contactors 100 may include a first probe part 110, a second probe part 120, and an elastic part 130.
One end portion 111 of the first probe part 110 may be brought into contact with a terminal 11 of the inspection target device 10 for electric connection therebetween. The one end portion 111 of the first probe part 110 may have a flat shape. However, the one end portion 111 of the first probe part 110 is not limited thereto. For example, the one end portion 111 of the first probe part 110 may have a curved shape for stable contact with a terminal 11 of the inspection target device 10, and an additional tip (not shown) may be formed on the one end portion 111 of the first probe part 110.
In addition, one end portion 121 of the second probe part 120 may be brought into contact with a pad 21 of the inspection device 20 for electric connection therebetween. The one end portion 121 of the second probe part 120 may have a flat shape. However, the one end portion 121 of the second probe part 120 is not limited thereto. For example, the one end portion 121 of the second probe part 120 may have a curved shape for stable contact with a pad 21 of the inspection device 20, and an additional tip (not shown) may be formed on the one end portion 121 of the second probe part 120.
In addition, the first probe part 110 and the second probe part 120 may have the same shape and thickness. In addition, the first probe part 110 and the second probe part 120 may be coaxial.
In addition, the elastic part 130 may be provided between the first probe part 110 and the second probe part 120 and may electrically connect the first probe part 110 and the second probe part 120 to each other. The elastic part 130 may be formed in one piece with the first probe part 110 and the second probe part 120.
In addition, the elastic part 130 may have a thickness D3 that is less than a thickness D1 of the first probe part 110 and a thickness D2 of the second probe part 120. In the current embodiment, the thickness D3 of the elastic part 130 may be constant along the entire length of the elastic part 130. In this case, the thickness D3 of the elastic part 130 may be 25 μm.
In addition, both end portions of the elastic part 130 may be respectively connected to one side 113 of the other end portion 112 of the first probe part 110 and one side 123 of the other end portion 122 of the second probe part 120.
The elastic part 130 may be curved in a direction toward a first imaginary connection line L1 connecting the other side 114 of the other end portion 112 of the first probe part 110 to the other side 124 of the other end portion 122 of the second probe part 120. In addition, the elastic part 130 may be curved in such a manner that a center portion 131 of the elastic part 130 may not be beyond the first imaginary connection line L1. Preferably, the center portion 131 of the elastic part 130 may be on the first imaginary connection line L1.
The elastic part 130 of the semiconductor test contactor 100 may have the above-described curved shape even when compressive force is not applied to the semiconductor test contactor 100.
According to the present invention, both end portions of the elastic part 130 may be on a second imaginary connection line L2 connecting the one side 113 of the other end portion 112 of the first probe part 110 to the one side 123 of the other end portion 122 of the second probe part 120. Therefore, when the semiconductor test contactor 100 is viewed as a whole, the semiconductor test contactor 100 may be located inside the first imaginary connection line L1 and the second imaginary connection line L2.
Thus, even when a first coupling hole 31 of an upper plate of a test socket is coaxial with a second coupling hole 41 of a lower plate 40 of the test socket, the semiconductor test contactor 100 may be easily inserted into the first coupling hole 31 and the second coupling hole 41 (refer to FIG. 3).
In addition, according to the present invention, even when a plurality of semiconductor test contactors 100 are compressed in a state in which the semiconductor test contactors 100 are coupled to a test socket, the semiconductor test contactors 100 may not interfere with each other.
That is, referring to FIG. 4, even when compressive force is not applied to the semiconductor test contactors 100, the elastic parts 130 of the semiconductor test contactors 100 of the present invention are curved in one direction, and thus when compressive force is applied to the semiconductor test contactors 100, the elastic parts 130 of the semiconductor test contactors 100 may be further curved in the direction in which the elastic parts 130 are originally curved.
FIG. 5 illustrates force applied by a semiconductor test contactor 100 with respect to the amount of compression of the semiconductor test contactor 100 when the semiconductor test contactor 100 is compressed.
Referring to FIG. 5, a semiconductor test contactor of the present invention was used in an inventive example, and a cobra pin was used as a contactor in a comparative example. The semiconductor test contactor of the present invention and the cobra pin were compressed by the same amount.
Referring to the results, when the amount of compression of the contactor of the comparative example was intermittently increased by 25 μm, force applied by the contactor was linearly increased in a range in which the amount of compression ranged from 25 μm to 125 μm. That is, when the contactor is compressed as an inspection target device is lowered or an inspection device is lifted, force applied by the contactor to a terminal of the inspection target device and a pad of the inspection device may be linearly increased in proportion to the amount of compression of the contactor, and thus the terminal or the pad may be damaged.
However, after the semiconductor test contactor of the present invention was compressed by an amount of about 25 μm to about 50 μm, force applied by the semiconductor test contactor slightly increased. That is, although the semiconductor test contactor is compressed as an inspection target device is lowered or an inspection device is lifted, force applied by the semiconductor test contactor to a terminal of the inspection target device and a pad of the inspection device may be constantly maintained without a meaningful increase. Therefore, contact resistance with the terminal or the pad may be uniformly maintained without being significantly influenced by the amount of compression of the semiconductor test contactor, and thus current capability may be guaranteed. In addition, since force applied to the terminal of the inspection target device and the pad of the inspection device is barely increased even though the amount of compression is increased, the possibility of breakage of the terminal and the pad may be reduced, compared to the case of using a conventional contactor. In addition, the durability of the semiconductor test contactor may increase, and thus the lifespan of the semiconductor test contactor may increase.
The elastic part 130 may have at least one curvature. When the elastic part 130 has a plurality of curvatures, the curvatures of the elastic part 130 may be in the same direction or different directions.
FIG. 6 is a front view illustrating a semiconductor test contactor according to a second embodiment of the present invention. The semiconductor test contactor of the current embodiment may have the same structure as the semiconductor test contactor of the first embodiment except for an elastic part having a different thickness, and thus a description of the same structure will be omitted.
As illustrated in FIG. 6, a semiconductor test contactor 300 of the current embodiment may include an elastic part 330 having a thicknessdecreasingindirections from a center portion 331 toward both end portions of the elastic part 330.
In the current embodiment, the center portion 331 of the elastic part 330 may have a thickness D4 of 30 μm, and both end portions of the elastic part 330 may have a thickness D5 of 25 μm. As described above, since the center portion 331 has a relatively large thickness, the center portion 331 may not be broken even though bending stress concentrates on the center portion 331.
FIG. 7 is a front view illustrating a semiconductor test contactor according to a third embodiment of the present invention. The semiconductor test contactor of the current embodiment may have the same structure as the semiconductor test contactor of the first embodiment except for the shape of an elastic part, and thus a description of the same structure will be omitted.
As illustrated in FIG. 7, according to the current embodiment, a protrusion 440 may be formed on a center portion 431 of an elastic part 430 of a semiconductor test contactor 400. The protrusion 440 may protrude in a direction toward a second imaginary connection line L2 connecting a first probe part 410 and a second probe part 420.
The protrusion 440 may have a round shape to effectively distribute stress concentrating thereon, and the outermost side of the protrusion 440 may not be beyond the second imaginary connection line L2.
The description of the present invention is for illustrative purposes only, and it will be understood by those of ordinary skill in the art that modifications and changes in form may be made without departing from the technical ideas and essential features of the present invention. Therefore, the above-described embodiments should be considered in a descriptive sense only and not for purposes of limitation. For example, each constituent part described above may be provided in a distributed manner, and parts described above as being distributed may be provided in a combined form.
The scope of the present invention is defined by the following claims, and it should be construed that all modifications or changes made within the meaning and scope of the present invention and equivalents thereof are within the scope of the present invention.

