JP6744173B2 - Socket for electrical parts - Google Patents

Description

The present invention relates to an electrical component socket which is disposed on a wiring board and accommodates the electrical component such as a semiconductor device (hereinafter referred to as “IC package”) for testing.

Conventionally, as this type of “electrical component socket”, there is an IC socket that detachably accommodates an IC package that is an “electrical component” (see Patent Document 1).

Some of such IC sockets are designed to accommodate a plurality of IC packages vertically.

JP, 2013-8499, A

However, in the conventional case, there is a possibility that a temperature difference may occur between the upper and lower IC packages in the test depending on the environment at the time of the test, and it is difficult to perform the test in a state where the upper and lower IC packages have substantially the same temperature.

Therefore, the present invention provides an electrical component socket that performs a test or the like in a state in which a plurality of electrical components are arranged vertically, and an electrical component that can make a temperature difference between the upper and lower electrical components small with a simple structure. An object is to provide a socket for parts.

In order to achieve the above object, the invention according to claim 1 is a socket for an electric component in which a first electric component and a second electric component are accommodated and arranged on a wiring board, wherein the wiring is A socket body disposed on the substrate for accommodating the first electric component and the second electric component, the socket main body having an upper accommodating portion for accommodating the first electric component; 2 has a lower housing portion for housing the electrical component, the upper housing portion is disposed in a main body portion and an opening provided in the main body portion, and has a thermal conductivity higher than that of the main body portion. Of high heat conductivity, the heat conductive member having the first electrical component housed in the upper housing portion and the second electrical component housed in the lower housing portion. It is characterized in that it is a socket for electric parts which is configured so as to be in contact with both.

In addition to the invention according to claim 1, the invention according to claim 2 is characterized in that the opening is provided in a substantially central portion of the upper accommodation portion, and the heat conductive member is made of an insulating material. It is characterized in that it is a socket for electric parts having.

In addition to the invention according to claim 1 or 2, the invention according to claim 3 is, in addition to the invention according to claim 1 or 2, above the upper housing part, the first electrical component and the lower side housed in the upper housing part. A pressing member that presses the second electric component housed in the housing portion is provided, and a heater that heats the first electric component and the second electric component from above is provided on the pressing member. It is characterized in that it is used as a socket for electric parts that are already used.

According to a fourth aspect of the present invention, in addition to the invention according to any one of the first to third aspects, the first electric component and the second electric component are a package-on-package structure. It is characterized in that it is an electrical component socket which is an IC package arranged on the top and bottom.

According to the first aspect of the invention, in the socket for electrical components that performs a test or the like with a plurality of electrical components arranged vertically, the first electrical component accommodated in the upper accommodation part and the lower accommodation part. Since a heat conductive member having a higher thermal conductivity than that of the main body is arranged in the upper housing so as to come into contact with both the second electrical components housed in the The heat can be transferred easily by using, and the temperature difference between the upper and lower electric components can be made small. As a result, the upper and lower electric components can be tested in a state close to the set temperature state.

According to the invention as set forth in claim 2, since the heat conductive member is disposed in the opening provided in the substantially central portion of the upper accommodation portion, the first electrical component and the second electrical component Both can be contacted in a large area. Therefore, the temperature difference between the upper and lower electric components can be further reduced. Moreover, since the heat conductive member has an insulating property, it is possible to transmit only heat while preventing an inappropriate flow of electricity.

According to the third aspect of the present invention, the pressing member is provided above the upper accommodation portion, and the pressing member is provided with the heater, so that the temperature condition that can be set by the device for arranging the socket for electrical components is set to be higher than that of the temperature condition. The electric component can be further heated. Here, since the heat of the heater is transmitted from above, the temperature of the first electric component arranged on the upper side is usually higher than the temperature of the second electric component arranged on the lower side. It will be difficult. However, since the heat conductive member is provided between the first electric component and the second electric component, it is possible to easily transfer the heat from above to the second electric component on the lower side. It is possible to make the temperature difference between the upper and lower parts small when the parts are heated.

According to the invention described in claim 4, in the socket for electric parts in which the upper and lower electric parts constituting the package-on-package structure are arranged, the temperature difference between the upper and lower electric parts is reduced. Therefore, it is possible to test the package-on-package structure, which is used by stacking it up and down when it becomes a product, as close to the product as possible.

