WO2017138522A1

WO2017138522A1 - Socket for electrical component

Info

Publication number: WO2017138522A1
Application number: PCT/JP2017/004392
Authority: WO
Inventors: 亮太外山
Original assignee: 株式会社エンプラス
Priority date: 2016-02-08
Filing date: 2017-02-07
Publication date: 2017-08-17
Also published as: JPWO2017138522A1; KR20180103899A

Abstract

A socket (10) for an electrical component is provided with a first engaging piece (51) on a cover (40), and is also provided with a first piece to be engaged (25) on a base module (20). When a first electrical component (11) and a second electrical component (12) are simultaneously accommodated as electrical components in the socket for an electrical component, the first electrical component (11) and the second electrical component (12) are respectively accommodated in the base module (20) and a connecting module (30), and in a state in which the connecting module (30) is interposed between the cover (40) and the base module (20), an upper part to be engaged (25a) of the first piece to be engaged of the base module (20) is engaged in the first engaging piece (51) of the cover. When only a third electrical component (11) is accommodated in the socket for an electrical component, the third electrical component (11) is accommodated in the base module (20), and in a state in which the base module (20) is pressed against the cover (40) without interposition of the connection module (30), a lower part to be engaged (25b) of the first piece to be engaged of the base module is engaged with the first engaging piece (51) of the cover.

Description

Socket for electrical parts

The present invention relates to an electrical component socket used when evaluating electrical components such as a processor package and a memory package.

Conventionally, as this type of electrical component socket, a cover (for example, a lid, a lid, etc.) is provided above a base module (for example, a socket body) that accommodates electrical components (for example, a semiconductor device, an electronic component package, etc.). ) Have been proposed to be detachably attached by a claw engagement method (see, for example, Patent Documents 1 and 2).

In this electrical component socket, after the electrical component is accommodated in the base module, the cover is locked to the base module by the claw engagement method, whereby the terminal of the electrical component is connected to the contact pin disposed in the base module. This electrical component can be properly evaluated by contacting with contact pressure.

JP 2007-248181 A JP 2013-8499 A

By the way, when two types of electrical components (for example, a processor package and a memory package) are simultaneously evaluated using the electrical component socket having such a structure, it is conceivable to adopt a so-called double latch method. In this double latch system, prior to the evaluation of the two types of electrical components, a connecting module is prepared in addition to the cover and the base module, and one electrical component (for example, processor package) is accommodated in the base module, while the other An electrical component (for example, a memory package) is accommodated in the connecting module. Next, the connecting module is attached to the lower side of the cover, and the base module is attached to the lower side of the connecting module, whereby the base module is assembled to the cover via the connecting module. Thus, the double latch type socket for electrical parts has a structure in which the base module is assembled to the cover via the coupling module, in other words, a structure in which the base module cannot be assembled to the cover without the coupling module interposed. It has become.

Therefore, when evaluating one type of electrical component (for example, processor package) using the base module, the vertical position (height) of the base module with respect to the cover is the same as when evaluating two types of electrical components. In order to prevent this, a dummy module having the same size as the connecting module needs to be interposed between the base module and the cover. In this case, since it is necessary to prepare a dummy module each time an electrical component is evaluated, it takes time to prepare for evaluation. In addition, even if the cover has a heat sink, the heat generated in the electrical components during the evaluation is transferred to the heat sink via the dummy module, so this heat is transferred directly to the heat sink. There is a problem that the heat sink cannot efficiently dissipate the electrical components.

Therefore, the present invention eliminates the trouble of preparing for the evaluation when evaluating one type of electrical component using the base module, even if it is a so-called double latch system, and the electrical component is heat-sinked during the evaluation. It is an object of the present invention to provide a socket for electrical parts that can efficiently dissipate heat.

In order to achieve the above object, the present invention provides a socket for an electrical component configured such that a base module is attached to a lower side of a cover via a connecting module, and is provided on the cover. And a first engaged piece provided on the base module and capable of engaging with the first engaged piece, the first engaged piece being an upper engaged portion. And when the first electrical component and the second electrical component are simultaneously accommodated as electrical components, the first electrical component is accommodated in the base module and the coupling module is The upper side of the first engaged piece of the base module is accommodated in the first engaging piece of the cover in a state in which the second electrical component is accommodated and the connecting module is sandwiched between the cover and the base module. By engaging the engaging portion, the base module and the connecting module are held by the cover, and when only the third electrical component is accommodated as an electrical component, the third electrical component is accommodated in the base module. By engaging the first engaging piece of the cover with the lower engaged portion of the first engaged piece of the base module without using the connecting module, the base module is It is made to hold | maintain to the said cover.

