KR102362735B1 - socket for electrical components - Google Patents

Abstract

[Problem] In a socket for electrical components in which a test or the like is performed in a state in which two electrical components are arranged vertically, the temperature difference between these two electrical components is reduced.
[Solution Means] The socket for electric component of the present invention has an upper accommodating portion for accommodating the first electric component and a lower accommodating portion for accommodating the second electric component. The upper accommodating part has a accommodating body having an opening, and a thermally conductive member provided in the opening and having a higher thermal conductivity than the accommodating body. This thermally conductive member is arrange|positioned so that it may contact both the 1st electric component accommodated in the upper accommodating part, and the 2nd electric component accommodated in the lower accommodating part.

Description

socket for electrical components

TECHNICAL FIELD The present invention relates to a socket for electrical components that is installed on a wiring board and accommodates electrical components such as semiconductor devices (hereinafter referred to as "IC packages") for testing and the like.

Conventionally, there is an IC socket for removably housing an IC package and performing an operation test of the IC package.

Also, as such an IC socket for operation test, it is known that a plurality of IC packages are accommodated at the same time to perform an operation test (refer to Patent Document 1).

Also known is an IC socket in which a plurality of IC packages are respectively heated with a heater to perform an operation test under a high temperature.

Japanese Laid-Open Patent Publication No. 2013-8499

However, in the conventional IC socket, when a plurality of IC packages are simultaneously subjected to an operation test under high temperature, there is a risk that a temperature difference may occur in the plurality of IC packages. It was difficult to conduct a highly reliable operation test in

Accordingly, it is an object of the present invention to provide a socket for electrical components that can make the temperature difference between these electrical components sufficiently small when accommodating a plurality of electrical components at the same time and performing an operation test.

In order to achieve the above object, the socket for electrical components according to the present invention is a socket for electrical components in which a first electrical component and a second electrical component are accommodated and installed on a wiring board, and is installed on the wiring board, a socket body for accommodating the first electrical component and the second electrical component, the socket body having an upper accommodating portion for accommodating the first electrical component and a lower accommodating portion for accommodating the second electrical component, , the upper accommodating portion has an accommodating body having an opening, and a thermally conductive member provided in the opening and having a higher thermal conductivity than the accommodating body, wherein the thermally conductive member includes the first electrical component accommodated in the upper accommodating portion; It is characterized in that it is configured to contact both sides of the second electric part accommodated in the lower accommodating part.

In the socket for electric component of the present invention, it is preferable that the opening is formed in a substantially central portion of the upper accommodating portion.

In the socket for electrical components of the present invention, it is preferable that the thermally conductive member has insulation.

In the socket for electrical component of the present invention, it is preferable that the thermally conductive member is disposed so as to be in contact with the lower surface of the main body of the first electric component and to be in contact with the upper surface of the main body of the second electric component.

In the socket for electrical components of the present invention, it is preferable to further include a heating mechanism for heating the upper surface of the main body of the first electrical component.

The socket for electric component of this invention WHEREIN: It is preferable that the said heating mechanism has a heat sink which presses the said main body upper surface of the said 1st electric component, and a heater which heats this heat sink.

In the electrical component socket of the present invention, it is preferable that the first electrical component and the second electrical component are two IC packages mounted on a circuit board in a vertically overlapped state.

According to the present invention, a thermally conductive member having a higher thermal conductivity than the housing body is disposed in the upper accommodating portion so as to contact both the first electric component accommodated in the upper accommodating portion and the second electric component accommodated in the lower accommodating portion. With the structure, it is possible to easily transmit heat between the upper and lower electric components, thereby reducing the temperature difference between the upper and lower electric components. As a result, the test can be performed with the upper and lower electrical components in a state close to the preset temperature.

In the present invention, by forming an opening in the substantially central portion of the upper housing portion and arranging the thermal conductive member in the opening, the thermal conductive member is brought into contact with both the first electrical component and the second electrical component in a sufficiently large area can do it Therefore, the temperature difference between the upper and lower electric components can be sufficiently reduced.