It is a perspective view which shows the IC socket which concerns on embodiment of this invention. It is a perspective view of a state where the bottom module and the upper module of the IC socket according to the same embodiment are removed from the cover. It is a top view which shows the IC socket which concerns on the same embodiment. It is sectional drawing which follows the AA line of FIG. 3 in the IC socket which concerns on the same embodiment, a right side is a state diagram before a lock, and a left side is a state diagram at the time of a lock. FIG. 4 is a cross-sectional view of the IC socket according to the same embodiment taken along the line BB in FIG. 3. It is a top view which shows the state which removed the cover of the IC socket which concerns on the same embodiment. FIG. 4A is a cross-sectional view of a contact pin disposition portion in the upper module of the IC socket according to the same embodiment, where (a) is a state diagram before locking and (b) is a state diagram during locking. It is sectional drawing which follows the CC line of FIG. 6 in the IC socket which concerns on the same embodiment. It is sectional drawing which follows the DD line of FIG. 6 in the IC socket which concerns on the same embodiment. It is a top view which shows the state which removed the cover and upper module of the IC socket which concern on the same embodiment. FIG. 4A is a cross-sectional view of a contact pin disposition portion of the bottom module of the IC socket according to the same embodiment, where FIG. 7A is a state diagram before locking and FIG. FIG. 3 is a cross-sectional view showing contact pin disposition portions of the upper module and the bottom module of the IC socket according to the same embodiment. It is a figure which shows the memory package which concerns on the same embodiment, (a) is a front view and (b) is a top view. It is a figure which shows the processor package which concerns on the same embodiment, (a) is a front view, (b) is a top view. It is a figure which shows the state at the time of the heating comparison experiment of the IC socket which concerns on the same embodiment, (a) is a figure which shows the state at the time of heating the IC socket of the same embodiment, (b) is an IC socket of a prior art example. It is a figure which shows the state at the time of heating.

Hereinafter, embodiments of the present invention will be described.

1 to 15 show an embodiment of the present invention.

First, the configuration will be described. An IC socket 10 as an “electrical component socket” according to the present embodiment includes an upper module 20 as an “upper housing portion” and an “lower housing” as shown in FIGS. 1 and 2. A socket body 10a having a bottom module 30 as a "unit", a memory package 11 that is a "first electrical component" is accommodated in an upper module 20, and a processor package 12 that is a "second electrical component". With the bottom module 30 accommodated in the bottom module 30, the bottom module 30 is assembled via the upper module 20 below the cover 40 having a rectangular shape in plan view as a “pressing member”, and as shown in FIG. By arranging the bottom module 30 on the top, two types of electric components (memory package 11 and processor package 12) can be tested at the same time.

Here, the memory package 11 and the processor package 12 of this embodiment have a so-called package-on-package (PoP) structure in which the memory package 11 is mounted on the processor package 12 in a stacked state.

Of these, the memory package 11 is a so-called BGA as shown in FIG. 13, has a main body 11a formed in a square shape in a plan view, and has a rectangular frame shape on the lower surface of the main body 11a. A plurality of hemispherical terminals 11b are formed so as to project downward from the peripheral portion of the.

As shown in FIG. 14, the processor package 12 is also referred to as a so-called BGA, and has a main body portion 12a having the same size as the main body portion 11a of the memory package 11 formed in a square shape in a plan view. A plurality of hemispherical lower terminals 12b for contacting the wiring board 19 are formed so as to project downward from the lower surface of the main body 12a. Further, a hemispherical upper terminal 12c which is conductive by contacting the hemispherical terminal 11b of the memory package 11 is formed on a peripheral portion of the rectangular frame shape on the upper surface of the main body 12a (see FIG. 12). The shape of each terminal described above is not limited to a hemispherical shape, and may be an appropriate shape such as a substantially flat plate shape.

On the other hand, the bottom module 30 in the IC socket 10 has a module main body 30a as a main body, as shown in FIG. The module main body 30a has a frame-shaped frame-shaped portion 31, and a substantially square plate-shaped contact unit 32 is fitted in the central portion thereof. As shown in FIGS. 10 to 12, the contact unit 32 has a lower plate member 33, an upper plate member 34, and a floating member 35. The floating member 35 is biased upward by a spring (not shown) with respect to the lower plate member 33 and the upper plate member 34. The lower plate member 33 includes an upper first lower plate member 33a and a lower second lower plate member 33b. These are held by a holding member (not shown), and in a state where the processor package 12 is placed in the lower placement portion 38 provided on the upper surface of the floating member 35, the floating member 35 is attached to the upper plate member 34 and the lower plate member 33. It is vertically elastically urged upward.