According to the present invention, there is provided a second engagement piece provided on the cover, and a second engaged piece provided on the connection module and capable of engaging with the second engagement piece. It is preferable that the connecting module is held by the cover by engaging the second engaging piece of the cover with the second engaged piece of the connecting module.

In the present invention, the cover has a quadrangular shape in plan view, and the cover has the first engagement piece attached to one of the two opposing sides and the other two opposing sides. It is preferable that the second engagement piece is attached to the first and second engagement pieces.

Furthermore, in the present invention, the cover is provided with a pressing member having a heat sink, and when the first electric component and the second electric component are accommodated simultaneously, the second electric component accommodated in the connecting module is included. When the pressing member is brought into contact with a component and only the third electric component is accommodated, it is desirable that the pressing member is brought into contact with the third electric component accommodated in the base module.

In the present invention, the first engagement piece is a first latch that opens and closes by rotating around a first shaft attached to a cover body of the cover, and is near the lower end of the first latch. It is desirable to engage with the first engaged piece.

In the present invention, the cover has a lock member that descends relative to the cover body, and the lock member descends to a position above the first shaft of the first latch, By blocking the movement of the portion of the first latch above the first shaft in the direction approaching the cover body, the first latch opens and the first engagement piece and the first engagement piece It is desirable to be configured to prevent the engagement with.

In the present invention, the second engagement piece is a second latch that opens and closes by rotating around a second shaft attached to a cover main body of the cover, and near the lower end of the second latch. It is desirable to engage with the second engaged piece.

According to the present invention, since the upper engaged portion and the lower engaged portion are provided in the first engaged piece, even when both the base module and the connecting module are accommodated in the electrical component socket, Even when only the base module is accommodated in the electrical component socket, the first engaged piece of the base module can be engaged with the first engaging piece of the cover. Therefore, even in the case of a so-called double latch type socket for electrical components, when evaluating one type of electrical component (third electrical component) using the base module, a dummy module is interposed between the base module and the cover. There is no need to let them. As a result, unlike the case where two types of electrical components (first electrical component and second electrical component) are simultaneously evaluated, only the base module needs to be prepared, which saves the trouble of preparing for evaluation of electrical components. It becomes possible.

Further, according to the present invention, by engaging the second engaging piece of the cover with the second engaged piece of the connecting module, the connecting module can be attached to the cover independently without the base module. Therefore, only the connecting module can be attached to the cover before the base module is attached. Therefore, it becomes easy to handle the socket for electrical components, and as a result, it is possible to smoothly evaluate two types of electrical components (first electrical component and second electrical component).

Further, according to the present invention, the first engagement piece is attached to either one of the two opposing sides and the second engagement piece is attached to the other two opposing sides of the cover having a rectangular shape in plan view. Therefore, the operation in which the first engaging piece engages with the first engaged piece and the operation in which the second engaging piece engages with the second engaged piece interfere with each other spatially. Disappear. Therefore, it is possible to ensure the respective operations and smoothly perform the evaluation of the electrical component.

Furthermore, according to the present invention, since the electrical component is configured to dissipate heat by contacting the heat sink, it is possible to efficiently dissipate the electrical component.

According to the present invention, since the first engagement piece is provided near the lower end of the first latch, the first engagement piece and the first engaged piece can be reliably engaged with each other with a simple structure. Can do.

Further, according to the present invention, since the rotation of the first latch is prevented by the lock member, the engagement between the first engagement piece and the first engaged piece is securely locked with a simple structure. can do.

According to the present invention, since the second engagement piece is provided in the vicinity of the lower end of the second latch, the second engagement piece and the second engagement piece can be reliably engaged with each other with a simple structure. Can do.