In this invention, the short circuit between the terminals of a 1st electrical component and a 2nd electrical component can be prevented by using an insulating thermally conductive member.

In the present invention, by disposing the thermally conductive member in contact with the lower surface of the main body of the first electric component and in contact with the upper surface of the main body of the second electric component, this thermally conductive member is formed of the first electric component and the second electric component. It can be brought into contact with a sufficiently large area on both sides. Therefore, the temperature difference between the upper and lower electric components can be sufficiently reduced.

According to the present invention, since the heat conduction member is provided, when a heating mechanism for heating the upper surface of the main body of the first electrical component is provided, the heat generated by the heating mechanism is conducted to the first electrical component and the second electrical component approximately equally can do it

In this invention, fixing and heating of a 1st electric component can be performed effectively by heating while pressing the main body upper surface of a 1st electric component with the heat sink which has a heater.

According to the present invention, two IC packages mounted on a circuit board in a vertically overlapped state can be tested under conditions close to the mounted state.

1 is a perspective view showing an IC socket according to an embodiment of the present invention.
[ Fig. 2] Fig. 2 is an exploded perspective view showing an IC socket according to an embodiment of the present invention.
Fig. 3 is a plan view showing an IC socket according to an embodiment of the present invention.
Fig. 4 is a cross-sectional view taken along line AA of Fig. 3 in the IC socket according to the embodiment of the present invention, wherein the right side is a state diagram before locking, and the left side is a state diagram at the time of locking.
Fig. 5 is a cross-sectional view taken along line BB of Fig. 3 in the IC socket according to the embodiment of the present invention.
Fig. 6 is a plan view showing a state in which the cover of the IC socket according to the embodiment of the present invention is removed.
Fig. 7 is a cross-sectional view of a contact pin mounting portion in an upper module of an IC socket according to an embodiment of the present invention, wherein (a) is a state diagram before locking, (b) is a state diagram at the time of locking.
Fig. 8 is a cross-sectional view taken along line CC of Fig. 6 in the IC socket according to the embodiment of the present invention.
Fig. 9 is a cross-sectional view taken along line DD in Fig. 6 in the IC socket according to the embodiment of the present invention.
[Fig. 10] Fig. 10 is a plan view showing a state in which the cover of the IC socket and the upper module according to the embodiment of the present invention are removed.
[Fig. 11] Fig. 11 is a cross-sectional view of a contact pin mounting portion in a bottom module of an IC socket according to an embodiment of the present invention, wherein (a) is a state diagram before locking, and (b) is a state diagram at the time of locking.
[ Fig. 12] Fig. 12 is a cross-sectional view showing a contact pin attachment portion of an upper module and a bottom module of an IC socket according to an embodiment of the present invention.
Fig. 13A is a front view showing an external appearance of a memory package according to an embodiment of the present invention.
Fig. 13B is a plan view showing an external appearance of a memory package according to an embodiment of the present invention.
Fig. 14A is a front view showing the appearance of a processor package according to an embodiment of the present invention.
[FIG. 14B] It is a top view which shows the external appearance of the memory package which concerns on embodiment of this invention.
Fig. 15A is an isothermal diagram showing the temperature distribution during heating of the IC socket according to the embodiment of the present invention.
Fig. 15B is an isothermal diagram showing the temperature distribution during heating of the IC socket according to the comparative example.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

1 to 15A show an embodiment of the present invention.

First, the configuration will be described.

The IC socket 10 according to the present embodiment corresponds to the "electric component socket" of the present invention, and as shown in Figs. 1 and 2, the upper module 20 as the "upper side accommodating part" of the present invention; A socket body 10a having a bottom module 30 as a "lower accommodating part" is included.

The upper module 20 accommodates the memory package 11 as the "first electrical component" of the present invention. In addition, the bottom module 30 accommodates the processor package 12 as the "second electric component" of the present invention.