Further, as shown in FIGS. 10 to 12, a large number of contact pins 70 are vertically arranged in the lower arrangement portion 38.

These contact pins 70 are provided between the first plunger 71 that contacts the lower terminal 12b of the processor package 12, the second plunger 72 that contacts the wiring board 19, and between the first plunger 71 and the second plunger 72. And a biasing member 73 such as a coil spring that biases the two in a direction in which they are separated from each other. Then, as shown in FIG. 4, when the bottom module 30 and the upper module 20 are assembled to the cover 40 and installed on the wiring board 19, as shown in FIG. The upper end contacts the lower terminal 12b of the processor package 12 on the lower placement part 38 of the bottom module 30, and the lower end of the second plunger 72 contacts the terminal (not shown) of the wiring board 19. Has been.

Further, as shown in FIG. 4, a pair of engaged pieces 30b capable of engaging with a pair of latches 51 of the cover 40 described later are provided on the outer peripheral surface of the module body 30a. Each engaged piece 30b has a tapered upper engaged portion 30c and a tapered lower engaged portion 30d. Both of the upper engaged portion 30c and the lower engaged portion 30d are formed outward facing the claw portions 51a of the latches 51 of the cover 40.

Here, the difference in the vertical position between the upper engaged portion 30c and the lower engaged portion 30d (the height of the upper engaged portion 30c minus the height of the lower engaged portion 30d) 4), as shown in FIG. 4, the assembly height of the upper module 20 (that is, the vertical position of the bottom module 30 when the bottom module 30 is assembled to the cover 40 via the upper module 20 and the cover height). (The difference from the vertical position of the bottom module 30 when the bottom module 30 is assembled to the 40 without the intervention of the upper module 20).

Therefore, in the IC socket 10, as shown in FIG. 4, the claw portion 51a of the latch 51 of the cover 40 is hooked and engaged with the upper engaged portion 30c of the engaged piece 30b of the bottom module 30 to engage the upper portion. The bottom module 30 can be assembled to the cover 40 via the module 20, and the claw portion 51a of the latch 51 of the cover 40 is hooked on the lower engaged portion 30d of the engaged piece 30b of the bottom module 30 to be engaged. By doing so, it is possible to assemble the bottom module 30 to the cover 40 independently without using the upper module 20.

Further, the upper module 20 has a module main body 20a as a main body, as shown in FIGS. The module main body 20a has a frame-shaped frame-shaped portion 21, and a substantially square plate-shaped contact unit 22 is fitted in the central portion thereof. This contact unit 22 has a lower plate member 23, an upper plate member 24, and a floating member 25, as shown in FIGS. The floating member 25 is biased upward by the spring 26 with respect to the lower plate member 23 and the upper plate member 24.

Further, it has a stopper member 27 penetrating the lower plate member 23, the upper plate member 24, and the floating member 25. The stopper member 27 is configured such that the lower plate member 23 and the upper plate member 24 are fixed by a lower screw portion 27a and a small flange portion 27b provided on the upper side thereof and wider than the screw portion 27a. Further, a large flange portion 27c, which is provided on the upper side thereof and is wider than the small flange portion 27b, holds the floating member 25 downward so as not to rise above a predetermined position.

An upper arrangement portion 28 for arranging the memory package 11 is provided on the upper surface of the floating member 25, and is elastically attached upward between the upper plate member 24 and the large flange portion 27c of the stopper member 27. It is urged to move up and down. Further, guides 28 a for guiding the memory package 11 when the memory package 11 is arranged are provided at four corners of the upper arrangement portion 28.

Further, below the peripheral portion of the upper arrangement portion 28, as shown in FIGS. 6, 7, and 12, a large number of contact pins 60 are arranged in the vertical direction. These contact pins 60 have a plunger 61 that comes into contact with the terminal 11b of the memory package 11, and a biasing member 62 such as a coil spring that is inserted into the lower portion of the plunger 61 and comes into contact with the upper terminal 12c of the processor package 12. doing.

Then, as shown in FIG. 1, when the bottom module 30 and the upper module 20 are assembled to the cover 40, as shown in FIG. 7B, the upper end portion of the plunger 61 is located above the upper module 20. 23 so that the lower end of the biasing member 62 contacts the upper terminal 12c of the processor package 12 on the lower placement portion 38 of the bottom module 30 with a predetermined contact pressure. It is provided.