1 is a perspective view showing a state in which two types of electrical components are simultaneously evaluated using a base module and a coupling module in the electrical component socket according to Embodiment 1 of the present invention, wherein the base module and the coupling module cover It is a figure which shows the state attached to. 1 is a perspective view showing a state in which two types of electrical components are simultaneously evaluated using a base module and a coupling module in the electrical component socket according to Embodiment 1 of the present invention, wherein the base module and the coupling module cover It is the state figure removed from. It is a top view which shows the socket for electrical components of FIG. FIG. 3 is a cross-sectional view of the electrical component socket of FIG. 2 taken along line AA. FIG. 3 is a cross-sectional view of the electrical component socket of FIG. 2 taken along line BB, showing a state before evaluation of the electrical component. FIG. 3 is a cross-sectional view taken along the line BB of the electrical component socket of FIG. 2 and shows a state during evaluation of the electrical component. FIG. 3 is a cross-sectional view taken along line CC of the electrical component socket of FIG. 2. FIG. 5 is a perspective view showing a state in which one type of electrical component is evaluated using a base module in the electrical component socket according to the first embodiment, and shows a state where the base module is attached to a cover. FIG. 6 is a perspective view showing a state in which one type of electrical component is evaluated using a base module in the electrical component socket according to the first embodiment, and shows a state where the base module is removed from the cover. It is a top view which shows the socket for electrical components of FIG. FIG. 8 is a cross-sectional view of the electrical component socket of FIG. 7 taken along line DD. FIG. 9 is a cross-sectional view of the electrical component socket of FIG. 7 taken along line EE, showing a state before evaluation of the electrical component. FIG. 9 is a cross-sectional view of the electrical component socket of FIG. 7 taken along the line EE, showing a state when the electrical component is evaluated. It is a front view which shows the processor package accommodated in the base module of the socket for electrical components shown in FIG. It is a bottom view which shows the processor package accommodated in the base module of the socket for electrical components shown in FIG. It is a front view which shows the memory package accommodated in the module for connection of the socket for electrical components shown in FIG. It is a bottom view which shows the memory package accommodated in the module for connection of the socket for electrical components shown in FIG.

Hereinafter, embodiments of the present invention will be described.

Embodiment 1 of the Invention
1A to 11B show Embodiment 1 of the present invention.

The IC socket 10 as the “electrical component socket” according to the first embodiment is of a so-called double latch type, and is based on the processor package 11 as the “first electric component” as shown in FIG. 1B. While being accommodated in the module 20, the memory package 12, which is a “second electrical component”, is accommodated in the connecting module 30, and in this state, the base 40 is disposed below the cover 40 having a rectangular shape in plan view via the connecting module 30. The module 20 is assembled (see FIG. 1A). Thereafter, as shown in FIGS. 4A and 4B, by disposing the base module 20 on the wiring board 19, two types of electrical components (the processor package 11 and the memory package 12) can be simultaneously evaluated.

Here, as shown in FIG. 1B and FIG. 4, the cover 40 includes a cover body 41 having a substantially rectangular parallelepiped frame shape, and an elevating block 39 is mounted in the cover body 41 so as to be movable up and down. . A pressing member 42 is fixedly attached to the lower side of the lifting block 39, and a heat sink 43 is integrally provided on the pressing member 42. The elevating block 39, the pressing member 42, and the heat sink 43 are attached so as to be movable up and down while being elastically biased upward by a spring 48 (see FIG. 4B). Further, when the base module 20 is attached to the cover 40 alone without the connection module 30, the processor package 11 accommodated in the electrical component accommodating portion 23 of the base module 20 contacts the heat sink 43 to dissipate heat. Is configured to do.

Further, on the upper side of the heat sink 43, as shown in FIGS. 4 and 5, a substantially flat plate 44 is horizontally mounted. Furthermore, a substantially U-shaped operating lever 45 is attached to the cover body 41 so as to be rotatable about 90 ° in the directions of arrows M and N about the shaft 46 between the standby position P1 and the evaluation position P2. A plate cam 47 is attached to each end of the operation lever 45. When the operation lever 45 is positioned at the standby position P1, the first surface 47a of the plate cam 47 comes into contact with the upper surface of the plate 44, and the pressing member 42 is positioned at a predetermined standby height H1 (see FIG. 4A). When the operation lever 45 is positioned at the evaluation position P2, the second surface 47b of the plate cam 47 comes into contact with the upper surface of the plate 44, and the pressing member 42 has a predetermined pressing height H2 (see FIG. 4B). ) Is positioned.

