KR20210088989A - Test apparatus - Google Patents

Abstract

The present invention relates to a semiconductor chip package test device, and more specifically, to a semiconductor chip package test device, wherein when performing a test on a semiconductor chip package, there is no need to mount in and take out the semiconductor chip package from a socket device, thereby simplifying a test process, significantly reducing a time required for testing, and reducing operating cost of the device.

Description

Semiconductor chip package test equipment {TEST APPARATUS}

The present invention relates to a semiconductor chip package testing apparatus, and more particularly, when performing a test on a semiconductor chip package, there is no need to mount and take out a semiconductor chip package in a socket device, thereby simplifying the test process, It relates to a semiconductor chip package test apparatus in which the time required for testing can be greatly shortened and the operating cost of the apparatus can be reduced.

After the semiconductor device undergoes a manufacturing process, an inspection is performed to determine its electrical performance. The performance test of the semiconductor device is performed while a semiconductor chip package test socket formed to be in electrical contact with the terminal of the semiconductor device is inserted between the semiconductor device and the test circuit board. In addition, the semiconductor chip package test socket is used in a burn-in test process during the manufacturing process of the semiconductor device in addition to the inspection of the semiconductor device.

In general, when testing a semiconductor chip package, a semiconductor chip package test socket is used. The semiconductor chip package test socket includes a contact electrically connecting the semiconductor chip package and a predetermined board, a base on which the contact is mounted, and members such as an adapter, a latch, and an actuator for fixing the semiconductor chip package. Accordingly, after the semiconductor chip package is mounted in the semiconductor chip package test socket and the test is performed in a fixed state, the semiconductor chip package is detached from the semiconductor chip package test socket.

In this process, since it is necessary to move the semiconductor chip package and operate the semiconductor chip package test socket, the time required for the semiconductor chip package test is long. In addition, as described above, various members such as an adapter, a latch, and an actuator are required, thereby increasing the overall operating cost of the device. This may lead to an increase in the unit price of the semiconductor chip package.

Accordingly, there is a need to develop a semiconductor chip package test apparatus capable of shortening the test time of the semiconductor chip package and reducing the overall operating cost of the apparatus.

Patent Publication No. 2009-0068645

The present invention has been devised to solve the above problems, and when performing a test on the semiconductor chip package, there is no need to mount and take out the semiconductor chip package in the socket device, thereby simplifying the test process and necessary for testing It relates to a semiconductor chip package test apparatus in which time can be greatly reduced and the operating cost of the apparatus can be reduced.

A semiconductor chip package testing apparatus according to an embodiment of the present invention includes: a socket module; and a tray module on which a semiconductor chip package is mounted; including, wherein the socket module includes a socket body, and a contact mounted on the socket body and protruding to the outside of the socket body, wherein the tray module includes a tray body in the form of a flat plate having a predetermined area, and the a mounting unit formed on a tray body, wherein a semiconductor chip package is mounted on the mounting unit, positions of the socket module and the tray module are relatively displaced, and the contact of the socket module to the semiconductor chip package mounted on the mounting unit connected to perform a test on the semiconductor chip package.

According to an embodiment, a plurality of the mounting parts are formed on the tray body to have a mesh-shaped arrangement structure.

According to one embodiment, the board; It further includes, the socket body of the socket module is fixed on the board, and the contact protrudes upward.

According to an embodiment, the mounting part is configured with a mounting hole penetrating the tray body up and down.

According to an embodiment, the tray module is disposed on the tray body, and further includes a tray cover covering the semiconductor chip package mounted in the mounting hole.

According to one embodiment, a pusher for fixing between the tray body and the tray cover; further includes.

According to an embodiment, the socket body has an interpolation three-dimensional structure in which the upper part can be interpolated into the mounting part.

According to one embodiment, the socket module, or a drive device for displacing the tray module; further includes.

The semiconductor chip package test apparatus according to the present invention does not require mounting and taking out the semiconductor chip package in the socket device when performing a test on the semiconductor chip package. Therefore, the test process is simplified and the time required for the test can be greatly reduced.

In addition, since the semiconductor chip package test apparatus according to the present invention does not need to mount the semiconductor chip package on the socket module, the structure of the socket module can be very simple. Accordingly, the operating cost of the semiconductor chip package test apparatus can be greatly reduced.