The cover 40, which is substantially rectangular in plan view, corresponds to the "pressing member" of the present invention. On the lower side of the cover 40 , the bottom module 30 is assembled by sandwiching the upper module 20 .

And, as shown in FIG. 4, by installing the bottom module 30 on the wiring board 19, two types of electrical components (that is, the memory package 11 and the processor package 12) are simultaneously installed. can be tested

As described above, in the IC socket 10 of the present embodiment, the memory package 11 and the processor package 12 are accommodated in a state in which the memory package 11 is stacked above the processor package 12 . That is, the IC socket 10 of the present embodiment can perform operation tests of the memory package 11 and the processor package 12 under an environment close to the state in which the memory package 11 and the processor package 12 are mounted to form a so-called package-on-package (PoP) structure.

The memory package 11 of this embodiment is a so-called BGA (Ball Grid Array), as shown in FIGS. 13A and 13B. That is, the memory package 11 has a substantially square body portion 11a in plan view, and on the lower surface of the main body portion 11a, protrudes downward from the peripheral edge portion of the rectangular frame shape, A plurality of hemispherical terminals 11b are provided.

Further, the processor package 12 of the present embodiment is also a so-called BGA, as shown in Figs. 14A and 14B. The processor package 12 has a body portion 12a having the same size as the body portion 11a of the memory package 11 , which is approximately square in plan view. A plurality of hemispherical lower terminals 12b for contacting the wiring board 19 are formed on the lower surface of the main body 12a to protrude downward. Further, on the upper surface of the main body portion 12a, a hemispherical upper terminal 12c is formed for making the terminal 11b of the memory package 11 conduct by contacting the peripheral edge portion of the rectangular frame shape (FIG. 12). Reference). In addition, the shape of each of said terminals is not limited to a hemispherical shape, Other shapes, such as a substantially flat shape, may be sufficient.

On the other hand, the bottom module 30 of the IC socket 10 has a module body 30a as shown in FIG. 2 or FIG. 10 . This module body 30a has a frame-shaped portion 31, and a plate-shaped contact unit 32 is fitted in the central portion thereof to have a substantially square shape in plan view. The contact unit 32 has a lower plate member 33 , an upper plate member 34 , and a floating member 35 as shown in FIGS. 11 and 12 . The floating member 35 is urged away from the lower plate member 33 and the upper plate member 34 by a spring (not shown). The lower plate member 33 is composed of an upper first lower plate member 33a and a lower second lower plate member 33b. These first lower plate members and second lower plate members 33a and 33b are held by holding members not shown. The floating member 35 is pressed down against the above-described urging force of the spring with the processor package 12 disposed on the lower arranging portion 38 formed on the upper surface thereof, thereby forming the upper plate member 34 and the lower plate member 33 . ) is supported so that it can move up and down.

In addition, as shown in Figs. 10 to 12, the contact unit 32 is provided with a plurality of contact pins 70 facing up and down.

These contact pins 70 include a first plunger 71 that comes into contact with the lower terminal 12b of the processor package 12 , a second plunger 72 that comes into contact with the wiring board 19 , and a first It has an urging member 73, such as a coil spring, which is provided between the plunger 71 and the 2nd plunger 72 and urges both sides in the direction spaced apart.

These contact pins 70 are shown in FIG. 11B when the bottom module 30 and the upper module 20 are assembled to the cover 40 and installed on the wiring board 19 (see FIG. 4 ). As shown, the upper end of the first plunger 71 is in contact with the lower terminal 12b of the processor package 12 mounted on the lower mounting portion 38 of the bottom module 30, and the second plunger 72 A lower end portion of the circuit board 19 contacts an electrode (not shown) of the wiring board 19 .