Claims (10)

  1. A semiconductor test contactor comprising:
    a first probe part comprising one end portion configured to make electric contact with a terminal of an inspection target device;
    a second probe part comprising one end portion configured to make electric contact with a pad of an inspection device; and
    an elastic part formed in one piece with the first and second probe parts and electrically connecting the first and second probe parts to each other,
    wherein the elastic part is thinner than the first and second probe parts, both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part, the elastic part is curved in a direction toward a first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, and the elastic part is curved in such a manner that a center portion of the elastic part is not beyond the first imaginary connection line.
  2. The semiconductor test contactor of claim 1, wherein the elastic part has the same thickness along an entire length of the elastic part.
  3. The semiconductor test contactor of claim 1, wherein the elastic part has a thickness decreasing in directions from the center portion towards both the end portions of the elastic part.
  4. The semiconductor test contactor of claim 1, wherein, when the elastic part is compressed, the elastic part is further curved in the direction in which the elastic part is originally curved.
  5. The semiconductor test contactor of claim 1, wherein a protrusion is formed on the center portion of the elastic part in such a manner that the protrusion protrudes in a direction toward a second imaginary connection line connecting the one side of the other end portion of the first probe part to the one side of the other end portion of the second probe part.
  6. The semiconductor test contactor of claim 1, wherein the first and second probe parts are coaxial.
  7. The semiconductor test contactor of claim 1, wherein the elastic part has at least one curvature.
  8. A semiconductor test contactor comprising:
    a first probe part comprising one end portion configured to make electric contact with a terminal of an inspection target device;
    a second probe part comprising one end portion configured to make electric contact with a pad of an inspection device; and
    an elastic part formed in one piece with the first and second probe parts and electrically connecting the first and second probe parts to each other,
    wherein the elastic part is thinner than the first and second probe parts, both end portions of the elastic part are respectively connected to one side of the other end portion of the first probe part and one side of the other end portion of the second probe part, and the elastic part is curved with a predetermined radius of curvature.
  9. The semiconductor test contactor of claim 8, wherein the elastic part is located between a first imaginary connection line and a second imaginary connection line, the first imaginary connection line connecting the other side of the other end portion of the first probe part to the other side of the other end portion of the second probe part, the second imaginary connection line connecting the one side of the other end portion of the first probe part to the one side of the other end portion of the second probe part.
  10. The semiconductor test contactor of claim 9, wherein a center portion of the elastic part is closer to the first imaginary connection line than to the second imaginary connection line.
PCT/KR2016/015566 2016-01-04 2016-12-30 Semiconductor test contactor WO2017119676A1 (en)