Further, as shown in FIGS. 2 and 4 to 6, a lower plate opening 23b having a substantially square shape in plan view is provided at a substantially central portion of the lower plate member 23 in the contact unit 22 of the upper module 20. Further, an upper plate opening 24b having a substantially square shape in plan view and having substantially the same shape and size as the lower plate opening 23b is provided at a substantially central portion of the upper plate member 24 of the contact unit 22. The lower plate opening 23b and the upper plate opening 24b form the opening 20b in the contact unit 22 of the upper module 20.

A rectangular parallelepiped heat conductive member 29 having a substantially square shape in plan view is disposed in the opening 20b thus configured. The heat conductive member 29 is configured to easily conduct heat and have an insulating property. Here, a member having an insulating property obtained by alumite processing a member made of aluminum having a high heat conductivity is used. I am using.

Further, the upper surface and the lower surface of the heat conductive member 29 are formed in a substantially flat shape, and the upper surface of the heat conductive member 29 contacts the memory package 11 in a large area, and the lower surface of the heat conductive member 29 has a large area. It comes into contact with the processor package 12.

Further, the heat conductive member 29 has a protrusion 29a that protrudes outward in the form of a flange at the central portion in the vertical direction over the entire circumference of the peripheral edge portion. In addition, a cutout portion 24a into which the protrusion 29a can be inserted is provided in the lower portion of the upper plate opening 24b of the upper plate member 24, and the lower plate member 23 is inserted in the cutout portion 24a. The upper module 20 is configured to hold the heat conductive member 29 in the opening 20b composed of the lower plate opening 23b and the upper plate opening 24b by sandwiching it with and fixing it with the stopper member 27.

Further, as shown in FIGS. 2 to 5, the cover 40 of the IC socket 10 has a cover main body 41 having a substantially rectangular parallelepiped frame shape, and the cover main body 41 can be raised and lowered with respect to the cover main body 41. The heat sink 42 configured as described above is mounted so as to be vertically movable along the positioning pin 43. The heat sink 42 is attached so as to be vertically movable while being elastically biased upward by a spring (not shown).

Further, a substantially U-shaped bail (operation lever) 45 is attached to the cover body 41 between the standby position P1 and the test position P2 so as to be rotatable about the shaft 46 in the directions of arrows M and N by about 180°. ing. A pair of cams 47 is attached to both ends of the bail 45, and when the bail 45 is rotated, the cams 47 rotate about the shaft 46 and come into contact with the heat sink 42. The heat sink 42 is configured to be pushed down.

When the bail 45 is positioned at the test position P2 as shown on the left side of FIG. 4, the pressing portion 47a of the cam 47 comes into contact with the upper surface of the protruding portion 42a of the heat sink 42 as shown in FIG. 42 is pushed down. Further, as shown in the right side of FIG. 4, when the bail 45 is positioned at the standby position P1, the push-down portion 47a of the cam 47 releases the push on the upper surface of the protruding portion 42a of the heat sink 42, and accordingly the spring is activated. The heat sink 42 urged upward pushes up.

Further, as shown in FIG. 4, on the outer peripheral surface of the cover main body 41, a pair of latches 51 on one of the two opposite sides are opened and closed by rotating around the shaft 52 in the directions of arrows K and L, respectively. It is installed. Each of the latches 51 has an operation portion 51b formed on the upper end portion thereof, and a tapered claw portion 51a formed on the lower end portion thereof inwardly.

Further, two coil springs 53 are provided between the operation portion 51b at the upper end of each latch 51 and the cover body 41, respectively, so that the latch 51 is always elastically biased in the direction of arrow L to be closed. Has been done. Further, as shown in FIG. 4, the cover main body 41 is provided with a pair of substantially cylindrical lock pins 49 for locking the pair of latches 51 in the closed state in the horizontal direction outward (that is, the pair of latches 51). It is embedded in a protruding form on the side).

A heater 44 is provided inside the heat sink 42 as shown in FIG. During the test, the heat sink 42 is heated by the heater 44, and the memory package 11 housed in the upper module 20 is heated by the portion of the heat sink 42 that presses the memory package 11 by the heat of the heat sink 42. The processor package 12 housed in the bottom module 30 is heated by the heat transmitted downward via the heat conductive member 29 described later.

Further, the heat sink 42 is provided with a thermocouple 44a as a temperature control device for controlling the temperature of the heater 44. When it is not easy to set a high temperature (e.g., 80° C.) higher than a predetermined temperature due to the burn-in device capacity, the heater 44 is additionally heated by the heater 44 so that a predetermined temperature (for example, 120° C.) is obtained. It allows the test to be performed at (°C).