Further, as shown in Fig. 4, on the outside of the module body 30a, a pair of engaging pieces 30b for engaging with a pair of latches 51 of a cover 40 to be described later are provided. . Each engaged piece 30b has an upper engaged portion 30c and a lower engaged portion 30d, respectively. Both the upper engaged portion 30c and the lower engaged portion 30d are formed outwardly so as to face a claw portion 51a provided in each latch 51 of the cover 40. .

Here, the vertical position difference between the upper engaged portion 30c and the lower engaged portion 30d (the height of the lower engaged portion 30d from the height of the upper engaged portion 30c) 4, the assembly height of the upper module 20 (that is, the bottom module 30 when the upper module 20 is interposed between the cover 40 and the bottom module 30) difference between the position and the position of the bottom module 30 when the upper module 20 is not interposed between the cover 40 and the bottom module 30].

Therefore, in the IC socket 10 , as shown in FIG. 4 , the claw portion 51a provided on the latch 51 of the cover 40 is formed on the engageable piece 30b of the bottom module 30 on the upper side. By engaging the engaging portion 30c, the bottom module 30 can be assembled to the cover 40 with the upper module 20 interposed therebetween. On the other hand, by engaging the claw portion 51a formed on the latch 51 of the cover 40 with the lower engaged portion 30d formed on the engaging piece 30b of the bottom module 30, The bottom module 30 may be assembled to the cover 40 in a state where the upper module 20 is not interposed therebetween.

The upper module 20 has the module main body 20a as the "accommodating main body" of this invention, as shown to FIG. 2 and FIGS. 4-6. This module main body 20a has a frame-shaped part 21, and the contact unit 22 which is substantially square and plate-shaped in plan view is fitted in the center part. The contact unit 22 includes a lower plate member 23 , an upper plate member 24 , and a floating member 25 as shown in FIGS. 8 , 9 , and 12 . As shown in FIG. 8 , the floating member 25 is urged by a spring 26 in a direction away from the lower plate member 23 and the upper plate member 24 .

In addition, the upper module 20 includes a lower plate member 23 , an upper plate member 24 , and a stopper member 27 penetrating the floating member 25 . This stopper member 27 has a lower plate member 23 and an upper plate member ( 24) is fixed. Further, the uppermost position of the floating member 25 is regulated by the large flange portion 27c formed above the small flange portion 27b and wider than the small flange portion 27b.

In addition, an upper arranging part 28 for arranging the memory package 11 is formed on the upper surface of the floating member 25 . Since the floating member 25 can rise/fall between the large flange portion 27c of the upper plate member 24 and the stopper member 27, the upper arranging portion 28 is also positioned between the uppermost position and the lowermost position. It is possible to move up and down. In addition, guides 28a defining the arrangement positions of the memory packages 11 are provided at four corners of the upper arrangement unit 28 .

Further, as shown in Figs. 6, 7, and 12, a plurality of contact pins 60 are provided below the peripheral edge portion of the upper mounting portion 28 in a state in which they face up and down. These contact pins 60 include a plunger 61 in contact with the terminal 11b of the memory package 11 , and a coil inserted under the plunger 61 and in contact with the upper terminal 12c of the processor package 12 . It has an urging member 62, such as a spring.

And, in the state in which the bottom module 30 and the upper module 20 are assembled to the cover 40 (see FIG. 1), as shown in FIG. 7 (b), the upper end of the plunger 61 is the upper module ( The lower end of the pressing member 62 is in contact with the terminal 11b of the memory package 11 disposed on the upper arrangement 28 of the bottom module 30 , and is on the lower arrangement 38 of the bottom module 30 . It contacts the upper terminal 12c of the disposed processor package 12 with a predetermined contact pressure.

As described above, the contact unit 22 of the upper module 20 includes the lower plate member 23, the upper plate member 24, and the floating member 25 (refer to Figs. 8, 9, 12, etc.) . In the substantially central portion of the members 23, 24, and 25, openings 23b, 24b, 25b having a substantially square shape in plan view are formed. And the opening 20b of the contact unit 22 is comprised by these opening parts 23b, 24b, and 25b.