Applications Claiming Priority (2)

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KR10-2016-0000310 2016-01-04
KR1020160000310A KR101813006B1 (en) 2016-01-04 2016-01-04 Contactor for semiconductor test

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107402318A (en) * 2017-08-31 2017-11-28 京东方科技集团股份有限公司 Probe assembly and test equipment

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6806269B2 (en) * 2018-01-11 2021-01-06 オムロン株式会社 Probe pins, inspection jigs, inspection units and inspection equipment
KR102566040B1 (en) * 2021-06-29 2023-08-16 주식회사 프로웰 Probe for semiconductor device test socket
KR102321081B1 (en) * 2021-07-21 2021-11-03 (주)새한마이크로텍 Contact Probe Assembly
KR102644534B1 (en) * 2023-10-30 2024-03-07 (주)새한마이크로텍 Contact Probe

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070105362A (en) * 2005-02-18 2007-10-30 니혼 하츠쵸 가부시키가이샤 Conductive terminal unit and conductive terminal
US20090224782A1 (en) * 2008-03-10 2009-09-10 Hon Hai Precision Ind. Co., Ltd. Test socket for testing semiconductor package
JP4434371B2 (en) * 1999-08-31 2010-03-17 株式会社日本マイクロニクス Probe unit and probe card
JP2011133354A (en) * 2009-12-24 2011-07-07 Nhk Spring Co Ltd Contact probe and probe unit
KR101082459B1 (en) * 2008-05-09 2011-11-11 파인메탈 게엠베하 Electrical Contact Element for Contacting an Electrical Test Sample and Contacting Apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3773396B2 (en) * 2000-06-01 2006-05-10 住友電気工業株式会社 Contact probe and manufacturing method thereof
JP2003207522A (en) * 2002-01-15 2003-07-25 Sumitomo Electric Ind Ltd Contact probe
KR100546361B1 (en) * 2003-08-08 2006-01-26 삼성전자주식회사 Test tool of semiconductor device and operation method of the test tool
JPWO2010061857A1 (en) * 2008-11-25 2012-04-26 日本発條株式会社 Contact probe, probe unit and assembling method of probe unit
JP2010197092A (en) 2009-02-23 2010-09-09 Nhk Spring Co Ltd Contact probe and probe unit
TWM411569U (en) * 2011-03-22 2011-09-11 Micro Precise Technology Co Ltd Testing probe and probe retaining base

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4434371B2 (en) * 1999-08-31 2010-03-17 株式会社日本マイクロニクス Probe unit and probe card
KR20070105362A (en) * 2005-02-18 2007-10-30 니혼 하츠쵸 가부시키가이샤 Conductive terminal unit and conductive terminal
US20090224782A1 (en) * 2008-03-10 2009-09-10 Hon Hai Precision Ind. Co., Ltd. Test socket for testing semiconductor package
KR101082459B1 (en) * 2008-05-09 2011-11-11 파인메탈 게엠베하 Electrical Contact Element for Contacting an Electrical Test Sample and Contacting Apparatus
JP2011133354A (en) * 2009-12-24 2011-07-07 Nhk Spring Co Ltd Contact probe and probe unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107402318A (en) * 2017-08-31 2017-11-28 京东方科技集团股份有限公司 Probe assembly and test equipment
US10782314B2 (en) 2017-08-31 2020-09-22 Boe Technology Group Co., Ltd. Probe assembly and testing device

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TW201734466A (en) 2017-10-01
TWI633309B (en) 2018-08-21
KR20170081364A (en) 2017-07-12

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