1 is a diagram showing the structure of a semiconductor chip package test apparatus according to an embodiment of the present invention.
2 is a diagram illustrating a structure of a socket module of a semiconductor chip package test apparatus according to an embodiment of the present invention.
3 is a view showing the structure of a tray module of the semiconductor chip package test apparatus according to an embodiment of the present invention.
4 is a diagram illustrating a structure of a semiconductor chip package test apparatus according to an embodiment of the present invention.
5 is a diagram illustrating a structure of a semiconductor chip package test apparatus and a semiconductor chip package test according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment according to the present invention will be described.

1 is a diagram showing the structure of a semiconductor chip package test apparatus according to an embodiment of the present invention.

The semiconductor chip package test apparatus according to an embodiment of the present invention includes a socket module 100 and a tray module 200 . In addition, it may further include a board 300 , a pusher device 400 , and a driving device (not shown).

<Socket module (100)>

2 is a view showing the structure of the socket module 100 of the semiconductor chip package test apparatus according to an embodiment of the present invention.

The socket module 100 includes a socket body 110 and a contact 120 .

The socket body 110 may be formed of a predetermined three-dimensional structure. The socket body 110 may have, for example, a hexahedral shape as a whole. The socket body 110 may include a contact mounting hole penetrating up and down therein.

An interpolation guide 130 may be provided on an upper portion of the socket body 110 . The interpolation guide 130 may be formed of, for example, a predetermined bevel, step, embossed or engraved portion formed along the outer edge of the upper portion of the socket body 110 . The shape of the interpolation guide 130 is not limited.

The contact 120 may be a predetermined pin structure made of an electrically conductive material. The contact 120 may be, for example, a pogo pin, but is not limited thereto. The contact 120 may be mounted in the contact mounting hole of the socket body 110 . An upper end of the contact 120 may protrude onto the socket body 110 , and a lower end of the contact 120 may protrude below the socket body 110 .

<Tray module (200)>

FIG. 3 is a diagram illustrating a tray module 200 and a semiconductor chip mounted on the tray module 200 of the semiconductor chip package testing apparatus according to an embodiment of the present invention and connected to the socket module 100 .

The tray module 200 includes a tray body 210 and a mounting unit 220 formed on the tray body 210 . In addition, the tray cover 230 may be further included.

The tray body 210 is composed of a plate-shaped member having a predetermined area and thickness. According to one embodiment, the tray body 210 may be made of a material having excellent thermal conductivity. For example, the tray body 210 may be made of a material such as SUS. Accordingly, heat generated during the test process of the semiconductor chip package P can be easily processed.

The mounting part 220 is formed on the tray body 210 . The mounting unit 220 is a means on which the semiconductor chip package P is mounted and fixed. A specific configuration of the mounting unit 220 is not limited. For example, the mounting part 220 may include a mounting groove having a predetermined area and depth, and the semiconductor chip package P may be fitted and fixed in the mounting groove.

In this case, the mounting groove is formed on the lower surface of the tray body 210 and is opened downwardly, so that when the semiconductor chip package P is fitted and fixed in the mounting groove, the semiconductor chip package P may be exposed downwardly.

Alternatively, as another example, the mounting unit 220 may be configured as a predetermined mounting hole penetrating the tray body 210 in the vertical direction. Accordingly, the semiconductor chip package P can be raised inside or on the mounting hole. In addition, the semiconductor chip package P placed in the mounting hole may be exposed downward.

The shape and size of the mounting part 220 are not limited. The mounting unit 220 may have a shape and size corresponding to the shape and size of the semiconductor chip package P to be tested. Accordingly, the semiconductor chip package P may be mounted in the mounting unit 220 . For example, the mounting unit 220 may have a rectangular shape.

According to an example, the mounting unit 220 may be configured as a mounting hole penetrating the tray body 210 . In addition, the upper outer peripheral portion of the mounting portion 220 may be provided with an upper step on which the lower outer peripheral portion of the semiconductor chip package P is placed and seated. In addition, an interpolation unit 222 having a shape corresponding to the interpolation guide 130 of the socket body 110 may be provided on the lower outer peripheral portion of the mounting unit 220 .

A plurality of mounting units 220 may be formed. For example, a plurality of mounting units 220 are formed on the tray body 210 and may have an arrangement structure in the form of a mesh.

<The board 300, the pusher device 400, and the driving device (not shown)>

4 is a diagram illustrating a structure of a semiconductor chip package test apparatus according to an embodiment of the present invention.