Further, on the outer peripheral surface of the cover main body 41, as shown in FIGS. 1A, 4A, 4B, etc., a first latch 51 as a pair of “first engagement pieces” is provided on one opposite two sides, respectively. It is attached so that it can be opened and closed by rotating in the directions of arrows K and L around 52. Each of the first latches 51 has an operation part 51b formed at the upper end part and a tapered claw part 51a formed inward at the lower end part. Two coil springs 53 are always elastically urged in the direction of the arrow L to close between the operation portion 51b at the upper end of each first latch 51 and the cover body 41, respectively. It has been reduced. Further, as shown in FIG. 4, a pair of substantially cylindrical lock pins 49 as “lock members” for locking in a state where the pair of first latches 51 are closed are provided in the elevating block 39 in the horizontal direction. It is embed | buried in the form protruded outward (namely, a pair of 1st latch 51 side).

Further, on the outer peripheral surface of the cover body 41, as shown in FIG. 1A, FIG. 3, etc., a second latch 56 as a pair of “second engaging pieces” on the other two opposite sides is centered on the shaft 57, respectively. Are attached so that they can be opened and closed by rotating in the directions of arrows I and J. Each of the second latches 56 has an operation portion 56b formed at the upper end portion and two tapered claw portions 56a formed inward at the lower end portion. Two coil springs 58 always close the second latch 56 by elastically biasing the second latch 56 in the direction of arrow J between the operation portion 56b at the upper end of each second latch 56 and the cover body 41. It has been reduced.

The base module 20 has a module body 21 having a substantially square frame shape as shown in FIG. 1B and the like. A substantially square plate-like contact unit 22 is fitted in the center of the module body 21. The contact unit 22 is provided with an electrical component accommodating portion 23 in the upper part thereof so as to be movable up and down in an elastically urged upward direction, and a number of contact pins below the electrical component accommodating portion 23. (Not shown) are arranged in the vertical direction. When the base module 20 and the connecting module 30 are assembled to the cover 40 (see FIG. 1A), these contact pins are in contact with the processor package 11 on the electric component housing portion 23 of the base module 20 while the upper end portion is in contact with the processor package 11. The lower end portion is provided in contact with the wiring board 19 (see FIG. 3).

Furthermore, a pair of first engaged pieces 25 that can engage with the pair of first latches 51 of the cover 40 are provided on the outer peripheral surface of the module body 21 as shown in FIGS. ing. Each of the first engaged pieces 25 has a tapered upper engaged portion 25a and a tapered lower engaged portion 25b. Both the upper engaged portion 25a and the lower engaged portion 25b are formed outward so as to face the claw portions 51a of the first latches 51 of the cover 40. Here, the difference in the vertical position between the upper engaged portion 25a and the lower engaged portion 25b (the height of the lower engaged portion 25b is subtracted from the height of the upper engaged portion 25a. ΔH is an assembly height of the connecting module 30 (that is, a vertical position of the base module 20 when the base module 20 is assembled to the cover 40 via the connecting module 30), The difference between the base module 20 and the vertical position of the base module 20 when the base module 20 is assembled to the cover 40 without the connecting module 30 therebetween.

Further, the connection module 30 has a module body 31 having a substantially square frame shape as shown in FIG. 1B. A substantially square plate-like contact unit 32 is fitted in the center of the module body 31. The contact unit 32 is provided with an electric component accommodating portion 33 in the upper part thereof so as to be movable up and down in an elastically urged upward direction, and a number of contact pins below the electric component accommodating portion 33. (Not shown) are arranged in the vertical direction. When the base module 20 and the connecting module 30 are assembled to the cover 40 (see FIG. 1A), the upper ends of these contact pins come into contact with the memory package 12 on the electrical component accommodating portion 33 of the connecting module 30. At the same time, the lower end portion is provided so as to contact the processor package 11 on the electric component housing portion 23 of the base module 20.

Further, as shown in FIGS. 1 and 3, a pair of second engaged pieces 28 that can engage with the pair of second latches 56 of the cover 40 are provided on the outer peripheral surface of the module body 31. Each second engaged piece 28 has two tapered claw portions 28a. These claw portions 28 a are formed outward facing the two claw portions 56 a of each second latch 56 of the cover 40.