As shown in Fig. 6, the opening 20b is provided with a thermally conductive member 29 having a substantially square shape in plan view. The thermally conductive member 29 is formed so as to easily conduct heat and have insulating properties. In the present embodiment, as the thermal conductive member 29 , an insulating film formed by an anodizing treatment on the surface of the aluminum member is used.

In addition, the upper surface and the lower surface of the thermally conductive member 29 are formed in a substantially planar shape so that the contact area between the upper surface and the memory package 11 or the contact area between the lower surface and the processor package 12 is sufficiently large. have.

As shown in Fig. 5, the thermally conductive member 29 has, on its side surface, a flange-shaped protrusion 29a, which is formed so as to protrude outward over its entire circumference. On the other hand, in the upper plate member 24 , a cutout 24a is formed from the lower part of the inner peripheral surface of the upper plate opening 24b to the lower surface. With the protrusion 29a of the thermally conductive member 29 inserted into the cutout 24a, the upper surface of the lower plate member 23 is brought into contact with the lower surface of the upper plate member 24, whereby the protrusion 29a is ) is sandwiched by the lower plate member 23 and the upper plate member 24 . Then, by fixing the lower plate member 23 and the upper plate member 24 with the stopper member 27 , the thermal conductive member 29 can be accommodated and held in the opening 20b of the upper module 20 .

Further, the cover 40 of the IC socket 10 has a cover body 41 in the shape of a substantially rectangular parallelepiped frame, as shown in FIGS. 2 to 5 . Inside the cover body 41, a heat sink 42 is mounted so as to be movable up and down in accordance with a positioning pin 43 in a state in which the heat sink 42 is pressed upward by a spring (not shown).

In addition, as shown in Figs. 1, 2 and 4, the cover body 41 has an approximately U-shaped bail (operation lever) 45 centered on the shaft 46 in the direction of arrows M and N, approximately 180 ° It is rotatable. Thereby, the said bail 45 is rotationally moved between the standby position P1 (the right side of FIG. 4) and the test position P2 (the left side of FIG. 4).

On both ends of the bail 45, cams 47 are mounted one by one. These cams (47) rotate about the shaft (46) by rotating the bail (45).

When the bail 45 is positioned at the standby position P1 (left side in Fig. 4), as shown in Fig. 5, the depressed portion 47a of the cam 47 is in the uppermost position, and the heat sink 42 do not press the protrusion 42a of Therefore, the heat sink 42 is in a state in which it is pushed up by the urging force of a spring (not shown). On the other hand, when the bale 45 is rotationally moved to the test position P2 (right side of FIG. 4), the lower portion 47a of the cam 47 is processed to contact the upper surface of the protrusion 42a of the heat sink 42, and , the heat sink 42 is pressed down by resisting the pressing force of the spring.

Further, on the outer peripheral surface of the cover body 41, latches 51 are respectively attached to opposite sides as shown in Fig. 4 . Each of these latches 51 is configured to open and close by rotating in the directions of arrows K and L, centering on the shaft 52, respectively. Each of the latches 51 has an operating portion 51b formed at its upper end, and a tapered claw portion 51a formed at its lower end inwardly.

As shown in FIG. 3 , two coil springs 53 are respectively provided between the upper end operation part 51b of each latch 51 and the cover body 41 . The operation portion 51b of the latch 51 is always pressed to the outside of the cover body 41 by these coil springs 53 . Thereby, a pressing force rotating in the arrow L direction (refer to FIG. 4 ), that is, a pressing force in the closing direction, is always applied to the latch 51 .

Further, as shown in Fig. 4, the cover body 41 has a pair of substantially cylindrical locking pins 49 protruding outward in the horizontal direction (that is, in the direction opposite to the corresponding latch 51). is buried. With these locking pins 49, each latch 51 can be locked in a closed state while the heat sink 42 is pressed down.