Next, an operation when two types of electric components (memory package 11 and processor package 12) are simultaneously tested (burn-in test) using the IC socket 10 will be described below.

First, as shown in FIG. 2, the processor package 12 is accommodated on the lower arrangement portion 38 of the bottom module 30 and the memory package 11 is accommodated on the upper arrangement portion 28 of the upper module 20.

Next, as shown in FIG. 4, with the bail 45 of the cover 40 positioned at the standby position P1, the latch 51 of the cover 40 is hooked on the engaged piece 30b of the bottom module 30 to be engaged. Thus, the upper module 20 and the bottom module 30 are attached to the lower side of the cover 40. As a result, the bottom module 30 is assembled to the cover 40 via the upper module 20.

Next, as shown in FIG. 4, after the IC socket 10 is arranged on the wiring board 19, the bail 45 of the cover 40 is rotated in the direction of arrow N as shown on the left side of FIG. Position to P2. Then, the pressing portion 47b of the cam 47 comes into contact with the upper surface of the protruding portion 42a of the heat sink 42 and descends.

As a result, the memory package 11 on the upper arrangement portion 23 of the upper module 20 is pushed down by the heat sink 42 and descends in the module body 20a, and the contact pins 60 contact the processor package 12 in the module body 30a of the bottom module 30. The lower terminal 11b of the memory package 11 contacts the upper terminal 12c of the processor package 12 with a predetermined contact pressure to be electrically connected.

At the same time, the processor package 12 is pushed by the upper module 20 and the processor package 12 on the lower placement portion 38 of the bottom module 30 descends in the module body 31, the contact pins 70 contact the wiring board 19, and the lower side of the processor package 12 is contacted. The terminal 12b comes into contact with a terminal (not shown) of the wiring board 19 at a predetermined contact pressure to be electrically connected.

As the heat sink 42 descends, the pair of lock pins 49 descend and come into contact with the stepped portions 51c of the pair of latches 51, as shown in FIG. As a result, these latches 51 can be kept closed.

Then, the inside of the burn-in device (not shown) is brought to a set temperature (for example, 80° C.). Further, the surface temperature of the memory package 11 and the processor package 12 is preliminarily planned by turning on the heater 44 arranged on the cover 40 of the IC socket 10 to further heat the memory package 11 and the processor package 12. Bring to temperature (eg 120° C.). In this embodiment, since it is not easy to set a temperature higher than 80° C. due to the capacity of the burn-in device, additional heating is performed by the heater 44 attached to the IC socket 10, so that the temperature of 120° C. which is scheduled in advance is maintained. It is possible to carry out a test.

Further, at this time, as the memory package 11 and the upper module 20 descend, the heat conductive member 29 disposed in the opening 20b at the substantially central portion of the upper module 20 causes the lower surface of the memory package 11 and the processor package 12 to move. Abut the top surface. Thereby, heat is easily transferred to both the memory package 11 and the processor package 12, and the temperature difference between the packages 11 and 12 can be reduced.

As a result, the heat sink 42 is heated by the heater 44 installed inside the upper heat sink 42, and the heat of the heat sink 42 applies heat to the memory package 11 arranged in the upper module 20, and this heat causes the heat conductive member 29. The temperature of the processor package 12 can also be set to a temperature substantially equal to that of the memory package 11 by being transmitted to the processor package 12 via the.

In this state, a test is conducted by passing a current through two types of electric parts (memory package 11 and processor package 12).

Next, a comparative experiment between the IC socket 10 according to this embodiment including the heat conductive member 29 and the IC socket without the heat conductive member 29 will be described with reference to FIG.

In this experiment, the IC socket 10 according to this embodiment and the IC socket in which the heat conductive member 29 is not provided are simultaneously heated with a heater of 150 degC (fixed), no wind, and an environmental temperature of 25 degC (room temperature). Heated. Then, after the temperature was raised, the temperature in a stable state was measured.

As a result, the IC socket 10 according to this embodiment is in a state where the temperature difference is relatively small in the vertical direction as shown in FIG. Specifically, the memory package 11 has 145.75 degC, the heat conductive member 29 has 142.04 degC, the processor package 12 has 141.23 degC, and the temperature difference between the memory package 11 and the processor package 12 is 4.52 degC. ..

On the other hand, in the case where the heat conductive member 29 was not provided, as shown in FIG. 15B, the temperature difference was relatively large at the top and bottom. Specifically, the memory package 11 was 149.14 degC, the processor package 12 was 128.23 degC, and the temperature difference between the memory package 11 and the processor package 12 was 20.91 degC.