The IC socket 10 accommodates the processor package 11 and the memory package 12 in the base module 20 and the connecting module 30, respectively. When evaluating the processor package 11 and the memory package 12, the first latch 51 of the cover 40 is used. Is engaged with the upper engaged portion 25a of the first engaged piece 25 of the base module 20, so that the base module 20 is attached to the cover 40 so as to sandwich the connecting module 30, and the base module When the processor package 11 is accommodated in 20 and only the processor package 11 is evaluated, the first latch 51 of the cover 40 is engaged with the lower engaged portion 25 b of the first engaged piece 25 of the base module 20. Base module Le 20 is configured to be solely attached to the cover 40 without passing through the connection module 30.

Further, the IC socket 10 is configured such that the second latch 56 of the cover 40 is engaged with the second engaged piece 28 of the connecting module 30, so that the connecting module 30 alone is not accompanied by the base module 20. It is comprised so that it can be attached to.

Here, the processor package 11 and the memory package 12 of this embodiment form a so-called package on package (PoP) structure in which the memory package 12 is mounted in a state of being stacked on the processor package 11.

The processor package 11 is a so-called BGA. As shown in FIGS. 10A and 10B, the processor package 11 has a main body portion 11a formed in a square shape in plan view, and a wiring board 19 is formed from the lower surface of the main body portion 11a. A plurality of hemispherical lower terminals 11b are formed so as to protrude downward. In addition, a hemispherical upper terminal 11c for contacting and conducting a hemispherical terminal 12b (described later) of the memory package 12 is formed on the peripheral edge of the rectangular frame shape on the upper surface of the main body 11a (see FIG. 10A).

The memory package 12 is a so-called BGA. As shown in FIGS. 11A and 11B, the memory package 12 is formed in a square shape in plan view and has a main body 12a having the same size as the main body 11a of the processor package 11. And a plurality of hemispherical terminals 12b are formed so as to protrude downward from the peripheral edge of the rectangular frame shape on the lower surface of the main body 12a.

It should be noted that the shape of each terminal described above is not limited to a hemispherical shape, and may be an appropriate shape such as a substantially flat plate shape.

Next, regarding the method of using the IC socket 10, as shown in FIGS. 1A and 1B, two types of electrical components (a processor package 11 as a “first electrical component”) are used by using the base module 20 and the connecting module 30. When the memory package 12) as the “second electrical component” is simultaneously evaluated, and as shown in FIGS. 6A and 6B, one type of electrical component (“third electrical component”) is used using the base module 20. The processor package 11) will be described separately in the case of evaluation.

First, when two types of electrical components (processor package 11 and memory package 12) are simultaneously evaluated using the base module 20 and the connecting module 30, for example, the following procedure is followed.

That is, as shown in FIG. 1B, the processor package 11 is accommodated on the electric component accommodating portion 23 of the base module 20 and the memory package 12 is accommodated on the electric component accommodating portion 33 of the connecting module 30. Next, as shown in FIG. 4A, the second latch 56 of the cover 40 is hooked on the second engaged piece 28 of the connecting module 30 in a state where the operation lever 45 of the cover 40 is positioned at the standby position P1. By engaging, the connecting module 30 is attached to the lower side of the cover 40. Further, the first latch 51 of the cover 40 is hooked and engaged with the upper engaged portion 25 a of the first engaged piece 25 of the base module 20, so that the base module 20 is placed below the connecting module 30. Install. As a result, the base module 20 is assembled to the cover 40 via the connection module 30.

When the second latch 56 of the cover 40 is hooked and engaged with the second engaged piece 28 of the connecting module 30, after the operation portion 56 b of the second latch 56 is pushed and the second latch 56 is opened. In a state where the connecting module 30 is pressed against the lower side of the cover 40, the force for pressing the operating portion 56b of the second latch 56 is released to close the second latch 56. Further, when the first latch 51 of the cover 40 is hooked and engaged with the upper engaged portion 25a of the first engaged piece 25 of the base module 20, the operation portion 51b of the first latch 51 is pushed to be engaged with the first engaged portion 25a. After the latch 51 is opened, the force that pushes the operating portion 51b of the first latch 51 is released in a state where the base module 20 is pressed against the lower side of the connecting module 30, and the first latch 51 is closed.