As shown in FIG. 3 , a heater 44 is provided inside the heat sink 42 described above. During the test, the heat sink 42 is heated with the heater 44 while the heat sink 42 is placed on the memory package 11 . As a result, the heat of the heat sink 42 heats the memory package 11 accommodated in the upper module 20 . In addition, heat generated by the heat sink 42 is conducted from the memory package 11 through the thermal conductive member 29 to the processor package 12 accommodated in the bottom module 30 .

The heat sink 42 is provided with a thermocouple 44a for managing the temperature of the heater 44 .

And in a normal burn-in (burn-in) apparatus, it is not easy to raise the temperature inside an apparatus to a predetermined test temperature (for example, 120 degreeC). Therefore, in the present embodiment, the temperature in the burn-in apparatus is raised to a predetermined high temperature (eg, 80°C), and the temperature of the sheet sink is raised by the heater 44 to the test temperature (eg, 120°C). make it

Next, a procedure for performing a test (a burn-in test in this embodiment) of two types of electrical components (memory package 11 and processor package 12 in this embodiment) using such an IC socket 10 is described. do.

First, as shown in FIG. 2 , the processor package 12 is accommodated on the lower placement part 38 of the bottom module 30 , and the memory package ( 11) is accepted. As a result, the processor package 12 faces the lower surface of the thermal conductive member 29 on the upper surface of the body portion 12a, and the memory package 11 moves the thermal conductive member 29 on the lower surface of the main body portion 11a. ) is opposite to the upper surface of

Next, as shown on the right side of FIG. 4 , with the bail 45 of the cover 40 positioned at the standby position P1, the claw portion 51a of the latch 51 is pivoted by the bottom module 30. By engaging with the fitting piece 30b, the upper module 20 and the bottom module 30 are provided below the cover 40. Accordingly, the bottom module 30 is assembled to the cover 40 through the upper module 20 .

Next, as shown in Fig. 4, the IC socket 10 is installed on the wiring board 19, and thereafter, as shown on the left side of Fig. 4, the veil 45 of the cover 40 is moved by an arrow. Rotate in the N direction to the test position P2. With this rotation, the press-down portion 47b (see FIG. 5 ) of the cam 47 presses the upper surface of the protrusion portion 42a of the heat sink 42 to lower the heat sink 42 .

As a result, the heat sink 42 lowers the memory package 11 mounted on the upper mounting portion 28 of the upper module 20 in the module body 20a. Thereby, the contact pin 60 contacts the upper terminal 12c of the processor package 12 and the terminal 11b of the memory package 11 with a predetermined contact pressure, respectively, and the upper terminal 12c and the terminal ( 11b) is electrically connected (see Fig. 7).

At the same time, the processor package 12 mounted on the lower mounting portion 38 of the bottom module 30 is pressed down on the upper module 20 in the module body 30a. As a result, the contact pins 70 respectively contact the electrodes (not shown) of the wiring board 19 and the lower terminals 12b of the processor package 12 with a predetermined contact pressure. Thereby, the lower terminal 12b and the electrode of the wiring board 19 are electrically connected.

Further, as the heat sink 42 is lowered, as shown on the left side of FIG. 4 , the pair of lock pins 49 are lowered and fitted into the step portions 51c of the pair of latches 51 . . As a result, these latches 51 are locked in the closed state.

In addition, with the lowering of the heat sink 42 , the processor package 12 comes into contact with the lower surface of the thermal conductive member 29 from the upper surface of the body portion 12a, and the memory package 11 moves to the body portion 11a. ) in contact with the upper surface of the thermally conductive member 29 from the lower surface.