As described above, in the IC socket 10 according to this embodiment having the heat conductive member 29, the temperature of the upper and lower packages 11 and 12 is clearly higher than that in the state without the heat conductive member 29. It turns out that the difference can be reduced.

As described above, the IC socket 10 of this embodiment is the same as the IC socket 10 for performing a test or the like with the memory package 11 and the processor package 12 arranged above and below the memory package 11 and the bottom housed in the upper module 20. Since the thermal conductive member 29 having a higher thermal conductivity than that of the module main body 20a is disposed in the upper module 20 so as to contact both the processor packages 12 housed in the module 30, the upper and lower memories are simple in structure. Heat can be easily transferred between the package 11 and the processor package 12, and a temperature difference between the upper and lower memory packages 11 and the processor package 12 can be reduced. As a result, the upper and lower memory packages 11 and the processor package 12 can be tested in a state close to the set temperature state.

Further, in the IC socket 10 of this embodiment, since the heat conductive member 29 is arranged in the opening 20b provided at the substantially central portion of the upper module 20, both the memory package 11 and the processor package 12 are provided. It is possible to make contact with a wider area. Therefore, the temperature difference between the upper and lower memory packages 11 and the processor packages 12 can be made smaller. Further, since the heat conductive member 29 has an insulating property, it is possible to transmit only heat while preventing an inappropriate flow of electricity.

Further, the IC socket 10 of this embodiment has a cover 40 above the upper module 20, and by providing a heater 44 on the cover 40, a temperature condition that can be set by a burn-in device in which the IC socket 10 is arranged is set. Also, the memory package 11 and the processor package 12 can be further heated. Here, since the heat of the heater 44 is transferred from above, the temperature of the memory package 11 arranged on the upper side is likely to rise, and the temperature of the processor package 12 arranged on the lower side is less likely to rise. However, since the heat conductive member 29 is provided between the memory package 11 and the processor package 12, the heat from above can be easily transferred to the processor package 12 on the lower side, and the memory package 11 and the processor package 12 can be easily transferred. When heating 12, the temperature difference between the upper and lower sides can be small.

Further, the IC socket 10 of this embodiment has the same temperature difference between the upper and lower memory packages 11 and the processor package 12 in the IC socket 10 in which the upper and lower IC packages 11 and 12 constituting the package-on-package structure are arranged. Therefore, the package-on-package structure, which is used as a product in a vertically stacked state, can be tested in a state as close to the product as possible.

Although the present invention is applied to the IC socket 10 as the “electrical component socket” in the above-described embodiment, it is needless to say that the present invention can be applied to other devices as well.

Further, in the above-described embodiment, the memory package 11 and the processor package 12, which are IC packages used in the package-on-package structure as electric components, have been described, but the present invention is not limited to this. For example, two IC packages that are not used in the package-on-package structure may be arranged vertically. Also, other electric components other than the IC package may be housed vertically.

10 IC socket (socket for electric parts)
10a socket body
11 Memory package (first electrical component)
12 Processor package (second electrical component)
19 wiring board
20 Upper module (upper compartment)
20a Module body (body part)
20b opening
29 Thermally conductive material
30 Bottom module (lower housing)
40 Cover (pressing member)
44 heater

Claims (4)

A socket for an electric component, which accommodates a first electric component and a second electric component and is arranged on a wiring board,
A socket body that is disposed on the wiring board and that houses the first electric component and the second electric component,
The socket body has an upper housing portion that houses the first electric component and a lower housing portion that houses the second electric component,
The upper side accommodating portion has a main body portion and a heat conductive member that is disposed in an opening provided in the main body portion and has a higher thermal conductivity than the main body portion.
The heat conductive member is configured to be in contact with both the first electric component housed in the upper housing portion and the second electric component housed in the lower housing portion. Characteristic socket for electrical parts. The opening is provided in a substantially central portion of the upper accommodation portion,
The socket for electric parts according to claim 1, wherein the heat conductive member has an insulating property. Above the upper housing portion, a pressing member for pressing the first electric component housed in the upper housing portion and the second electric component housed in the lower housing portion is provided,
The electric component socket according to claim 1 or 2, wherein the pressing member is provided with a heater for heating the first electric component and the second electric component from above. The electrical device according to any one of claims 1 to 3, wherein the first electrical component and the second electrical component are IC packages arranged above and below in a package-on-package structure. Socket for parts.