The semiconductor chip package testing apparatus according to an embodiment of the present invention may further include a board 300 , a pusher device 400 , and a driving device (not shown).

The board 300 may be a predetermined PCB. The socket module 100 is fixed on the board 300 , and the contacts 120 of the socket module 100 may be connected to various electrical terminals provided on the board 300 .

The pusher device 400 is a means for fixing the tray module 200 . For example, as in the above embodiment, when the tray module 200 includes the tray body 210 and the tray cover 230 , the pusher device 400 applies a force to the tray body 210 and the tray cover 230 . In addition, the tray body 210 and the tray cover 230 may be fixed to each other.

A specific configuration of the pusher device 400 is not limited. For example, a lower pusher 410 for supporting the lower portion of the tray body 210 and an upper pusher 420 for pressing the upper portion of the tray cover 230 are provided, and between the upper pusher 420 and the lower pusher 410 is provided. The tray body 210 and the tray cover 230 may be fixed to each other using a pressing force. Of course, the distance between the lower pusher 410 and the upper pusher 420 may vary. Here, the lower pusher 410 may be a predetermined support (SUPPORT).

The driving device (not shown) is various devices that provide power to the semiconductor chip package test device according to the embodiment of the present invention. The specific configuration and operation of the driving device (not shown) is not limited. A driving device (not shown) may displace at least one of the socket module 100 and the tray module 200 . In addition, the semiconductor chip package P may be mounted on the tray module 200 or the semiconductor chip package P may be recovered from the tray module 200 . In addition, after the tray cover 230 is covered on the tray body 210 of the tray module 200 and the test is performed, the tray cover 230 may be removed. In addition, the distance between the lower pusher 410 and the upper pusher 420 may be varied by operating the pusher device 400 .

In addition, according to the embodiment, the tray module 200 may further include a tray cover 230 . The tray cover 230 may be a cover having a predetermined flat plate shape. The tray cover 230 is disposed on the tray module 200 , and may cover and fix the semiconductor chip package P mounted in the mounting hole.

Meanwhile, the tray cover 230 may have a predetermined window 232 . The window 232 may be opened upwardly or may have light-transmitting properties. Accordingly, it can be confirmed whether the semiconductor chip package P is correctly mounted in the tray module 200 .

<Operation and Effects of Semiconductor Chip Package Test Device>

5 is a diagram illustrating a structure of a semiconductor chip package test apparatus and a test of a semiconductor chip package P according to an embodiment of the present invention.

Hereinafter, the operation and effect of the semiconductor chip package test apparatus according to the embodiment of the present invention will be described.

The semiconductor chip package P may be tested using the semiconductor chip package test apparatus according to the embodiment of the present invention.

First, the semiconductor chip package P is mounted on the mounting unit 220 of the tray module 200 . According to the embodiment, after the semiconductor chip package P is placed on the tray body 210 , the tray cover 230 may be placed on the tray body 210 and the semiconductor chip package P to cover it. In addition, the tray body 210 and the tray cover 230 may be fixed using the pusher device 400 . Accordingly, the semiconductor chip package P may be fixed in a mounted state in the tray module 200 .

Next, the semiconductor chip package P is positioned on the socket module 100 . In this process, the driving device (not shown) may move the socket module 100 or the tray module 200 . Of course, it is also possible for the driving device (not shown) to move both the socket module 100 and the tray module 200 .

When the socket module 100 or the tray module 200 moves, the contact 120 of the socket module 100 is electrically connected to the terminal Q of the semiconductor chip package P. In this case, the interpolation guide 130 provided in the socket body 110 may be interpolated into the interpolation portion 222 provided in the mounting unit 220 . Accordingly, the socket body 110 may be interpolated into the mounting portion 220 . Accordingly, the interpolation part 222 and the interpolation guide 130 may guide the contact 120 of the socket module 100 and the terminal Q of the semiconductor chip package P to be accurately connected to each other.

In addition, in the pusher device 400 and the tray cover 230 , when the contact 120 of the socket module 100 is connected to the terminal Q of the semiconductor chip package P, the semiconductor chip package P is separated. can be prevented from doing

When the test for one semiconductor chip package (P) is completed, the tray module 200 or the socket module 100 is then moved to sequentially perform tests on the semiconductor chip package (P) located in different positions. have. Of course, as a plurality of socket modules 100 are provided, tests are performed on all of the semiconductor chip packages P mounted in one tray module 200, and the tray module 200 is replaced after the test is completed. It is possible.