Thereafter, the temperature in the burn-in device (not shown) is raised to a set temperature (eg, 80°C). Further, the heater 44 provided on the cover 40 of the IC socket 10 is turned on to heat the heat sink 42 . As a result, the heat of the heat sink 42 is conducted to the memory package 11, and the temperature of the memory package 11 rises. Then, heat is conducted from the lower surface of the main body 11a of the memory package 11 to the upper surface of the thermal conductive member 29 , and the temperature of the thermal conductive member 29 rises. In addition, heat is conducted from the lower surface of the thermally conductive member 29 to the upper surface of the body portion 12a of the processor package 12, and the temperature of the processor package 12 rises. In this way, in the present embodiment, the surface temperatures of the memory package 11 and the processor package 12 are set to a predetermined temperature (eg, 120° C.).

As described above, in the present embodiment, the thermal conductive member 29 is disposed between the memory package 11 and the upper module 20 so that the lower surface of the memory package 11 and the upper surface of the thermal conductive member 29 are and the lower surface of the thermally conductive member 29 and the upper surface of the processor package 12 were brought into contact with each other.

As a result, heat can be easily transferred between the memory package 11 and the processor package 12, and thus the temperature difference between these packages 11 and 12 can be made small.

In this state, a test is performed by passing a current through two types of electrical components (memory package 11 and processor package 12).

As described above, according to the present embodiment, the burn-in tests of the processor package 12 and the memory package 11 can be simultaneously performed under substantially equal temperature conditions.

Next, a comparative experiment of an IC socket having the thermal conductive member 29 (IC socket 10 of this embodiment) and an IC socket not having the thermal conductive member 29 is shown in Figs. 15A and 15B. will be described with reference to 15 , the curve within the range is an isotherm.

In this experiment, the IC socket 10 according to the present embodiment was first manufactured, and the memory package 11 and the processor package 12 were accommodated therein. Also, at the same time, the memory package 11 and the processor package 12 were accommodated in the IC socket for comparison. The IC socket for comparison differs from the IC socket of the present embodiment only in that the thermal conductive member 29 is not provided.

Subsequently, these two types of IC sockets were heated with a heater 150degC (fixed), no wind, and an environmental temperature of 25degC (room temperature). Then, the temperature of the memory package 11 and the processor package 12 was measured while the temperature was increased and stable. In addition, about the IC socket 10 which concerns on this embodiment, the temperature of the thermally conductive member 29 was also measured.

As a result, in the IC socket 10 according to the present embodiment, the temperature difference between the packages 11 and 12 is small as shown in Fig. 15A. Specifically, the memory package 11 is 145.75degC, the thermal conductive member 29 is 142.04degC, and the processor package 12 is 141.23degC, and the temperature difference between the memory package 11 and the processor package 12 is 4.52degC. became

In contrast, in the IC socket in which the thermal conductive member 29 is not provided, the temperature difference between the packages 11 and 12 is larger than in the case of the IC socket 10 of the present embodiment, as shown in Fig. 15B. became Specifically, the memory package 11 is 149.14degC, the processor package 12 is 128.23degC, and the temperature difference between the memory package 11 and the processor package 12 is 20.91degC.

In this way, the IC socket 10 according to the present embodiment having the thermal conductive member 29 has a smaller temperature difference between the packages 11 and 12 compared to the state in which the thermal conductive member 29 is not included. could

As described above, in the present embodiment, the thermal conductive member 29 is provided in the IC socket 10 in which the test or the like is performed in a state where the memory package 11 and the processor package 12 are arranged vertically to provide the memory package. (11) and the processor package (12) were brought into contact with both sides.

Here, it is preferable to make the thermal conductivity of the thermally conductive member 29 higher than the thermal conductivity of the module main body 20a provided in the upper module 20. As shown in FIG. According to the present embodiment, with a simple structure, heat can be easily transferred from the upper memory package 11 to the lower processor package 12, whereby the upper memory package 11 and the lower processor package The temperature difference in (12) can be made small. As a result, the test can be performed with the memory package 11 and the processor package 12 in a state close to the set temperature state.