Next, as shown in FIGS. 3 and 4A, after the IC socket 10 is disposed on the wiring board 19, the operation lever 45 of the cover 40 is rotated in the direction of arrow N (see FIG. 4B) to evaluate the position P2. Position to. Then, the second surface 47b of the plate cam 47 comes into contact with the upper surface of the plate 44, and the pressing member 42 is pushed down from the standby height H1 (see FIG. 4A) to the pressing height H2 (see FIG. 4B) and descends. As a result, the memory package 12 on the electric component accommodating portion 33 of the connecting module 30 is pushed down by the pressing member 42 and descends in the module main body 31 and contacts the processor package 11 in the module main body 21 of the base module 20. The terminal 12b of the memory package 12 contacts and is electrically connected to the upper terminal 11c of the processor package 11 with a predetermined contact pressure, and the lower terminal 11b of the processor package 11 contacts the wiring board 19 with a predetermined contact pressure. Touch and be electrically connected. Further, as shown in FIGS. 4A and 4B, as the pressing member 42 is lowered, the elevating block 39 is also lowered, so that the pair of lock pins 49 are lowered to the step portions 51 c of the pair of first latches 51. Contact (see FIG. 4B). As a result, the first latch 51 can be kept closed.

In this state, current is passed through two types of electrical components (processor package 11 and memory package 12) for evaluation.

At this time, as described above, the processor package 11 and the memory package 12 are formed in a shape that can be used for simultaneous evaluation of two types of electrical components by the IC socket 10. The package 12 can be evaluated simultaneously.

In addition, since the cover 40 is provided with the heat sink 43 as described above, the heat generated in the processor package 11 and the memory package 12 due to energization is dissipated by the heat sink 43, so that these two types of electrical components Evaluation can be continued without hindrance.

Furthermore, since the pair of first latches 51 holding the base module 20 is held closed by the pair of lock pins 49 as described above, an external force that opens the first latch 51 acts. Even so, the base module 20 and the connecting module 30 can be securely gripped until the evaluation of the electrical components is completed.

Here, the procedure of disposing the IC socket 10 on the wiring board 19 after assembling the IC socket 10 by assembling the base module 20 and the connecting module 30 to the cover 40 has been described. Is also possible. For example, the base module 20 is disposed on the wiring board 19 and the connecting module 30 is assembled to the cover 40. Then, the connecting module 30 and the cover 40 are placed on the base module 20 and the base module 20 is mounted. May be attached to the cover 40. Alternatively, after the base module 20 is disposed on the wiring board 19, the connecting module 30 is placed on the base module 20, and finally, the cover 40 is placed on the connecting module 30. The base module 20 and the connecting module 30 may be attached to 40.

In this case, the first latch 51 of the cover 40 has a tapered claw portion 51a, and the first engaged piece 25 of the base module 20 has a tapered upper engaged portion 25a. Therefore, the base module 20 can be easily attached to the cover 40 simply by pressing the cover 40 toward the base module 20 side. Further, the second latch 56 of the cover 40 has a tapered claw portion 56a, and the second engaged piece 28 of the connecting module 30 has a tapered claw portion 28a. The connecting module 30 can be easily attached to the cover 40 simply by pressing the 40 toward the connecting module 30.

On the other hand, when evaluating one type of electrical component (processor package 11) using the base module 20, for example, the following procedure is followed.

That is, as shown in FIG. 6B, the processor package 11 is accommodated on the electric component accommodating portion 23 of the base module 20. Next, as shown in FIG. 9A, with the operation lever 45 of the cover 40 positioned at the standby position P1, the first latch 51 of the cover 40 is moved to the lower side of the first engaged piece 25 of the base module 20. The base module 20 is attached to the lower side of the cover 40 by being engaged with the engaging portion 25b. As a result, the base module 20 is in a state of being assembled to the cover 40 independently without the connection module 30 being interposed.

When the first latch 51 of the cover 40 is hooked and engaged with the lower engaged portion 25b of the first engaged piece 25 of the base module 20, the operating portion 51b of the first latch 51 is pushed to After the first latch 51 is opened, the force that pushes the operation portion 51b of the first latch 51 is released in a state where the base module 20 is pressed against the lower side of the cover 40, and the first latch 51 is closed.