In the semiconductor chip package test apparatus according to the present invention, the semiconductor chip package P is fixed to the tray module 200 , and the tray module 200 is placed on the socket module 100 to provide do the test That is, the semiconductor chip package test apparatus according to the present invention may be referred to as a tray on test socket apparatus.

Therefore, in the semiconductor chip package test apparatus according to the present invention, when performing a test on the semiconductor chip package P, there is no need to mount and take out the semiconductor chip package P in the socket device.

When performing a test on the semiconductor chip package P according to the prior art, the semiconductor chip package P is mounted in a socket, the test is performed using the socket, and then the semiconductor chip package P is removed from the socket. An extraction process was required. Therefore, since the semiconductor chip package P has to be mounted and removed from one socket one by one, a process of moving the semiconductor chip package P and operating the socket was required. This increases the time required for the test, and the related devices also require a complex structure, which increases the test unit cost.

On the other hand, in the semiconductor chip package test apparatus according to the present invention, when the semiconductor chip package P is tested, it is not necessary to mount the semiconductor chip package P in the socket device and take it out. However, the test can be performed simply by mounting the semiconductor chip package P in the tray module 200 and placing the socket module 100 in the semiconductor chip package P mounted in the tray module 200 . Therefore, the test process is simplified and the time required for the test can be greatly reduced.

In addition, since there is no need to mount the semiconductor chip package P on the socket module 100 , the structure of the socket module 100 can be very simple. That is, when the semiconductor chip package P is to be fixed to the socket device according to the prior art, various latches and actuators for operating the latches are required. However, in the socket module 100 of the semiconductor chip package test apparatus according to the present invention, only the socket body 110 for fixing the contact 120 is required. Accordingly, the operating cost of the semiconductor chip package test apparatus can be greatly reduced.

In addition, according to an embodiment, the tray body 210 and the tray cover 230 may be made of a material having excellent thermal conductivity. For example, the tray body 210 and the tray cover 230 may be made of a material such as SUS. Accordingly, the tray module 200 may absorb heat generated in the semiconductor chip package P during the test process and dissipate the heat. That is, the tray module 200 may perform a function of a heat sink. Accordingly, the occurrence of defects in the semiconductor chip package P may be prevented, and test efficiency may be improved.

Although preferred embodiments have been illustrated and described above, the present invention is not limited to the specific embodiments described above, and common knowledge in the technical field to which the present invention pertains without departing from the gist of the present invention as claimed in the claims is not limited thereto. Various modifications are possible by the possessor, of course, and these modifications should not be individually understood from the technical spirit or perspective of the present invention.

100: socket module
110: socket body
120: contact
130: interpolation guide
200: tray module
210: tray body
220: mount
222: interpolation
230: tray cover
232: Windows
300: board
400: pusher device
410: lower pusher
420: upper pusher

Claims (8)

A semiconductor chip package test apparatus comprising:
socket module; and
a tray module on which a semiconductor chip package is mounted; includes,
The socket module is
socket body, and
and a contact mounted on the socket body and protruding to the outside of the socket body,
The tray module,
A tray body in the form of a plate having a predetermined area, and
and a mounting portion formed on the tray body.
A semiconductor chip package is mounted on the mounting part, and the positions of the socket module and the tray module are relatively displaced,
A semiconductor chip package testing apparatus for performing a test on the semiconductor chip package by connecting the contact of the socket module to the semiconductor chip package mounted on the mounting unit. According to claim 1,
The mounting unit,
A semiconductor chip package test apparatus formed in plurality on the tray body and having an array structure in a mesh shape. The method according to claim 1,
board; further comprising,
The socket body of the socket module is fixed on the board,
The contact is a semiconductor chip package test apparatus protruding upward. According to claim 1,
The mounting unit,
A semiconductor chip package testing apparatus comprising a mounting hole penetrating the tray body vertically. 5. The method according to claim 4,
The tray module,
and a tray cover disposed on the tray body and covering the semiconductor chip package mounted in the mounting hole. 6. The method of claim 5,
The semiconductor chip package testing apparatus further comprising a; pusher for fixing between the tray body and the tray cover. The method according to claim 1,
The socket body,
A semiconductor chip package testing apparatus having an interpolation guide, the upper portion of which can be interpolated into the mounting portion. The method according to claim 1,
The semiconductor chip package testing apparatus further comprising a; a driving device for displacing the socket module or the tray module.

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