Further, in the IC socket 10 of the present embodiment, since the thermal conductive member 29 is provided in the opening 20b formed in the substantially central portion of the upper module 20, the memory package 11 and the processor package 12 It can be brought into contact with a larger area on both sides of the Also in this respect, the temperature difference between the memory package 11 and the processor package 12 can be reduced.

Further, according to the IC socket 10 of the present embodiment, since the surface of the thermal conductive member 29 has insulation properties, the plurality of terminals 11b of the package 11 and the plurality of upper terminals of the package 12 are (12c) can be prevented from being electrically short-circuited.

In the IC socket 10 of the present embodiment, a heat sink 42 is provided above the upper module 20, and a heater 44 is provided in the heat sink 42, whereby the IC socket The memory package 11 and the processor package 12 can be made higher in temperature than the temperature that can be set in the burn-in device in which the (10) is disposed. In addition, since the thermally conductive member 29 is disposed between the memory package 11 and the processor package 12 as described above, despite heating the upper surface of the memory package 11 with the heat sink 42, this The temperature difference between the memory package 11 and the processor package 12 can be made very small.

The IC socket 10 of the present embodiment is suitable for use in testing an IC package mounted on a mounting circuit of a so-called package-on-package structure. As is well known, the package-on-package structure is a mounting method in which two IC packages are superimposed in direct contact with each other on a circuit board. The IC socket 10 of this embodiment has the thermal conductive member 29 disposed between two IC packages (that is, the memory package 11 and the processor package 12), so it is very suitable for a package-on-package mounting circuit. Under close temperature conditions, these two IC packages can be tested.

As described above, in the present embodiment, the memory package 11 is heated from the upper surface using the heat sink 42 . However, the present invention can also be applied to an IC socket that is not heated by the heat sink 42 or the like, and even in that case, the effect that the temperature difference between the two IC packages superimposed vertically can be reduced can be obtained.

In addition, although the case where the IC socket 10 is employ|adopted as "the socket for electrical components" is described in this embodiment, it is not limited to this, It goes without saying that it can also be applied to the socket which accommodates other types of electrical components.

As described above, the IC socket of the present embodiment is suitable for testing an IC package applied to a package-on-package structure mounted circuit, but it goes without saying that it can also be used for testing a package other than the package-on-package structure.

10: IC socket (socket for electrical parts)
10a: socket body
11: memory package (first electrical component)
12: processor package (second electrical component)
19: wiring board
20: upper module (upper receiving part)
20a: module body (receiving body)
20b: opening
29: thermally conductive member
30: bottom module (lower receiving part)
40: cover (pressing member)
44: heater

Claims (7)

A socket for electrical components in which a first electrical component and a second electrical component are accommodated and installed on a wiring board,
a socket body installed on the wiring board and accommodating the first electrical component and the second electrical component;
The socket body has an upper accommodating portion for accommodating the first electric component and a lower accommodating portion for accommodating the second electric component,
The upper accommodating part has an accommodating body having an opening, and a thermally conductive member provided in the opening and having a higher thermal conductivity than the accommodating body,
the thermally conductive member is configured to contact both the first electric component accommodated in the upper accommodating portion and the second electric component accommodated in the lower accommodating portion;
Sockets for electrical components. According to claim 1,
The opening is formed in a central portion of the upper receiving portion, the socket for electrical components. According to claim 1,
The thermally conductive member has insulation, an electrical component socket. According to claim 1,
The said thermally conductive member is arrange|positioned so that it may contact with the main body lower surface of the said 1st electric component, and it may contact with the main body upper surface of the said 2nd electric component, The socket for electrical components. 5. The method of claim 4,
The socket for electrical components further comprising a heating mechanism for heating the upper surface of the main body of the first electrical component. 6. The method of claim 5,
The said heating mechanism has the heat sink which presses the said main body upper surface of the said 1st electrical component, and the heater which heats the said heat sink, The socket for electrical components. According to claim 1,
The first electrical component and the second electrical component are two IC packages mounted on a circuit board in a vertically overlapped state, the electrical component socket.

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