Next, as shown in FIGS. 8 and 9A, after the IC socket 10 is disposed on the wiring board 19, the operation lever 45 of the cover 40 is rotated in the direction of arrow N to be positioned at the evaluation position P2. Then, the second surface 47b of the plate cam 47 contacts the upper surface of the plate 44, and the pressing member 42 is pushed down from the standby height H1 to the pressing height H2 (see FIG. 9B). As a result, the pressing member 42 comes into contact with the processor package 11 accommodated in the base module 20, and the lower terminal 11 b of the processor package 11 comes into contact with the wiring board 19 with a predetermined contact pressure and is electrically connected. As the pressing member 42 is lowered, as shown in FIGS. 9A and 9B, the lifting block 39 is also lowered, so that the pair of lock pins 49 are lowered to the step portions 51c of the pair of first latches 51. Contact (see FIG. 9B). As a result, the first latch 51 can be kept closed.

In this state, current is passed through the processor package 11 for evaluation.

At this time, since the heat sink 43 is provided on the cover 40 as described above, the heat generated in the processor package 11 due to energization is dissipated by the heat sink 43 and the evaluation of the processor package 11 is continued without any trouble. can do.

Further, as described above, the pair of first latches 51 holding the base module 20 are held in the closed state by the pair of lock pins 49, so that an external force that opens the first latch 51 acts. Even so, the base module 20 can be securely held until the evaluation of the processor package 11 is completed.

Here, the procedure for disposing the IC socket 10 on the wiring board 19 after assembling the IC socket 10 by assembling the base module 20 to the cover 40 has been described, but other procedures are also conceivable. For example, after the base module 20 is disposed on the wiring board 19, the cover 40 may be placed on the base module 20 and the base module 20 may be attached to the cover 40.

In this case, the first latch 51 of the cover 40 has a tapered claw portion 51a, and the first engaged piece 25 of the base module 20 has a tapered upper engaged portion 25a and a tapered lower portion. Since the side engaged portion 25b is provided, the base module 20 can be easily attached to the cover 40 simply by pressing the cover 40 toward the base module 20 side.

As described above, in the first embodiment, when the processor package 11 is accommodated in the base module 20 and the processor package 11 is evaluated, the connecting module 30 is not used, and therefore the base module 20 based on the cover 40 is used. The position (height) in the vertical direction differs from the evaluation time of the two types of electrical components (the processor package 11 and the memory package 12) by the assembly height of the connecting module 30. However, the first latch 51 of the cover 40 is engaged with the lower engaged portion 25b of the first engaged piece 25 of the base module 20 so that the base module 20 is independent without the connection module 30 being interposed. It comes to be attached to the cover 40. Therefore, even when the so-called double latch type IC socket 10 is used, when the base module 20 is used to evaluate one type of electrical component (the processor package 11 in the first embodiment), the base module 20 and the cover 40 are used. It is no longer necessary to interpose a dummy module between them. As a result, unlike the case where two types of electrical components (the processor package 11 and the memory package 12) are simultaneously evaluated, only the base module 20 needs to be prepared. It becomes possible.

Further, when the base module 20 is independently attached to the cover 40 without the connection module 30, the processor package 11 accommodated in the base module 20 contacts the heat sink 43 and dissipates heat. ing. Therefore, compared with the case where a dummy module is interposed between the base module 20 and the cover 40, the processor package 11 can be efficiently radiated by the heat sink 43 during the evaluation.

Further, the second latch 56 of the cover 40 is engaged with the second engaged piece 28 of the connecting module 30 so that the connecting module 30 can be attached to the cover 40 alone without the base module 20. Since it is configured, the connecting module 30 can be attached to the cover 40 without the base module 20. Therefore, handling of the IC socket 10 becomes easy. For example, it is easy to attach the base module 20 to the cover 40 in a state where the connecting module 30 is attached to the cover 40. Therefore, it is possible to smoothly evaluate two types of electrical components (processor package 11 and memory package 12).

In addition, as described above, the first latch 51 is attached to one opposite two sides and the second latch 56 is attached to the other two opposite sides on the outer peripheral surface of the cover 40 having a square shape in plan view. Therefore, the operation in which the first latch 51 is engaged with the first engaged piece 25 of the base module 20 and the operation in which the second latch 56 is engaged with the second engaged piece 28 of the connecting module 30 are performed. , Will not interfere with each other spatially. Therefore, it is possible to smoothly perform the evaluation of the electrical components (the processor package 11 and the memory package 12) while ensuring the respective operations.

[Other Embodiments of the Invention]
In the first embodiment, the connection module 30 is independent without the base module 20 by the method in which the second latch 56 of the cover 40 is engaged with the second engaged piece 28 of the connection module 30. The IC socket 10 configured to be attached to the cover 40 has been described. However, it is also conceivable that the connecting module 30 can be independently attached to the cover 40 without using the base module 20 by another technique.

In the first embodiment, the IC socket 10 in which the heat sink 43 is provided integrally with the pressing member 42 has been described. However, the heat sink 43 is not necessarily provided integrally with the pressing member 42.

In the first embodiment, the case where the processor package 11 and the memory package 12 are used as the electrical components housed in the base module 20 and the connection module 30 of the IC socket 10 is described. Of course, both the base module 20 and the connecting module 30 can accommodate processor packages, and these two processor packages can be evaluated simultaneously.

Furthermore, in the first embodiment, the present invention is applied to the IC socket 10 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices.

10 IC socket (socket for electrical parts)
11 Processor package (first electrical component, third electrical component)
12 Memory package (second electrical component)
20 base module 25 first engaged piece 25a upper engaged portion 25b lower engaged portion 28 second engaged piece 30 connecting module 40 cover 43 heat sink 51 first latch (first engaging piece)
56 Second latch (second engagement piece)

Claims

A socket for an electrical component configured so that a base module can be attached to a lower side of a cover via a connecting module,
A first engagement piece provided on the cover; and a first engaged piece provided on the base module and engageable with the first engagement piece;
The first engaged piece has an upper engaged portion and a lower engaged portion,
When simultaneously storing the first electrical component and the second electrical component as electrical components, the first electrical component is accommodated in the base module and the second electrical component is accommodated in the connecting module, and the cover and the base By engaging the upper engaged portion of the first engaged piece of the base module with the first engaging piece of the cover in a state where the connecting module is sandwiched between the base module and the base module, Holding the module and the connecting module on the cover;
When only the third electrical component is accommodated as the electrical component, the third electrical component is accommodated in the base module, and the first engagement piece of the cover is not interspersed with the connection module. By engaging the lower engaged portion of the first engaged piece, the base module is held by the cover.
A socket for electrical parts characterized by the above.
A second engaging piece provided on the cover; and a second engaged piece provided on the connecting module and engageable with the second engaging piece;
2. The connecting module is held by the cover by engaging the second engaging piece of the cover with a second engaged piece of the connecting module. Socket for electrical parts.
The cover has a quadrangular shape in plan view, and the cover is provided with the first engagement piece on one of the two opposing sides and the second engagement piece on the other two opposite sides. The socket for electrical parts according to claim 2, wherein the socket is attached.
The cover is provided with a pressing member having a heat sink,
When simultaneously storing the first electric component and the second electric component, the pressing member is brought into contact with the second electric component stored in the connecting module;
When only the third electrical component is accommodated, the pressing member is brought into contact with the third electrical component accommodated in the base module.
The electrical component socket according to claim 1, wherein the electrical component socket is provided.
The first engagement piece is a first latch that opens and closes by rotating around a first shaft attached to a cover body of the cover,
Engaging with the first engaged piece in the vicinity of the lower end of the first latch;
The electrical component socket according to claim 1.
The cover has a lock member that descends relative to the cover body,
The lock member descends to a position above the first shaft of the first latch, and prevents the portion of the first latch above the first shaft from moving in a direction approaching the cover body. In this case, the first latch is configured to be prevented from being opened and the engagement between the first engaging piece and the first engaged piece being released. Socket for electrical parts.
The second engagement piece is a second latch that opens and closes by rotating around a second shaft attached to a cover body of the cover;
Engaging with the second engaged piece in the vicinity of the lower end of the second latch;
The socket for an electrical component according to claim 2.